KR101478690B1 - 신규 층상 인산 지르코늄 - Google Patents

신규 층상 인산 지르코늄 Download PDF

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Publication number
KR101478690B1
KR101478690B1 KR1020097008040A KR20097008040A KR101478690B1 KR 101478690 B1 KR101478690 B1 KR 101478690B1 KR 1020097008040 A KR1020097008040 A KR 1020097008040A KR 20097008040 A KR20097008040 A KR 20097008040A KR 101478690 B1 KR101478690 B1 KR 101478690B1
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South Korea
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zirconium phosphate
layered zirconium
layered
present
sealing
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Korean (ko)
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KR20090073180A (ko
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야스하루 오노
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도아고세이가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B25/00—Phosphorus; Compounds thereof
    • C01B25/16—Oxyacids of phosphorus; Salts thereof
    • C01B25/26—Phosphates
    • C01B25/45—Phosphates containing plural metal, or metal and ammonium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B25/00—Phosphorus; Compounds thereof
    • C01B25/16—Oxyacids of phosphorus; Salts thereof
    • C01B25/26—Phosphates
    • C01B25/37—Phosphates of heavy metals
    • C01B25/372—Phosphates of heavy metals of titanium, vanadium, zirconium, niobium, hafnium or tantalum
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G25/00—Compounds of zirconium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C09D5/082—Anti-corrosive paints characterised by the anti-corrosive pigment
    • C09D5/084—Inorganic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Plant Pathology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020097008040A 2006-10-27 2007-10-15 신규 층상 인산 지르코늄 Active KR101478690B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006293174 2006-10-27
JPJP-P-2006-293174 2006-10-27
PCT/JP2007/070075 WO2008053694A1 (fr) 2006-10-27 2007-10-15 Nouveau phosphate de zirconium lamellaire

Publications (2)

Publication Number Publication Date
KR20090073180A KR20090073180A (ko) 2009-07-02
KR101478690B1 true KR101478690B1 (ko) 2015-01-02

Family

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Family Applications (1)

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KR1020097008040A Active KR101478690B1 (ko) 2006-10-27 2007-10-15 신규 층상 인산 지르코늄

Country Status (6)

Country Link
US (1) US8066810B2 (enExample)
JP (2) JP5157911B2 (enExample)
KR (1) KR101478690B1 (enExample)
CN (1) CN101528594B (enExample)
TW (1) TW200819391A (enExample)
WO (1) WO2008053694A1 (enExample)

Cited By (1)

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KR20180089524A (ko) * 2016-02-25 2018-08-08 아사히 가세이 가부시키가이샤 비수 전해질 전지용 무기 입자 및 비수 전해질 전지

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JP5658536B2 (ja) * 2010-03-08 2015-01-28 日新製鋼株式会社 塗装アルミニウムめっき鋼板
KR101263086B1 (ko) * 2010-12-28 2013-05-09 주식회사 포스코 판상형 지르코늄포스페이트 및 그의 제조 방법
WO2013109297A2 (en) 2011-04-14 2013-07-25 University Of Florida Research Foundation. Inc. Filter materials, filters, filtering systems, and methods of filtering
JP5724578B2 (ja) * 2011-04-20 2015-05-27 東亞合成株式会社 層状リン酸ジルコニウムの製造方法
JP5821258B2 (ja) * 2011-04-20 2015-11-24 東亞合成株式会社 層状リン酸ジルコニウムの製造方法
KR20150040977A (ko) * 2012-08-06 2015-04-15 도아고세이가부시키가이샤 필러 및 유리 조성물, 그리고 육방정 인산염의 제조 방법
JP2014150246A (ja) * 2013-01-08 2014-08-21 Sumitomo Chemical Co Ltd 太陽電池用封止シート
CN103072965B (zh) * 2013-01-28 2014-05-28 太原理工大学 一种磷酸铜锆材料的制备及应用方法
JP6052428B2 (ja) * 2013-11-20 2016-12-27 東亞合成株式会社 フィラー及びガラス組成物、並びに六方晶リン酸塩系化合物の製造方法
JP6710034B2 (ja) * 2014-12-12 2020-06-17 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6304404B2 (ja) 2014-12-26 2018-04-04 東亞合成株式会社 消臭剤組成物及び消臭製品
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CN105386150A (zh) * 2015-11-30 2016-03-09 东华大学 一种PET-有机插层α-ZrP复合纤维材料的制备方法
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JP6512181B2 (ja) * 2016-06-23 2019-05-15 信越化学工業株式会社 フォトカプラー一次封止用熱硬化性シリコーン樹脂組成物、該組成物で封止されたフォトカプラー及び該フォトカプラーを有する光半導体装置
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JP6965553B2 (ja) * 2017-04-14 2021-11-10 東亞合成株式会社 微粒子状繊維用消臭剤
CN108034078B (zh) * 2017-12-15 2020-04-28 深圳南科二维复材科技有限公司 一种氟化碳材料/磷酸锆二元复合材料、制备方法及其应用
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CN108862225A (zh) * 2018-07-26 2018-11-23 绵竹耀隆化工有限公司 一种批量制备纳米级α-ZrP晶体的方法
CN109336076B (zh) * 2018-11-13 2020-07-28 华南理工大学 一种绿色高效剥离层状磷酸锆的方法
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JP7599356B2 (ja) 2021-03-08 2024-12-13 株式会社デンソー 光硬化性接着剤
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CN115057422A (zh) * 2021-12-06 2022-09-16 上海朗亿功能材料有限公司 一种片层状磷酸锆及其制备方法和应用
CN114698646A (zh) * 2022-01-07 2022-07-05 福建瑞森新材料股份有限公司 一种片状椭球体磷酸锆载银锌抗菌粉体的制备方法
CN114835096A (zh) * 2022-04-28 2022-08-02 晋大纳米科技（厦门）有限公司 一种离子交换剂及其制备方法
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180089524A (ko) * 2016-02-25 2018-08-08 아사히 가세이 가부시키가이샤 비수 전해질 전지용 무기 입자 및 비수 전해질 전지
US10680291B2 (en) 2016-02-25 2020-06-09 Asahi Kasei Kabushiki Kaisha Nonaqueous electrolyte battery inorganic particles and nonaqueous electrolyte battery
KR102233533B1 (ko) * 2016-02-25 2021-03-29 아사히 가세이 가부시키가이샤 비수 전해질 전지용 무기 입자 및 비수 전해질 전지

Also Published As

Publication number Publication date
US20090272293A1 (en) 2009-11-05
TW200819391A (en) 2008-05-01
JPWO2008053694A1 (ja) 2010-02-25
JP5157911B2 (ja) 2013-03-06
CN101528594B (zh) 2012-05-30
JP5545328B2 (ja) 2014-07-09
TWI363039B (enExample) 2012-05-01
WO2008053694A1 (fr) 2008-05-08
JP2012254925A (ja) 2012-12-27
CN101528594A (zh) 2009-09-09
US8066810B2 (en) 2011-11-29
KR20090073180A (ko) 2009-07-02

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