KR101449005B1 - 반도체 발광소자 및 그 제조방법 - Google Patents

반도체 발광소자 및 그 제조방법 Download PDF

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Publication number
KR101449005B1
KR101449005B1 KR1020070120649A KR20070120649A KR101449005B1 KR 101449005 B1 KR101449005 B1 KR 101449005B1 KR 1020070120649 A KR1020070120649 A KR 1020070120649A KR 20070120649 A KR20070120649 A KR 20070120649A KR 101449005 B1 KR101449005 B1 KR 101449005B1
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KR
South Korea
Prior art keywords
layer
light emitting
conductive
emitting device
semiconductor layer
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Expired - Fee Related
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KR1020070120649A
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English (en)
Korean (ko)
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KR20090054008A (ko
Inventor
박형조
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엘지이노텍 주식회사
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Priority to KR1020070120649A priority Critical patent/KR101449005B1/ko
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to JP2010534897A priority patent/JP5550078B2/ja
Priority to US12/743,197 priority patent/US8253156B2/en
Priority to EP08855034.8A priority patent/EP2201618B1/en
Priority to EP12166234.0A priority patent/EP2485280B1/en
Priority to DE202008018199U priority patent/DE202008018199U1/de
Priority to CN2008801178926A priority patent/CN101874308B/zh
Priority to PCT/KR2008/006947 priority patent/WO2009069929A2/en
Priority to CN201210251517.9A priority patent/CN102751405B/zh
Publication of KR20090054008A publication Critical patent/KR20090054008A/ko
Priority to US13/560,812 priority patent/US8618571B2/en
Priority to US13/936,032 priority patent/US8969902B2/en
Priority to JP2014007182A priority patent/JP2014096603A/ja
Application granted granted Critical
Publication of KR101449005B1 publication Critical patent/KR101449005B1/ko
Priority to US14/599,184 priority patent/US9472739B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8316Multi-layer electrodes comprising at least one discontinuous layer

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  • Led Devices (AREA)
KR1020070120649A 2007-11-26 2007-11-26 반도체 발광소자 및 그 제조방법 Expired - Fee Related KR101449005B1 (ko)

Priority Applications (13)

Application Number Priority Date Filing Date Title
KR1020070120649A KR101449005B1 (ko) 2007-11-26 2007-11-26 반도체 발광소자 및 그 제조방법
PCT/KR2008/006947 WO2009069929A2 (en) 2007-11-26 2008-11-25 Semiconductor light emitting device
EP08855034.8A EP2201618B1 (en) 2007-11-26 2008-11-25 Semiconductor light emitting device
EP12166234.0A EP2485280B1 (en) 2007-11-26 2008-11-25 Semiconductor light emitting device
DE202008018199U DE202008018199U1 (de) 2007-11-26 2008-11-25 Lichtemittierende Halbleitervorrichtung
CN2008801178926A CN101874308B (zh) 2007-11-26 2008-11-25 半导体发光器件
JP2010534897A JP5550078B2 (ja) 2007-11-26 2008-11-25 半導体発光素子
CN201210251517.9A CN102751405B (zh) 2007-11-26 2008-11-25 半导体发光器件
US12/743,197 US8253156B2 (en) 2007-11-26 2008-11-25 Semiconductor light emitting device
US13/560,812 US8618571B2 (en) 2007-11-26 2012-07-27 Semiconductor light emitting device having a reflective layer
US13/936,032 US8969902B2 (en) 2007-11-26 2013-07-05 Semiconductor light emitting device
JP2014007182A JP2014096603A (ja) 2007-11-26 2014-01-17 半導体発光素子
US14/599,184 US9472739B2 (en) 2007-11-26 2015-01-16 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070120649A KR101449005B1 (ko) 2007-11-26 2007-11-26 반도체 발광소자 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20090054008A KR20090054008A (ko) 2009-05-29
KR101449005B1 true KR101449005B1 (ko) 2014-10-08

Family

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Family Applications (1)

