KR101505355B1 - 배선기판, 다수개 취득 배선기판, 및 그 제조방법 - Google Patents

배선기판, 다수개 취득 배선기판, 및 그 제조방법 Download PDF

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Publication number
KR101505355B1
KR101505355B1 KR1020137030740A KR20137030740A KR101505355B1 KR 101505355 B1 KR101505355 B1 KR 101505355B1 KR 1020137030740 A KR1020137030740 A KR 1020137030740A KR 20137030740 A KR20137030740 A KR 20137030740A KR 101505355 B1 KR101505355 B1 KR 101505355B1
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South Korea
Prior art keywords
wiring board
back surface
metallization layer
front surface
groove
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Expired - Fee Related
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KR1020137030740A
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English (en)
Korean (ko)
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KR20140004223A (ko
Inventor
마사미 하세가와
사토시 히라야마
나오키 기토
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니혼도꾸슈도교 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/0036—Laser treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020137030740A 2011-04-25 2012-02-01 배선기판, 다수개 취득 배선기판, 및 그 제조방법 Expired - Fee Related KR101505355B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011096829A JP6006474B2 (ja) 2011-04-25 2011-04-25 配線基板、多数個取り配線基板、およびその製造方法
JPJP-P-2011-096829 2011-04-25
PCT/JP2012/000671 WO2012147243A1 (ja) 2011-04-25 2012-02-01 配線基板、多数個取り配線基板、およびその製造方法

Publications (2)

Publication Number Publication Date
KR20140004223A KR20140004223A (ko) 2014-01-10
KR101505355B1 true KR101505355B1 (ko) 2015-03-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137030740A Expired - Fee Related KR101505355B1 (ko) 2011-04-25 2012-02-01 배선기판, 다수개 취득 배선기판, 및 그 제조방법

Country Status (7)

Country Link
US (1) US9295151B2 (https=)
EP (1) EP2704537B1 (https=)
JP (1) JP6006474B2 (https=)
KR (1) KR101505355B1 (https=)
CN (1) CN103444270B (https=)
TW (1) TWI488551B (https=)
WO (1) WO2012147243A1 (https=)

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JP2015159204A (ja) * 2014-02-25 2015-09-03 日本特殊陶業株式会社 セラミックパッケージ
CN106463476B (zh) * 2014-04-22 2019-07-16 京瓷株式会社 布线基板、电子装置以及电子模块
JP6482785B2 (ja) * 2014-07-28 2019-03-13 ローム株式会社 半導体装置および半導体装置の製造方法
JP2016149419A (ja) * 2015-02-11 2016-08-18 日本特殊陶業株式会社 多数個取り配線基板の製造方法
JP2017022334A (ja) * 2015-07-15 2017-01-26 Ｎｇｋエレクトロデバイス株式会社 多数個取り配線基板及びその製造方法
EP3448133B1 (en) 2016-04-22 2020-12-02 Kyocera Corporation Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board
EP3361839A1 (en) * 2017-02-14 2018-08-15 Infineon Technologies AG Multiple substrate and method for its fabrication
TWI610403B (zh) * 2017-03-03 2018-01-01 矽品精密工業股份有限公司 基板結構及其製法與電子封裝件
JP7153438B2 (ja) * 2017-10-26 2022-10-14 日東電工株式会社 基板集合体シート
WO2020004565A1 (ja) * 2018-06-28 2020-01-02 京セラ株式会社 回路基板およびこれを備える電子装置
CN113365541B (zh) * 2019-03-28 2024-05-07 奥林巴斯株式会社 内窥镜的前端框、前端单元和内窥镜
KR102844112B1 (ko) * 2022-08-10 2025-08-07 앱솔릭스 인코포레이티드 코어기판, 기판 및 반도체 패키징 기판의 용도
CN116402008B (zh) * 2023-03-13 2024-06-14 本源量子计算科技（合肥）股份有限公司 量子芯片频率调控线的布图构建方法、系统、介质及设备

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JP2002043701A (ja) 2000-07-25 2002-02-08 Kyocera Corp 多数個取りセラミック配線基板およびセラミック配線基板
JP2005285865A (ja) 2004-03-26 2005-10-13 Kyocera Corp 多数個取り配線基板
JP2008186967A (ja) 2007-01-30 2008-08-14 Ngk Spark Plug Co Ltd 多数個取り基板

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Publication number Priority date Publication date Assignee Title
JP2002043701A (ja) 2000-07-25 2002-02-08 Kyocera Corp 多数個取りセラミック配線基板およびセラミック配線基板
JP2005285865A (ja) 2004-03-26 2005-10-13 Kyocera Corp 多数個取り配線基板
JP2008186967A (ja) 2007-01-30 2008-08-14 Ngk Spark Plug Co Ltd 多数個取り基板

Also Published As

Publication number Publication date
TW201251540A (en) 2012-12-16
EP2704537B1 (en) 2019-07-10
CN103444270B (zh) 2016-03-30
WO2012147243A1 (ja) 2012-11-01
KR20140004223A (ko) 2014-01-10
JP6006474B2 (ja) 2016-10-12
EP2704537A4 (en) 2014-10-08
CN103444270A (zh) 2013-12-11
US20150107879A1 (en) 2015-04-23
JP2012230945A (ja) 2012-11-22
TWI488551B (zh) 2015-06-11
US9295151B2 (en) 2016-03-22
EP2704537A1 (en) 2014-03-05

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