TW293167B - - Google Patents

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Publication number
TW293167B
TW293167B TW84104789A TW84104789A TW293167B TW 293167 B TW293167 B TW 293167B TW 84104789 A TW84104789 A TW 84104789A TW 84104789 A TW84104789 A TW 84104789A TW 293167 B TW293167 B TW 293167B
Authority
TW
Taiwan
Prior art keywords
lead
frame
leads
lead frame
resin
Prior art date
Application number
TW84104789A
Other languages
English (en)
Chinese (zh)
Inventor
Suzuki Hiromichi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of TW293167B publication Critical patent/TW293167B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW84104789A 1994-05-16 1995-05-15 TW293167B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10044494 1994-05-16

Publications (1)

Publication Number Publication Date
TW293167B true TW293167B (enExample) 1996-12-11

Family

ID=14274105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW84104789A TW293167B (enExample) 1994-05-16 1995-05-15

Country Status (7)

Country Link
US (2) US5637914A (enExample)
EP (1) EP0683518B1 (enExample)
KR (1) KR100225333B1 (enExample)
CN (1) CN1097312C (enExample)
DE (1) DE69534483T2 (enExample)
MY (1) MY114386A (enExample)
TW (1) TW293167B (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928120B2 (ja) * 1995-01-18 1999-08-03 日本電気株式会社 樹脂封止型半導体装置用リードフレームおよび樹脂封止型半導体装置の製造方法
JPH0951067A (ja) * 1995-08-08 1997-02-18 Sony Corp リードフレーム
JPH09129686A (ja) * 1995-11-06 1997-05-16 Toshiba Microelectron Corp テープキャリヤ及びその実装構造
KR100214480B1 (ko) * 1996-05-17 1999-08-02 구본준 반도체 패키지용 리드 프레임
US5939775A (en) * 1996-11-05 1999-08-17 Gcb Technologies, Llc Leadframe structure and process for packaging intergrated circuits
US5929512A (en) * 1997-03-18 1999-07-27 Jacobs; Richard L. Urethane encapsulated integrated circuits and compositions therefor
JPH10303352A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 半導体装置および半導体装置の製造方法
US6305921B1 (en) * 1999-07-12 2001-10-23 Accu-Mold Corp. Saw tooth mold
JP2001156212A (ja) 1999-09-16 2001-06-08 Nec Corp 樹脂封止型半導体装置及びその製造方法
JP2002343816A (ja) * 2001-05-18 2002-11-29 Lintec Corp 樹脂タイバー形成用テープ、樹脂タイバー、樹脂タイバー付リードフレーム、樹脂封止型半導体装置およびその製造方法
JP4054188B2 (ja) * 2001-11-30 2008-02-27 富士通株式会社 半導体装置
CN100536121C (zh) * 2001-12-14 2009-09-02 株式会社瑞萨科技 半导体器件及其制造方法
JP3812447B2 (ja) * 2002-01-28 2006-08-23 富士電機デバイステクノロジー株式会社 樹脂封止形半導体装置
JP2005086014A (ja) * 2003-09-09 2005-03-31 Oki Electric Ind Co Ltd 半導体装置、及び半導体装置の製造方法
JP4595835B2 (ja) * 2006-03-07 2010-12-08 株式会社日立製作所 鉛フリーはんだを用いたリード付き電子部品
US8148825B2 (en) * 2007-06-05 2012-04-03 Stats Chippac Ltd. Integrated circuit package system with leadfinger
US8648458B2 (en) * 2009-12-18 2014-02-11 Nxp B.V. Leadframe circuit and method therefor
JP5549612B2 (ja) * 2011-01-31 2014-07-16 三菱電機株式会社 半導体装置の製造方法
US9082759B2 (en) * 2012-11-27 2015-07-14 Infineon Technologies Ag Semiconductor packages and methods of formation thereof
US20140208689A1 (en) 2013-01-25 2014-07-31 Renee Joyal Hypodermic syringe assist apparatus and method
KR102099814B1 (ko) 2013-01-25 2020-04-13 루미리즈 홀딩 비.브이. 조명 조립체 및 조명 조립체를 제조하기 위한 방법
CN108735701B (zh) 2017-04-13 2021-12-24 恩智浦美国有限公司 具有用于包封期间的毛刺缓解的虚设引线的引线框架
JP7182374B2 (ja) * 2017-05-15 2022-12-02 新光電気工業株式会社 リードフレーム及びその製造方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57192058A (en) * 1981-05-22 1982-11-26 Hitachi Ltd Semiconductor device
JPS5828841A (ja) * 1981-08-14 1983-02-19 Toshiba Corp 樹脂封止型半導体装置の製造方法
US4899207A (en) * 1986-08-27 1990-02-06 Digital Equipment Corporation Outer lead tape automated bonding
JPH01187842A (ja) * 1988-01-21 1989-07-27 Toshiba Corp 半導体装置の製造方法
JPH02122660A (ja) * 1988-11-01 1990-05-10 Nec Corp プラスチックパッケージ
JPH02220468A (ja) * 1989-02-21 1990-09-03 Oki Electric Ind Co Ltd 半導体装置用リードフレーム
JP2685582B2 (ja) * 1989-05-26 1997-12-03 株式会社日立製作所 リードフレーム及びこれを用いた半導体装置
US5432127A (en) * 1989-06-30 1995-07-11 Texas Instruments Incorporated Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads
US5258331A (en) * 1989-10-20 1993-11-02 Texas Instruments Incorporated Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
JPH0491464A (ja) * 1990-08-01 1992-03-24 Ibiden Co Ltd リードフレーム
JPH04133459A (ja) * 1990-09-26 1992-05-07 Nec Corp リードフレーム
JPH04206560A (ja) * 1990-11-30 1992-07-28 New Japan Radio Co Ltd 半導体装置の製造方法
JPH04255260A (ja) * 1991-02-07 1992-09-10 Fujitsu Ltd リードフレーム及び半導体装置の製造方法
JP2959874B2 (ja) * 1991-07-02 1999-10-06 大日本印刷株式会社 リードフレームの製造方法
JPH05218283A (ja) * 1992-02-03 1993-08-27 Nec Corp 半導体装置
US5352633A (en) * 1992-06-02 1994-10-04 Texas Instruments Incorporated Semiconductor lead frame lead stabilization
JP3246769B2 (ja) * 1992-07-15 2002-01-15 株式会社日立製作所 半導体装置及びその製造方法
JPH0799768B2 (ja) * 1992-08-24 1995-10-25 徹也 北城 リードフレームへのピン保持部の形成方法、および形成装置
US5281851A (en) * 1992-10-02 1994-01-25 Hewlett-Packard Company Integrated circuit packaging with reinforced leads
US5336564A (en) * 1993-12-06 1994-08-09 Grumman Aerospace Corporation Miniature keeper bar
US5422313A (en) * 1994-05-03 1995-06-06 Texas Instruments Incorporated Integrated circuit device and manufacturing method using photoresist lead covering

Also Published As

Publication number Publication date
US5637914A (en) 1997-06-10
MY114386A (en) 2002-10-31
DE69534483T2 (de) 2006-07-06
EP0683518B1 (en) 2005-09-28
KR100225333B1 (ko) 1999-10-15
DE69534483D1 (de) 2006-02-09
CN1097312C (zh) 2002-12-25
EP0683518A3 (en) 1998-09-09
EP0683518A2 (en) 1995-11-22
US5837567A (en) 1998-11-17
CN1121261A (zh) 1996-04-24

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