JPS5734344A - Testing method of semiconductor device - Google Patents

Testing method of semiconductor device

Info

Publication number
JPS5734344A
JPS5734344A JP10996380A JP10996380A JPS5734344A JP S5734344 A JPS5734344 A JP S5734344A JP 10996380 A JP10996380 A JP 10996380A JP 10996380 A JP10996380 A JP 10996380A JP S5734344 A JPS5734344 A JP S5734344A
Authority
JP
Japan
Prior art keywords
rays
pattern
discriminate
chips
tested
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10996380A
Other languages
Japanese (ja)
Inventor
Shinji Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10996380A priority Critical patent/JPS5734344A/en
Publication of JPS5734344A publication Critical patent/JPS5734344A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To shorten the time required for sorting an article of good quality, by firstly analizing image through pattern recognition in a state of finished wafer process followed by an electrical test for a chip with no pattern defect only. CONSTITUTION:A test chip 1a is tested by visible rays, infrared rays X-rays, electron rays and ultrasonic rays using an image analyzing device to change into image information 10 for accumlation. Said information together with test condition data 12 is put into an analyzer 11 to be treated, and to discriminate the existence of pattern defects and crystal defects, further according to the results of the judgment 13 to discriminate the defective ships from those with no defect. Subsequently, on only the chips with no defect an electric characteristic is tested to discriminate the chips 7 with poor characteristic and deficient margin. Thereby the chips with high reliability, no pattern deficiency satisfying the requirements for a low poor condition rate and with good electric characteristic can be tested in a short time for discrimination.
JP10996380A 1980-08-08 1980-08-08 Testing method of semiconductor device Pending JPS5734344A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10996380A JPS5734344A (en) 1980-08-08 1980-08-08 Testing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10996380A JPS5734344A (en) 1980-08-08 1980-08-08 Testing method of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5734344A true JPS5734344A (en) 1982-02-24

Family

ID=14523579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10996380A Pending JPS5734344A (en) 1980-08-08 1980-08-08 Testing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5734344A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098636A (en) * 1983-11-04 1985-06-01 Hitachi Ltd Controller for ink mark for wafer prober
JPS6281793A (en) * 1985-10-05 1987-04-15 日立化成工業株式会社 Manufacturing laminated board for printed circuit board
WO2003036718A3 (en) * 2001-10-23 2004-02-26 Cree Inc Pattern for improved visual inspection of semiconductor devices

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098636A (en) * 1983-11-04 1985-06-01 Hitachi Ltd Controller for ink mark for wafer prober
JPH0516179B2 (en) * 1983-11-04 1993-03-03 Hitachi Ltd
JPS6281793A (en) * 1985-10-05 1987-04-15 日立化成工業株式会社 Manufacturing laminated board for printed circuit board
WO2003036718A3 (en) * 2001-10-23 2004-02-26 Cree Inc Pattern for improved visual inspection of semiconductor devices
US6903446B2 (en) 2001-10-23 2005-06-07 Cree, Inc. Pattern for improved visual inspection of semiconductor devices
US7297561B2 (en) 2001-10-23 2007-11-20 Cree, Inc. Pattern for improved visual inspection of semiconductor devices
CN100385662C (en) * 2001-10-23 2008-04-30 克里公司 Pattern for improved visual inspection of semiconductor devices

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