KR101588019B1 - 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 - Google Patents
전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 Download PDFInfo
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- KR101588019B1 KR101588019B1 KR1020147029075A KR20147029075A KR101588019B1 KR 101588019 B1 KR101588019 B1 KR 101588019B1 KR 1020147029075 A KR1020147029075 A KR 1020147029075A KR 20147029075 A KR20147029075 A KR 20147029075A KR 101588019 B1 KR101588019 B1 KR 101588019B1
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- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/163—Photovoltaic cells having only PN heterojunction potential barriers comprising only Group III-V materials, e.g. GaAs/AlGaAs or InP/GaInAs photovoltaic cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
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- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
- H10D62/8161—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
- H10D62/8162—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation
- H10D62/8164—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation comprising only semiconductor materials
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- H10D62/82—Heterojunctions
- H10D62/824—Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
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- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/05—Manufacture or treatment characterised by using material-based technologies using Group III-V technology
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- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
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- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
- H10F10/142—Photovoltaic cells having only PN homojunction potential barriers comprising multiple PN homojunctions, e.g. tandem cells
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- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
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- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/161—Photovoltaic cells having only PN heterojunction potential barriers comprising multiple PN heterojunctions, e.g. tandem cells
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- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
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- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
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- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
- H10F77/1248—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
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- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
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- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/11—Separation of active layers from substrates
- H10P95/112—Separation of active layers from substrates leaving a reusable substrate, e.g. epitaxial lift off
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
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- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82635406P | 2006-09-20 | 2006-09-20 | |
| US60/826,354 | 2006-09-20 | ||
| US94465307P | 2007-06-18 | 2007-06-18 | |
| US60/944,653 | 2007-06-18 | ||
| PCT/US2007/079070 WO2008036837A2 (en) | 2006-09-20 | 2007-09-20 | Release strategies for making transferable semiconductor structures, devices and device components |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147001286A Division KR101615255B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140141662A KR20140141662A (ko) | 2014-12-10 |
| KR101588019B1 true KR101588019B1 (ko) | 2016-02-12 |
Family
ID=39201282
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147029075A Active KR101588019B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
| KR1020147001286A Active KR101615255B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
| KR1020097007923A Active KR101430587B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020147001286A Active KR101615255B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
| KR1020097007923A Active KR101430587B1 (ko) | 2006-09-20 | 2007-09-20 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US7932123B2 (enExample) |
| EP (1) | EP2064734B1 (enExample) |
| JP (3) | JP5319533B2 (enExample) |
| KR (3) | KR101588019B1 (enExample) |
| CN (2) | CN103956336B (enExample) |
| MY (1) | MY149190A (enExample) |
| TW (1) | TWI438827B (enExample) |
| WO (1) | WO2008036837A2 (enExample) |
Families Citing this family (506)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080055581A1 (en) * | 2004-04-27 | 2008-03-06 | Rogers John A | Devices and methods for pattern generation by ink lithography |
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| KR101368748B1 (ko) | 2004-06-04 | 2014-03-05 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치 |
| US8217381B2 (en) * | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
| US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
| JP5271541B2 (ja) * | 2006-01-16 | 2013-08-21 | パナソニック株式会社 | 半導体小片の製造方法ならびに電界効果トランジスタおよびその製造方法 |
| US20100047959A1 (en) * | 2006-08-07 | 2010-02-25 | Emcore Solar Power, Inc. | Epitaxial Lift Off on Film Mounted Inverted Metamorphic Multijunction Solar Cells |
| KR101588019B1 (ko) | 2006-09-20 | 2016-02-12 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
| US8005402B2 (en) * | 2007-01-10 | 2011-08-23 | Kabushiki Kaisha Toshiba | Charging device, image forming apparatus and charging method |
| CN105826345B (zh) | 2007-01-17 | 2018-07-31 | 伊利诺伊大学评议会 | 通过基于印刷的组装制造的光学系统 |
| US8097922B1 (en) * | 2007-05-29 | 2012-01-17 | The Regents Of The University Of California | Nanometer-scale transistor architecture providing enhanced carrier mobility |
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| US20060038182A1 (en) | 2004-06-04 | 2006-02-23 | The Board Of Trustees Of The University | Stretchable semiconductor elements and stretchable electrical circuits |
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| US20080108171A1 (en) | 2008-05-08 |
| MY149190A (en) | 2013-07-31 |
| EP2064734A2 (en) | 2009-06-03 |
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| JP5805712B2 (ja) | 2015-11-04 |
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| US20110171813A1 (en) | 2011-07-14 |
| US20140361409A1 (en) | 2014-12-11 |
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| US8895406B2 (en) | 2014-11-25 |
| TWI438827B (zh) | 2014-05-21 |
| JP2016040828A (ja) | 2016-03-24 |
| KR101430587B1 (ko) | 2014-08-14 |
| KR20140016432A (ko) | 2014-02-07 |
| EP2064734A4 (en) | 2014-03-26 |
| KR20140141662A (ko) | 2014-12-10 |
| CN101517700A (zh) | 2009-08-26 |
| JP2010504649A (ja) | 2010-02-12 |
| WO2008036837A2 (en) | 2008-03-27 |
| US7932123B2 (en) | 2011-04-26 |
| US20110316120A1 (en) | 2011-12-29 |
| CN103956336A (zh) | 2014-07-30 |
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