TW261558B - - Google Patents

Info

Publication number
TW261558B
TW261558B TW083102746A TW83102746A TW261558B TW 261558 B TW261558 B TW 261558B TW 083102746 A TW083102746 A TW 083102746A TW 83102746 A TW83102746 A TW 83102746A TW 261558 B TW261558 B TW 261558B
Authority
TW
Taiwan
Application number
TW083102746A
Original Assignee
Citizen Watch Co Ltd
Shiyota Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd, Shiyota Kk filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of TW261558B publication Critical patent/TW261558B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
TW083102746A 1993-05-31 1994-03-30 TW261558B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15431193 1993-05-31

Publications (1)

Publication Number Publication Date
TW261558B true TW261558B (zh) 1995-11-01

Family

ID=15581347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083102746A TW261558B (zh) 1993-05-31 1994-03-30

Country Status (8)

Country Link
US (1) US5467913A (zh)
JP (1) JP3303109B2 (zh)
KR (1) KR100343520B1 (zh)
GB (1) GB2284933B (zh)
HK (1) HK116497A (zh)
SG (1) SG42943A1 (zh)
TW (1) TW261558B (zh)
WO (1) WO1994028580A1 (zh)

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JP3079921B2 (ja) * 1994-11-28 2000-08-21 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
JP3271461B2 (ja) * 1995-02-07 2002-04-02 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
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DE19541996C2 (de) * 1995-11-10 1997-09-25 David Finn Vorrichtung zur Applikation von Verbindungsmaterialeinheiten
DE19544929C2 (de) * 1995-12-01 2001-02-15 Fraunhofer Ges Forschung Vorrichtung zum flußmittelfreien Aufbringen eines Lötmittels auf ein Substrat oder einen Chip
US5753904A (en) * 1995-12-29 1998-05-19 Motorola, Inc. Tool for detecting missing balls using a photodetector
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JP4045517B2 (ja) * 1998-09-25 2008-02-13 澁谷工業株式会社 フラックス転写装置
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
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US6325272B1 (en) 1998-10-09 2001-12-04 Robotic Vision Systems, Inc. Apparatus and method for filling a ball grid array
JP3932501B2 (ja) * 1998-12-01 2007-06-20 澁谷工業株式会社 ボールマウント装置
JP3024113B1 (ja) * 1999-01-27 2000-03-21 株式会社日鉄マイクロメタル 金属球配列方法及び配列装置
ATE341003T1 (de) * 1999-02-16 2006-10-15 Applera Corp Vorrichtung zur handhabung von kügelchen
JP3283026B2 (ja) * 1999-04-30 2002-05-20 新光電気工業株式会社 ボール状端子の吸着装置及びボール状端子の搭載方法
JP4598240B2 (ja) * 1999-06-24 2010-12-15 アスリートＦａ株式会社 ボール搭載装置及びボール搭載方法
US6276598B1 (en) * 1999-07-13 2001-08-21 Asm Assembly Automation Ltd. Method and apparatus for ball placement
JP4143788B2 (ja) * 1999-08-04 2008-09-03 澁谷工業株式会社 ボールマウント装置及びマウント方法
US6355298B1 (en) * 1999-08-23 2002-03-12 Asm Assembly Automation Ltd. Placement system apparatus and method
US6227437B1 (en) 1999-08-24 2001-05-08 Kulicke & Soffa Industries Inc. Solder ball delivery and reflow apparatus and method of using the same
US6386433B1 (en) 1999-08-24 2002-05-14 Kulicke & Soffa Investments, Inc. Solder ball delivery and reflow apparatus and method
SG97164A1 (en) 2000-09-21 2003-07-18 Micron Technology Inc Individual selective rework of defective bga solder balls
KR100694462B1 (ko) * 2001-04-02 2007-03-12 앰코 테크놀로지 코리아 주식회사 반도체 자재의 신호인출단자 형성 장치 및 그 형성 방법
DE20106464U1 (de) * 2001-04-12 2001-08-02 Pac Tech Gmbh Vorrichtung zum Aufbringen von Lotkugeln
US6607118B2 (en) 2001-04-30 2003-08-19 Asm Assembly Automation Limited Apparatus and method for ball release
US6739498B2 (en) * 2001-05-17 2004-05-25 Intel Corporation Solder ball attachment system
JP4126996B2 (ja) * 2002-03-13 2008-07-30 セイコーエプソン株式会社 デバイスの製造方法及びデバイス製造装置
JP4258759B2 (ja) * 2003-06-26 2009-04-30 澁谷工業株式会社 半田ボール搭載方法及び装置
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US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7186645B2 (en) * 2003-10-13 2007-03-06 Intel Corporation Selective plating of package terminals
JP4586583B2 (ja) * 2005-03-10 2010-11-24 ソニー株式会社 半導体装置の接合方法
JP4042914B2 (ja) * 2005-04-22 2008-02-06 Ｔｄｋ株式会社 半田付け装置及び半田分配装置
KR101353650B1 (ko) 2006-03-20 2014-02-07 알앤디 소켓, 인코포레이티드 미세 피치 전기 상호접속 조립체용 복합 접촉체
US7494913B2 (en) * 2006-08-31 2009-02-24 Intel Corporation Microball placement solutions
JP4247919B2 (ja) * 2006-09-25 2009-04-02 Ｔｄｋ株式会社 導電性材料の供給装置及び供給方法
JP5341768B2 (ja) * 2006-11-22 2013-11-13 ロッコ・ベンチャーズ・プライベイト・リミテッド 改良されたボール実装装置および方法
US8671561B2 (en) * 2007-05-24 2014-03-18 Shinko Electric Industries Co., Ltd. Substrate manufacturing method
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8237171B2 (en) * 2010-02-09 2012-08-07 Microsemi Corporation High voltage high package pressure semiconductor package
US8587107B2 (en) * 2010-02-09 2013-11-19 Microsemi Corporation Silicon carbide semiconductor
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USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
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JP2014011231A (ja) * 2012-06-28 2014-01-20 Hitachi Ltd ハンダボール印刷搭載装置
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
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US20160181222A1 (en) * 2014-12-23 2016-06-23 Mohit Sood Pickhead for solder ball placement on an integrated circuit package
JP6567290B2 (ja) * 2015-02-20 2019-08-28 Ａｉメカテック株式会社 基板処理装置、基板処理システム、及び基板処理方法
CN108605431B (zh) * 2016-01-22 2020-10-30 华封科技有限公司 元件封装设备及其方法
US11440117B2 (en) * 2019-09-27 2022-09-13 Jian Zhang Multiple module chip manufacturing arrangement
KR20230144626A (ko) * 2021-07-20 2023-10-16 가부시키가이샤 신가와 플럭스 전사 장치

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Also Published As

Publication number Publication date
GB9424776D0 (en) 1995-03-01
US5467913A (en) 1995-11-21
GB2284933A (en) 1995-06-21
SG42943A1 (en) 1997-10-17
GB2284933B (en) 1996-12-04
KR100343520B1 (ko) 2002-11-23
JP3303109B2 (ja) 2002-07-15
HK116497A (en) 1997-09-05
WO1994028580A1 (fr) 1994-12-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees