KR100659921B1 - 반도체 장치 및 그의 제조 방법 - Google Patents
반도체 장치 및 그의 제조 방법 Download PDFInfo
- Publication number
- KR100659921B1 KR100659921B1 KR1020000021009A KR20000021009A KR100659921B1 KR 100659921 B1 KR100659921 B1 KR 100659921B1 KR 1020000021009 A KR1020000021009 A KR 1020000021009A KR 20000021009 A KR20000021009 A KR 20000021009A KR 100659921 B1 KR100659921 B1 KR 100659921B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- insulating film
- concentration impurity
- impurity region
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6717—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions the source and the drain regions being asymmetrical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6719—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions having significant overlap between the lightly-doped drains and the gate electrodes, e.g. gate-overlapped LDD [GOLDD] TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0221—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
- H10D86/0223—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials
- H10D86/0225—Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies comprising crystallisation of amorphous, microcrystalline or polycrystalline semiconductor materials using crystallisation-promoting species, e.g. using a Ni catalyst
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133337—Layers preventing ion diffusion, e.g. by ion absorption
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
- Liquid Crystal (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11160599 | 1999-04-20 | ||
| JP99-111605 | 1999-04-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010014789A KR20010014789A (ko) | 2001-02-26 |
| KR100659921B1 true KR100659921B1 (ko) | 2006-12-21 |
Family
ID=14565591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000021009A Expired - Fee Related KR100659921B1 (ko) | 1999-04-20 | 2000-04-20 | 반도체 장치 및 그의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6424012B1 (enExample) |
| JP (1) | JP2001007342A (enExample) |
| KR (1) | KR100659921B1 (enExample) |
| TW (1) | TW451269B (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3830623B2 (ja) * | 1997-07-14 | 2006-10-04 | 株式会社半導体エネルギー研究所 | 結晶性半導体膜の作製方法 |
| JP3295346B2 (ja) | 1997-07-14 | 2002-06-24 | 株式会社半導体エネルギー研究所 | 結晶性珪素膜の作製方法及びそれを用いた薄膜トランジスタ |
| US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
| JP4202502B2 (ja) * | 1998-12-28 | 2008-12-24 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US8158980B2 (en) * | 2001-04-19 | 2012-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having a pixel matrix circuit that includes a pixel TFT and a storage capacitor |
| JP2001007342A (ja) * | 1999-04-20 | 2001-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| WO2001061760A1 (en) * | 2000-02-15 | 2001-08-23 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing thin-film transistor, and liquid-crystal display |
| TW507258B (en) * | 2000-02-29 | 2002-10-21 | Semiconductor Systems Corp | Display device and method for fabricating the same |
| JP4769997B2 (ja) * | 2000-04-06 | 2011-09-07 | ソニー株式会社 | 薄膜トランジスタ及びその製造方法、液晶表示装置、液晶表示装置の製造方法、有機el装置、有機el装置の製造方法 |
| US8610645B2 (en) | 2000-05-12 | 2013-12-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| US7633471B2 (en) * | 2000-05-12 | 2009-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric appliance |
| KR100383920B1 (ko) * | 2000-09-01 | 2003-05-14 | 엘지.필립스 엘시디 주식회사 | 박막트랜지스터형 광센서 |
| KR100628257B1 (ko) * | 2000-10-20 | 2006-09-27 | 엘지.필립스 엘시디 주식회사 | 반사형 및 반투과형 lcd의 구조 |
| JP2002133890A (ja) * | 2000-10-24 | 2002-05-10 | Alps Electric Co Ltd | シフトレジスタ |
| JP2002141514A (ja) * | 2000-11-07 | 2002-05-17 | Sanyo Electric Co Ltd | ボトムゲート型薄膜トランジスタ及びその製造方法 |
| TW541584B (en) * | 2001-06-01 | 2003-07-11 | Semiconductor Energy Lab | Semiconductor film, semiconductor device and method for manufacturing same |
| KR100437765B1 (ko) * | 2001-06-15 | 2004-06-26 | 엘지전자 주식회사 | 고온용 기판을 이용한 박막트랜지스터 제조방법과 이를 이용한 표시장치의 제조방법 |
| JP3961240B2 (ja) * | 2001-06-28 | 2007-08-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6756608B2 (en) * | 2001-08-27 | 2004-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| JP3961310B2 (ja) * | 2002-02-21 | 2007-08-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2003330388A (ja) * | 2002-05-15 | 2003-11-19 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| KR100905470B1 (ko) * | 2002-11-20 | 2009-07-02 | 삼성전자주식회사 | 박막 트랜지스터 어레이 기판 |
| KR100915148B1 (ko) * | 2003-03-07 | 2009-09-03 | 엘지디스플레이 주식회사 | 구동회로 일체형 액정표시장치의 스위칭 소자 및구동소자의제조방법 |
| KR100916606B1 (ko) * | 2003-03-07 | 2009-09-14 | 엘지디스플레이 주식회사 | 구동회로 일체형 액정표시장치의 스위칭 소자 및 구동소자및 그 제조방법 |
| TWI231996B (en) * | 2003-03-28 | 2005-05-01 | Au Optronics Corp | Dual gate layout for thin film transistor |
| KR100468865B1 (ko) * | 2003-06-18 | 2005-01-29 | 삼성전자주식회사 | 이차원적인 도펀트 분포의 분석을 위한 선택적 전기화학에칭방법 |
| JP4748954B2 (ja) * | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| KR100675636B1 (ko) * | 2004-05-31 | 2007-02-02 | 엘지.필립스 엘시디 주식회사 | Goldd구조 및 ldd구조의 tft를 동시에포함하는 구동회로부 일체형 액정표시장치 |
| US7807516B2 (en) * | 2005-06-30 | 2010-10-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of the same |
| US8138058B2 (en) * | 2006-11-24 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Substrate with marker, manufacturing method thereof, laser irradiation apparatus, laser irradiation method, light exposure apparatus, and manufacturing method of semiconductor device |
| JP5371144B2 (ja) * | 2007-06-29 | 2013-12-18 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法、並びに電子機器 |
| KR100872981B1 (ko) * | 2007-07-19 | 2008-12-08 | 주식회사 동부하이텍 | 반도체 소자의 제조방법 |
| FR2922046B1 (fr) * | 2007-10-05 | 2011-06-24 | Saint Gobain | Perfectionnements apportes a des elements capables de collecter de la lumiere |
| KR101425131B1 (ko) * | 2008-01-15 | 2014-07-31 | 삼성디스플레이 주식회사 | 표시 기판 및 이를 포함하는 표시 장치 |
| WO2010053060A1 (en) | 2008-11-07 | 2010-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JP5615540B2 (ja) * | 2008-12-19 | 2014-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8383470B2 (en) * | 2008-12-25 | 2013-02-26 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor (TFT) having a protective layer and manufacturing method thereof |
| US20100193920A1 (en) * | 2009-01-30 | 2010-08-05 | Infineon Technologies Ag | Semiconductor device, leadframe and method of encapsulating |
| KR101460869B1 (ko) * | 2009-09-04 | 2014-11-11 | 가부시끼가이샤 도시바 | 박막 트랜지스터 및 그 제조 방법 |
| KR102257147B1 (ko) * | 2010-01-20 | 2021-05-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 및 휴대 전화기 |
| KR20110114089A (ko) * | 2010-04-12 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 이의 제조 방법 및 이를 포함하는 표시 장치 |
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| KR20120061383A (ko) * | 2010-12-03 | 2012-06-13 | 삼성전자주식회사 | 표시 장치 및 그 제조 방법 |
| US8859330B2 (en) * | 2011-03-23 | 2014-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JPWO2012153365A1 (ja) * | 2011-05-10 | 2014-07-28 | パナソニック株式会社 | 薄膜トランジスタ装置の製造方法、薄膜トランジスタ装置および表示装置 |
| US9466618B2 (en) * | 2011-05-13 | 2016-10-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including two thin film transistors and method of manufacturing the same |
| JP2014002250A (ja) * | 2012-06-18 | 2014-01-09 | Mitsubishi Electric Corp | 液晶表示装置及びその製造方法 |
| TWI665778B (zh) * | 2014-02-05 | 2019-07-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置、模組及電子裝置 |
| JP6523695B2 (ja) * | 2014-02-05 | 2019-06-05 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2015188062A (ja) * | 2014-02-07 | 2015-10-29 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP6267624B2 (ja) * | 2014-10-24 | 2018-01-24 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
| CN104360557B (zh) * | 2014-11-26 | 2017-04-26 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法,以及显示装置 |
| CN105355590B (zh) * | 2015-10-12 | 2018-04-20 | 武汉华星光电技术有限公司 | 阵列基板及其制作方法 |
| FR3055430B1 (fr) * | 2016-08-31 | 2019-04-05 | Valeo Vision | Dispositif d'eclairage et/ou de signalisation, notamment pour vehicule automobile |
| CN106898613A (zh) * | 2017-02-07 | 2017-06-27 | 武汉华星光电技术有限公司 | Tft基板及其制作方法 |
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| JPS5893273A (ja) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | 薄膜半導体装置 |
| JPS58168278A (ja) * | 1982-03-30 | 1983-10-04 | Toshiba Corp | 薄膜トランジスタの製造方法 |
| JPS637635A (ja) * | 1986-06-27 | 1988-01-13 | Toshiba Corp | 半導体装置の製造方法 |
| JPH02137228A (ja) * | 1988-11-17 | 1990-05-25 | Nec Yamagata Ltd | 半導体装置の製造方法 |
| JP3483581B2 (ja) * | 1991-08-26 | 2004-01-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2768590B2 (ja) * | 1992-04-24 | 1998-06-25 | シャープ株式会社 | アクティブマトリクス基板 |
| JPH06148616A (ja) | 1992-11-04 | 1994-05-27 | Sharp Corp | 液晶表示パネル |
| US5843225A (en) * | 1993-02-03 | 1998-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating semiconductor and process for fabricating semiconductor device |
| US5639698A (en) * | 1993-02-15 | 1997-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
| US6413805B1 (en) * | 1993-03-12 | 2002-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device forming method |
| JP3089174B2 (ja) | 1994-12-26 | 2000-09-18 | シャープ株式会社 | 絶縁膜の形成方法および絶縁膜を有する電子装置 |
| JP3076504B2 (ja) | 1994-12-27 | 2000-08-14 | シャープ株式会社 | 絶縁膜を有する電子装置および絶縁膜の形成方法 |
| TW447144B (en) * | 1995-03-27 | 2001-07-21 | Semiconductor Energy Lab | Semiconductor device and a method of manufacturing the same |
| JP2919306B2 (ja) * | 1995-05-31 | 1999-07-12 | 日本電気株式会社 | 低抵抗タンタル薄膜の製造方法及び低抵抗タンタル配線並びに電極 |
| US5637519A (en) * | 1996-03-21 | 1997-06-10 | Industrial Technology Research Institute | Method of fabricating a lightly doped drain thin-film transistor |
| JP3593212B2 (ja) * | 1996-04-27 | 2004-11-24 | 株式会社半導体エネルギー研究所 | 表示装置 |
| JP3424891B2 (ja) * | 1996-12-27 | 2003-07-07 | 三洋電機株式会社 | 薄膜トランジスタの製造方法および表示装置 |
| JPH10261803A (ja) * | 1997-03-18 | 1998-09-29 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
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| JPH10261802A (ja) | 1997-03-19 | 1998-09-29 | Toshiba Electron Eng Corp | 薄膜トランジスタアレイ基板及び薄膜トランジスタアレイ基板の製造方法 |
| JP3939399B2 (ja) * | 1997-07-22 | 2007-07-04 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3974229B2 (ja) * | 1997-07-22 | 2007-09-12 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3942699B2 (ja) * | 1997-08-29 | 2007-07-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JPH1197706A (ja) * | 1997-09-23 | 1999-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
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| JP4386978B2 (ja) * | 1998-08-07 | 2009-12-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6294441B1 (en) * | 1998-08-18 | 2001-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
| JP2001007342A (ja) * | 1999-04-20 | 2001-01-12 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP2000036606A (ja) * | 1999-07-14 | 2000-02-02 | Semiconductor Energy Lab Co Ltd | 薄膜状絶縁ゲイト型半導体装置 |
-
2000
- 2000-03-30 JP JP2000092827A patent/JP2001007342A/ja not_active Withdrawn
- 2000-04-18 US US09/550,829 patent/US6424012B1/en not_active Expired - Fee Related
- 2000-04-19 TW TW089107381A patent/TW451269B/zh not_active IP Right Cessation
- 2000-04-20 KR KR1020000021009A patent/KR100659921B1/ko not_active Expired - Fee Related
-
2002
- 2002-06-10 US US10/166,151 patent/US6677221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6424012B1 (en) | 2002-07-23 |
| US20020149057A1 (en) | 2002-10-17 |
| KR20010014789A (ko) | 2001-02-26 |
| JP2001007342A (ja) | 2001-01-12 |
| US6677221B2 (en) | 2004-01-13 |
| TW451269B (en) | 2001-08-21 |
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