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KR1020070120649A Expired - Fee Related KR101449005B1 (ko) 2007-11-26 2007-11-26 반도체 발광소자 및 그 제조방법

Country Status (7)

Country Link
US (4) US8253156B2 (enExample)
EP (2) EP2201618B1 (enExample)
JP (2) JP5550078B2 (enExample)
KR (1) KR101449005B1 (enExample)
CN (2) CN102751405B (enExample)
DE (1) DE202008018199U1 (enExample)
WO (1) WO2009069929A2 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101449005B1 (ko) * 2007-11-26 2014-10-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101550922B1 (ko) * 2009-03-10 2015-09-07 엘지이노텍 주식회사 발광 소자
JP2011029574A (ja) * 2009-03-31 2011-02-10 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体素子の製造方法
JP2011009524A (ja) * 2009-06-26 2011-01-13 Hitachi Cable Ltd 発光素子及び発光素子の製造方法
KR101072034B1 (ko) 2009-10-15 2011-10-10 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101014013B1 (ko) 2009-10-15 2011-02-10 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101081193B1 (ko) 2009-10-15 2011-11-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101114047B1 (ko) 2009-10-22 2012-03-09 엘지이노텍 주식회사 발광소자 및 그 제조방법
KR101039896B1 (ko) 2009-12-03 2011-06-09 엘지이노텍 주식회사 발광소자 및 그 제조방법
EP2942823B1 (en) * 2009-12-09 2021-05-05 LG Innotek Co., Ltd. Light emitting device, light emitting package, and lighting system
KR101028314B1 (ko) * 2010-01-29 2011-04-12 엘지이노텍 주식회사 발광 소자 및 그 제조방법
KR101064020B1 (ko) 2010-04-23 2011-09-08 엘지이노텍 주식회사 발광 소자 및 그 제조방법
TW201248915A (en) * 2011-05-31 2012-12-01 Aceplux Optotech Inc Light-emitting diode of high light-extraction efficiency and its preparation method
KR101877396B1 (ko) * 2011-09-07 2018-08-09 엘지이노텍 주식회사 발광소자
US8957440B2 (en) * 2011-10-04 2015-02-17 Cree, Inc. Light emitting devices with low packaging factor
US9847372B2 (en) * 2011-12-01 2017-12-19 Micron Technology, Inc. Solid state transducer devices with separately controlled regions, and associated systems and methods
KR102083837B1 (ko) * 2011-12-12 2020-03-03 센서 일렉트로닉 테크놀로지, 인크 자외선 반사성 접촉부
US9818912B2 (en) 2011-12-12 2017-11-14 Sensor Electronic Technology, Inc. Ultraviolet reflective contact
CN104103722B (zh) 2013-04-15 2017-03-01 展晶科技(深圳)有限公司 发光二极管晶粒及其制造方法
JP6110217B2 (ja) * 2013-06-10 2017-04-05 ソニーセミコンダクタソリューションズ株式会社 発光素子の製造方法
CN103346227B (zh) * 2013-07-03 2016-04-06 河北工业大学 一种氮化镓基发光二极管芯片及其制备方法
CN104218134B (zh) * 2014-09-15 2017-02-15 映瑞光电科技(上海)有限公司 一种具有特殊粗化形貌的led垂直芯片结构及其制备方法
US9472719B2 (en) * 2015-02-18 2016-10-18 Epistar Corporation Light-emitting diode
KR20170108321A (ko) 2016-03-17 2017-09-27 주식회사 루멘스 발광 다이오드
CN108767081B (zh) * 2018-03-06 2020-01-24 天津三安光电有限公司 倒装发光二极管及其制作方法
KR102346212B1 (ko) * 2018-12-31 2022-01-03 주식회사 나노엑스 양면 발광 led 칩
JP7352941B2 (ja) * 2019-08-28 2023-09-29 学校法人 名城大学 窒化物半導体多層膜反射鏡の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
JP2006054420A (ja) 2004-08-11 2006-02-23 Samsung Electro Mech Co Ltd 窒化物半導体発光素子及びその製造方法、並びに窒化物半導体発光素子を備えたフリップチップ構造の発光装置
JP2007096327A (ja) 2005-09-29 2007-04-12 Osram Opto Semiconductors Gmbh ビーム放射半導体チップ

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2809692B2 (ja) 1989-04-28 1998-10-15 株式会社東芝 半導体発光素子およびその製造方法
DE69025273T2 (de) 1989-11-22 1996-07-11 Daido Steel Co Ltd Lichtemittierende Diode mit lichtreflektierender Schicht
EP1313153A3 (en) 1992-07-23 2005-05-04 Toyoda Gosei Co., Ltd. Light-emitting device of gallium nitride compound semiconductor
JP3312049B2 (ja) * 1993-03-12 2002-08-05 シャープ株式会社 半導体発光装置
JP3316062B2 (ja) * 1993-12-09 2002-08-19 株式会社東芝 半導体発光素子
DE19629920B4 (de) * 1995-08-10 2006-02-02 LumiLeds Lighting, U.S., LLC, San Jose Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor
US6320206B1 (en) 1999-02-05 2001-11-20 Lumileds Lighting, U.S., Llc Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks
US6531719B2 (en) * 1999-09-29 2003-03-11 Toyoda Gosei Co., Ltd. Group III nitride compound semiconductor device
JP2002111057A (ja) 2000-09-29 2002-04-12 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子
US7180100B2 (en) * 2001-03-27 2007-02-20 Ricoh Company, Ltd. Semiconductor light-emitting device, surface-emission laser diode, and production apparatus thereof, production method, optical module and optical telecommunication system
KR20020081947A (ko) 2001-04-20 2002-10-30 주식회사 옵토웨이퍼테크 다중반사막을 포함한 발광소자 및 그 제조방법
TW564584B (en) 2001-06-25 2003-12-01 Toshiba Corp Semiconductor light emitting device
US6784462B2 (en) 2001-12-13 2004-08-31 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
US20040104395A1 (en) * 2002-11-28 2004-06-03 Shin-Etsu Handotai Co., Ltd. Light-emitting device, method of fabricating the same, and OHMIC electrode structure for semiconductor device
JP2005142532A (ja) * 2003-10-14 2005-06-02 Matsushita Electric Ind Co Ltd 窒化物半導体素子の製造方法
JP4604488B2 (ja) * 2003-12-26 2011-01-05 日亜化学工業株式会社 窒化物半導体発光素子およびその製造方法
WO2005104780A2 (en) * 2004-04-28 2005-11-10 Verticle, Inc Vertical structure semiconductor devices
US20060124956A1 (en) * 2004-12-13 2006-06-15 Hui Peng Quasi group III-nitride substrates and methods of mass production of the same
US7432119B2 (en) * 2005-01-11 2008-10-07 Semileds Corporation Light emitting diode with conducting metal substrate
CN100466310C (zh) * 2005-02-25 2009-03-04 日立电线株式会社 发光二极管及其制造方法
JP2006253298A (ja) * 2005-03-09 2006-09-21 Toshiba Corp 半導体発光素子及び半導体発光装置
US7483466B2 (en) * 2005-04-28 2009-01-27 Canon Kabushiki Kaisha Vertical cavity surface emitting laser device
WO2006131316A1 (en) * 2005-06-08 2006-12-14 Firecomms Limited Surface emitting optical devices
US7736945B2 (en) * 2005-06-09 2010-06-15 Philips Lumileds Lighting Company, Llc LED assembly having maximum metal support for laser lift-off of growth substrate
TWI269467B (en) 2005-07-01 2006-12-21 Epitech Technology Corp Light-emitting diode
KR100721147B1 (ko) 2005-11-23 2007-05-22 삼성전기주식회사 수직구조 질화갈륨계 발광다이오드 소자
