KR101027840B1 - 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 - Google Patents

전기ㆍ전자기기용 동합금 판재 및 그 제조방법 Download PDF

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Publication number
KR101027840B1
KR101027840B1 KR1020097004769A KR20097004769A KR101027840B1 KR 101027840 B1 KR101027840 B1 KR 101027840B1 KR 1020097004769 A KR1020097004769 A KR 1020097004769A KR 20097004769 A KR20097004769 A KR 20097004769A KR 101027840 B1 KR101027840 B1 KR 101027840B1
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South Korea
Prior art keywords
copper alloy
compound
alloy sheet
mass
intermetallic compound
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Korean (ko)
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KR20090051077A (ko
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구니테루 미하라
다쓰히코 에구치
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후루카와 덴키 고교 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
KR1020097004769A 2006-09-12 2007-09-12 전기ㆍ전자기기용 동합금 판재 및 그 제조방법 Expired - Fee Related KR101027840B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006246961 2006-09-12
JPJP-P-2006-246961 2006-09-12
JPJP-P-2007-236003 2007-09-11
JP2007236003A JP4247922B2 (ja) 2006-09-12 2007-09-11 電気・電子機器用銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
KR20090051077A KR20090051077A (ko) 2009-05-20
KR101027840B1 true KR101027840B1 (ko) 2011-04-07

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Country Link
US (1) US7947133B2 (https=)
JP (1) JP4247922B2 (https=)
KR (1) KR101027840B1 (https=)
CN (1) CN101535511B (https=)
MY (1) MY144826A (https=)
TW (1) TWI349714B (https=)
WO (1) WO2008032738A1 (https=)

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Publication number Priority date Publication date Assignee Title
KR20200002779A (ko) * 2017-04-26 2020-01-08 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법

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JP4837697B2 (ja) * 2008-03-31 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5367999B2 (ja) * 2008-03-31 2013-12-11 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
JP5225787B2 (ja) * 2008-05-29 2013-07-03 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金板又は条
EP2351862B1 (en) * 2008-10-22 2014-11-26 Furukawa Electric Co., Ltd. Copper alloy sheet, electric and electronic parts, and copper alloy sheet manufacturing method
EP2371976B1 (en) 2008-12-01 2014-10-22 JX Nippon Mining & Metals Corporation Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
EP2374907B1 (en) * 2008-12-19 2014-06-25 Furukawa Electric Co., Ltd. Copper alloy sheet for electrical/electronic components, and method for producing same
JP5604882B2 (ja) * 2009-03-10 2014-10-15 日立金属株式会社 半軟化温度の低い銅荒引線の製造方法、銅線の製造方法及び銅線
JP4948678B2 (ja) * 2009-12-02 2012-06-06 古河電気工業株式会社 銅合金板材、これを用いたコネクタ、並びにこれを製造する銅合金板材の製造方法
JP5654571B2 (ja) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金
JP4672804B1 (ja) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4834781B1 (ja) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
CN102021359B (zh) * 2010-11-03 2013-01-02 西安理工大学 高Ni、Si含量的Cu-Ni-Si合金的制备方法
JP5192536B2 (ja) * 2010-12-10 2013-05-08 三菱伸銅株式会社 深絞り加工性及び耐疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金板及びその製造方法
JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
US10002684B2 (en) * 2012-07-26 2018-06-19 Ngk Insulators, Ltd. Copper alloy and method for manufacturing the same
WO2014115307A1 (ja) * 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
WO2014176357A1 (en) 2013-04-23 2014-10-30 Materion Corporation Copper-nickel-tin alloy with high toughness
JP6445895B2 (ja) * 2014-03-04 2018-12-26 Ｄｏｗａメタルテック株式会社 Ｓｎめっき材およびその製造方法
WO2016059707A1 (ja) * 2014-10-16 2016-04-21 三菱電機株式会社 Ｃｕ－Ｎｉ－Ｓｉ合金及びその製造方法
JP6085633B2 (ja) 2015-03-30 2017-02-22 Ｊｘ金属株式会社 銅合金板および、それを備えるプレス成形品
CN105316523A (zh) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 一种磨削机调节器用耐用电阻合金
CN106101960A (zh) * 2016-07-21 2016-11-09 瑞声科技(新加坡)有限公司 铜合金、应用所述铜合金的柔性电路板及微型发声器
JP6342975B2 (ja) 2016-11-25 2018-06-13 ファナック株式会社 射出成形管理システム
JP6440760B2 (ja) 2017-03-21 2018-12-19 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
JP6670277B2 (ja) 2017-09-14 2020-03-18 Ｊｘ金属株式会社 金型摩耗性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
CN113215439A (zh) * 2021-04-16 2021-08-06 安徽绿能技术研究院有限公司 一种高强度铜合金板材及其生产工艺
CN114293065A (zh) * 2021-12-31 2022-04-08 镇江市镇特合金材料有限公司 一种具有高强度的铜合金板材
CN116065053B (zh) * 2023-04-03 2023-07-11 凯美龙精密铜板带（河南）有限公司 一种铜合金及其制备方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JP2005307223A (ja) 2004-04-16 2005-11-04 Nikko Metal Manufacturing Co Ltd 高強度高導電性銅合金

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US4594221A (en) 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
JP3334157B2 (ja) * 1992-03-30 2002-10-15 三菱伸銅株式会社 スタンピング金型を摩耗させることの少ない銅合金条材
JPH06184680A (ja) 1992-12-21 1994-07-05 Kobe Steel Ltd 曲げ加工性が優れた銅合金
JP3550233B2 (ja) * 1995-10-09 2004-08-04 同和鉱業株式会社 高強度高導電性銅基合金の製造法
JPH10265874A (ja) * 1997-03-25 1998-10-06 Kobe Steel Ltd 電気・電子部品用銅合金及びその製造方法
JP2898627B2 (ja) * 1997-03-27 1999-06-02 日鉱金属株式会社 銅合金箔
JP4188440B2 (ja) * 1997-10-17 2008-11-26 大豊工業株式会社 摺動特性及び被削性に優れた銅系焼結摺動材料
JP3739214B2 (ja) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
US6436206B1 (en) * 1999-04-01 2002-08-20 Waterbury Rolling Mills, Inc. Copper alloy and process for obtaining same
JP3383615B2 (ja) 1999-08-05 2003-03-04 日鉱金属株式会社 電子材料用銅合金及びその製造方法
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4664584B2 (ja) * 2003-09-18 2011-04-06 株式会社神戸製鋼所 高強度銅合金板および高強度銅合金板の製造方法
JP4020881B2 (ja) 2004-04-13 2007-12-12 日鉱金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ−Ｍｇ系銅合金条
JP4959141B2 (ja) * 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 高強度銅合金

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JP2005307223A (ja) 2004-04-16 2005-11-04 Nikko Metal Manufacturing Co Ltd 高強度高導電性銅合金

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200002779A (ko) * 2017-04-26 2020-01-08 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법
KR102499442B1 (ko) 2017-04-26 2023-02-13 후루카와 덴키 고교 가부시키가이샤 구리 합금 판재 및 그 제조 방법

Also Published As

Publication number Publication date
KR20090051077A (ko) 2009-05-20
TWI349714B (en) 2011-10-01
WO2008032738A1 (fr) 2008-03-20
TW200821394A (en) 2008-05-16
MY144826A (en) 2011-11-15
JP2008095185A (ja) 2008-04-24
CN101535511B (zh) 2011-09-21
JP4247922B2 (ja) 2009-04-02
US7947133B2 (en) 2011-05-24
US20090257909A1 (en) 2009-10-15
CN101535511A (zh) 2009-09-16

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