JP6276816B2 - 基板引張装置、成膜装置、膜の製造方法及び有機電子デバイスの製造方法 - Google Patents
基板引張装置、成膜装置、膜の製造方法及び有機電子デバイスの製造方法 Download PDFInfo
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Description
2 辺部
3,4 把持片
Claims (17)
- 互いに対向する一対のクランプ機構が備えられた基板引張装置であって、
前記クランプ機構には、基板を上下から挟む把持部が複数備えられ、
前記把持部ごとに前記基板を把持するための押圧力及び前記基板を外方側に引張るための引張力を前記把持部に伝達する駆動手段が備えられ、
この駆動手段は、前記把持部により前記基板の対向する一対の辺部を夫々把持した状態で、対向する前記把持部を互いに離間させることで前記基板を外方側に引張るように構成されており、
前記クランプ機構には、前記把持部ごとに備える前記駆動手段の夫々の押圧力及び引張力を、駆動手段ごとに夫々個別に調整することが可能な個別調整手段が備えられていることを特徴とする基板引張装置。 - 前記クランプ機構の前記把持部には一対の把持片が備えられており、この一対の把持片により、上下から前記基板を押圧すると共に、把持した基板を外方側に引張るように前記駆動手段が構成されていることを特徴とする請求項1に記載の基板引張装置。
- 前記クランプ機構には、前記把持部ごとに備える駆動手段の夫々の押圧力若しくは引張力、またはそれらの両方を、駆動手段ごとに個別に制御することが可能な個別制御手段が備えられていることを特徴とする請求項1に記載の基板引張装置。
- 前記クランプ機構には、前記把持部ごとに備える駆動手段の前記個別制御手段同士を連携させて制御することが可能な連携制御手段が備えられていることを特徴とする請求項3に記載の基板引張装置。
- 前記個別調整手段若しくは前記個別制御手段は、把持する基板の辺部において生じている弛みの度合いに応じて、前記把持部ごとに備える駆動手段の夫々の押圧力若しくは引張力、またはそれらの両方を個別に調整若しくは個別に制御するように構成されていることを特徴とする請求項1〜3のいずれか1項に記載の基板引張装置。
- 前記個別調整手段若しくは前記個別制御手段は、把持する基板の辺部の中央領域における押圧力若しくは引張力、またはそれらの両方が、把持する基板の辺部の端部領域よりも高くなるように、前記把持部ごとの駆動手段を個別に調整若しくは個別に制御するように構成されていることを特徴とする請求項1〜3のいずれか1項に記載の基板引張装置。
- 前記個別調整手段若しくは前記個別制御手段は、前記把持部ごとに備える夫々の駆動手段による引張力で基板を引張るタイミングを、夫々駆動手段ごとに個別に調整若しくは個別に制御するように構成されていることを特徴とする請求項1〜3のいずれか1項に記載の基板引張装置。
- 前記駆動手段による引張力で基板を引張るタイミングが、把持する基板の辺部の中央領域では、把持する辺部の端部領域よりも先となるように前記個別調整手段若しくは前記個別制御手段が構成されていることを特徴とする請求項7に記載の基板引張装置。
- 前記駆動手段による引張力で基板を引張るタイミングが、把持する基板の辺部の端部領域に向かうに従って次第に遅れるように前記個別調整手段若しくは前記個別制御手段が構成されていることを特徴とする請求項8に記載の基板引張装置。
- 前記連携制御手段は、把持する基板の辺部において生じている弛みの度合いに応じて、前記把持部ごとに備える駆動手段の個別制御手段同士を連携して制御するように構成されていることを特徴とする請求項4に記載の基板引張装置。
- 前記連携制御手段は、把持する基板の辺部の中央領域における押圧力若しくは引張力、またはそれらの両方が、把持する辺部の端部領域よりも高くなるように、前記把持部ごとに備える駆動手段を制御するように構成されていることを特徴とする請求項4に記載の基板引張装置。
- 前記連携制御手段は、前記把持する基板の弛みの度合いを、使用する基板の材質・形状・面積・重量・縦横比などによってグループ化したそれぞれの基板グループごとに予め測定しておいた基板弛み傾向を用いて決定し、決定した基板の弛み度合いに応じて、前記把持部ごとに備える駆動手段の個別制御手段同士を連携して制御するように構成されていることを特徴とする請求項10に記載の基板引張装置。
- 前記把持する基板の弛みを検出する弛み検出手段が備えられていることを特徴とする請求項1〜10のいずれか1項に記載の基板引張装置。
- 前記個別制御手段は、対向する一対の前記クランプ機構のうち片方のクランプ機構の前記駆動手段を、夫々制御するように構成されていることを特徴とする請求項3に記載の基板引張装置。
- 成膜室内に設置された基板に成膜を行う成膜装置であって、
請求項1〜14のいずれか1項に記載の基板引張装置が設けられていることを特徴とする成膜装置。 - 膜の製造方法であって、
基板を成膜室に搬入する工程と、
前記基板を把持して外方側に引張る工程と、
前記基板に膜を付着させる工程と、
を有し、
前記基板を把持して外方側に引張る工程において、請求項1〜14のいずれか1項に記載の基板引張装置を用いることを特徴とする膜の製造方法。 - 基板の上に一対の電極に挟まれた有機層を備える素子を複数備える有機電子デバイスの製造方法であって、
複数の電極を備える基板を蒸着室に搬入する工程と、
前記基板を把持して外方側に引張る工程と、
蒸発源に収容された有機材料を加熱する工程と、
前記基板に前記有機材料の蒸気を付着させる工程と、
を有し、
前記を把持して外方側に引張る工程において、請求項1〜14のいずれか1項に記載の基板引張装置を用いることを特徴とする有機電子デバイスの製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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TW105130641A TWI691111B (zh) | 2015-10-01 | 2016-09-22 | 基板拉伸裝置、成膜裝置、膜的製造方法及有機電子裝置的製造方法 |
KR1020160125500A KR101968804B1 (ko) | 2015-10-01 | 2016-09-29 | 기판 인장 장치, 성막 장치, 막의 제조방법 및 유기 전자 디바이스의 제조방법 |
CN201610874058.8A CN106967957B (zh) | 2015-10-01 | 2016-09-30 | 基板拉伸装置、成膜装置以及膜和有机电子器件的制造方法 |
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JP6461235B2 (ja) * | 2017-05-22 | 2019-01-30 | キヤノントッキ株式会社 | 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法 |
KR102003467B1 (ko) * | 2017-07-28 | 2019-07-24 | 주식회사 필옵틱스 | 기판 처짐 변형 조절 장치 |
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JP6821641B2 (ja) * | 2018-12-25 | 2021-01-27 | キヤノントッキ株式会社 | 基板載置装置、成膜装置、基板載置方法、成膜方法、および電子デバイスの製造方法 |
CN109530162B (zh) * | 2018-12-27 | 2020-08-14 | 杭州小橙工业设计有限公司 | 一种led加工系统 |
JP2021073373A (ja) * | 2021-01-05 | 2021-05-13 | キヤノントッキ株式会社 | 基板載置方法、電子デバイスの製造方法、基板保持装置、及び電子デバイスの製造方法 |
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JP2005281746A (ja) * | 2004-03-29 | 2005-10-13 | Seiko Epson Corp | 蒸着装置、蒸着方法、電気光学装置、および電子機器 |
CN101842513B (zh) * | 2007-12-26 | 2012-05-23 | 佳能安内华股份有限公司 | 基板保持器、使用基板保持器的成膜方法、硬盘制造方法、成膜设备及程序 |
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