JP2007157853A (ja) 2005-12-01 2007-06-21 Sony Corp 半導体発光素子およびその製造方法
JP4655920B2 (ja) * 2005-12-22 2011-03-23 日立電線株式会社 半導体発光素子
JP5189734B2 (ja) 2006-01-24 2013-04-24 ローム株式会社 窒化物半導体発光素子
JP4049186B2 (ja) * 2006-01-26 2008-02-20 ソニー株式会社 光源装置
JP2007207981A (ja) * 2006-02-01 2007-08-16 Rohm Co Ltd 窒化物半導体発光素子の製造方法
CN101395728B (zh) 2006-03-10 2011-04-13 松下电工株式会社 发光元件及其制造方法
JP5048960B2 (ja) * 2006-03-20 2012-10-17 パナソニック株式会社 半導体発光素子
KR100778820B1 (ko) * 2006-04-25 2007-11-22 포항공과대학교 산학협력단 금속 전극 형성 방법 및 반도체 발광 소자의 제조 방법 및질화물계 화합물 반도체 발광 소자
JP5306589B2 (ja) * 2006-11-17 2013-10-02 シャープ株式会社 半導体発光素子及びその製造方法
JP2008182110A (ja) * 2007-01-25 2008-08-07 Matsushita Electric Ind Co Ltd 窒化物半導体発光装置
KR100770681B1 (ko) 2007-01-30 2007-10-29 삼성전기주식회사 수직구조 질화갈륨계 발광다이오드 소자 및 그 제조방법
US20080197369A1 (en) * 2007-02-20 2008-08-21 Cree, Inc. Double flip semiconductor device and method for fabrication
CN101315959A (zh) * 2007-06-01 2008-12-03 富士迈半导体精密工业(上海)有限公司 高亮度发光二极管
US20100200881A1 (en) * 2007-06-28 2010-08-12 Kyocera Corporation Light Emitting Element and Illumination Device
US20090001404A1 (en) * 2007-06-29 2009-01-01 Ohata Takafumi Semiconductor light emitting device, process for producing the same, and led illuminating apparatus using the same
JP2009081374A (ja) * 2007-09-27 2009-04-16 Rohm Co Ltd 半導体発光素子
KR101449005B1 (ko) * 2007-11-26 2014-10-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100992776B1 (ko) * 2008-11-14 2010-11-05 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100992772B1 (ko) * 2008-11-20 2010-11-05 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874747A (en) * 1996-02-05 1999-02-23 Advanced Technology Materials, Inc. High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same
JP2006054420A (ja) 2004-08-11 2006-02-23 Samsung Electro Mech Co Ltd 窒化物半導体発光素子及びその製造方法、並びに窒化物半導体発光素子を備えたフリップチップ構造の発光装置
JP2007096327A (ja) 2005-09-29 2007-04-12 Osram Opto Semiconductors Gmbh ビーム放射半導体チップ

Also Published As

Publication number Publication date
US8969902B2 (en) 2015-03-03
JP2014096603A (ja) 2014-05-22
US20120286316A1 (en) 2012-11-15
CN102751405B (zh) 2016-04-13
US20150129920A1 (en) 2015-05-14
CN101874308B (zh) 2012-09-05
WO2009069929A3 (en) 2009-09-03
KR20090054008A (ko) 2009-05-29
EP2201618A4 (en) 2011-03-30
JP5550078B2 (ja) 2014-07-16
EP2485280A3 (en) 2013-01-16
EP2485280B1 (en) 2015-09-23
US9472739B2 (en) 2016-10-18
US8618571B2 (en) 2013-12-31
CN101874308A (zh) 2010-10-27
DE202008018199U1 (de) 2012-02-23
EP2201618B1 (en) 2014-06-18
US8253156B2 (en) 2012-08-28
US20130292732A1 (en) 2013-11-07
EP2485280A2 (en) 2012-08-08
US20100264440A1 (en) 2010-10-21
EP2201618A2 (en) 2010-06-30
WO2009069929A2 (en) 2009-06-04
CN102751405A (zh) 2012-10-24
JP2011504660A (ja) 2011-02-10

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