JP6006474B2 - 配線基板、多数個取り配線基板、およびその製造方法 - Google Patents

配線基板、多数個取り配線基板、およびその製造方法 Download PDF

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Publication number
JP6006474B2
JP6006474B2 JP2011096829A JP2011096829A JP6006474B2 JP 6006474 B2 JP6006474 B2 JP 6006474B2 JP 2011096829 A JP2011096829 A JP 2011096829A JP 2011096829 A JP2011096829 A JP 2011096829A JP 6006474 B2 JP6006474 B2 JP 6006474B2
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JP
Japan
Prior art keywords
wiring board
substrate body
metallized layer
groove
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011096829A
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English (en)
Japanese (ja)
Other versions
JP2012230945A (ja
JP2012230945A5 (https=
Inventor
政美 長谷川
政美 長谷川
平山　聡
聡 平山
鬼頭　直樹
直樹 鬼頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2011096829A priority Critical patent/JP6006474B2/ja
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to KR1020137030740A priority patent/KR101505355B1/ko
Priority to PCT/JP2012/000671 priority patent/WO2012147243A1/ja
Priority to CN201280014410.0A priority patent/CN103444270B/zh
Priority to EP12777596.3A priority patent/EP2704537B1/en
Priority to US14/000,568 priority patent/US9295151B2/en
Priority to TW101113884A priority patent/TWI488551B/zh
Publication of JP2012230945A publication Critical patent/JP2012230945A/ja
Publication of JP2012230945A5 publication Critical patent/JP2012230945A5/ja
Application granted granted Critical
Publication of JP6006474B2 publication Critical patent/JP6006474B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/0036—Laser treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011096829A 2011-04-25 2011-04-25 配線基板、多数個取り配線基板、およびその製造方法 Expired - Fee Related JP6006474B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011096829A JP6006474B2 (ja) 2011-04-25 2011-04-25 配線基板、多数個取り配線基板、およびその製造方法
PCT/JP2012/000671 WO2012147243A1 (ja) 2011-04-25 2012-02-01 配線基板、多数個取り配線基板、およびその製造方法
CN201280014410.0A CN103444270B (zh) 2011-04-25 2012-02-01 布线基板、多连片布线基板及其制造方法
EP12777596.3A EP2704537B1 (en) 2011-04-25 2012-02-01 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
KR1020137030740A KR101505355B1 (ko) 2011-04-25 2012-02-01 배선기판, 다수개 취득 배선기판, 및 그 제조방법
US14/000,568 US9295151B2 (en) 2011-04-25 2012-02-01 Wiring substrate, multi-piece wiring substrate, and method for manufacturing same
TW101113884A TWI488551B (zh) 2011-04-25 2012-04-19 配線基板、多片式配線基板、及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011096829A JP6006474B2 (ja) 2011-04-25 2011-04-25 配線基板、多数個取り配線基板、およびその製造方法

Publications (3)

Publication Number Publication Date
JP2012230945A JP2012230945A (ja) 2012-11-22
JP2012230945A5 JP2012230945A5 (https=) 2014-12-25
JP6006474B2 true JP6006474B2 (ja) 2016-10-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011096829A Expired - Fee Related JP6006474B2 (ja) 2011-04-25 2011-04-25 配線基板、多数個取り配線基板、およびその製造方法

Country Status (7)

Country Link
US (1) US9295151B2 (https=)
EP (1) EP2704537B1 (https=)
JP (1) JP6006474B2 (https=)
KR (1) KR101505355B1 (https=)
CN (1) CN103444270B (https=)
TW (1) TWI488551B (https=)
WO (1) WO2012147243A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015159204A (ja) * 2014-02-25 2015-09-03 日本特殊陶業株式会社 セラミックパッケージ
CN106463476B (zh) * 2014-04-22 2019-07-16 京瓷株式会社 布线基板、电子装置以及电子模块
JP6482785B2 (ja) * 2014-07-28 2019-03-13 ローム株式会社 半導体装置および半導体装置の製造方法
JP2016149419A (ja) * 2015-02-11 2016-08-18 日本特殊陶業株式会社 多数個取り配線基板の製造方法
JP2017022334A (ja) * 2015-07-15 2017-01-26 Ｎｇｋエレクトロデバイス株式会社 多数個取り配線基板及びその製造方法
EP3448133B1 (en) 2016-04-22 2020-12-02 Kyocera Corporation Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board
EP3361839A1 (en) * 2017-02-14 2018-08-15 Infineon Technologies AG Multiple substrate and method for its fabrication
TWI610403B (zh) * 2017-03-03 2018-01-01 矽品精密工業股份有限公司 基板結構及其製法與電子封裝件
JP7153438B2 (ja) * 2017-10-26 2022-10-14 日東電工株式会社 基板集合体シート
WO2020004565A1 (ja) * 2018-06-28 2020-01-02 京セラ株式会社 回路基板およびこれを備える電子装置
CN113365541B (zh) * 2019-03-28 2024-05-07 奥林巴斯株式会社 内窥镜的前端框、前端单元和内窥镜
KR102844112B1 (ko) * 2022-08-10 2025-08-07 앱솔릭스 인코포레이티드 코어기판, 기판 및 반도체 패키징 기판의 용도
CN116402008B (zh) * 2023-03-13 2024-06-14 本源量子计算科技（合肥）股份有限公司 量子芯片频率调控线的布图构建方法、系统、介质及设备

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JP3856573B2 (ja) * 1998-08-24 2006-12-13 日本特殊陶業株式会社 リードレスパッケージの製造方法
JP2002043701A (ja) * 2000-07-25 2002-02-08 Kyocera Corp 多数個取りセラミック配線基板およびセラミック配線基板
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WO2012046640A1 (ja) 2010-10-08 2012-04-12 日本特殊陶業株式会社 多数個取り配線基板およびその製造方法

Also Published As

Publication number Publication date
TW201251540A (en) 2012-12-16
EP2704537B1 (en) 2019-07-10
CN103444270B (zh) 2016-03-30
WO2012147243A1 (ja) 2012-11-01
KR20140004223A (ko) 2014-01-10
EP2704537A4 (en) 2014-10-08
CN103444270A (zh) 2013-12-11
KR101505355B1 (ko) 2015-03-23
US20150107879A1 (en) 2015-04-23
JP2012230945A (ja) 2012-11-22
TWI488551B (zh) 2015-06-11
US9295151B2 (en) 2016-03-22
EP2704537A1 (en) 2014-03-05

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