JPS6098636A - Controller for ink mark for wafer prober - Google Patents

Abstract

PURPOSE:To prevent ink-mark operation at an unnecessary position by processing the moving-pattern information of a table, the coordinate-pattern information of a chip and a defective information signal from a wafer tester and ink-mark operating an ink marking mechanism. CONSTITUTION:In a wafer probe control section 40, coordinates are computed by a microprocessor section, and the coordinate informations are transmitted over a chip coordinate-pattern memory processing section 43 through a signal line 42 from an XYZ moving-coordinate generating section 38. Timing signals, etc. are transmitted over the chip coordinate-pattern processing section 43 through a signal line 41 from the microprocessor section. The result obtained by processing these informations and chip coordinate-pattern informations memorized to a chip coordinate information memory section 45 is transmitted over a signal line 44. An ink mark operation section 30 processes the informations transmitted over the signal line 44 by an AND operation section 31 together with acceptable or defective signal informations transmitted from a wafer tester 7, and generates the operation signals of an ink marking mechanism.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is applicable to semiconductor wafers such as memo IJ IC.
7-B In the inspection process, defect information as the inspection result is transferred to the ink mark control device for the Ueno A prober on the chips of the wafer.

[Background of the invention]

In general, completion inspection work in a wafer processing process for memory ICs, logic ICs, etc. is performed by an automated device in which a Ueno 1 blower device and a wafer tester are linked. This device is configured to send chip defect information outputted from a tester to a prober device and place an ink mark on the defective chip.

Hereinafter, a conventional example of a device for applying force will be described with reference to FIG. The test sea urchin/'tl is an XYZ moving table 2
The wafer chuck 3 attached to the The wafer 1 comes into contact with the probe needle 4, and necessary inspection is performed for each IC chip. The probe needle 4 is attached to the test rod 51,
It is connected to the wafer tester 7 via the signal line 6, receives supply of test voltage and test waveform, and functions to return chip output information to the wafer tester 7. The wafer tester 7 that has received the chip output information processes it and determines whether the chip under test is good or bad. Good/bad information is sent to the AND operation section 101 of the ink mark operation section 9 via the signal line 8. The output of the AND operation section IO is connected to the ink mark section 13 via an ink mark drive amplifier 11 and a signal line 12.

A wafer prober control section 14 is connected to the XYZ moving table 2. The wafer prober control section 4 includes a microprocessor section 15 and an XYZ table movement coordinate generation section 1.
6 and an XYZ table operating section 17), the microprocessor section 5 controls the AND operation via the start signal line 18 and the test end signal flu 1.9, and also via the marking enable signal line 20. The sections 10# are connected to each other.

The wafer blower control section 14 includes a microprocessor section 1
5, sends a start signal to the wafer tester 7 via a start signal line 18, receives a test end r signal via a test end signal line 19, and proceeds with the measurement/inspection on the wafer l. In addition, the J-hub rover control unit 14 performs morph control for driving the XYZ table in the XYZ table operation unit 17.
The range in which the table is to be moved depends on the command from the XYZ table movement coordinate generation section 16. It stores the coordinates calculated by the microprocessor section 15 from the XYZ table movement coordinate generation section 1 (i is data such as the wafer size given in advance), and sequentially instructs the xYZ table operation section 17 about the table movement coordinates. .

The defect indication of the inspected defective chip is made by directly marking the surface of the chip on the wafer 1 by the ink mark unit 3 which operates based on the command ζ of the ink mark operation unit 9. Since the microprocessor section 15 of the wafer prober control section 14 also manages the sequence operation of the wafer prober device, the marking ingel signal 2
You can get 0. This signal and wafer tester 7 f
e) The AND operation unit 10 processes the signal with the good/bad information sent from the ink mark command. By this ink mark command, the ink mark drive amplifier 11
The ink mark section 13 operates via the ink mark section 13.

Wafer 1 is X Y 7. Table movement coordinate generation unit 16
It moves in pitch according to the command, and moves up and down every chip (7).It is measured and inspected by touching the probe needle 4.

The commanded coordinates of the XYZ double movement coordinate generation section 16 are calculated by the microprocessor section 15, but since only the wafer size, chip pitch in the X direction, and pitch in the Y direction are given as input information, detailed coordinates cannot be calculated. .

FIG. 2 shows an example of the coordinate information of the XYZ table movement coordinate generation unit 16, in which 9 pitches at a pitch a in the X direction,
This shows that the XYZ moving table 2, that is, the wafer 1, moves within a rectangular range of 11 pitches in the Y direction at a pitch b. In the figure, reference numeral 21 indicates the outer contour of the wafer, which is usually circular, so there are areas around the periphery where normal chips cannot be formed. When the wafer 1 is measured and inspected, in the shaded area in the figure, there is no wafer or the chip is chipped and formed incompletely, so the wafer tester 7
F) will result in a defective signal being output.

On the other hand, since the marking enable signal is sent from the microprocessor unit 15 through the signal line 20 to the entire rectangular area, the ink mark operation is always performed in the shaded area in the figure.

In this way, in the conventional device, the ink mark operation is always performed on a surface other than the wafer surface, and when an inkjet type ink mark mechanism is adopted, the wafer jack 3
There was a drawback that ink was always ejected and adhered to other parts. If you want to prevent ink from adhering to such unnecessary areas, you will need a complicated prevention mechanism, and even if you use a normal suppression type ink mark mechanism, it will not work.
This has disadvantages such as waste of dynamic power.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to prevent ink mark operation in unnecessary locations, to adopt a simple ink jet type ink mark mechanism, and to realize a rational inspection system. Our goal is to provide the following.

[Summary of the invention]

The present invention provides a wafer blobber control section that controls an XYZ moving table, an ink mark operation section that generates an ink mark signal from a signal from the wafer blower (1 prono<control section force) and a signal from a wafer tester, and an ink mark operation section that generates an ink mark signal from a signal from a wafer tester. An ink mark control device for a wafer prober, which includes an ink mark unit that applies a defective mark to a defective chip based on a signal, and a chip coordinate pattern storage processing unit that stores depth coordinate pattern information and performs predetermined processing. , XYZ installed in the wafer blobber control section
The ink mark is operated by a signal obtained by processing the movement pattern information of the table movement coordinate generation section, the chip coordinate pattern information of the chip coordinate pattern storage processing section, and the defect information signal obtained from the wafer tester. It is characterized by

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIG. Note that parts with the same structure and function as those in Figure 1 are designated by the same reference numerals. The wafer 1 is suctioned and fixed to a wafer chuck 3 placed and fixed on an XYZ moving table 2, and is index-fed back and forth, left and right at a predetermined pitch by the XYZ moving table 2, and can be moved up and down. This vertical movement causes the wafer 1 to come into contact with the probe needles 4, and the necessary inspection is performed for each IC chip. Although not shown, the probe needle 4 is attached to the test plate and connected to the tester 7 via a signal line, as in FIG. Good/bad information from the wafer tester 7 is sent to the AND operation section 31ζ of the ink mark operation section 30 via the signal line 8. It has become so. The output of the AND operation section 31 is sent to the inkjet drive section 32 and the signal line 33.
It is connected to the ink supply mechanism 34 via. The ink supply mechanism 34 includes an ink reservoir 35 and a jet nozzle 36.
and is provided.

The XYZ moving table 2 has a micro block setting section 3.
7, XY7. A wafer prober control section 40 drawn from the $ moving coordinate generation section 38 and the XY2 table operation section 39 is connected. Microprocessor section 37 and xY
The Z8 dynamic coordinate generation section 38 is connected to the chip coordinate pattern storage processing section 431 via signal lines 41 and 42, respectively.
Furthermore, the AND operation section 31 is connected via a signal line 44. The chip coordinate pattern storage processing section 43 includes a depth coordinate information storage section 45 for storing, as input information, coordinate information of chips that need to be inspected on a single wafer as shown in FIG. .

Next, the procedure for making an ink mark using the apparatus of this embodiment will be explained. In the wafer prober control section 40, the microprocessor section 37 calculates coordinates as shown in FIG.
The data is supplied to the depth coordinate pattern storage processing section 43 via the signal line 42. The microprocessor section 37 also sends a marking enable signal, a timing signal, and a status signal to the chip coordinate pattern storage processing section 43 via the No. N gland 41.These information and the chip coordinate information storage section 45 The result of processing the chip coordinate pattern information stored in the wafer tester 7 is sent to the signal line 44.The ink mark operation section 30 receives this and sends the result to the AND operation section 3. 1, the ink jet drive section 32 operates based on the signal C, and controls the ink supply H mechanism 34. The ink discharged from the ink reservoir 35 is sent to the ink supply mechanism. Pressurized and direction controlled by 34,
Wafer 1-J is ejected from the wafer 36:
+,'z A mark for indicating a defect is set as ('J'-/j. Fig. 6 shows an example of a pattern marked as shown in -42 below.

The pattern information on the signal line 44 is a stair-step pattern as shown in FIG. This results in a defective ink mark pattern.
According to this embodiment, the ink supply mechanism 34 does not operate at all in areas other than on the wafer, making it possible to completely prevent ink from being ejected in unnecessary areas. It is also possible to eliminate unnecessary power consumption.

Next, other embodiments of the invention will be described. In the above embodiment, the marking operation of the inkjet can be limited to the coordinate pattern shown in FIG. 5, which is reasonable.However, as the blower device, the XYZ moving table 2 moves to other positions than on the wafer, so the operation is limited. &c pA is useless. This embodiment is an improvement on this point, and the signal flow is changed as shown by the broken line in FIG. Immediately, appropriate information from the chip coordinate pattern 'frr2 +, α processing section 43 is placed on the signal gland 46 indicated by the broken line, and sent to the XYZ table operation section 39. Based on the processed result, the coordinate pattern shown in FIG. Then, the XYZ moving table 2 immediately moves the wafer 1 by pitch. Therefore, wafer 1-hi(7)
Wafer l so that only the chips to be measured and inspected are inspected.
moves.

When the wafer 1 is pitch-feeded, a mark enable signal is sent from the microprocessor section 37 to the AND operation section 311 through the signal input driver 47, and the inkjet drive section 32 is operated. The result is similar to the defective mark-to-turn example shown in .

According to this embodiment, the operation of the ink mark mechanism and the
Since the pitch feeding operation of the Z-moving table 2 is performed only on the ground plane, the driving power for the XYZ-moving table and the driving power for the inkjet driving section can be reduced. It also has the effect of shortening the travel time for the entire Ueno 1.

In addition, in the above embodiment, an example was described in which an inkjet method was adopted as the ink mark mechanism, but a conventional stamping method may also be adopted.

〔Effect of the invention〕

According to the present invention, since the operating range of the inkjet type ink mark mechanism can be limited to the area above the wafer, the conventional problem of ink ejecting outside the wafer 1 can be solved. Further, even when a conventional stamping type ink mark mechanism is adopted, unnecessary pressing operations are eliminated, and a rational defective chip ink mark system can be constructed as a whole.

In addition, the output signal from the chip coordinate pattern storage processing section is
By adding it to the YZ table operating section, it is possible to optimize the pitch movement operation of the XYZ moving table and the number of tests, resulting in an energy saving effect and a significant shortening of the inspection time for the entire wafer.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a conventional ink mark control device, and FIG. 2 is an explanatory diagram of a conventional ink mark control device. FIG. 3 is an explanatory diagram showing coordinate information of a moving coordinate generating section. FIG. 3 is an explanatory diagram simultaneously showing two embodiments of the ink mark control device of the present invention. FIG. 4 is an example of XYZ table moving information in the XYZ moving coordinate generating section. FIG. 5 is an explanatory diagram of the coordinate information pattern of the tube coordinate information storage section, and FIG. 6 is a clear diagram of +t8F showing an example of a pattern resulting from a defective ink mark. l...Wafer, 2...XYZ movement table, 7.
...Wafer tester, 30...Ink mark operation section,
31...AND operation unit, 32...Ink sheet drive unit, 34...Ink supply mechanism, 38...X
YZ movement coordinate generation unit, 40... Uni/'t prober control unit, 43... Chi'tsubu coordinate/NO turn storage processing unit. Figure 1 Figure 2 Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] a wafer prober control section that controls the XYZ moving table; an ink mark operation section that generates an ink mark signal from signals from the wafer prober control section and signals from the wafer tester force 1; In the ink mark control device for a wafer prober, the ink mark control device includes an ink mark section for applying a defective indication mark. This is located inside the control section. 1 (Ink mapping is performed by a signal obtained by processing the movement pattern information of the YZ table movement coordinate generation section, the chip coordinate pattern information of the chip coordinate pattern storage processing section, and the defect information signal obtained from the wafer tester. l Kotoko L
An ink mark control device for a wafer prober, characterized by: