KR100343520B1 - 땜납볼공급장치 - Google Patents

땜납볼공급장치 Download PDF

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Publication number
KR100343520B1
KR100343520B1 KR1019940703657A KR19940703657A KR100343520B1 KR 100343520 B1 KR100343520 B1 KR 100343520B1 KR 1019940703657 A KR1019940703657 A KR 1019940703657A KR 19940703657 A KR19940703657 A KR 19940703657A KR 100343520 B1 KR100343520 B1 KR 100343520B1
Authority
KR
South Korea
Prior art keywords
solder ball
flux
head
solder
supplying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019940703657A
Other languages
English (en)
Korean (ko)
Inventor
나메카와마사토시
이부키요시테루
이구찌노리오
오쿠노마사토시
Original Assignee
시티즌 도케이 가부시키가이샤
미요타 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시티즌 도케이 가부시키가이샤, 미요타 가부시키가이샤 filed Critical 시티즌 도케이 가부시키가이샤
Application granted granted Critical
Publication of KR100343520B1 publication Critical patent/KR100343520B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
KR1019940703657A 1993-05-31 1994-03-02 땜납볼공급장치 Expired - Lifetime KR100343520B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP15431193 1993-05-31
JP93-154311 1993-05-31
PCT/JP1994/000337 WO1994028580A1 (en) 1993-05-31 1994-03-02 Solder ball feeder

Publications (1)

Publication Number Publication Date
KR100343520B1 true KR100343520B1 (ko) 2002-11-23

Family

ID=15581347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940703657A Expired - Lifetime KR100343520B1 (ko) 1993-05-31 1994-03-02 땜납볼공급장치

Country Status (8)

Country Link
US (1) US5467913A (enExample)
JP (1) JP3303109B2 (enExample)
KR (1) KR100343520B1 (enExample)
GB (1) GB2284933B (enExample)
HK (1) HK116497A (enExample)
SG (1) SG42943A1 (enExample)
TW (1) TW261558B (enExample)
WO (1) WO1994028580A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100694462B1 (ko) * 2001-04-02 2007-03-12 앰코 테크놀로지 코리아 주식회사 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법
US12495504B2 (en) * 2023-09-13 2025-12-09 Samsung Electronics Co., Ltd. Ball attach tool

