KR101036084B1 - 프린트 기판의 검사 장치 및 검사 방법 - Google Patents

프린트 기판의 검사 장치 및 검사 방법 Download PDF

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Publication number
KR101036084B1
KR101036084B1 KR1020080055239A KR20080055239A KR101036084B1 KR 101036084 B1 KR101036084 B1 KR 101036084B1 KR 1020080055239 A KR1020080055239 A KR 1020080055239A KR 20080055239 A KR20080055239 A KR 20080055239A KR 101036084 B1 KR101036084 B1 KR 101036084B1
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KR
South Korea
Prior art keywords
inspection
probe
inspection probes
probes
circuit board
Prior art date
Application number
KR1020080055239A
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English (en)
Korean (ko)
Other versions
KR20080110510A (ko
Inventor
도오루 이시이
게이이찌로오 사사미네
도모까즈 사이또오
겐고 쯔찌다
Original Assignee
야마하 파인 테크 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 야마하 파인 테크 가부시키가이샤 filed Critical 야마하 파인 테크 가부시키가이샤
Publication of KR20080110510A publication Critical patent/KR20080110510A/ko
Application granted granted Critical
Publication of KR101036084B1 publication Critical patent/KR101036084B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020080055239A 2007-06-14 2008-06-12 프린트 기판의 검사 장치 및 검사 방법 KR101036084B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00157064 2007-06-14
JP2007157064A JP4461159B2 (ja) 2007-06-14 2007-06-14 プリント基板の検査装置および検査方法

Publications (2)

Publication Number Publication Date
KR20080110510A KR20080110510A (ko) 2008-12-18
KR101036084B1 true KR101036084B1 (ko) 2011-05-19

Family

ID=40197166

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080055239A KR101036084B1 (ko) 2007-06-14 2008-06-12 프린트 기판의 검사 장치 및 검사 방법

Country Status (4)

Country Link
JP (1) JP4461159B2 (zh)
KR (1) KR101036084B1 (zh)
CN (1) CN101334441B (zh)
TW (1) TWI416140B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412754B (zh) * 2009-05-15 2013-10-21 Hon Hai Prec Ind Co Ltd 特性阻抗測試系統及方法
CN105021938B (zh) * 2014-04-30 2018-11-09 佰欧特株式会社 检查装置
CN104819986B (zh) * 2015-04-01 2018-05-18 广东韦达尔科技有限公司 一种全景式自动修补的银浆线检测机
CN104793095B (zh) * 2015-04-01 2018-10-30 广东韦达尔科技有限公司 一种能自动补缺的银浆线检测机
TWI581035B (zh) * 2015-07-24 2017-05-01 惠特科技股份有限公司 液晶測試板定位方法
CN105427297B (zh) * 2015-11-12 2018-12-18 广州视源电子科技股份有限公司 一种图像校准方法及装置
CN106197279B (zh) * 2016-08-26 2019-04-16 苏州朗坤自动化设备有限公司 一种表面对焦位置检测机构
CN111562413A (zh) * 2019-02-14 2020-08-21 均豪精密工业股份有限公司 检测方法及检测系统
CN111580020B (zh) * 2020-05-27 2022-03-11 中国南方电网有限责任公司 一种三相分体式变压器ct极性校验方法及系统
CN114942381A (zh) * 2022-07-21 2022-08-26 深圳市东方宇之光科技股份有限公司 基于悬臂式结构测试电路板的飞针测试机及测试方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH04283672A (ja) * 1991-03-13 1992-10-08 Fujitsu Ltd 分割試験ヘッドの位置補正方法及び装置
JPH04340484A (ja) * 1991-05-17 1992-11-26 Fujitsu Ltd 多軸プローブ位置決め装置
JP2002341074A (ja) * 2001-05-14 2002-11-27 Yamaha Fine Technologies Co Ltd 位置認識可能な処理装置および処理方法
US20070015711A1 (en) * 2004-01-23 2007-01-18 Szeto Hazel H Methods for reducing oxidative damage

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JP2783456B2 (ja) * 1990-11-16 1998-08-06 ファナック株式会社 ロボットの座標系設定方式
JPH04244973A (ja) * 1991-01-31 1992-09-01 Mitsui Eng & Shipbuild Co Ltd 導通検査装置
JPH0511822A (ja) * 1991-07-03 1993-01-22 Fanuc Ltd ロボツトの協調作業方式
JPH05185384A (ja) * 1992-01-14 1993-07-27 Shimadzu Corp マイクロマニピュレータ
JPH0823572B2 (ja) * 1992-09-18 1996-03-06 オカノ電機株式会社 プローブ移動方式基板検査装置
US5657394A (en) * 1993-06-04 1997-08-12 Integrated Technology Corporation Integrated circuit probe card inspection system
JPH07209384A (ja) * 1994-01-24 1995-08-11 Okano Denki Kk プローブ移動式基板検査装置
JPH1034576A (ja) * 1996-07-24 1998-02-10 Tescon:Kk マルチロボットシステム
EP0962777A3 (en) * 1998-06-02 2002-12-11 Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) Printed circuit board testing apparatus
US6208375B1 (en) * 1999-05-21 2001-03-27 Elite Engineering Corporation Test probe positioning method and system for micro-sized devices
JP2002018750A (ja) * 2000-07-07 2002-01-22 Yaskawa Electric Corp ロボットのキャリブレーション方法及び装置
JP4721247B2 (ja) * 2001-03-16 2011-07-13 東京エレクトロン株式会社 プローブ方法及びプローブ装置
DE10220343B4 (de) * 2002-05-07 2007-04-05 Atg Test Systems Gmbh & Co. Kg Reicholzheim Vorrichtung und Verfahren zum Prüfen von Leiterplatten und Prüfsonde
US7026832B2 (en) * 2002-10-28 2006-04-11 Dainippon Screen Mfg. Co., Ltd. Probe mark reading device and probe mark reading method
TW200537110A (en) * 2004-05-14 2005-11-16 Innolux Display Corp Testing apparatus
JP4919617B2 (ja) * 2005-05-27 2012-04-18 ヤマハファインテック株式会社 プリント基板の電気検査装置および電気検査方法
KR100990028B1 (ko) * 2005-10-18 2010-10-26 지에스아이 그룹 코포레이션 레이저 프로세싱 방법, 정렬 방법 및 레이저 프로세싱 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04283672A (ja) * 1991-03-13 1992-10-08 Fujitsu Ltd 分割試験ヘッドの位置補正方法及び装置
JPH04340484A (ja) * 1991-05-17 1992-11-26 Fujitsu Ltd 多軸プローブ位置決め装置
JP2002341074A (ja) * 2001-05-14 2002-11-27 Yamaha Fine Technologies Co Ltd 位置認識可能な処理装置および処理方法
US20070015711A1 (en) * 2004-01-23 2007-01-18 Szeto Hazel H Methods for reducing oxidative damage

Also Published As

Publication number Publication date
JP4461159B2 (ja) 2010-05-12
TW200918923A (en) 2009-05-01
CN101334441B (zh) 2012-06-27
KR20080110510A (ko) 2008-12-18
TWI416140B (zh) 2013-11-21
JP2008309601A (ja) 2008-12-25
CN101334441A (zh) 2008-12-31

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