JPS63244643A - Wafer-mounting stage - Google Patents
Wafer-mounting stageInfo
- Publication number
- JPS63244643A JPS63244643A JP62077297A JP7729787A JPS63244643A JP S63244643 A JPS63244643 A JP S63244643A JP 62077297 A JP62077297 A JP 62077297A JP 7729787 A JP7729787 A JP 7729787A JP S63244643 A JPS63244643 A JP S63244643A
- Authority
- JP
- Japan
- Prior art keywords
- mounting table
- pin
- main body
- mounting
- mounting stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003825 pressing Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 abstract description 19
- 239000000523 sample Substances 0.000 abstract description 14
- 239000000428 dust Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 5
- 238000005259 measurement Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、半導体ウェハを載置されるウェハ載置台に係
り、特にプローブ装置に好適なウェハ載置台に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a wafer mounting table on which a semiconductor wafer is mounted, and particularly to a wafer mounting table suitable for a probe device.
（従来の技術）
一般に、ウェハ載置台は、プローブ装置等の半導体試験
装置、および半導体製造装置等に配置される。(Prior Art) Generally, a wafer mounting table is placed in a semiconductor testing device such as a probe device, a semiconductor manufacturing device, and the like.
第３図はこのような従来のウェハ載置台の一例を示して
いおり、円盤状の載置台本体１は、上面がほぼ平面の載
置面１ａとされており、この載置面１ａにほぼ直交する
複数例えば３個の貫通孔１ｂが、載置面１ａと同心の円
周上に穿設されている。なお、載置面１ａには、図示し
ない真空チャック用の渭および吸引孔等が配置されてい
る。FIG. 3 shows an example of such a conventional wafer mounting table, in which a disk-shaped mounting table main body 1 has a mounting surface 1a whose upper surface is approximately flat, and a surface 1a that is substantially perpendicular to this mounting surface 1a. A plurality of through holes 1b, for example three, are bored on a circumference concentric with the mounting surface 1a. Note that a vacuum chuck arm, a suction hole, etc. (not shown) are arranged on the mounting surface 1a.
載置台本体１の下部には、上記貫通孔１ｂに対応して、
３本の保持ピン２が立設されており、この保持ピン２の
上部が貫通孔１ｂに挿入されている。At the lower part of the mounting table main body 1, corresponding to the through hole 1b,
Three holding pins 2 are erected, and the upper portions of the holding pins 2 are inserted into the through holes 1b.
上記構成の従来のウェハ載置台は、例えばプローブ装置
等に配置され、載置面１ａに半導体装置ハ３がロードさ
れる。The conventional wafer mounting table having the above configuration is placed in, for example, a probe device, and a semiconductor device 3 is loaded onto the mounting surface 1a.
この時、まず、第３図（ａ）に示すように、ウェハ搬送
機構のアーム等が挿入される間隔を設けるため、図示し
ない駆動機構により載置台本体１を下降させ、保持ピン
２を載置面１ａ上に突出させ、これらの保持ピン２上に
半導体ウェハ３を配置する。At this time, first, as shown in FIG. 3(a), in order to provide an interval for inserting the arms of the wafer transport mechanism, the mounting table main body 1 is lowered by a drive mechanism (not shown), and the holding pins 2 are mounted. A semiconductor wafer 3 is placed on these holding pins 2 so as to protrude above the surface 1a.
この後、第３図（ｂ）に示すように、載置台本体１を上
昇させ、半導体ウェハ３を保持ピン２上から載置面１ａ
上に移し、真空チャックにより載置面１ａ上に吸着保持
する。Thereafter, as shown in FIG. 3(b), the mounting table main body 1 is raised and the semiconductor wafer 3 is placed on the mounting surface 1a from above the holding pins 2.
It is then moved to the top and held on the mounting surface 1a by suction using a vacuum chuck.
しかる後、載置台本体１を上下動させるとともに、水平
方向に移動させて、半導体ウェハ３上に多数形成された
チップに、載置台本体１上方に配置された探針を次々と
接触させてこれらのチップの試験測定を行う、なおこの
時、保持ピン２の先端部は、常に貫通孔１ｂ内に位置す
る。Thereafter, the mounting table main body 1 is moved up and down and horizontally to bring the probe placed above the mounting table main body 1 into contact with a large number of chips formed on the semiconductor wafer 3 one after another. At this time, the tip of the holding pin 2 is always located within the through hole 1b.
（発明が解決しようとする問題点）
しかしながら、上記説明の従来のウェハ載置台では、例
えばプローブ装置に配置し、半導体ウェハ上に多数形成
されたチップに探針を接触させて試験測定を行う場合、
次のような問題が生じる。(Problems to be Solved by the Invention) However, with the conventional wafer mounting table described above, for example, when it is placed in a probe device and a test measurement is performed by bringing the probe into contact with a large number of chips formed on a semiconductor wafer. ,
The following problems arise.
すなわち、プローブ装置では、１つのチップの測定が終
了し、次のチップに探針を接触させる毎に載置台本体を
１回上下動させる。したがって、１枚の半導体ウェハの
測定を行う毎に、数十〜数百回載置台本体を上下動させ
る。この時、保持ピンと、載置台本体の貫通孔内部とが
擦れ、塵が発生し、半導体ウェハに付着する恐れがある
。That is, in the probe device, the mounting table body is moved up and down once every time the measurement of one chip is completed and the probe is brought into contact with the next chip. Therefore, each time one semiconductor wafer is measured, the mounting table main body is moved up and down several tens to hundreds of times. At this time, the holding pins rub against the inside of the through hole of the mounting table main body, and there is a risk that dust will be generated and adhere to the semiconductor wafer.
本発明は、かかる従来の事情に対処してなされたもので
、従来に較べて大幅に塵の発生量を低減させることので
きるウェハ載置台を提供しようとするものである。The present invention has been made in response to such conventional circumstances, and aims to provide a wafer mounting table that can significantly reduce the amount of dust generated compared to the prior art.
［発明の構成］
（問題点を解決するための手段）
すなわち本発明は、ほぼ平面状の載置面および該載置面
にほぼ直交する貫通孔を有し上下動可能とされた載置台
本体と、前記貫通孔に配置され下方か４押圧することに
より前記載置面から突出可能とされた保持ピンと、前記
載置台下方の所定位置に配設され該載置台が所定位置よ
り下方に降下すると前記保持ピン端部と当接されるピン
押圧部材とを備えたことを特徴とする。[Structure of the Invention] (Means for Solving the Problems) That is, the present invention provides a mounting table main body that has a substantially planar mounting surface and a through hole that is substantially perpendicular to the mounting surface and is movable up and down. a holding pin disposed in the through hole and capable of protruding from the mounting surface by pressing downward; and a holding pin disposed at a predetermined position below the mounting table, when the mounting table descends below the predetermined position. The present invention is characterized in that it includes a pin pressing member that comes into contact with the end portion of the holding pin.
（作 用）
本発明のウェハ載置台では、保持ピンが載置台本体の貫
通孔に配置されており、例えばチップからチップへの探
針の移動時等載置台本体が所定位置より上方で上下動す
る場合は、保持ピンは、載置台本体とともに上下動する
だけで摩擦が生じない。(Function) In the wafer mounting table of the present invention, the holding pins are arranged in the through holes of the mounting table main body, and the mounting table main body moves up and down above a predetermined position, for example, when moving a probe from chip to chip. In this case, the holding pin simply moves up and down together with the mounting table body, and no friction occurs.
そして、例えば半導体ウェハのロード・アンロード時等
、載置台本体が所定位置より下方に降下すると、保持ピ
ン下側端部と、ピン押圧部材とが当接され、載置台本体
の下降により保持ピン上部が載置面に突出する。When the mounting table body descends below a predetermined position, for example when loading/unloading a semiconductor wafer, the lower end of the holding pin and the pin pressing member come into contact with each other, and as the mounting table main body descends, the holding pin The upper part protrudes onto the mounting surface.
したがって、摩擦によって生じる塵の発生量を従来に較
べて大幅に減少させることができる。Therefore, the amount of dust generated due to friction can be significantly reduced compared to the conventional method.
（実施例）
以下本発明のウェハ載置台を第１図および第２図を参照
して一実施例について説明する。(Embodiment) An embodiment of the wafer mounting table of the present invention will be described below with reference to FIGS. 1 and 2.
載置台本体１１は、材質例えばアルミニウム等からなり
、円盤状に形成されている。この載置台本体１１の上面
は、ほぼ平面の載置面１１ａとされている。なお、載置
面１１ａには、同心的に真空チャック用の渭１１ｃが形
成されており、この渭１１ｃ内には、図示しない吸引孔
が配置されている。また、載置台本体１１には、上記載
置面１１ａにほぼ直交する複数例えば３個の貫通孔１１
ｂが、載置面１１ａと同心の円周上の正三角形の各頂点
の位置に穿設されている。The mounting table main body 11 is made of a material such as aluminum, and is formed into a disk shape. The upper surface of this mounting table main body 11 is a substantially flat mounting surface 11a. Note that a vacuum chuck arm 11c is concentrically formed on the mounting surface 11a, and a suction hole (not shown) is arranged in this arm 11c. Further, the mounting table main body 11 has a plurality of through holes 11, for example, three, which are substantially orthogonal to the mounting surface 11a.
b are bored at each vertex of an equilateral triangle on the circumference concentric with the mounting surface 11a.
そして、上記貫通孔１１ｂには、保持ピン１２が配置さ
れている。この保持ピン１２は、中空円筒状の外筒１３
と、この外筒１３に挿入配置されたピン本体１４と、外
筒１３内に配置されピン本体１４を軸方向に付勢するコ
イルスプリング１５とから構成されている。A holding pin 12 is arranged in the through hole 11b. This holding pin 12 is attached to a hollow cylindrical outer tube 13.
The pin main body 14 is inserted into the outer cylinder 13, and the coil spring 15 is arranged inside the outer cylinder 13 and biases the pin main body 14 in the axial direction.
上記外筒１３は、材質例えば真鍮またはアルミニウム等
からなり、上端部に段差状に小径部１３ａが形成されて
いる。また、上記ピン本体１４は、材質例えば樹脂、セ
ラミック等からなり、上側が直径例えばｉｎｎ程度の小
径部１４ａとされ、下側が直径例えば３ｎ＋ｎ程度の大
径部１４ｂとされており、その中間部には大径部１４ｂ
より大径な係止部Ｘ４ｃが形成されている。The outer tube 13 is made of a material such as brass or aluminum, and has a stepped small diameter portion 13a formed at its upper end. The pin body 14 is made of a material such as resin or ceramic, and has a small diameter part 14a having a diameter of, for example, about inn on the upper side, a large diameter part 14b having a diameter of about 3n+n on the lower side, and an intermediate part thereof. is the large diameter portion 14b
A locking portion X4c having a larger diameter is formed.
そして、係止部Ｉ４ｃの下側が外筒１３下端部の内側に
折曲された折曲部に係止され、ピン本体１４が、外筒１
３に係止される。また、コイルスプリング１５上端部は
外筒１３内の小径部１３ａとの境界の段差部分に当接さ
れ、下端部は係止部１４ｃの上側に当接されて、ピン本
体１４を下方に向けて付勢する。すなわち、ピン本体１
４上部の小径部１４ａは、通常時は外筒１３内に収容さ
れており、ピン本体１４下側端部を押圧することにより
、外筒１３上方向に突出する構成とされている。Then, the lower side of the locking portion I4c is locked to the bent portion bent inside the lower end portion of the outer cylinder 13, and the pin body 14 is fixed to the outer cylinder 1.
It is locked at 3. Further, the upper end of the coil spring 15 is brought into contact with a stepped portion at the boundary with the small diameter part 13a in the outer cylinder 13, and the lower end is brought into contact with the upper side of the locking part 14c, so that the pin body 14 is directed downward. energize. That is, the pin body 1
The small diameter portion 14a at the top of the pin body 14 is normally housed within the outer cylinder 13, and is configured to protrude upward from the outer cylinder 13 by pressing the lower end of the pin body 14.
また、！！置台本体１１裏面側すなわち載置台本体１１
の下方には、所定間隔を設けて例えば板状のピン押圧部
材１６が配設されている。Also,! ! The back side of the mounting table main body 11, that is, the mounting table main body 11
For example, a plate-shaped pin pressing member 16 is disposed below at a predetermined interval.
上記構成のこの実施例のウェハ載置台は、例えばプロー
ブ装置等に配置され、載置面１１ａに半導体ウェハがロ
ードされる。この時、まず第１図（ａ＞に示すように、
ウェハ搬送機構のアーム等が挿入される間隔を設けるた
め、図示しない駆動機構によりａ置台本体１１を下降さ
せ、ピン本体１４の下側端部とピン押圧部材１６とを当
接させ、さらに載１台本体１１を下降させてピン本体１
４を載置面１１ａ上に突出させ、これらのピン本体１４
上に半導体ウェハ２０を配置する。The wafer mounting table of this embodiment having the above-mentioned configuration is placed in, for example, a probe device, and a semiconductor wafer is loaded onto the mounting surface 11a. At this time, first, as shown in Figure 1 (a>),
In order to provide an interval for insertion of the arm of the wafer transport mechanism, the A-mounting table main body 11 is lowered by a drive mechanism (not shown), the lower end of the pin main body 14 is brought into contact with the pin pressing member 16, and the Lower the stand body 11 and press the pin body 1.
4 protrude onto the mounting surface 11a, and these pin bodies 14
A semiconductor wafer 20 is placed on top.
この後、第１図（ｂ）に示すように、載置台本体１１を
上昇させ、半導体ウェハ２０をピン本体１４上から載置
面１１ａ上に移し、真空チャックにより載置面１１ａ上
に吸着保持する。After that, as shown in FIG. 1(b), the mounting table main body 11 is raised, the semiconductor wafer 20 is transferred from the pin main body 14 onto the mounting surface 11a, and the vacuum chuck holds the semiconductor wafer 20 on the mounting surface 11a by suction. do.
しかる後、載置台本体１１を上下動させるとともに、水
平方向に移動させて、半導体ウェハ２０上に多数形成さ
れたチップに、載置台本体１１上方に配置された図示し
ない探針を次々と接触させてこれらのチップの試験測定
を行う。Thereafter, the mounting table main body 11 is moved up and down as well as horizontally to bring probes (not shown) placed above the mounting table main body 11 into contact with a large number of chips formed on the semiconductor wafer 20 one after another. These chips will be tested and measured.
なおこの実施例では、載置台本体１１の全ストロークを
例えば１５１ｍ、保持ピン１２のピン本体１４のストロ
ークを例えば７．５ｎｌ、載１台本体１１が再上部に位
置した時のピン本体１４下端部とピン押圧部材１６との
間隔ｄを例えば７．５ｍｍとしている。In this embodiment, the total stroke of the mounting table main body 11 is, for example, 151 m, the stroke of the pin main body 14 of the holding pin 12 is, for example, 7.5 nl, and the lower end of the pin main body 14 when the mounting table main body 11 is located at the top again. The distance d between the pin pressing member 16 and the pin pressing member 16 is, for example, 7.5 mm.
また、半導体ウェハ２０上のチップ測定を開始し、チッ
プからチップへの探針の移動を行う場合は、載置台本体
１１を再上部位置から例えば６ＩＩ１１〜６．５１１１
１以内のストロークで上下動させる。In addition, when starting chip measurement on the semiconductor wafer 20 and moving the probe from chip to chip, the mounting table main body 11 is moved from the upper position to, for example, 6II11 to 6.5111.
Move up and down with a stroke of 1 or less.
すなわち、この実施例のウェハ載置台では、チップから
チップへの探針の移動時には、保持ピン１２は、載置台
本体１１とともに上下動するだけで摩擦が生じない、そ
して、半導体ウェハ２０のロード・アンロード時には、
保持ピン１２下側端部と、ピン押圧部材１６とが当接さ
れ、載置台本体１１の下降により保持ピン１２上側が載
置面に突出する。That is, in the wafer mounting table of this embodiment, when the probe is moved from chip to chip, the holding pins 12 only move up and down together with the mounting table main body 11 without causing any friction. When unloading,
The lower end of the holding pin 12 and the pin pressing member 16 are brought into contact with each other, and as the mounting table main body 11 is lowered, the upper side of the holding pin 12 projects onto the mounting surface.
したがって、半導体ウェハ２０のロード・アンロード時
以外は、摩擦が生じることがなく、従来に較べて塵の発
生量を大幅に減少させることができる。Therefore, no friction occurs except when loading and unloading the semiconductor wafer 20, and the amount of dust generated can be significantly reduced compared to the conventional method.
［発明の効果コ
上述のように、本発明のウェハ載置台では、従来に較べ
て大幅に塵の発生量を低減させることができる。[Effects of the Invention] As described above, the wafer mounting table of the present invention can significantly reduce the amount of dust generated compared to the conventional one.
第１図は本発明の一実施例のウェハ載置台の要部を示す
縦断面図、第２図は第１図に示すウェハ載置台の上面図
、第３図は従来のウェハ載置台を示す縦断面図である。
１１！・・・・・載置台本体、１２・・・・・・保持ピ
ン、１３・・・・・・外筒、１４・・・・・・ピン本体
、１５・・・・・・コイルスプリング、１６・・・・・
・ピン押圧部材。FIG. 1 is a vertical cross-sectional view showing the main parts of a wafer mounting table according to an embodiment of the present invention, FIG. 2 is a top view of the wafer mounting table shown in FIG. 1, and FIG. 3 is a diagram showing a conventional wafer mounting table. FIG. 11! ...... Mounting table body, 12... Holding pin, 13... Outer cylinder, 14... Pin body, 15... Coil spring, 16・・・・・・
・Pin pressing member.
Claims (2)
る貫通孔を有し上下動可能とされた載置台本体と、前記
貫通孔に配置され下方から押圧することにより前記載置
面から突出可能とされた保持ピンと、前記載置台下方の
所定位置に配設され該載置台が所定位置より下方に降下
すると前記保持ピン端部と当接されるピン押圧部材とを
備えたことを特徴とするウェハ載置台。(1) A mounting table main body that has a substantially planar mounting surface and a through hole that is substantially perpendicular to the mounting surface and is movable up and down; A holding pin that can protrude from the surface, and a pin pressing member that is disposed at a predetermined position below the mounting table and comes into contact with the end of the holding pin when the mounting table is lowered from the predetermined position. A wafer mounting table featuring:
に挿入配置されたピン本体と、前記外筒内に配置され前
記ピン本体を軸方向に付勢するコイルスプリングとから
なる特許請求の範囲第１項記載のウェハ載置台。(2) The holding pin includes a hollow cylindrical outer cylinder, a pin main body inserted into the outer cylinder, and a coil spring arranged inside the outer cylinder and biasing the pin main body in the axial direction. A wafer mounting table according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62077297A JPH073833B2 (en) | 1987-03-30 | 1987-03-30 | Probe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62077297A JPH073833B2 (en) | 1987-03-30 | 1987-03-30 | Probe device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63244643A true JPS63244643A (en) | 1988-10-12 |
| JPH073833B2 JPH073833B2 (en) | 1995-01-18 |
Family
ID=13629955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62077297A Expired - Fee Related JPH073833B2 (en) | 1987-03-30 | 1987-03-30 | Probe device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073833B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006073963A (en) * | 2004-09-06 | 2006-03-16 | Tokyo Electron Ltd | Wafer chuck |
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| JP2008004695A (en) * | 2006-06-21 | 2008-01-10 | Micronics Japan Co Ltd | Inspection stage and inspection apparatus |
| CN104181449A (en) * | 2009-09-03 | 2014-12-03 | 应用材料公司 | Testing apparatus and relative method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52145121A (en) * | 1976-05-24 | 1977-12-02 | Kubota Ltd | Seedling planting apparatus |
| JPS6014449A (en) * | 1983-06-15 | 1985-01-25 | エスヴィージー・リトグラフィー・システムズ・インコーポレイテッド | Wafer treating mechanism |
| JPS6098636A (en) * | 1983-11-04 | 1985-06-01 | Hitachi Ltd | Controller for ink mark for wafer prober |
| JPS6153930U (en) * | 1984-09-14 | 1986-04-11 | ||
| JPS61207035U (en) * | 1985-06-17 | 1986-12-27 | ||
| JPS6214434A (en) * | 1985-07-12 | 1987-01-23 | Canon Inc | Wafer chuck |
-
1987
- 1987-03-30 JP JP62077297A patent/JPH073833B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52145121A (en) * | 1976-05-24 | 1977-12-02 | Kubota Ltd | Seedling planting apparatus |
| JPS6014449A (en) * | 1983-06-15 | 1985-01-25 | エスヴィージー・リトグラフィー・システムズ・インコーポレイテッド | Wafer treating mechanism |
| JPS6098636A (en) * | 1983-11-04 | 1985-06-01 | Hitachi Ltd | Controller for ink mark for wafer prober |
| JPS6153930U (en) * | 1984-09-14 | 1986-04-11 | ||
| JPS61207035U (en) * | 1985-06-17 | 1986-12-27 | ||
| JPS6214434A (en) * | 1985-07-12 | 1987-01-23 | Canon Inc | Wafer chuck |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007502538A (en) * | 2003-08-11 | 2007-02-08 | 東京エレクトロン株式会社 | Vacuum chuck apparatus and method for holding a wafer during high pressure processing |
| JP2006073963A (en) * | 2004-09-06 | 2006-03-16 | Tokyo Electron Ltd | Wafer chuck |
| JP4559801B2 (en) * | 2004-09-06 | 2010-10-13 | 東京エレクトロン株式会社 | Wafer chuck |
| JP2008004695A (en) * | 2006-06-21 | 2008-01-10 | Micronics Japan Co Ltd | Inspection stage and inspection apparatus |
| CN104181449A (en) * | 2009-09-03 | 2014-12-03 | 应用材料公司 | Testing apparatus and relative method |
| US9412898B2 (en) | 2009-09-03 | 2016-08-09 | Applied Materials, Inc. | Apparatus and method of testing a substrate using a supporting nest and testing probes |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073833B2 (en) | 1995-01-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |