KR101510748B1 - 기판 지지 장치 - Google Patents

기판 지지 장치 Download PDF

Info

Publication number
KR101510748B1
KR101510748B1 KR20130080306A KR20130080306A KR101510748B1 KR 101510748 B1 KR101510748 B1 KR 101510748B1 KR 20130080306 A KR20130080306 A KR 20130080306A KR 20130080306 A KR20130080306 A KR 20130080306A KR 101510748 B1 KR101510748 B1 KR 101510748B1
Authority
KR
South Korea
Prior art keywords
substrate
arm
support
attachment
respect
Prior art date
Application number
KR20130080306A
Other languages
English (en)
Korean (ko)
Other versions
KR20140048793A (ko
Inventor
도시오 나라
하루미 다케마츠
Original Assignee
가부시키가이샤 아이프란트
도쿄 가코키 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아이프란트, 도쿄 가코키 컴퍼니 리미티드 filed Critical 가부시키가이샤 아이프란트
Publication of KR20140048793A publication Critical patent/KR20140048793A/ko
Application granted granted Critical
Publication of KR101510748B1 publication Critical patent/KR101510748B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR20130080306A 2012-10-15 2013-07-09 기판 지지 장치 KR101510748B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-227760 2012-10-15
JP2012227760A JP2014080645A (ja) 2012-10-15 2012-10-15 基板保持装置

Publications (2)

Publication Number Publication Date
KR20140048793A KR20140048793A (ko) 2014-04-24
KR101510748B1 true KR101510748B1 (ko) 2015-04-10

Family

ID=50450382

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130080306A KR101510748B1 (ko) 2012-10-15 2013-07-09 기판 지지 장치

Country Status (4)

Country Link
JP (1) JP2014080645A (zh)
KR (1) KR101510748B1 (zh)
CN (1) CN103726096B (zh)
TW (1) TWI575114B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015034071A (ja) * 2013-08-08 2015-02-19 日本電気硝子株式会社 シート部材搬送装置、シート部材支持装置、シート部材検査装置、およびシート部材搬送方法
CN103600954B (zh) 2013-10-11 2015-10-07 京东方科技集团股份有限公司 一种掩模板搬运治具
US10043689B2 (en) 2015-06-05 2018-08-07 Hirata Corporation Chamber apparatus and processing system
KR101687734B1 (ko) * 2015-06-11 2016-12-19 히라따기꼬오 가부시키가이샤 챔버 장치 및 처리 시스템
JP6276816B2 (ja) * 2015-10-01 2018-02-07 キヤノントッキ株式会社 基板引張装置、成膜装置、膜の製造方法及び有機電子デバイスの製造方法
KR102415814B1 (ko) * 2015-11-17 2022-07-01 세메스 주식회사 기판 적재 장치
JP6594760B2 (ja) * 2015-12-11 2019-10-23 日本ラック株式会社 引き込み機能付き挟持具、及び該挟持具を用いた張設治具
CN108604031A (zh) * 2016-02-08 2018-09-28 堺显示器制品株式会社 密封图案形成装置
CN106654065B (zh) * 2016-12-29 2018-03-30 武汉华星光电技术有限公司 一种用于柔性屏基板的剥离设备及柔性屏的制造方法
CN110293530A (zh) * 2019-06-25 2019-10-01 顺德职业技术学院 电控箱底板的安装平台
KR20200024178A (ko) * 2020-02-17 2020-03-06 엘지전자 주식회사 반도체 발광소자의 자가조립용 기판 척
EP4080552B1 (en) * 2021-04-23 2023-08-09 Semsysco GmbH Frame system for holding a substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306163A (ja) 2007-05-10 2008-12-18 Ihi Corp 基板搬送装置
KR100881333B1 (ko) * 2007-08-31 2009-02-02 주식회사 케이씨텍 박판형 인쇄회로기판의 이송장치
KR101169921B1 (ko) 2011-10-12 2012-08-06 주식회사 티케이씨 비접촉식 수직 현상기에서의 인쇄회로기판 파지용 카세트

