KR101121794B1 - 도포 현상 장치 및 그 방법 - Google Patents

도포 현상 장치 및 그 방법 Download PDF

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Publication number
KR101121794B1
KR101121794B1 KR1020060005978A KR20060005978A KR101121794B1 KR 101121794 B1 KR101121794 B1 KR 101121794B1 KR 1020060005978 A KR1020060005978 A KR 1020060005978A KR 20060005978 A KR20060005978 A KR 20060005978A KR 101121794 B1 KR101121794 B1 KR 101121794B1
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South Korea
Prior art keywords
unit
block
substrate
coating
film
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Korean (ko)
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KR20060085190A (ko
Inventor
마사미 아키모토
신이치 하야시
야스시 하야시다
노부아키 마츠오카
요시오 키무라
이세이 우에다
히카루 이토
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도쿄엘렉트론가부시키가이샤
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Publication of KR20060085190A publication Critical patent/KR20060085190A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/70—Door leaves
    • E06B3/7003—Door leaves consisting of several adjacent similar elements, e.g. planks, without outer covering panels
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/70—Door leaves
    • E06B3/7001—Coverings therefor; Door leaves imitating traditional raised panel doors, e.g. engraved or embossed surfaces, with trim strips applied to the surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060005978A 2005-01-21 2006-01-19 도포 현상 장치 및 그 방법 Active KR101121794B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00014716 2005-01-21
JP2005014716 2005-01-21
JPJP-P-2005-00294579 2005-10-07
JP2005294579A JP4955977B2 (ja) 2005-01-21 2005-10-07 塗布、現像装置及びその方法

Publications (2)

Publication Number Publication Date
KR20060085190A KR20060085190A (ko) 2006-07-26
KR101121794B1 true KR101121794B1 (ko) 2012-03-20

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KR1020060005978A Active KR101121794B1 (ko) 2005-01-21 2006-01-19 도포 현상 장치 및 그 방법

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Country Link
US (1) US7281869B2 (enExample)
EP (1) EP1684333B1 (enExample)
JP (1) JP4955977B2 (enExample)
KR (1) KR101121794B1 (enExample)
SG (1) SG124420A1 (enExample)
TW (1) TW200643639A (enExample)

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JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4566035B2 (ja) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4514657B2 (ja) * 2005-06-24 2010-07-28 株式会社Sokudo 基板処理装置
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4654120B2 (ja) * 2005-12-08 2011-03-16 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法並びにコンピュータプログラム
JP4816217B2 (ja) * 2006-04-14 2011-11-16 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP2008072016A (ja) * 2006-09-15 2008-03-27 Tokyo Electron Ltd 液処理装置、液処理方法及び記憶媒体
JP5132920B2 (ja) * 2006-11-22 2013-01-30 東京エレクトロン株式会社 塗布・現像装置および基板搬送方法、ならびにコンピュータプログラム
JP5149513B2 (ja) * 2007-02-15 2013-02-20 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2009004478A (ja) * 2007-06-20 2009-01-08 Toshiba Corp パターン形成方法及び半導体装置の製造方法
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP2010118557A (ja) * 2008-11-13 2010-05-27 Canon Inc 露光装置、基板処理装置、リソグラフィーシステムおよびデバイス製造方法
JP4760919B2 (ja) * 2009-01-23 2011-08-31 東京エレクトロン株式会社 塗布、現像装置
JP2010177673A (ja) * 2009-01-30 2010-08-12 Semes Co Ltd 基板処理設備及び基板処理方法
JP2010192623A (ja) * 2009-02-17 2010-09-02 Renesas Electronics Corp 半導体装置の製造装置、その制御方法、及びその制御プログラム
JP4973675B2 (ja) * 2009-02-26 2012-07-11 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP5562759B2 (ja) * 2009-11-04 2014-07-30 東京エレクトロン株式会社 基板処理装置
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JP2014038929A (ja) * 2012-08-15 2014-02-27 Disco Abrasive Syst Ltd インラインシステム
JP5779168B2 (ja) * 2012-12-04 2015-09-16 東京エレクトロン株式会社 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体
JP5664701B2 (ja) * 2013-06-05 2015-02-04 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5644916B2 (ja) * 2013-08-13 2014-12-24 東京エレクトロン株式会社 塗布、現像装置
JP2013243406A (ja) * 2013-08-13 2013-12-05 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5590201B2 (ja) * 2013-08-13 2014-09-17 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5926752B2 (ja) * 2014-02-20 2016-05-25 東京エレクトロン株式会社 半導体装置の製造方法及び半導体製造装置
JP6262634B2 (ja) * 2014-10-31 2018-01-17 東京エレクトロン株式会社 基板処理装置
JP6426223B2 (ja) * 2017-03-31 2018-11-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP7251673B2 (ja) * 2017-06-16 2023-04-04 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN111650813B (zh) * 2019-03-04 2024-04-16 东京毅力科创株式会社 基板处理装置、基板检查装置及方法、以及记录介质
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7486378B2 (ja) * 2020-08-07 2024-05-17 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
JP7546617B2 (ja) * 2022-03-22 2024-09-06 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム及び基板搬送方法
CN117019567A (zh) * 2023-10-10 2023-11-10 常州捷佳创智能装备有限公司 一种硅片上料涂覆机构、涂布平台、硅片涂布机

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JP3337677B2 (ja) 1999-12-06 2002-10-21 ディ エヌ エス コリア カンパニー リミティッド フォトリソグラフィ工程のための半導体製造装置
KR100646515B1 (ko) 2000-05-09 2006-11-14 동경 엘렉트론 주식회사 도포 현상 처리 시스템 및 도포 현상 처리 방법

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KR100646515B1 (ko) 2000-05-09 2006-11-14 동경 엘렉트론 주식회사 도포 현상 처리 시스템 및 도포 현상 처리 방법
JP2002050668A (ja) 2000-08-07 2002-02-15 Tokyo Electron Ltd 基板処理装置及びその方法

Also Published As

Publication number Publication date
JP2006229184A (ja) 2006-08-31
TWI367397B (enExample) 2012-07-01
US7281869B2 (en) 2007-10-16
EP1684333B1 (en) 2012-09-12
SG124420A1 (en) 2006-08-30
JP4955977B2 (ja) 2012-06-20
EP1684333A2 (en) 2006-07-26
TW200643639A (en) 2006-12-16
US20060165409A1 (en) 2006-07-27
KR20060085190A (ko) 2006-07-26
EP1684333A3 (en) 2011-06-15

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