|
DE3510755A1
(de)
*
|
1985-03-25 |
1986-09-25 |
H & K Verpackungstechnik GmbH, 4600 Dortmund |
Einrichtung zum erkennen von kennzeichenelementen an transportanlagen fuer stueckgueter und dgl.
|
|
FR2652914A1
(fr)
*
|
1989-10-05 |
1991-04-12 |
Pailler Andre |
Systeme d'eclairage et de vision permettant la lecture automatique de caracteres graves a la surface de substrats semi-conducteurs.
|
|
KR920007535B1
(ko)
*
|
1990-05-23 |
1992-09-05 |
삼성전자 주식회사 |
식별회로를 구비한 반도체 집적회로 칩
|
|
US5410125A
(en)
*
|
1990-10-11 |
1995-04-25 |
Harry Winston, S.A. |
Methods for producing indicia on diamonds
|
|
JPH04199733A
(ja)
*
|
1990-11-29 |
1992-07-20 |
Tokyo Seimitsu Co Ltd |
半導体チップの製造方法及びその装置
|
|
US5570293A
(en)
*
|
1990-11-29 |
1996-10-29 |
Tokyo Seimitsu Co., Ltd. |
Method and device for manufacturing a semiconductor chip
|
|
JP3659981B2
(ja)
*
|
1992-07-09 |
2005-06-15 |
アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド |
ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
|
|
JP2845713B2
(ja)
*
|
1993-03-12 |
1999-01-13 |
株式会社東芝 |
並列ビットテストモード内蔵半導体メモリ
|
|
US5360747A
(en)
*
|
1993-06-10 |
1994-11-01 |
Xilinx, Inc. |
Method of reducing dice testing with on-chip identification
|
|
JP3654597B2
(ja)
*
|
1993-07-15 |
2005-06-02 |
株式会社ルネサステクノロジ |
製造システムおよび製造方法
|
|
US8505108B2
(en)
*
|
1993-11-18 |
2013-08-06 |
Digimarc Corporation |
Authentication using a digital watermark
|
|
US6882738B2
(en)
*
|
1994-03-17 |
2005-04-19 |
Digimarc Corporation |
Methods and tangible objects employing textured machine readable data
|
|
US6644184B1
(en)
*
|
1995-02-09 |
2003-11-11 |
Man Roland Druckmaschinen Ag |
Offset printing machine
|
|
EP0712012A1
(en)
*
|
1994-11-09 |
1996-05-15 |
International Business Machines Corporation |
Authentication label and authenticating pattern incorporating diffracting structure and method of fabricating them
|
|
FR2728104A1
(fr)
*
|
1994-12-09 |
1996-06-14 |
Sgs Thomson Microelectronics |
Procede de marquage de circuits integres avec un laser, et appareil de marquage s'y rapportant
|
|
KR970007379A
(ko)
*
|
1995-07-19 |
1997-02-21 |
김주용 |
패턴층이 형성된 웨이퍼의 결함 다이 검사 방법
|
|
US5932119A
(en)
*
|
1996-01-05 |
1999-08-03 |
Lazare Kaplan International, Inc. |
Laser marking system
|
|
US5937270A
(en)
|
1996-01-24 |
1999-08-10 |
Micron Electronics, Inc. |
Method of efficiently laser marking singulated semiconductor devices
|
|
US5867505A
(en)
*
|
1996-08-07 |
1999-02-02 |
Micron Technology, Inc. |
Method and apparatus for testing an integrated circuit including the step/means for storing an associated test identifier in association with integrated circuit identifier for each test to be performed on the integrated circuit
|
|
US6100486A
(en)
|
1998-08-13 |
2000-08-08 |
Micron Technology, Inc. |
Method for sorting integrated circuit devices
|
|
US5927512A
(en)
*
|
1997-01-17 |
1999-07-27 |
Micron Technology, Inc. |
Method for sorting integrated circuit devices
|
|
US5844803A
(en)
*
|
1997-02-17 |
1998-12-01 |
Micron Technology, Inc. |
Method of sorting a group of integrated circuit devices for those devices requiring special testing
|
|
US5915231A
(en)
*
|
1997-02-26 |
1999-06-22 |
Micron Technology, Inc. |
Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture
|
|
US5856923A
(en)
*
|
1997-03-24 |
1999-01-05 |
Micron Technology, Inc. |
Method for continuous, non lot-based integrated circuit manufacturing
|
|
US5907492A
(en)
|
1997-06-06 |
1999-05-25 |
Micron Technology, Inc. |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
|
|
US7120513B1
(en)
*
|
1997-06-06 |
2006-10-10 |
Micron Technology, Inc. |
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs
|
|
US5877064A
(en)
*
|
1997-07-15 |
1999-03-02 |
Taiwan Semiconductor Manufacturing Co.Ltd |
Method for marking a wafer
|
|
US6018686A
(en)
*
|
1997-10-31 |
2000-01-25 |
Cypress Semiconductor Corp. |
Electrically imprinting a semiconductor die with identifying information
|
|
US6154872A
(en)
*
|
1997-11-20 |
2000-11-28 |
Cypress Semiconductor Corporation |
Method, circuit and apparatus for preserving and/or correcting product engineering information
|
|
US6148279A
(en)
*
|
1997-12-04 |
2000-11-14 |
Cypress Semiconductor Corporation |
Apparatus for recording and/or reading program history
|
|
US6052319A
(en)
*
|
1997-12-04 |
2000-04-18 |
Cypress Semiconductor Corp. |
Apparatus and method for controlling experimental inventory
|
|
US6049624A
(en)
|
1998-02-20 |
2000-04-11 |
Micron Technology, Inc. |
Non-lot based method for assembling integrated circuit devices
|
|
US6268641B1
(en)
*
|
1998-03-30 |
2001-07-31 |
Kabushiki Kaisha Toshiba |
Semiconductor wafer having identification indication and method of manufacturing the same
|
|
US6209110B1
(en)
|
1998-03-30 |
2001-03-27 |
Cypress Semiconductor Corporation |
Circuitry, apparatus and method for embedding a test status outcome within a circuit being tested
|
|
US6181615B1
(en)
|
1998-03-30 |
2001-01-30 |
Cypress Semiconductor Corporation |
Circuitry, apparatus and method for embedding quantifiable test results within a circuit being tested
|
|
US7313253B2
(en)
*
|
1998-09-11 |
2007-12-25 |
Digimarc Corporation |
Methods and tangible objects employing machine readable data in photo-reactive materials
|
|
US6262388B1
(en)
|
1998-12-21 |
2001-07-17 |
Micron Electronics, Inc. |
Laser marking station with enclosure and method of operation
|
|
US6417484B1
(en)
|
1998-12-21 |
2002-07-09 |
Micron Electronics, Inc. |
Laser marking system for dice carried in trays and method of operation
|
|
US6161213A
(en)
*
|
1999-02-17 |
2000-12-12 |
Icid, Llc |
System for providing an integrated circuit with a unique identification
|
|
JP4951811B2
(ja)
*
|
1999-03-24 |
2012-06-13 |
富士通セミコンダクター株式会社 |
半導体装置の製造方法
|
|
JP2000294607A
(ja)
*
|
1999-04-08 |
2000-10-20 |
Hitachi Ltd |
半導体装置の製造方法
|
|
ES2360031T3
(es)
*
|
1999-09-28 |
2011-05-31 |
Kaneka Corporation |
Método de control del proceso de fabricacioón de un aparato de conversión fotoeléctrica.
|
|
JP2001118232A
(ja)
|
1999-10-20 |
2001-04-27 |
Tdk Corp |
記号読取方法および装置
|
|
DE19951048C2
(de)
*
|
1999-10-22 |
2002-11-21 |
Infineon Technologies Ag |
Verfahren zur Identifizierung einer integrierten Schaltung
|
|
CN100375097C
(zh)
*
|
2000-01-20 |
2008-03-12 |
扎威腾半导体有限公司 |
个体化方法及系统
|
|
US6528760B1
(en)
|
2000-07-14 |
2003-03-04 |
Micron Technology, Inc. |
Apparatus and method using rotational indexing for laser marking IC packages carried in trays
|
|
US6524881B1
(en)
*
|
2000-08-25 |
2003-02-25 |
Micron Technology, Inc. |
Method and apparatus for marking a bare semiconductor die
|
|
US6415977B1
(en)
*
|
2000-08-30 |
2002-07-09 |
Micron Technology, Inc. |
Method and apparatus for marking and identifying a defective die site
|
|
US6492706B1
(en)
|
2000-12-13 |
2002-12-10 |
Cypress Semiconductor Corp. |
Programmable pin flag
|
|
US7316934B2
(en)
*
|
2000-12-18 |
2008-01-08 |
Zavitan Semiconductors, Inc. |
Personalized hardware
|
|
KR100393214B1
(ko)
*
|
2001-02-07 |
2003-07-31 |
삼성전자주식회사 |
패드의 수를 최소화하기 위한 칩 식별 부호 인식 장치 및이를 내장한 반도체 장치
|
|
JP4071476B2
(ja)
*
|
2001-03-21 |
2008-04-02 |
株式会社東芝 |
半導体ウェーハ及び半導体ウェーハの製造方法
|
|
CN101335195B
(zh)
*
|
2001-03-21 |
2011-04-06 |
株式会社东芝 |
具有id标记的半导体晶片,及从中生产半导体器件的方法和设备
|
|
US6867856B1
(en)
|
2001-07-19 |
2005-03-15 |
Advanced Micro Devices, Inc. |
Apparatus for reading marks on a semiconductor substrate
|
|
US6792365B2
(en)
*
|
2001-08-10 |
2004-09-14 |
Micron Technology, Inc. |
Sequential unique marking
|
|
US6555400B2
(en)
*
|
2001-08-22 |
2003-04-29 |
Micron Technology, Inc. |
Method for substrate mapping
|
|
JP3870780B2
(ja)
*
|
2001-12-21 |
2007-01-24 |
ヤマハ株式会社 |
半導体装置の製造方法
|
|
US7169685B2
(en)
*
|
2002-02-25 |
2007-01-30 |
Micron Technology, Inc. |
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
|
|
DE10216874A1
(de)
*
|
2002-04-17 |
2003-07-10 |
Infineon Technologies Ag |
Verfahren zum Ablegen einer Information auf einem Halbleiter-Chip eines Wafers sowie Halbleiter-Chip
|
|
DE10219346B4
(de)
*
|
2002-04-30 |
2010-10-07 |
Osram Opto Semiconductors Gmbh |
Verfahren zum Abbilden und Zuordnen von Eigenschaften von einer Mehrzahl auf einem Wafer angeordneter Funktionschips und Wafer mit einer Mehrzahl von Funktionschips und Referenzchips
|
|
DE10321403A1
(de)
*
|
2002-05-15 |
2003-12-04 |
Infineon Technologies Ag |
Verfahren zur Markierung von Schlechtteilen
|
|
DE10241141B4
(de)
*
|
2002-09-05 |
2015-07-16 |
Infineon Technologies Ag |
Halbleiter-Bauelement-Test-Verfahren für ein Halbleiter-Bauelement-Test-System mit reduzierter Anzahl an Test-Kanälen
|
|
DE10259049A1
(de)
*
|
2002-12-17 |
2004-07-15 |
Infineon Technologies Ag |
Integriertes Halbleitermodul
|
|
US7097107B1
(en)
|
2003-04-09 |
2006-08-29 |
Mobile-Mind, Inc. |
Pseudo-random number sequence file for an integrated circuit card
|
|
US6954711B2
(en)
*
|
2003-05-19 |
2005-10-11 |
Applied Materials, Inc. |
Test substrate reclamation method and apparatus
|
|
US7275234B2
(en)
*
|
2003-09-09 |
2007-09-25 |
International Business Machines Corporation |
System and method of automatically generating kerf design data
|
|
DE102004027489B4
(de)
*
|
2004-06-04 |
2017-03-02 |
Infineon Technologies Ag |
Verfahren zum Anordnen von Chips eines ersten Substrats auf einem zweiten Substrat
|
|
DE112004002826T5
(de)
*
|
2004-06-08 |
2007-04-26 |
Advantest Corporation |
Bildsensor-Prüfsystem
|
|
KR100674950B1
(ko)
*
|
2005-01-22 |
2007-01-26 |
삼성전자주식회사 |
기준 반도체 칩을 구비하는 반도체 기판 및 이를 이용한반도체 칩 어셈블리 방법
|
|
JP2006267056A
(ja)
|
2005-03-25 |
2006-10-05 |
Toshiba Corp |
半導体装置およびそのテスト方法
|
|
US7657390B2
(en)
*
|
2005-11-02 |
2010-02-02 |
Applied Materials, Inc. |
Reclaiming substrates having defects and contaminants
|
|
DE102005061834B4
(de)
*
|
2005-12-23 |
2007-11-08 |
Ioss Intelligente Optische Sensoren & Systeme Gmbh |
Vorrichtung und Verfahren zum optischen Prüfen einer Oberfläche
|
|
DE102006001601B4
(de)
*
|
2006-01-11 |
2008-06-26 |
Infineon Technologies Ag |
Verfahren zur Herstellung eines Halbleiterwafers mit Rückseitenidentifizierung
|
|
US7684608B2
(en)
*
|
2006-02-23 |
2010-03-23 |
Vistech Corporation |
Tape and reel inspection system
|
|
US7544578B2
(en)
*
|
2007-01-03 |
2009-06-09 |
International Business Machines Corporation |
Structure and method for stochastic integrated circuit personalization
|
|
US8492072B2
(en)
*
|
2009-04-30 |
2013-07-23 |
Infineon Technologies Ag |
Method for marking objects
|
|
US9099481B2
(en)
|
2013-03-15 |
2015-08-04 |
Semiconductor Components Industries, Llc |
Methods of laser marking semiconductor substrates
|
|
US10713776B2
(en)
|
2017-04-13 |
2020-07-14 |
Instrumental, Inc. |
Method for predicting defects in assembly units
|
|
US12380553B2
(en)
|
2016-01-15 |
2025-08-05 |
Instrumental, Inc. |
Method for predicting defects in assembly units
|
|
US10964648B2
(en)
|
2017-04-24 |
2021-03-30 |
International Business Machines Corporation |
Chip security fingerprint
|
|
US11063000B2
(en)
*
|
2019-01-29 |
2021-07-13 |
Infineon Technologies Ag |
Semiconductor package authentication feature
|
|
CN112718522B
(zh)
*
|
2020-12-03 |
2022-07-12 |
常熟理工学院 |
镍钛丝计数检测及激光打标一体机
|
|
CN113492114B
(zh)
*
|
2021-09-08 |
2021-11-16 |
苏州贝克微电子有限公司 |
一种用于集成电路的半导体芯片测试方法及其测试装置
|