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US5615823A (en) * 1994-07-26 1997-04-01 Matsushita Electric Industrial Co., Ltd. Soldering ball mounting apparatus and method
JP3528264B2 (ja) * 1994-08-19 2004-05-17 ソニー株式会社 ソルダーボールのマウント装置
US5657528A (en) * 1994-08-25 1997-08-19 Matsushita Electric Industrial Co., Ltd. Method of transferring conductive balls
JP3079921B2 (ja) * 1994-11-28 2000-08-21 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
JP3271461B2 (ja) * 1995-02-07 2002-04-02 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
JP3129151B2 (ja) 1995-06-13 2001-01-29 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
JP3158966B2 (ja) * 1995-06-19 2001-04-23 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
US5685477A (en) * 1995-06-28 1997-11-11 Intel Corporation Method for attaching and handling conductive spheres to a substrate
JP3120714B2 (ja) * 1995-10-31 2000-12-25 松下電器産業株式会社 導電性ボールの搭載装置
DE19541996C2 (de) * 1995-11-10 1997-09-25 David Finn Vorrichtung zur Applikation von Verbindungsmaterialeinheiten
DE19544929C2 (de) * 1995-12-01 2001-02-15 Fraunhofer Ges Forschung Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip
US5753904A (en) * 1995-12-29 1998-05-19 Motorola, Inc. Tool for detecting missing balls using a photodetector
KR100268632B1 (ko) * 1996-03-08 2000-10-16 야마구치 다케시 범프형성방법 및 장치
KR100262844B1 (ko) * 1996-04-01 2000-09-01 모리시타 요이찌 도전성 보올의 탑재장치 및 방법
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6024584A (en) 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
JP3397051B2 (ja) * 1996-08-20 2003-04-14 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6241535B1 (en) 1996-10-10 2001-06-05 Berg Technology, Inc. Low profile connector
TW406454B (en) 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6412685B2 (en) * 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US6230963B1 (en) * 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) * 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6003753A (en) * 1997-07-14 1999-12-21 Motorola, Inc. Air-blow solder ball loading system for micro ball grid arrays
JP3351314B2 (ja) 1997-10-15 2002-11-25 松下電器産業株式会社 導電性ボールの搭載装置および搭載方法
US6182356B1 (en) 1997-11-24 2001-02-06 International Business Machines Corporation Apparatus for solder ball mold loading
US6237219B1 (en) * 1998-03-05 2001-05-29 Matsushita Electric Industrial Co., Ltd. Method of mounting conductive ball
JP4045517B2 (ja) * 1998-09-25 2008-02-13 澁谷工業株式会社 フラックス転写装置
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
US6268275B1 (en) * 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
US6325272B1 (en) 1998-10-09 2001-12-04 Robotic Vision Systems, Inc. Apparatus and method for filling a ball grid array
JP3932501B2 (ja) * 1998-12-01 2007-06-20 澁谷工業株式会社 ボールマウント装置
JP3024113B1 (ja) * 1999-01-27 2000-03-21 株式会社日鉄マイクロメタル 金属球配列方法及び配列装置
WO2000049382A2 (en) * 1999-02-16 2000-08-24 The Perkin-Elmer Corporation Bead dispensing system
JP3283026B2 (ja) * 1999-04-30 2002-05-20 新光電気工業株式会社 ボール状端子の吸着装置及びボール状端子の搭載方法
JP4598240B2 (ja) * 1999-06-24 2010-12-15 アスリートＦａ株式会社 ボール搭載装置及びボール搭載方法
US6276598B1 (en) * 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP4143788B2 (ja) * 1999-08-04 2008-09-03 澁谷工業株式会社 ボールマウント装置及びマウント方法
US6355298B1 (en) * 1999-08-23 2002-03-12 Asm Assembly Automation Ltd. Placement system apparatus and method
US6227437B1 (en) 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
SG97164A1 (en) 2000-09-21 2003-07-18 Micron Technology Inc Individual selective rework of defective bga solder balls
DE20106464U1 (de) * 2001-04-12 2001-08-02 Pac Tech - Packaging Technologies GmbH, 14641 Nauen Vorrichtung zum Aufbringen von Lotkugeln
US6607118B2 (en) 2001-04-30 2003-08-19 Asm Assembly Automation Limited Apparatus and method for ball release
US6739498B2 (en) * 2001-05-17 2004-05-25 Intel Corporation Solder ball attachment system
JP4126996B2 (ja) * 2002-03-13 2008-07-30 セイコーエプソン株式会社 デバイスの製造方法及びデバイス製造装置
JP4258759B2 (ja) * 2003-06-26 2009-04-30 澁谷工業株式会社 半田ボール搭載方法及び装置
US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
JP2007535094A (ja) 2003-07-16 2007-11-29 グリフィクス インコーポレーティッド 連動接触システムを備えた電気相互接続アセンブリ
US7297003B2 (en) 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7186645B2 (en) * 2003-10-13 2007-03-06 Intel Corporation Selective plating of package terminals
JP4586583B2 (ja) * 2005-03-10 2010-11-24 ソニー株式会社 半導体装置の接合方法
JP4042914B2 (ja) * 2005-04-22 2008-02-06 Ｔｄｋ株式会社 半田付け装置及び半田分配装置
JP4956609B2 (ja) 2006-03-20 2012-06-20 グリフィクス インコーポレーティッド ファインピッチ電気接続アセンブリのための複合端子
US7494913B2 (en) * 2006-08-31 2009-02-24 Intel Corporation Microball placement solutions
JP4247919B2 (ja) * 2006-09-25 2009-04-02 Ｔｄｋ株式会社 導電性材料の供給装置及び供給方法
US8061583B2 (en) * 2006-11-22 2011-11-22 Rokko Ventures Pte Ltd Ball mounting apparatus and method
US8671561B2 (en) * 2007-05-24 2014-03-18 Shinko Electric Industries Co., Ltd. Substrate manufacturing method
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JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
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US20160181222A1 (en) * 2014-12-23 2016-06-23 Mohit Sood Pickhead for solder ball placement on an integrated circuit package
JP6567290B2 (ja) * 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
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KR102655727B1 (ko) * 2017-10-19 2024-04-08 엘지디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
US11440117B2 (en) * 2019-09-27 2022-09-13 Jian Zhang Multiple module chip manufacturing arrangement
WO2023002557A1 (ja) * 2021-07-20 2023-01-26 株式会社新川 フラックス転写装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100694462B1 (ko) * 2001-04-02 2007-03-12 앰코 테크놀로지 코리아 주식회사 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법
US12495504B2 (en) * 2023-09-13 2025-12-09 Samsung Electronics Co., Ltd. Ball attach tool

Also Published As

Publication number Publication date
WO1994028580A1 (en) 1994-12-08
TW261558B (enExample) 1995-11-01
GB2284933B (en) 1996-12-04
GB2284933A (en) 1995-06-21
JP3303109B2 (ja) 2002-07-15
HK116497A (en) 1997-09-05
GB9424776D0 (en) 1995-03-01
SG42943A1 (en) 1997-10-17
US5467913A (en) 1995-11-21

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