KR100225333B1 - 리이드프레임및반도체장치 - Google Patents

리이드프레임및반도체장치

Info

Publication number
KR100225333B1
KR100225333B1 KR1019950011908A KR19950011908A KR100225333B1 KR 100225333 B1 KR100225333 B1 KR 100225333B1 KR 1019950011908 A KR1019950011908 A KR 1019950011908A KR 19950011908 A KR19950011908 A KR 19950011908A KR 100225333 B1 KR100225333 B1 KR 100225333B1
Authority
KR
South Korea
Prior art keywords
lead
frame
semiconductor device
tab
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019950011908A
Other languages
English (en)
Korean (ko)
Inventor
다나까나오따까
야구찌아끼히로
기따노마꼬또
나가따다쯔야
구마자와데쯔오
나까무라아쯔시
스즈끼히로미찌
쯔가네마사요시
Original Assignee
가나이 쓰도무
가부시끼가이샤 히다치 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쓰도무, 가부시끼가이샤 히다치 세이사꾸쇼 filed Critical 가나이 쓰도무
Application granted granted Critical
Publication of KR100225333B1 publication Critical patent/KR100225333B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
KR1019950011908A 1994-05-16 1995-05-15 리이드프레임및반도체장치 Expired - Fee Related KR100225333B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-100444 1994-05-16
JP10044494 1994-05-16

Publications (1)

Publication Number Publication Date
KR100225333B1 true KR100225333B1 (ko) 1999-10-15

Family

ID=14274105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950011908A Expired - Fee Related KR100225333B1 (ko) 1994-05-16 1995-05-15 리이드프레임및반도체장치

Country Status (7)

Country Link
US (2) US5637914A (enExample)
EP (1) EP0683518B1 (enExample)
KR (1) KR100225333B1 (enExample)
CN (1) CN1097312C (enExample)
DE (1) DE69534483T2 (enExample)
MY (1) MY114386A (enExample)
TW (1) TW293167B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928120B2 (ja) * 1995-01-18 1999-08-03 日本電気株式会社 樹脂封止型半導体装置用リードフレームおよび樹脂封止型半導体装置の製造方法
JPH0951067A (ja) * 1995-08-08 1997-02-18 Sony Corp リードフレーム
JPH09129686A (ja) * 1995-11-06 1997-05-16 Toshiba Microelectron Corp テープキャリヤ及びその実装構造
KR100214480B1 (ko) * 1996-05-17 1999-08-02 구본준 반도체 패키지용 리드 프레임
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
US5929512A (en) * 1997-03-18 1999-07-27 Jacobs; Richard L. Urethane encapsulated integrated circuits and compositions therefor
JPH10303352A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 半導体装置および半導体装置の製造方法
US6305921B1 (en) * 1999-07-12 2001-10-23 Accu-Mold Corp. Saw tooth mold
JP2001156212A (ja) 1999-09-16 2001-06-08 Nec Corp 樹脂封止型半導体装置及びその製造方法
JP2002343816A (ja) * 2001-05-18 2002-11-29 Lintec Corp 樹脂タイバー形成用テープ、樹脂タイバー、樹脂タイバー付リードフレーム、樹脂封止型半導体装置およびその製造方法
JP4054188B2 (ja) * 2001-11-30 2008-02-27 富士通株式会社 半導体装置
CN100536121C (zh) * 2001-12-14 2009-09-02 株式会社瑞萨科技 半导体器件及其制造方法
JP3812447B2 (ja) * 2002-01-28 2006-08-23 富士電機デバイステクノロジー株式会社 樹脂封止形半導体装置
JP2005086014A (ja) * 2003-09-09 2005-03-31 Oki Electric Ind Co Ltd 半導体装置、及び半導体装置の製造方法
JP4595835B2 (ja) * 2006-03-07 2010-12-08 株式会社日立製作所 鉛フリーはんだを用いたリード付き電子部品
US8148825B2 (en) * 2007-06-05 2012-04-03 Stats Chippac Ltd. Integrated circuit package system with leadfinger
US8648458B2 (en) * 2009-12-18 2014-02-11 Nxp B.V. Leadframe circuit and method therefor
JP5549612B2 (ja) * 2011-01-31 2014-07-16 三菱電機株式会社 半導体装置の製造方法
US9082759B2 (en) * 2012-11-27 2015-07-14 Infineon Technologies Ag Semiconductor packages and methods of formation thereof
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
KR102099814B1 (ko) 2013-01-25 2020-04-13 루미리즈 홀딩 비.브이. 조명 조립체 및 조명 조립체를 제조하기 위한 방법
CN108735701B (zh) 2017-04-13 2021-12-24 恩智浦美国有限公司 具有用于包封期间的毛刺缓解的虚设引线的引线框架
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192058A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS5828841A (ja) * 1981-08-14 1983-02-19 Toshiba Corp 樹脂封止型半導体装置の製造方法
US4899207A (en) * 1986-08-27 1990-02-06 Digital Equipment Corporation Outer lead tape automated bonding
JPH01187842A (ja) * 1988-01-21 1989-07-27 Toshiba Corp 半導体装置の製造方法
JPH02122660A (ja) * 1988-11-01 1990-05-10 Nec Corp プラスチックパッケージ
JPH02220468A (ja) * 1989-02-21 1990-09-03 Oki Electric Ind Co Ltd 半導体装置用リードフレーム
JP2685582B2 (ja) * 1989-05-26 1997-12-03 株式会社日立製作所 リードフレーム及びこれを用いた半導体装置
US5432127A (en) * 1989-06-30 1995-07-11 Texas Instruments Incorporated Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
JPH0491464A (ja) * 1990-08-01 1992-03-24 Ibiden Co Ltd リードフレーム
JPH04133459A (ja) * 1990-09-26 1992-05-07 Nec Corp リードフレーム
JPH04206560A (ja) * 1990-11-30 1992-07-28 New Japan Radio Co Ltd 半導体装置の製造方法
JPH04255260A (ja) * 1991-02-07 1992-09-10 Fujitsu Ltd リードフレーム及び半導体装置の製造方法
JP2959874B2 (ja) * 1991-07-02 1999-10-06 大日本印刷株式会社 リードフレームの製造方法
JPH05218283A (ja) * 1992-02-03 1993-08-27 Nec Corp 半導体装置
US5352633A (en) * 1992-06-02 1994-10-04 Texas Instruments Incorporated Semiconductor lead frame lead stabilization
JP3246769B2 (ja) * 1992-07-15 2002-01-15 株式会社日立製作所 半導体装置及びその製造方法
JPH0799768B2 (ja) * 1992-08-24 1995-10-25 徹也 北城 リードフレームへのピン保持部の形成方法、および形成装置
US5281851A (en) * 1992-10-02 1994-01-25 Hewlett-Packard Company Integrated circuit packaging with reinforced leads
US5336564A (en) * 1993-12-06 1994-08-09 Grumman Aerospace Corporation Miniature keeper bar
US5422313A (en) * 1994-05-03 1995-06-06 Texas Instruments Incorporated Integrated circuit device and manufacturing method using photoresist lead covering

Also Published As

Publication number Publication date
US5637914A (en) 1997-06-10
MY114386A (en) 2002-10-31
DE69534483T2 (de) 2006-07-06
EP0683518B1 (en) 2005-09-28
TW293167B (enExample) 1996-12-11
DE69534483D1 (de) 2006-02-09
CN1097312C (zh) 2002-12-25
EP0683518A3 (en) 1998-09-09
EP0683518A2 (en) 1995-11-22
US5837567A (en) 1998-11-17
CN1121261A (zh) 1996-04-24

Similar Documents

Publication Publication Date Title
KR100225333B1 (ko) 리이드프레임및반도체장치
US5527740A (en) Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
US6638790B2 (en) Leadframe and method for manufacturing resin-molded semiconductor device
KR940007951B1 (ko) 반도체장치와 그 제조방법, 리이드프레임 및 메모리카드와 그 제조방법
KR19990005508A (ko) 2중 굴곡된 타이바와 소형 다이패드를 갖는 반도체 칩 패키지
KR100674548B1 (ko) 반도체 장치
JPH0558655B2 (enExample)
KR20030035952A (ko) 리드 프레임과 그 제조 방법 및 그 리드 프레임을 이용한반도체 장치의 제조 방법
US6677665B2 (en) Dual-die integrated circuit package
WO1996007204A1 (en) Ultra-thin composite package for integrated circuits
KR20040014178A (ko) 반도체장치 및 그 제조방법
US5382546A (en) Semiconductor device and method of fabricating same, as well as lead frame used therein and method of fabricating same
KR100366111B1 (ko) 수지봉합형 반도체장치의 구조
KR100237895B1 (ko) 저가 수지 몰드 반도체 장치
JP3367272B2 (ja) リードフレーム及び半導体装置
US20080042254A1 (en) Semiconductor device and manufacturing method of the same
KR0182509B1 (ko) 연장된 타이 바를 갖는 리드 프레임과 그를 이용한 반도체 칩 패키지
KR100216990B1 (ko) 복수개의 구멍이 형성된 폴리이미드 테이프를 이용한 리드 온 칩 구조
KR20000006597A (ko) 에어 캐비티를 가지는 플라스틱 패키지 및 그 제조방법
JP2515882B2 (ja) リ―ドフレ―ム、リ―ドフレ―ムの製造方法、半導体装置および半導体装置の製造方法
JPH08162596A (ja) リードフレーム及び半導体装置
KR200159005Y1 (ko) 리드온칩 반도체 패키지
JPS63273324A (ja) 樹脂封止型回路装置の製造方法
KR19990039503A (ko) 반도체 패키지 및 그 제조방법
JPH04316359A (ja) リードフレーム及びそれを用いた半導体装置の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19981028

Effective date: 19990531

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 19990531

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 1995 11908

Appeal request date: 19981028

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 1998101003498

PS0901 Examination by remand of revocation

St.27 status event code: A-6-3-E10-E12-rex-PS0901

S901 Examination by remand of revocation
GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

St.27 status event code: A-3-4-F10-F13-rex-PS0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20000215

Republication note text: Request for Correction Notice

Gazette number: 1002253330000

Gazette reference publication date: 19991015

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20030710

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20040720

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20040720

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000