KR100274526B1 - 에폭시 수지의 경화성 현탁액 - Google Patents
에폭시 수지의 경화성 현탁액 Download PDFInfo
- Publication number
- KR100274526B1 KR100274526B1 KR1019930012799A KR930012799A KR100274526B1 KR 100274526 B1 KR100274526 B1 KR 100274526B1 KR 1019930012799 A KR1019930012799 A KR 1019930012799A KR 930012799 A KR930012799 A KR 930012799A KR 100274526 B1 KR100274526 B1 KR 100274526B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- suspension
- core
- acid
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
- B32B2315/085—Glass fiber cloth or fabric
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH216192 | 1992-07-09 | ||
| CH92-0/2161 | 1992-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940002314A KR940002314A (ko) | 1994-02-17 |
| KR100274526B1 true KR100274526B1 (ko) | 2000-12-15 |
Family
ID=4227305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019930012799A Expired - Fee Related KR100274526B1 (ko) | 1992-07-09 | 1993-07-08 | 에폭시 수지의 경화성 현탁액 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6111015A (enExample) |
| EP (1) | EP0578613B1 (enExample) |
| JP (1) | JP3438059B2 (enExample) |
| KR (1) | KR100274526B1 (enExample) |
| CN (1) | CN1037975C (enExample) |
| CA (1) | CA2100026A1 (enExample) |
| DE (1) | DE59310074D1 (enExample) |
| ES (1) | ES2148213T3 (enExample) |
| FI (1) | FI110265B (enExample) |
| NO (1) | NO307470B1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101296986B1 (ko) * | 2009-02-27 | 2013-08-14 | 모멘티브 스페셜티 케미칼즈 인코포레이티드 | 비-셀룰로스 섬유 사이징, 코팅 또는 바인딩 조성물에 유용한 조성물 및 이를 포함하는 복합재 |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0659833B1 (de) * | 1993-12-21 | 2000-08-16 | Ciba SC Holding AG | Zusammensetzungen auf der Basis von Epoxidharzen, Zähigkeitsvermittlern und Aminen |
| JPH0925393A (ja) * | 1995-05-09 | 1997-01-28 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 |
| ES2175061T3 (es) * | 1995-11-29 | 2002-11-16 | Vantico Ag | Particulas nucleo-cascara (core-shell) y composiciones que contienen estas resinas epoxireticulables. |
| EP0816393B1 (de) * | 1996-07-02 | 2003-11-19 | Vantico AG | Härter für Epoxidharze |
| CN1089105C (zh) * | 1998-11-09 | 2002-08-14 | 南开大学 | 含刚性介晶基团及柔性链的环氧树脂粘合剂及其制备方法 |
| CA2365510A1 (en) | 1999-03-16 | 2000-09-21 | Vantico Ag | Hardenable composition with a particular combination of characteristics |
| KR100785572B1 (ko) * | 1999-04-13 | 2007-12-13 | 히다치 가세고교 가부시끼가이샤 | 에폭시수지조성물 및 전자장치 |
| JP4568940B2 (ja) * | 1999-04-13 | 2010-10-27 | 日立化成工業株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
| CN100371376C (zh) * | 2000-10-19 | 2008-02-27 | 长春人造树脂厂股份有限公司 | 阻燃性环氧树脂组合物及其应用 |
| JP5022540B2 (ja) * | 2001-01-15 | 2012-09-12 | コニカミノルタホールディングス株式会社 | インクジェットヘッド及びインクジェットヘッドの製造方法 |
| JP4771445B2 (ja) * | 2001-07-11 | 2011-09-14 | 日本化薬株式会社 | 電子部品用絶縁樹脂組成物及び接着シート |
| US20050010024A1 (en) * | 2001-10-08 | 2005-01-13 | Jorg Volle | Method for the production of tubes in composite materials |
| EP1456286B1 (en) | 2001-12-21 | 2012-06-13 | Henkel AG & Co. KGaA | Expandable epoxy resin-based systems modified with thermoplastic polymers |
| US20030198824A1 (en) * | 2002-04-19 | 2003-10-23 | Fong John W. | Photocurable compositions containing reactive polysiloxane particles |
| US6849687B2 (en) * | 2002-08-01 | 2005-02-01 | Bayer Polymers Llc | Thermoplastic composition having low gloss appearance |
| JP3909072B2 (ja) * | 2002-09-19 | 2007-04-25 | 三井化学株式会社 | 液晶シール剤組成物及びそれを用いた液晶表示パネルの製造方法 |
| US7056978B2 (en) * | 2002-11-06 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Toughened epoxy-anhydride no-flow underfill encapsulant |
| DE10357355A1 (de) * | 2003-12-09 | 2005-07-14 | Henkel Kgaa | 2 K Klebstoffe für den Fahrzeugbau |
| EP1780239B1 (en) * | 2004-08-18 | 2017-02-01 | Kaneka Corporation | Epoxy resin composition for semiconductor sealing agents and epoxy resin molding material |
| US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
| US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
| ATE534703T1 (de) * | 2005-08-24 | 2011-12-15 | Henkel Kgaa | Epoxidzusammensetzungen mit verbesserter schlagzähigkeit |
| KR100646939B1 (ko) * | 2005-08-29 | 2006-11-23 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 그 제조방법 |
| US7670683B2 (en) * | 2005-12-22 | 2010-03-02 | 3M Innovative Properties Company | Damage-resistant epoxy compound |
| US7892396B2 (en) * | 2006-06-07 | 2011-02-22 | Zephyros, Inc. | Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
| US7438782B2 (en) * | 2006-06-07 | 2008-10-21 | Zephyros, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| AU2007269038B8 (en) | 2006-07-07 | 2013-02-07 | Valspar Holdings I, Inc | Coating systems for cement composite articles |
| WO2008016889A1 (en) * | 2006-07-31 | 2008-02-07 | Henkel Ag & Co. Kgaa | Curable epoxy resin-based adhesive compositions |
| US8105460B2 (en) * | 2006-09-08 | 2012-01-31 | Zephyros, Inc. | Handling layer and adhesive parts formed therewith |
| WO2008045270A1 (en) | 2006-10-06 | 2008-04-17 | Henkel Ag & Co. Kgaa | Pumpable epoxy paste adhesives resistant to wash-off |
| ES2621154T3 (es) | 2006-11-13 | 2017-07-03 | Henkel IP & Holding GmbH | Composiciones de benzoxazina con cauchos de núcleo-envoltura |
| US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
| WO2008085286A1 (en) * | 2006-12-19 | 2008-07-17 | Henkel Corporation | (meth)acrylate compositions containing dispersions of core shell rubbers in (meth)acrylates |
| CN101679709B (zh) * | 2006-12-19 | 2012-06-06 | 汉高公司 | 含有在(甲基)丙烯酸酯中的核壳橡胶分散体的氰基丙烯酸酯组合物 |
| EP2123711B1 (en) * | 2007-02-28 | 2016-12-14 | Kaneka Corporation | Thermosetting resin composition having rubbery polymer particle dispersed therein, and process for production thereof |
| KR101526026B1 (ko) * | 2007-06-12 | 2015-06-04 | 제피로스, 인크. | 강화 접착 재료 |
| US8265949B2 (en) | 2007-09-27 | 2012-09-11 | Depuy Products, Inc. | Customized patient surgical plan |
| MX2010004855A (es) * | 2007-10-30 | 2010-06-30 | Henkel Ag & Co Kgaa | Adhesivos de pasta epoxi resistentes al lavado. |
| US7847034B2 (en) * | 2008-03-20 | 2010-12-07 | Loctite (R&D) Limited | Adducts and curable compositions using same |
| US20090253080A1 (en) * | 2008-04-02 | 2009-10-08 | Dammel Ralph R | Photoresist Image-Forming Process Using Double Patterning |
| GB0806434D0 (en) | 2008-04-09 | 2008-05-14 | Zephyros Inc | Improvements in or relating to structural adhesives |
| DE102008023076A1 (de) * | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
| ES2662646T3 (es) * | 2008-06-12 | 2018-04-09 | Henkel IP & Holding GmbH | Composiciones adhesivas epóxicas estructurales de dos partes, altamente reforzadas, de nueva generación |
| US8309633B2 (en) * | 2008-07-17 | 2012-11-13 | Henkel Ireland Ltd. | Low temperature, cationically curable compositions with improved cure speed and toughness |
| US20100040838A1 (en) * | 2008-08-15 | 2010-02-18 | Abdallah David J | Hardmask Process for Forming a Reverse Tone Image |
| US20100183851A1 (en) * | 2009-01-21 | 2010-07-22 | Yi Cao | Photoresist Image-forming Process Using Double Patterning |
| US8084186B2 (en) | 2009-02-10 | 2011-12-27 | Az Electronic Materials Usa Corp. | Hardmask process for forming a reverse tone image using polysilazane |
| JP5617171B2 (ja) * | 2009-02-19 | 2014-11-05 | 東レ株式会社 | 繊維強化複合材料およびその製造方法 |
| WO2010121392A1 (en) | 2009-04-21 | 2010-10-28 | Dow Global Technologies Inc. | Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom |
| CN102471651B (zh) * | 2009-07-08 | 2013-07-17 | 汉高股份有限及两合公司 | 导电粘合剂 |
| KR101684721B1 (ko) | 2009-08-31 | 2016-12-20 | 사이텍 테크놀러지 코포레이션 | 고성능 접착제 조성물 |
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| JP5605827B2 (ja) * | 2010-01-07 | 2014-10-15 | 株式会社カネカ | 不飽和エステル系樹脂組成物、不飽和エステル系硬化物、及びこれらの製造方法 |
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| GB201007793D0 (en) | 2010-05-10 | 2010-06-23 | Zephyros Inc | Improvements in or relating to structural adhesives |
| KR101496344B1 (ko) | 2010-09-15 | 2015-03-12 | 헨켈 아이피 앤드 홀딩 게엠베하 | 2-액형 시아노아크릴레이트/양이온 경화성 접착제 시스템 |
| GB201102672D0 (en) | 2011-02-15 | 2011-03-30 | Zephyros Inc | Improved structural adhesives |
| JP2012255135A (ja) * | 2011-05-17 | 2012-12-27 | Rohm & Haas Co | 熱可塑性ポリマーを吸収したラテックス粒子 |
| SG11201501745VA (en) * | 2012-09-07 | 2015-04-29 | Dow Global Technologies Llc | Toughened epoxy resin formulations |
| WO2014062531A2 (en) * | 2012-10-17 | 2014-04-24 | Dow Global Technologies Llc | Core shell rubber modified solid epoxy resins |
| JP2015532354A (ja) | 2012-10-19 | 2015-11-09 | ダウ グローバル テクノロジーズ エルエルシー | ポリオールを用いたポリマー粒子分散液 |
| US8981027B2 (en) | 2013-03-15 | 2015-03-17 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
| WO2014176512A2 (en) | 2013-04-26 | 2014-10-30 | Zephyros, Inc | Bonding dissimilar materials with adhesive paste |
| WO2015013084A1 (en) * | 2013-07-24 | 2015-01-29 | Dow Global Technologies Llc | Curable compositions |
| EP3024871B1 (en) | 2013-07-26 | 2022-12-07 | Zephyros Inc. | Thermosetting adhesive films including a fibrous carrier |
| CN106471047B (zh) * | 2014-06-30 | 2019-02-22 | 三菱化学株式会社 | 丝束预浸料、以及复合材料压力容器及其制造方法 |
| WO2016039232A1 (ja) * | 2014-09-11 | 2016-03-17 | 株式会社カネカ | 注型用エポキシ樹脂組成物 |
| GB201417985D0 (en) | 2014-10-10 | 2014-11-26 | Zephyros Inc | Improvements in or relating to structural adhesives |
| DE102014226826A1 (de) | 2014-12-22 | 2016-06-23 | Henkel Ag & Co. Kgaa | Epoxidharz-Zusammensetzung |
| FR3031109B1 (fr) * | 2014-12-24 | 2018-08-17 | Arkema France | Composition de polymeres, son procede de preparation, son utilisation et composition la comprenant |
| EP3749703B1 (en) | 2018-02-09 | 2025-09-03 | PPG Industries Ohio Inc. | Coating compositions |
| FI3765567T3 (fi) | 2018-03-16 | 2024-11-13 | Huntsman Adv Mat Switzerland | Varastointistabiileja ja kovettuvia hartsikoostumuksia |
| GB2576791B (en) | 2018-08-13 | 2022-09-14 | Henkel Ag & Co Kgaa | A two-part cyanoacrylate curable adhesive system |
| GB2576792B (en) | 2018-08-13 | 2022-09-14 | Henkel Ag & Co Kgaa | A two-part cyanoacrylate curable adhesive system |
| GB2582537B (en) | 2019-03-04 | 2022-02-23 | Henkel IP & Holding GmbH | Two-part, cyanoacrylate/cationically curable adhesive systems |
| DE102019204190A1 (de) * | 2019-03-27 | 2020-10-01 | Siemens Aktiengesellschaft | Gießharz, Formkörper daraus und Verwendung des Formkörpers |
| EP3946946A4 (en) * | 2019-03-28 | 2022-08-31 | Henkel AG & Co. KGaA | LIGHT-CURING COMPOSITIONS FOR ADDITIONAL MANUFACTURING |
| EP3825355A1 (de) | 2019-11-22 | 2021-05-26 | Henkel AG & Co. KGaA | Formulierungen mit hohen glasübergangstemperaturen für laminate |
| EP3835378A1 (en) | 2019-12-13 | 2021-06-16 | Henkel AG & Co. KGaA | Two component (2k) curable adhesive composition |
| ES2973449T3 (es) * | 2019-12-13 | 2024-06-20 | Henkel Ag & Co Kgaa | Composición adhesiva curable de dos componentes (2K) |
| EP4204509A1 (en) | 2020-08-27 | 2023-07-05 | Henkel AG & Co. KGaA | Electrically conductive one component (1k) epoxy formulation |
| CN114891161B (zh) * | 2022-05-26 | 2024-08-06 | 共享新材料(山东)有限公司 | 一种浆状复合材料及其制备方法和模具 |
| EP4547727A1 (en) | 2022-06-28 | 2025-05-07 | Henkel AG & Co. KGaA | Method of underwater bonding |
| WO2025135157A1 (ja) * | 2023-12-20 | 2025-06-26 | 株式会社カネカ | 硬化性樹脂組成物およびその利用 |
| GB2640960A (en) | 2024-05-10 | 2025-11-12 | Henkel Ag & Co Kgaa | Debonding of a cured composition |
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| US3864426A (en) * | 1973-05-23 | 1975-02-04 | Union Carbide Corp | Thermal shock resistant epoxy compositions |
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| US4645803A (en) * | 1984-02-29 | 1987-02-24 | American Cyanamid Company | Curable epoxy resin compositions |
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- 1993-06-30 DE DE59310074T patent/DE59310074D1/de not_active Expired - Lifetime
- 1993-06-30 ES ES93810462T patent/ES2148213T3/es not_active Expired - Lifetime
- 1993-07-07 CA CA002100026A patent/CA2100026A1/en not_active Abandoned
- 1993-07-07 FI FI933114A patent/FI110265B/fi not_active IP Right Cessation
- 1993-07-08 KR KR1019930012799A patent/KR100274526B1/ko not_active Expired - Fee Related
- 1993-07-08 NO NO932499A patent/NO307470B1/no not_active IP Right Cessation
- 1993-07-08 CN CN93108692A patent/CN1037975C/zh not_active Expired - Fee Related
- 1993-07-09 JP JP19418493A patent/JP3438059B2/ja not_active Expired - Fee Related
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1995
- 1995-02-21 US US08/391,329 patent/US6111015A/en not_active Expired - Lifetime
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| US3864426A (en) * | 1973-05-23 | 1975-02-04 | Union Carbide Corp | Thermal shock resistant epoxy compositions |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101296986B1 (ko) * | 2009-02-27 | 2013-08-14 | 모멘티브 스페셜티 케미칼즈 인코포레이티드 | 비-셀룰로스 섬유 사이징, 코팅 또는 바인딩 조성물에 유용한 조성물 및 이를 포함하는 복합재 |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2148213T3 (es) | 2000-10-16 |
| FI933114L (fi) | 1994-01-10 |
| NO932499L (no) | 1994-01-10 |
| CN1037975C (zh) | 1998-04-08 |
| NO932499D0 (no) | 1993-07-08 |
| JP3438059B2 (ja) | 2003-08-18 |
| JPH06157715A (ja) | 1994-06-07 |
| KR940002314A (ko) | 1994-02-17 |
| EP0578613A3 (enExample) | 1994-04-20 |
| CN1083082A (zh) | 1994-03-02 |
| EP0578613A2 (de) | 1994-01-12 |
| DE59310074D1 (de) | 2000-08-17 |
| CA2100026A1 (en) | 1994-01-10 |
| NO307470B1 (no) | 2000-04-10 |
| FI110265B (fi) | 2002-12-31 |
| EP0578613B1 (de) | 2000-07-12 |
| FI933114A0 (fi) | 1993-07-07 |
| US6111015A (en) | 2000-08-29 |
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