JPS568836A - Manufacturing system for semiconductor device - Google Patents

Manufacturing system for semiconductor device

Info

Publication number
JPS568836A
JPS568836A JP8343279A JP8343279A JPS568836A JP S568836 A JPS568836 A JP S568836A JP 8343279 A JP8343279 A JP 8343279A JP 8343279 A JP8343279 A JP 8343279A JP S568836 A JPS568836 A JP S568836A
Authority
JP
Japan
Prior art keywords
type
treatment
information
electron beam
electron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8343279A
Other languages
Japanese (ja)
Inventor
Kyozo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP8343279A priority Critical patent/JPS568836A/en
Publication of JPS568836A publication Critical patent/JPS568836A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To enhance the quality of a semiconductor and the productivity of a system for manufacturing the semiconductor device by internally containing beforehand information representing the type of treatment for the semiconductors in standby state for machining or inspecting step or the like and selecting the treating conditions corresponding to the detection of the information for predetermined treatment. CONSTITUTION:Pieces of information A, B, etc. representing the type of treatment beforehand are internally contained in a semicondcutor wafer 1 of standby state for treatment, and an electron beam from an electron beam drawing unit 6 is irradiated thereto. Then, a type information defined by a secondary electron or reflected electron reflected from the wafer 1 is detected by a detector 2, and a signal output from the detector 2 is applied through a controller 3 to a memory 4 for access. Thereafter, the electron beam drawing unit 6 is recontrolled in accordance with the type data such as the type A or B read from the memory 4 to obtain a desired drawing pattern. In this manner, it is adapted for manufacturing IC, LSI and the like of a number of types.
JP8343279A 1979-07-03 1979-07-03 Manufacturing system for semiconductor device Pending JPS568836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8343279A JPS568836A (en) 1979-07-03 1979-07-03 Manufacturing system for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8343279A JPS568836A (en) 1979-07-03 1979-07-03 Manufacturing system for semiconductor device

Publications (1)

Publication Number Publication Date
JPS568836A true JPS568836A (en) 1981-01-29

Family

ID=13802269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8343279A Pending JPS568836A (en) 1979-07-03 1979-07-03 Manufacturing system for semiconductor device

Country Status (1)

Country Link
JP (1) JPS568836A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56162813A (en) * 1981-04-27 1981-12-15 Nachi Fujikoshi Corp Solenoid
JPS5727042A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Inspecting method for wafer
JPS593537U (en) * 1982-06-30 1984-01-11 株式会社東京精密 Semiconductor device inspection equipment probe card
JPS5943524A (en) * 1982-09-06 1984-03-10 Hitachi Ltd Method and device for manufacture of semiconductor device
JPS59139640A (en) * 1983-01-31 1984-08-10 Ando Electric Co Ltd Measuring device for integrated circuit
EP0132520A2 (en) * 1983-06-23 1985-02-13 International Business Machines Corporation A method of producing a semiconductor device
JPS63110744A (en) * 1986-10-29 1988-05-16 Tokyo Electron Ltd Probing apparatus
US5175128A (en) * 1990-11-09 1992-12-29 Fujitsu Limited Process for fabricating an integrated circuit by a repetition of exposure of a semiconductor pattern
JPH0513047U (en) * 1992-04-09 1993-02-19 株式会社東京精密 Semiconductor element inspection equipment
JP2014223708A (en) * 2013-05-17 2014-12-04 株式会社ディスコ Processing device

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727042A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Inspecting method for wafer
JPS56162813A (en) * 1981-04-27 1981-12-15 Nachi Fujikoshi Corp Solenoid
JPS593537U (en) * 1982-06-30 1984-01-11 株式会社東京精密 Semiconductor device inspection equipment probe card
JPH0333061Y2 (en) * 1982-06-30 1991-07-12
JPS5943524A (en) * 1982-09-06 1984-03-10 Hitachi Ltd Method and device for manufacture of semiconductor device
JPS59139640A (en) * 1983-01-31 1984-08-10 Ando Electric Co Ltd Measuring device for integrated circuit
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
EP0132520A2 (en) * 1983-06-23 1985-02-13 International Business Machines Corporation A method of producing a semiconductor device
JPS63110744A (en) * 1986-10-29 1988-05-16 Tokyo Electron Ltd Probing apparatus
JPH077791B2 (en) * 1986-10-29 1995-01-30 東京エレクトロン株式会社 Probe device
US5175128A (en) * 1990-11-09 1992-12-29 Fujitsu Limited Process for fabricating an integrated circuit by a repetition of exposure of a semiconductor pattern
JPH0513047U (en) * 1992-04-09 1993-02-19 株式会社東京精密 Semiconductor element inspection equipment
JP2014223708A (en) * 2013-05-17 2014-12-04 株式会社ディスコ Processing device

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