KR101148225B1 - 적층체의 제조 방법 - Google Patents

적층체의 제조 방법 Download PDF

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Publication number
KR101148225B1
KR101148225B1 KR1020117004726A KR20117004726A KR101148225B1 KR 101148225 B1 KR101148225 B1 KR 101148225B1 KR 1020117004726 A KR1020117004726 A KR 1020117004726A KR 20117004726 A KR20117004726 A KR 20117004726A KR 101148225 B1 KR101148225 B1 KR 101148225B1
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South Korea
Prior art keywords
resin
weight
layer
cured
epoxy resin
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KR1020117004726A
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English (en)
Korean (ko)
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KR20110055587A (ko
Inventor
마사루 헤이시
노부히로 고또
히로시 고야나기
레오나 요꼬따
도시아끼 다나까
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20110055587A publication Critical patent/KR20110055587A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
KR1020117004726A 2008-09-01 2009-08-28 적층체의 제조 방법 Active KR101148225B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008223494 2008-09-01
JPJP-P-2008-223494 2008-09-01
PCT/JP2009/065081 WO2010024391A1 (ja) 2008-09-01 2009-08-28 積層体及び積層体の製造方法

Publications (2)

Publication Number Publication Date
KR20110055587A KR20110055587A (ko) 2011-05-25
KR101148225B1 true KR101148225B1 (ko) 2012-05-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117004726A Active KR101148225B1 (ko) 2008-09-01 2009-08-28 적층체의 제조 방법

Country Status (6)

Country Link
US (1) US20110217512A1 (cg-RX-API-DMAC10.html)
JP (2) JP4911795B2 (cg-RX-API-DMAC10.html)
KR (1) KR101148225B1 (cg-RX-API-DMAC10.html)
CN (1) CN102137758B (cg-RX-API-DMAC10.html)
TW (1) TW201012652A (cg-RX-API-DMAC10.html)
WO (1) WO2010024391A1 (cg-RX-API-DMAC10.html)

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CN101967264A (zh) * 2010-08-31 2011-02-09 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板
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JP5915610B2 (ja) * 2013-09-18 2016-05-11 味の素株式会社 樹脂組成物
CN105556699B (zh) 2013-09-20 2020-06-09 大日本印刷株式会社 电池用包装材料
JP5708860B1 (ja) * 2013-09-26 2015-04-30 大日本印刷株式会社 電池用包装材料
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CN106715108A (zh) * 2014-08-22 2017-05-24 欧姆龙株式会社 接合构造体以及接合构造体的制造方法
CN106553360B (zh) * 2015-09-25 2020-03-31 比亚迪股份有限公司 一种金属树脂复合体及其制备方法
JP6668712B2 (ja) * 2015-12-01 2020-03-18 味の素株式会社 樹脂組成物
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CN116330766B (zh) * 2016-12-28 2026-01-30 Ａｇｃ株式会社 层叠体、带有机硅树脂层的支撑基材、带有机硅树脂层的树脂基板、电子器件的制造方法
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Also Published As

Publication number Publication date
WO2010024391A1 (ja) 2010-03-04
JPWO2010024391A1 (ja) 2012-01-26
TW201012652A (en) 2010-04-01
KR20110055587A (ko) 2011-05-25
TWI378864B (cg-RX-API-DMAC10.html) 2012-12-11
US20110217512A1 (en) 2011-09-08
CN102137758B (zh) 2014-08-06
JP2012035631A (ja) 2012-02-23
CN102137758A (zh) 2011-07-27
JP4911795B2 (ja) 2012-04-04

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