KR101086957B1 - 캐리어 시트 부착 동박, 캐리어 시트 부착 동박의 제조 방법, 캐리어 시트 부착 표면 처리 동박 및 그 캐리어 시트부착 표면 처리 동박을 이용한 동박적층판 - Google Patents

캐리어 시트 부착 동박, 캐리어 시트 부착 동박의 제조 방법, 캐리어 시트 부착 표면 처리 동박 및 그 캐리어 시트부착 표면 처리 동박을 이용한 동박적층판 Download PDF

Info

Publication number
KR101086957B1
KR101086957B1 KR1020087027911A KR20087027911A KR101086957B1 KR 101086957 B1 KR101086957 B1 KR 101086957B1 KR 1020087027911 A KR1020087027911 A KR 1020087027911A KR 20087027911 A KR20087027911 A KR 20087027911A KR 101086957 B1 KR101086957 B1 KR 101086957B1
Authority
KR
South Korea
Prior art keywords
copper foil
layer
carrier sheet
copper
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087027911A
Other languages
English (en)
Korean (ko)
Other versions
KR20090008346A (ko
Inventor
세이지 나가타니
히로시 와타나베
카즈후미 이즈미다
Original Assignee
미쓰이 긴조꾸 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 긴조꾸 고교 가부시키가이샤 filed Critical 미쓰이 긴조꾸 고교 가부시키가이샤
Publication of KR20090008346A publication Critical patent/KR20090008346A/ko
Application granted granted Critical
Publication of KR101086957B1 publication Critical patent/KR101086957B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12625—Free carbon containing component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y10T428/24975—No layer or component greater than 5 mils thick
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR1020087027911A 2006-05-19 2007-05-18 캐리어 시트 부착 동박, 캐리어 시트 부착 동박의 제조 방법, 캐리어 시트 부착 표면 처리 동박 및 그 캐리어 시트부착 표면 처리 동박을 이용한 동박적층판 Active KR101086957B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2006140669 2006-05-19
JPJP-P-2006-140669 2006-05-19
JP2007067657 2007-03-15
JPJP-P-2007-067657 2007-03-15
PCT/JP2007/060191 WO2007135972A1 (ja) 2006-05-19 2007-05-18 キャリアシート付銅箔、キャリアシート付銅箔の製造方法、キャリアシート付表面処理銅箔及びそのキャリアシート付表面処理銅箔を用いた銅張積層板

Publications (2)

Publication Number Publication Date
KR20090008346A KR20090008346A (ko) 2009-01-21
KR101086957B1 true KR101086957B1 (ko) 2011-11-29

Family

ID=38723284

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087027911A Active KR101086957B1 (ko) 2006-05-19 2007-05-18 캐리어 시트 부착 동박, 캐리어 시트 부착 동박의 제조 방법, 캐리어 시트 부착 표면 처리 동박 및 그 캐리어 시트부착 표면 처리 동박을 이용한 동박적층판

Country Status (7)

Country Link
US (1) US8187722B2 (https=)
JP (1) JP4726855B2 (https=)
KR (1) KR101086957B1 (https=)
CN (1) CN101454153B (https=)
MY (1) MY147431A (https=)
TW (1) TW200804626A (https=)
WO (1) WO2007135972A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240114991A (ko) * 2023-01-18 2024-07-25 상신균 두께 균일성 및 부착성이 향상된 극박동박

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8642893B2 (en) * 2007-09-28 2014-02-04 Jx Nippon Mining & Metals Corporation Copper foil for printed circuit and copper-clad laminate
JP4805304B2 (ja) * 2008-05-12 2011-11-02 Ｊｘ日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
JP5255349B2 (ja) * 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
JP5095572B2 (ja) 2008-09-30 2012-12-12 本田技研工業株式会社 電気自動二輪車
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP5473838B2 (ja) * 2010-03-30 2014-04-16 日本電解株式会社 支持体金属箔付き複合金属層、これを用いた配線板とその製造方法、この配線板を用いた半導体パッケージの製造方法
CN102452197B (zh) 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
US8500870B2 (en) * 2010-12-03 2013-08-06 Marc S. Werblud Biocompatible, corrosion-inhibiting barrier surface treatment of aluminum foil
JP5466664B2 (ja) * 2011-04-08 2014-04-09 三井金属鉱業株式会社 多孔質金属箔およびその製造方法
JP2013006278A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 接着剤付き金属薄膜フィルム及びその製造方法、並びに銅張り積層板及びその製造方法
JP5427847B2 (ja) * 2011-07-21 2014-02-26 Ｊｘ日鉱日石金属株式会社 キャリヤー付金属箔
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
CN104335688B (zh) * 2012-06-04 2018-02-09 Jx日矿日石金属株式会社 多层印刷配线板的制造方法
WO2013183607A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
KR20170086691A (ko) * 2012-06-04 2017-07-26 제이엑스금속주식회사 캐리어 부착 금속박
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
JP6085919B2 (ja) * 2012-08-31 2017-03-01 味の素株式会社 極薄銅層付きフィルム、極薄銅層付き接着フィルム、それらの製造方法、銅張積層板、及び配線板
JPWO2014038424A1 (ja) * 2012-09-05 2016-08-08 東レ株式会社 積層体
TWI615271B (zh) * 2012-09-20 2018-02-21 Ｊｘ日鑛日石金屬股份有限公司 附載體金屬箔
JP6104261B2 (ja) * 2012-09-20 2017-03-29 Ｊｘ金属株式会社 キャリア付金属箔
CN104685980B (zh) * 2012-10-04 2018-11-23 Jx日矿日石金属株式会社 多层印刷配线基板的制造方法及基底基材
JP2014135344A (ja) * 2013-01-09 2014-07-24 Hitachi Chemical Co Ltd 配線基板の製造方法
CN105324267B (zh) 2013-07-05 2018-08-07 歌乐株式会社 驾驶支援装置
JP2015076610A (ja) * 2013-10-10 2015-04-20 サムソン エレクトロ−メカニックス カンパニーリミテッド． 表面処理銅箔及びそれを含む銅張積層板、並びにそれを用いた印刷回路基板及びその製造方法
WO2015080052A1 (ja) * 2013-11-27 2015-06-04 三井金属鉱業株式会社 キャリア箔付銅箔及び銅張積層板
JP6069749B2 (ja) * 2013-12-02 2017-02-01 東レＫｐフィルム株式会社 離型フィルム付銅箔
JP6526558B2 (ja) * 2013-12-27 2019-06-05 三井金属鉱業株式会社 プリント配線板用の複合金属箔、プリント配線板用のキャリア付複合金属箔、これらを用いて得られるプリント配線板用の金属張積層板及びプリント配線板
JP6300206B2 (ja) * 2014-01-21 2018-03-28 東レＫｐフィルム株式会社 離型フィルム付銅箔の製造方法
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
TWI616122B (zh) * 2014-05-28 2018-02-21 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法
DE102014210483A1 (de) * 2014-06-03 2015-12-03 Conti Temic Microelectronic Gmbh Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung
JP6466235B2 (ja) * 2015-04-16 2019-02-06 三井金属鉱業株式会社 キャリア付銅箔、キャリア付銅張積層板、及びプリント配線板の製造方法
JP6546526B2 (ja) * 2015-12-25 2019-07-17 三井金属鉱業株式会社 キャリア付銅箔及びコアレス支持体用積層板、並びに配線層付コアレス支持体及びプリント配線板の製造方法
US10772219B2 (en) * 2015-12-25 2020-09-08 Mitsui Mining & Smelting Co., Ltd. Copper foil with carrier, copper foil with resin and method for manufacturing printed wiring board
JP6616192B2 (ja) * 2016-01-06 2019-12-04 株式会社アルバック 成膜方法
WO2017149811A1 (ja) * 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔、並びに配線層付コアレス支持体及びプリント配線板の製造方法
WO2017149810A1 (ja) 2016-02-29 2017-09-08 三井金属鉱業株式会社 キャリア付銅箔及びその製造方法、並びに配線層付コアレス支持体及びプリント配線板の製造方法
KR102396894B1 (ko) * 2016-08-05 2022-05-11 미츠비시 가스 가가쿠 가부시키가이샤 지지 기판, 지지 기판이 부착된 적층체 및 반도체 소자 탑재용 패키지 기판의 제조 방법
US11576267B2 (en) * 2017-10-26 2023-02-07 Mitsui Mining & Smelting Co., Ltd. Ultra-thin copper foil, ultra-thin copper foil with carrier, and method for manufacturing printed wiring board
JP7201621B2 (ja) * 2017-12-27 2023-01-10 三井金属鉱業株式会社 キャリア付銅箔
US11637358B2 (en) * 2018-11-20 2023-04-25 Mitsui Mining & Smelting Co., Ltd. Carrier-containing metal foil and method for manufacturing millimeter-wave antenna substrate using same
CN110798986A (zh) * 2018-12-10 2020-02-14 广州方邦电子股份有限公司 一种带载体的金属箔
CN111295055A (zh) * 2018-12-10 2020-06-16 广州方邦电子股份有限公司 一种复合金属箔的制备方法
CN111491456A (zh) * 2019-01-29 2020-08-04 上海美维科技有限公司 一种含有隐埋线路的印制电路板的制作方法
JP7588956B2 (ja) * 2019-08-26 2024-11-25 東洋鋼鈑株式会社 キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板
CN110798985A (zh) * 2019-12-03 2020-02-14 深圳市环基实业有限公司 一种用高稳定性载具制造精细化薄膜线路板的方法
JP2021141142A (ja) 2020-03-03 2021-09-16 キオクシア株式会社 半導体装置の製造方法及び支持体
JP7618390B2 (ja) * 2020-04-22 2025-01-21 東洋鋼鈑株式会社 金属積層フィルム及びその製造方法
CN111740044A (zh) * 2020-07-09 2020-10-02 夏笔文 一种复合箔及其生产工艺
WO2022014647A1 (ja) * 2020-07-16 2022-01-20 三井金属鉱業株式会社 銅張積層板及びプリント配線板の製造方法
JP7825555B2 (ja) * 2020-07-16 2026-03-06 三井金属株式会社 銅張積層板及びプリント配線板
KR20230160813A (ko) * 2021-03-26 2023-11-24 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
CN114196920B (zh) * 2021-12-22 2022-10-21 安徽铜冠铜箔集团股份有限公司 一种铜箔制备方法
CN115911402B (zh) * 2022-12-19 2025-07-04 九江德福科技股份有限公司 一种锂离子电池用负极集流体及其制备方法
WO2025210946A1 (ja) * 2024-04-02 2025-10-09 Ｊｘ金属株式会社 表面処理チタン銅箔、チタン銅張積層板及びプリント配線板
CN121157453A (zh) * 2025-09-10 2025-12-19 江西铜博科技股份有限公司 一种高强度的多金属箔复合材料及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002024444A1 (fr) 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
JP2003181970A (ja) 2001-12-20 2003-07-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005260058A (ja) 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
JPH08158027A (ja) 1994-12-05 1996-06-18 Nippon Foil Mfg Co Ltd 圧延銅箔の焼鈍方法
JP3295308B2 (ja) 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ 電解銅箔
WO2000057680A1 (en) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
JP3466506B2 (ja) 1999-04-23 2003-11-10 三井金属鉱業株式会社 キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
JP2001068804A (ja) 1999-08-31 2001-03-16 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
EP1133220B1 (en) 2000-03-10 2011-05-11 GBC Metals, LLC Copper foil with low profile bond enhancement
US6893742B2 (en) 2001-02-15 2005-05-17 Olin Corporation Copper foil with low profile bond enhancement
LU90804B1 (fr) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards
US6770976B2 (en) * 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
JP3854207B2 (ja) * 2002-09-06 2006-12-06 日鉱金属株式会社 銅又は銅合金の支持体を備えた複合銅箔及び該複合銅箔を使用したプリント基板
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
US7132158B2 (en) * 2003-10-22 2006-11-07 Olin Corporation Support layer for thin copper foil
TW200609109A (en) * 2004-08-02 2006-03-16 Nippon Denkai Ltd Composite copper foil and method for production thereof
JP2007081274A (ja) 2005-09-16 2007-03-29 Oike Ind Co Ltd フレキシブル回路用基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002024444A1 (fr) 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
JP2003181970A (ja) 2001-12-20 2003-07-03 Mitsui Mining & Smelting Co Ltd キャリア箔付電解銅箔及びその製造方法並びにそのキャリア箔付電解銅箔を用いた銅張積層板
JP2005260058A (ja) 2004-03-12 2005-09-22 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、キャリア付き極薄銅箔の製造方法および配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240114991A (ko) * 2023-01-18 2024-07-25 상신균 두께 균일성 및 부착성이 향상된 극박동박
KR102906322B1 (ko) * 2023-01-18 2025-12-30 상신균 두께 균일성 및 부착성이 향상된 극박동박

Also Published As

Publication number Publication date
TW200804626A (en) 2008-01-16
JP4726855B2 (ja) 2011-07-20
CN101454153A (zh) 2009-06-10
KR20090008346A (ko) 2009-01-21
TWI356856B (https=) 2012-01-21
US8187722B2 (en) 2012-05-29
WO2007135972A1 (ja) 2007-11-29
US20090291319A1 (en) 2009-11-26
CN101454153B (zh) 2012-10-24
MY147431A (en) 2012-12-14
JP2008255462A (ja) 2008-10-23

Similar Documents

Publication Publication Date Title
KR101086957B1 (ko) 캐리어 시트 부착 동박, 캐리어 시트 부착 동박의 제조 방법, 캐리어 시트 부착 표면 처리 동박 및 그 캐리어 시트부착 표면 처리 동박을 이용한 동박적층판
JP4754402B2 (ja) キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
JP3973197B2 (ja) キャリア箔付電解銅箔及びその製造方法
TWI526299B (zh) Manufacturing method of supporting copper foil, printed wiring board, copper clad sheet, electronic machine and printed wiring board
KR20010075616A (ko) 캐리어 박 부착 전해 동박 및 그 전해 동박의 제조방법과그 전해 동박을 사용한 동 클래드 적층판
KR20140023744A (ko) 캐리어박 부착 극박동박, 이를 채용한 동부착적층판 및 프린트 배선판
JP2000309898A (ja) キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板
CN115233262A (zh) 一种附载体极薄铜箔的制备方法
US7816015B2 (en) Composite copper foil and method for production thereof
TWI626873B (zh) 印刷配線板之製造方法
JP2000340911A (ja) プリント配線板用銅箔
JP4217778B2 (ja) 抵抗層付き導電性基材、抵抗層付き回路基板及び抵抗回路配線板
WO2020195748A1 (ja) プリント配線板用金属箔、キャリア付金属箔及び金属張積層板、並びにそれらを用いたプリント配線板の製造方法
JP2010109275A (ja) プリント配線板用コイル状銅箔
WO2010004885A1 (ja) 表面処理銅箔
US9066432B2 (en) Copper foil for printed wiring board
JP5074822B2 (ja) 表面処理銅箔
TWI397359B (zh) A copper foil for printed wiring board excellent in etching and a laminate for use thereof
JP4279606B2 (ja) フィルムめっき材料の製造方法及び製造装置
TWI808775B (zh) 粗化處理銅箔、銅箔積層板及印刷佈線板
JP2010238928A (ja) プリント配線板用銅箔
JP2007035658A (ja) ポリイミド樹脂基材及びそのポリイミド樹脂基材を用いた配線板
JPH06350248A (ja) プリント配線板用銅箔の表面処理方法
JPH02122690A (ja) プリント配線板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20141021

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20161020

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20181101

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20191030

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000