WO2010013741A1 - エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板 - Google Patents

エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板 Download PDF

Info

Publication number
WO2010013741A1
WO2010013741A1 PCT/JP2009/063477 JP2009063477W WO2010013741A1 WO 2010013741 A1 WO2010013741 A1 WO 2010013741A1 JP 2009063477 W JP2009063477 W JP 2009063477W WO 2010013741 A1 WO2010013741 A1 WO 2010013741A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
silica particles
resin composition
laminate
silane coupling
Prior art date
Application number
PCT/JP2009/063477
Other languages
English (en)
French (fr)
Inventor
後藤　信弘
克 瓶子
英寛 出口
剛之 小林
淳之介 村上
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to KR1020117004727A priority Critical patent/KR101383434B1/ko
Priority to US13/056,392 priority patent/US20110189432A1/en
Priority to JP2009531681A priority patent/JP4782870B2/ja
Priority to CN200980130362XA priority patent/CN102112544A/zh
Publication of WO2010013741A1 publication Critical patent/WO2010013741A1/ja
Priority to US13/922,606 priority patent/US20130288041A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

　粗化処理された硬化体の表面の表面粗さを小さくすることができるエポキシ樹脂組成物を提供する。 　エポキシ樹脂と、硬化剤と、シリカ粒子がシランカップリング剤により表面処理されているシリカ成分とを含有し、硬化促進剤を含有しないか、又は上記エポキシ樹脂及び上記硬化剤の合計１００重量部に対して硬化促進剤を３．５重量部以下の含有量で含有し、上記シリカ粒子の平均粒子径が１μｍ以下であり、上記シリカ成分における上記シリカ粒子１ｇ当たりの上記シランカップリング剤の表面処理量Ｂ（ｇ）が、下記式（Ｘ）により算出されるシリカ粒子１ｇ当たりの値Ｃ（ｇ）に対して１０～８０％の範囲内にあるエポキシ樹脂組成物。 　Ｃ（ｇ）／シリカ粒子１ｇ＝［シリカ粒子の比表面積（ｍ２／ｇ）／シランカップリング剤の最小被覆面積（ｍ２／ｇ）］　　・・・式（Ｘ）
PCT/JP2009/063477 2008-07-29 2009-07-29 エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板 WO2010013741A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020117004727A KR101383434B1 (ko) 2008-07-31 2009-07-29 에폭시 수지 조성물, 프리프레그, 경화체, 시트상 성형체, 적층판 및 다층 적층판
US13/056,392 US20110189432A1 (en) 2008-07-29 2009-07-29 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
JP2009531681A JP4782870B2 (ja) 2008-07-31 2009-07-29 硬化体、シート状成形体、積層板及び多層積層板
CN200980130362XA CN102112544A (zh) 2008-07-31 2009-07-29 环氧树脂组合物、预浸料、固化物、片状成形体、叠层板及多层叠层板
US13/922,606 US20130288041A1 (en) 2008-07-31 2013-06-20 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer lalminate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-198036 2008-07-31
JP2008198036 2008-07-31

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/922,606 Division US20130288041A1 (en) 2008-07-31 2013-06-20 Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer lalminate

Publications (1)

Publication Number Publication Date
WO2010013741A1 true WO2010013741A1 (ja) 2010-02-04

Family

ID=41610440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/063477 WO2010013741A1 (ja) 2008-07-29 2009-07-29 エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板

Country Status (6)

Country Link
US (2) US20110189432A1 (ja)
JP (2) JP4782870B2 (ja)
KR (1) KR101383434B1 (ja)
CN (2) CN103232682B (ja)
TW (1) TW201012860A (ja)
WO (1) WO2010013741A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011178857A (ja) * 2010-02-26 2011-09-15 Sekisui Chem Co Ltd 樹脂組成物及び成形体
JP2012074606A (ja) * 2010-09-29 2012-04-12 Sekisui Chem Co Ltd プリント配線板用熱硬化性フィルム
JP2014047318A (ja) * 2012-09-03 2014-03-17 Ajinomoto Co Inc 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
WO2014084050A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 配線基板およびその実装構造体
JP2014193613A (ja) * 2014-04-25 2014-10-09 Ajinomoto Co Inc 積層板の製造方法
JP2015117358A (ja) * 2013-12-16 2015-06-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板用絶縁樹脂組成物およびこれを用いた製品
JP2015168714A (ja) * 2014-03-05 2015-09-28 三菱瓦斯化学株式会社 樹脂構造体、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板、及びプリント配線板
JP2019090059A (ja) * 2017-01-10 2019-06-13 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP2019182891A (ja) * 2018-04-02 2019-10-24 味の素株式会社 樹脂組成物
WO2020059434A1 (ja) * 2018-09-21 2020-03-26 サンアプロ株式会社 エポキシ樹脂組成物
JP7523304B2 (ja) 2015-03-26 2024-07-26 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 屋外用製品を製造するための熱硬化性エポキシ樹脂組成物、およびそれから得られる屋外用製品

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024391A1 (ja) * 2008-09-01 2010-03-04 積水化学工業株式会社 積層体及び積層体の製造方法
JP4686750B2 (ja) * 2008-09-24 2011-05-25 積水化学工業株式会社 硬化体及び積層体
JP5234229B1 (ja) 2011-05-27 2013-07-10 味の素株式会社 樹脂組成物
US8404764B1 (en) * 2011-09-22 2013-03-26 Elite Material Co., Ltd. Resin composition and prepreg, laminate and circuit board thereof
JP5234231B1 (ja) * 2011-10-26 2013-07-10 味の素株式会社 樹脂組成物
US10227476B2 (en) * 2011-11-29 2019-03-12 Mitsubishi Chemical Corporation Prepreg, fiber-reinforced composite material, method for producing same, and epoxy resin composition
JP2013145839A (ja) * 2012-01-16 2013-07-25 Nitto Denko Corp 中空封止用樹脂シートおよびその製法、並びに中空型電子部品装置の製法および中空型電子部品装置
WO2013111345A1 (ja) 2012-01-23 2013-08-01 味の素株式会社 樹脂組成物
US8921703B2 (en) * 2012-02-17 2014-12-30 Htc Corporation Circuit board, structural unit thereof and manufacturing method thereof
CN109920774A (zh) * 2012-03-26 2019-06-21 先进封装技术私人有限公司 用于半导体封装的多层基底
JP6240069B2 (ja) * 2012-06-07 2017-11-29 日本化薬株式会社 エポキシ樹脂組成物、およびその硬化物、並びに、硬化性樹脂組成物
US10053575B2 (en) * 2012-07-05 2018-08-21 Toray Industries, Inc. Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material
JP2014028880A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 樹脂組成物
EP2896654B1 (en) * 2012-09-14 2017-07-12 Shengyi Technology Co. Ltd. Epoxy resin compound, and, prepreg and copper-clad laminate manufactured using the compound
JP2014109027A (ja) * 2012-12-04 2014-06-12 Hitachi Chemical Co Ltd エポキシ樹脂組成物、プリプレグ、金属張積層板及びこれらを用いた印刷配線板
KR102119760B1 (ko) * 2012-12-17 2020-06-08 엘지이노텍 주식회사 Ic 모듈용 인쇄회로기판 및 그 제조방법
JP6183583B2 (ja) * 2013-02-14 2017-08-23 味の素株式会社 硬化性樹脂組成物
JP6217895B2 (ja) * 2013-02-14 2017-10-25 味の素株式会社 硬化性樹脂組成物
JP6163803B2 (ja) * 2013-03-14 2017-07-19 味の素株式会社 樹脂組成物
KR102021641B1 (ko) * 2013-03-25 2019-09-16 세키스이가가쿠 고교가부시키가이샤 적층체, 적층체의 제조 방법 및 다층 기판
JP6308344B2 (ja) * 2013-04-08 2018-04-11 味の素株式会社 硬化性樹脂組成物
US9905328B2 (en) * 2013-06-03 2018-02-27 Mitsubishi Gas Chemical Company, Inc. Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same
CN103408904A (zh) * 2013-07-04 2013-11-27 东莞上海大学纳米技术研究院 改性纳米二氧化硅填充环氧树脂组合物、制备方法及制品
EP3033379B1 (en) * 2013-08-13 2020-12-02 3M Innovative Properties Company Nanocomposites containing silica nanoparticles and dispersant, composites, articles, and methods of making same
KR101671877B1 (ko) * 2013-08-23 2016-11-03 엘리트 일렉트로닉 메터리얼 (쿤샨) 컴퍼니 리미티드 수지조성물, 이를 사용한 동박기판 및 인쇄회로
JP5915610B2 (ja) * 2013-09-18 2016-05-11 味の素株式会社 樹脂組成物
CN203690294U (zh) * 2013-11-07 2014-07-02 新科实业有限公司 电子元件组件
RU2559495C1 (ru) * 2014-01-13 2015-08-10 Открытое акционерное общество "Национальный институт авиационных технологий" (ОАО НИАТ) Состав для получения связующего для препрегов, способ изготовления связующего, препрег и способ изготовления панели из полимерного композиционного материала
KR101645074B1 (ko) * 2014-01-14 2016-08-02 제일모직주식회사 피리디늄계 화합물, 이를 포함하는 에폭시수지 조성물 및 이를 사용하여 제조된 장치
CN104892902B (zh) * 2014-03-03 2018-01-05 广东生益科技股份有限公司 一种热固性树脂组合物及其用途
JP6069278B2 (ja) * 2014-09-25 2017-02-01 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
KR102231099B1 (ko) * 2014-09-26 2021-03-23 삼성전기주식회사 절연필름용 수지 조성물
JP6010874B1 (ja) 2015-02-03 2016-10-19 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂複合シート、及びプリント配線板
CN107431152B (zh) * 2015-03-30 2021-03-19 大日本印刷株式会社 电池用包装材料、其制造方法和电池
WO2017130721A1 (ja) * 2016-01-27 2017-08-03 株式会社新技術研究所 表面改質ポリエステル系樹脂を含む銅または銅合金物品および製造方法
CN108291008B (zh) * 2016-03-28 2022-05-03 积水化学工业株式会社 树脂组合物和多层基板
ES2820506T3 (es) * 2016-06-28 2021-04-21 Toray Industries Composición de resina epoxídica, material compuesto preimpregnado y reforzado con fibra
KR102324899B1 (ko) 2016-06-29 2021-11-10 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치
WO2018003314A1 (ja) 2016-06-29 2018-01-04 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置
JP6885001B2 (ja) * 2016-07-21 2021-06-09 昭和電工マテリアルズ株式会社 プリプレグ、積層板及びプリント配線板
JP6868370B2 (ja) * 2016-10-25 2021-05-12 日東シンコー株式会社 エポキシ樹脂組成物、絶縁シート、及び、半導体モジュール
JP6534986B2 (ja) * 2016-11-29 2019-06-26 味の素株式会社 樹脂組成物
KR102117173B1 (ko) 2016-12-07 2020-05-29 히타치가세이가부시끼가이샤 수지 바니시, 프리프레그, 적층판 및 프린트 배선판
JP6668287B2 (ja) * 2017-04-04 2020-03-18 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングＭｅｒｃｋ Ｐａｔｅｎｔ ＧｍｂＨ 膜形成組成物およびそれを用いた膜形成方法
JP6511614B2 (ja) 2017-08-02 2019-05-15 株式会社新技術研究所 金属と樹脂の複合材
KR102094329B1 (ko) * 2018-04-05 2020-03-27 주식회사 제일화성 난연성이 우수한 구조용 접착제
CN109265654B (zh) * 2018-09-03 2020-04-17 广东同宇新材料有限公司 树脂组合物及其制成的预浸料、层压板
CN113396127B (zh) * 2019-02-06 2024-07-02 日产化学株式会社 柔性硬涂层用固化性组合物
CN109786962B (zh) * 2019-02-21 2021-02-23 成都形水科技有限公司 频率选择天线罩的制备方法
CN113185804A (zh) * 2020-01-14 2021-07-30 广东生益科技股份有限公司 一种树脂组合物、包含其的粘结片及其应用
KR102206736B1 (ko) * 2020-09-07 2021-01-26 한국내진시스템 주식회사 콘크리트 구조물의 보수보강용 바잘트섬유 복합 난연 보강재 및 이를 이용한 콘크리트 구조물의 보수보강공법
CN113527840A (zh) * 2021-07-19 2021-10-22 福建师范大学泉港石化研究院 一种内衬层环氧树脂的夹砂管及其制备方法
CN113831875B (zh) * 2021-09-18 2024-01-09 深圳市纽菲斯新材料科技有限公司 一种绝缘胶膜及其制备方法和应用
CN114395354B (zh) * 2022-01-25 2023-11-03 苏州英田电子科技有限公司 一种低收缩环氧结构胶

