KR100797666B1 - 기판처리장치 - Google Patents
기판처리장치 Download PDFInfo
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- KR100797666B1 KR100797666B1 KR1020060134474A KR20060134474A KR100797666B1 KR 100797666 B1 KR100797666 B1 KR 100797666B1 KR 1020060134474 A KR1020060134474 A KR 1020060134474A KR 20060134474 A KR20060134474 A KR 20060134474A KR 100797666 B1 KR100797666 B1 KR 100797666B1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (11)
- 노광장치에 인접하도록 배치되는 기판처리장치로서,기판에 처리를 행하기 위한 처리부와,상기 처리부와 상기 노광장치와의 사이에서 기판의 주고받기를 행하기 위한 주고받기부를 구비하고,상기 주고받기부는,기판을 반송하는 제1 및 제2 반송유닛과,상기 노광장치에 의한 노광처리 전에 기판의 세정처리를 행하는 세정처리유닛과,상기 노광장치에 의한 노광처리 후에 기판의 건조처리를 행하는 건조처리유닛과,기판을 일시적으로 재치하는 재치부(載置部)를 포함하고,상기 제1 반송유닛은 상기 처리부, 상기 세정처리유닛 및 상기 재치부의 사이에서 기판을 반송하고,상기 제2 반송유닛은 상기 재치부, 상기 노광장치 및 상기 건조처리유닛의 사이에서 기판을 반송하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 세정처리유닛은 기판의 세정처리 후에 기판의 건조처리를 행하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 건조처리유닛은 기판의 건조처리 전에 기판의 세정처리를 행하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 재치부는 상기 노광장치에 의한 노광처리 전의 기판을 소정온도로 유지하면서 상기 노광장치에의 반입이 가능하게 될 때까지 기판을 대기시키는 온도관리대기유닛을 포함하는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 처리부, 상기 주고받기부 및 상기 노광장치는 제1 방향으로 병설되고,상기 주고받기부는 상기 제1 방향과 수평면 내에서 직교하는 제2 방향에 적어도 한 개의 측면을 갖고,상기 건조처리유닛은 상기 주고받기부 내에 있어서 상기 한 개의 측면측에 배치되는 것을 특징으로 하는 기판처리장치.
- 제5항에 있어서,상기 주고받기부는 상기 제2 방향에 있어서 상기 한 개의 측면에 대향하는 다른 측면을 갖고,상기 세정처리유닛은 상기 주고받기부 내에 있어서 상기 다른 측면측에 배치되는 것을 특징으로 하는 기판처리장치.
- 제6항에 있어서,상기 재치부는 상기 주고받기부 내의 상기 제2 방향에서의 대략 중앙부에 배치되고,상기 제1 반송유닛은 상기 세정처리유닛과 상기 재치부와의 사이에 배치되며상기 제2 반송유닛은 상기 재치부와 상기 건조처리유닛과의 사이에 배치되는 것을 특징으로 하는 기판처리장치.
- 제5항에 있어서,상기 주고받기부는 상기 제2 방향에 있어서 상기 한 개의 측면에 대향하는 다른 측면을 갖고,상기 제1 반송유닛은 상기 주고받기부 내에 있어서 상기 다른 측면측에 배치되고,상기 세정처리유닛 및 상기 재치부는 상기 주고받기부 내의 상기 제2 방향에서의 대략 중앙부에 적층 배치되며,상기 제2 반송유닛은 상기 세정처리유닛 및 상기 재치부와 상기 건조처리유닛과의 사이에 배치되는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 제2 반송유닛은 기판을 지지하는 제1 및 제2 지지부를 포함하고,상기 노광장치에 의한 노광처리 전 및 상기 건조처리유닛에 의한 건조처리 후의 기판을 반송할 때는 상기 제1 지지부에 의해 기판을 지지하고,상기 노광처리 후의 기판을 상기 노광장치로부터 상기 건조처리유닛으로 반송할 때는 상기 제2 지지부에 의해 기판을 지지하는 것을 특징으로 하는 기판처리장치.
- 제9항에 있어서,상기 제2 지지부는 상기 제1 지지부보다 아래쪽에 설치되는 것을 특징으로 하는 기판처리장치.
- 제1항에 있어서,상기 주고받기부는 기판의 주변부를 노광하는 에지(edge)노광부를 더 포함하고,상기 제1 반송유닛은 상기 처리부, 상기 에지노광부, 상기 세정처리유닛 및 상기 재치부의 사이에서 기판을 반송하는 것을 특징으로 하는 기판처리장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2006-00007297 | 2006-01-16 | ||
JP2006007297A JP4667252B2 (ja) | 2006-01-16 | 2006-01-16 | 基板処理装置 |
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KR20070076420A KR20070076420A (ko) | 2007-07-24 |
KR100797666B1 true KR100797666B1 (ko) | 2008-01-23 |
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US (1) | US7722267B2 (ko) |
JP (1) | JP4667252B2 (ko) |
KR (1) | KR100797666B1 (ko) |
CN (1) | CN100495639C (ko) |
TW (1) | TWI330867B (ko) |
Cited By (1)
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KR20210040262A (ko) * | 2019-10-02 | 2021-04-13 | 도쿄엘렉트론가부시키가이샤 | 도포, 현상 장치 및 도포, 현상 방법 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3988676B2 (ja) * | 2003-05-01 | 2007-10-10 | セイコーエプソン株式会社 | 塗布装置、薄膜の形成方法、薄膜形成装置及び半導体装置の製造方法 |
JP2007201078A (ja) * | 2006-01-25 | 2007-08-09 | Sokudo:Kk | 基板処理装置 |
JP5132108B2 (ja) * | 2006-02-02 | 2013-01-30 | 株式会社Sokudo | 基板処理装置 |
JP2008060302A (ja) * | 2006-08-31 | 2008-03-13 | Sokudo:Kk | 基板処理装置 |
JP5096849B2 (ja) * | 2007-09-13 | 2012-12-12 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
JP5166802B2 (ja) | 2007-09-13 | 2013-03-21 | 株式会社Sokudo | 基板処理装置および基板処理方法 |
JP4940119B2 (ja) * | 2007-12-10 | 2012-05-30 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5462506B2 (ja) | 2009-03-18 | 2014-04-02 | 株式会社Sokudo | 基板処理装置 |
JP2012039075A (ja) * | 2010-07-13 | 2012-02-23 | Tokyo Electron Ltd | 真空処理装置 |
JP5666361B2 (ja) | 2011-03-29 | 2015-02-12 | 株式会社Screenセミコンダクターソリューションズ | 基板処理装置 |
JP5779168B2 (ja) * | 2012-12-04 | 2015-09-16 | 東京エレクトロン株式会社 | 周縁部塗布装置、周縁部塗布方法及び周縁部塗布用記録媒体 |
NL2014792A (en) | 2014-06-16 | 2016-03-31 | Asml Netherlands Bv | Lithographic apparatus, method of transferring a substrate and device manufacturing method. |
JP5830140B2 (ja) * | 2014-07-25 | 2015-12-09 | 東京エレクトロン株式会社 | 基板処理装置 |
JP7114456B2 (ja) * | 2018-12-28 | 2022-08-08 | 株式会社Screenホールディングス | 基板処理装置および基板搬送方法 |
JP7050735B2 (ja) * | 2019-10-02 | 2022-04-08 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像方法 |
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KR102319168B1 (ko) | 2019-10-02 | 2021-11-01 | 도쿄엘렉트론가부시키가이샤 | 도포, 현상 장치 및 도포, 현상 방법 |
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JP4667252B2 (ja) | 2011-04-06 |
TW200741841A (en) | 2007-11-01 |
US20070166031A1 (en) | 2007-07-19 |
CN100495639C (zh) | 2009-06-03 |
US7722267B2 (en) | 2010-05-25 |
CN101005009A (zh) | 2007-07-25 |
KR20070076420A (ko) | 2007-07-24 |
TWI330867B (en) | 2010-09-21 |
JP2007189138A (ja) | 2007-07-26 |
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