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416888Y2 (zh) * 1975-03-03 1979-07-02
JPS5259038A (en) * 1975-11-12 1977-05-16 Mitsubishi Chem Ind Electrolytic treatment of aluminum plate
JPH10145030A (ja) * 1996-11-07 1998-05-29 Maruya Seisakusho:Kk プリント配線基板の基板保持用治具とその取付装置
JP2002004092A (ja) * 2000-06-14 2002-01-09 3R Systems Kk メッキ板懸吊具
US6908540B2 (en) * 2001-07-13 2005-06-21 Applied Materials, Inc. Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process
KR100582345B1 (ko) * 2003-12-09 2006-05-22 삼성코닝정밀유리 주식회사 유리기판의 검사를 위한 클램핑장치
US7670436B2 (en) * 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
CN101435102B (zh) * 2008-11-10 2010-06-02 昆山鼎鑫电子有限公司 一种治具固定框
CN102257186B (zh) * 2008-11-14 2014-10-15 加布里埃尔·李普曼-公共研究中心 用于镀覆导电基材的系统和在镀覆过程中用于夹持导电基材的基材夹持器
CN101892508B (zh) * 2009-05-18 2012-02-15 深圳市奥美特科技有限公司 Led支架连续电镀定位装置
CN201892508U (zh) * 2010-11-11 2011-07-06 无锡明珠增压器制造有限公司 深度尺测量孔内槽辅助套

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306163A (ja) 2007-05-10 2008-12-18 Ihi Corp 基板搬送装置
KR100881333B1 (ko) * 2007-08-31 2009-02-02 주식회사 케이씨텍 박판형 인쇄회로기판의 이송장치
KR101169921B1 (ko) 2011-10-12 2012-08-06 주식회사 티케이씨 비접촉식 수직 현상기에서의 인쇄회로기판 파지용 카세트

Also Published As

Publication number Publication date
CN103726096A (zh) 2014-04-16
JP2014080645A (ja) 2014-05-08
TWI575114B (zh) 2017-03-21
TW201414880A (zh) 2014-04-16
KR20140048793A (ko) 2014-04-24
CN103726096B (zh) 2016-07-06

Similar Documents

Publication Publication Date Title
KR101510748B1 (ko) 기판 지지 장치
US20150014124A1 (en) Glass substrate conveyance device and conveyance method
WO2010073955A1 (ja) 可撓性基板の処理装置
WO2010087218A1 (ja) 可撓性基板の位置制御装置
US20120288347A1 (en) Conveying device and vacuum apparatus
JP2008302451A (ja) 液晶搬送ロボットおよびその制御方法
US8505991B2 (en) Conveying device and vacuum apparatus
JP2017057485A (ja) 真空処理装置
US8528725B2 (en) Flexible substrate conveying device
DE112014003314T5 (de) Vorrichtung und Verfahren zum Ausrichten und Zentrieren von Wafern
JP2018098377A (ja) 基板搬送装置用のキャリア
JPH06247728A (ja) 板状材の曲げ成形装置のアライメント方法及びその装置
JP5126088B2 (ja) 薄膜積層体の製造装置
JP5787216B2 (ja) 薄膜積層体製造装置およびその運転方法
JP2008302452A (ja) 液晶搬送ロボットおよびその制御方法
JP5347491B2 (ja) 薄膜形成装置
JP6251245B2 (ja) 板を曲げることによるローラの調整を有するインク装置及び調整方法
JP5488997B2 (ja) 薄膜積層体製造装置の基板位置制御装置
JP4094929B2 (ja) プレス機の駆動部位置検出装置
JP5196283B2 (ja) 可撓性基板の位置制御装置
JP5727243B2 (ja) 板状部材の支持装置及び支持方法
JP5224930B2 (ja) 転写装置
JP4465690B2 (ja) 基板の垂直保持装置
CN205853349U (zh) 横向拉伸设备链夹张紧调整装置
KR101608601B1 (ko) 샤프트홀더 정밀 셋업 장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
FPAY Annual fee payment

Payment date: 20180315

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20190329

Year of fee payment: 5