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002146233A (ja) * 2000-11-07 2002-05-22 Denki Kagaku Kogyo Kk 表面処理された微細球状シリカ粉末および樹脂組成物
JP2003318499A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Works Ltd 内層回路用プリプレグ、内層回路用金属張積層板及び多層プリント配線板
JP2005298740A (ja) * 2004-04-14 2005-10-27 Admatechs Co Ltd 金属酸化物表面処理粒子および樹脂組成物
JP2006036916A (ja) * 2004-07-27 2006-02-09 Admatechs Co Ltd スラリー組成物、ワニス組成物、およびそれを用いた絶縁フィルム、プリプレグ
WO2007032424A1 (ja) * 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2008137854A (ja) * 2006-12-01 2008-06-19 Nippon Shokubai Co Ltd 表面処理されたシリカ粒子とその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254000A (ja) * 2000-03-09 2001-09-18 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
JP3956717B2 (ja) * 2002-02-25 2007-08-08 松下電工株式会社 封止用エポキシ樹脂組成物及び片面封止型半導体装置
JP4070680B2 (ja) * 2003-08-01 2008-04-02 電気化学工業株式会社 樹脂充填用超微粉シリカ分散スラリーの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002146233A (ja) * 2000-11-07 2002-05-22 Denki Kagaku Kogyo Kk 表面処理された微細球状シリカ粉末および樹脂組成物
JP2003318499A (ja) * 2002-04-23 2003-11-07 Matsushita Electric Works Ltd 内層回路用プリプレグ、内層回路用金属張積層板及び多層プリント配線板
JP2005298740A (ja) * 2004-04-14 2005-10-27 Admatechs Co Ltd 金属酸化物表面処理粒子および樹脂組成物
JP2006036916A (ja) * 2004-07-27 2006-02-09 Admatechs Co Ltd スラリー組成物、ワニス組成物、およびそれを用いた絶縁フィルム、プリプレグ
WO2007032424A1 (ja) * 2005-09-15 2007-03-22 Sekisui Chemical Co., Ltd. 樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板、および多層積層板
JP2008137854A (ja) * 2006-12-01 2008-06-19 Nippon Shokubai Co Ltd 表面処理されたシリカ粒子とその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Shin'etsu Silicon Silane Coupling-zai, Shin'Etsu Chemical Co., Ltd. 2003.09, pages 3, 4, 9, 10 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011178857A (ja) * 2010-02-26 2011-09-15 Sekisui Chem Co Ltd 樹脂組成物及び成形体
JP2012074606A (ja) * 2010-09-29 2012-04-12 Sekisui Chem Co Ltd プリント配線板用熱硬化性フィルム
JP2014047318A (ja) * 2012-09-03 2014-03-17 Ajinomoto Co Inc 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP5961703B2 (ja) * 2012-11-28 2016-08-02 京セラ株式会社 配線基板およびその実装構造体
WO2014084050A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 配線基板およびその実装構造体
US9578738B2 (en) 2012-11-28 2017-02-21 Kyocera Corporation Wiring board and mounting: structure including the same
JP2015117358A (ja) * 2013-12-16 2015-06-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板用絶縁樹脂組成物およびこれを用いた製品
JP2015168714A (ja) * 2014-03-05 2015-09-28 三菱瓦斯化学株式会社 樹脂構造体、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板、及びプリント配線板
JP2014193613A (ja) * 2014-04-25 2014-10-09 Ajinomoto Co Inc 積層板の製造方法
JP7523304B2 (ja) 2015-03-26 2024-07-26 ハンツマン・アドヴァンスト・マテリアルズ・ライセンシング・（スイッツランド）・ゲーエムベーハー 屋外用製品を製造するための熱硬化性エポキシ樹脂組成物、およびそれから得られる屋外用製品
JP2019090059A (ja) * 2017-01-10 2019-06-13 味の素株式会社 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP2019182891A (ja) * 2018-04-02 2019-10-24 味の素株式会社 樹脂組成物
JP7206613B2 (ja) 2018-04-02 2023-01-18 味の素株式会社 樹脂組成物
WO2020059434A1 (ja) * 2018-09-21 2020-03-26 サンアプロ株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
JP5508330B2 (ja) 2014-05-28
KR20110043727A (ko) 2011-04-27
TWI379859B (ja) 2012-12-21
KR101383434B1 (ko) 2014-04-08
CN103232682B (zh) 2016-03-02
US20110189432A1 (en) 2011-08-04
US20130288041A1 (en) 2013-10-31
TW201012860A (en) 2010-04-01
JP4782870B2 (ja) 2011-09-28
JP2011174082A (ja) 2011-09-08
CN102112544A (zh) 2011-06-29
JPWO2010013741A1 (ja) 2012-01-12
CN103232682A (zh) 2013-08-07

Similar Documents

Publication Publication Date Title
WO2010013741A1 (ja) エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP2011174082A5 (ja) 硬化体、シート状成形体、積層板及び多層積層板
TW200714663A (en) Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
EP2666807A3 (en) A Prepreg And Carbon Fiber Reinforced Composite Materials
EP2431423A3 (en) Anti-reflective coatings
CA2798661A1 (en) Improvements in or relating to structural adhesives
ATE545065T1 (de) Negativ-arbeitende lithographische druckplattenvorläufer mit erhöhter abriebfestigkeit
WO2012003004A3 (en) Superhydrophobic and anti-icing coating and method for making same
CN106961827A (zh) 多层结构吸波橡胶材料及其制备方法
WO2008027199A3 (en) Low density drywall
WO2015069347A3 (en) Nanocomposites containing nonspherical silica nanoparticles, composites, articles, and methods of making same
MY165588A (en) Biaxially orientated polyester film for mold release
HK1131176A1 (en) Thermosetting resin composition and prepreg and laminate obtained with the same
EP2025695A8 (en) Epoxy resin composition and cured epoxy resin
SG179014A1 (en) Modular polymeric emi/rfi seal
WO2012151178A3 (en) Thermoplastic resin composite containing hollow glass microspheres
MX359276B (es) Laminado adhesivo.
EP2006259A3 (en) Concrete product with enhanced ornamental surface layer
MX2008012362A (es) Acabado antiadherente.
WO2008126812A1 (ja) 銅合金複合体とその製造方法
CA2429226A1 (en) Coupling of reinforcing fibres to resins in curable composites
NZ587921A (en) Use of a (1-3)-beta-d-glucan as an emulsion stabiliser
TW200517462A (en) Acrylic adhesive sheet
TW200606203A (en) Emulsion, production method thereof and use thereof
TW200801096A (en) Composite polymers

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2009531681

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 200980130362.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09802983

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20117004727

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 13056392

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 09802983

Country of ref document: EP

Kind code of ref document: A1