JP2008004695A - Inspection stage and inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve accuracy, suppressing disarrangement caused by the structures of an alignment camera, and a wafer lifter. <P>SOLUTION: An inspection apparatus comprises at least a chuck top, a Z-axis stage for moving the chuck top up and down, a θ stage for rotating the chuck top, an alignment camera for photographing and aligning the board to be inspected, and a wafer lifter for lifting the board to be inspected. The θ stage is provided between the Z-axis stage and the chuck top. The alignment camera is attached to the Z-axis stage. The wafer lifter comprises a plurality of struts vertically arranged so that the lower ends of the struts are fixed to a base, a first plate supported by the upper end of each strut, a second plate supported in a state in which the first plate is allowed to rotate, and a lift pin to penetrate into each of a plurality of through holes made in the chuck top in a state in which the lift pin is supported by the second plate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection stage that supports an inspection target plate such as a semiconductor wafer and an inspection apparatus including the inspection stage.

  A large number of semiconductor integrated circuits formed on each chip region of a semiconductor wafer undergo an electrical inspection in order to determine whether or not the semiconductor integrated circuit is manufactured according to specifications. In this type of electrical inspection, generally, an inspection device for electrical inspection is connected to a tester, and a contact provided in the inspection device is pressed against each corresponding electrode of a semiconductor wafer on the inspection stage. The semiconductor wafer is connected to a tester through this contact, and is subjected to electrical inspection.

  An example of this type of inspection apparatus will be outlined with reference to FIGS. The inspection apparatus 1 mainly includes a housing 2, a linear guide 3, an inspection stage 4, a probe card 5, a card fixing unit 6, and a wafer stocker W.

  The housing 2 is a member for constituting the outline of the inspection apparatus 1. Inside the housing 2, a linear guide 3, an inspection stage 4, and a probe card 5 are provided.

  The linear guide 3 is a device for moving the inspection stage 4 in the X-axis direction (left-right direction in FIG. 3) and the Y-axis direction (front-back direction in FIG. 3). The linear guide 3 includes an X-axis linear guide portion 7 and a Y-axis linear guide portion 8. The X-axis linear guide portion 7 includes two rails 10 arranged in the X-axis direction on a base 9 that is a bottom plate of the housing 2, and guides 11 that are slidably fitted to the two rails 10, respectively. It consists of and.

  The Y-axis linear guide portion 8 is fixed to the two guides 11 of the X-axis linear guide portion 7 and supported so as to be slidable along the rail 10, and the Y-axis base 13 is supported in the Y-axis direction. The two rails 14 are provided, and the guides 15 are slidably fitted to the two rails 14, respectively. The inspection stage 4 described later is supported by the two guides 15.

  The inspection stage 4 is an apparatus for supporting the semiconductor wafer 17 and bringing each electrode of the semiconductor wafer 17 into contact with each probe 23 of the probe card 5 described later. The inspection stage 4 includes a Z-axis movement mechanism 20 that moves the semiconductor wafer 17 in the Z-axis direction, a rotation mechanism 21 that rotates the semiconductor wafer 17, an alignment camera 22 for alignment, and the like. The inspection stage 4 has various configurations. Specific examples thereof will be described later.

  The probe card 5 is a member that integrally supports a plurality of probes 23 that contact each electrode of the semiconductor wafer 17. The probe card 5 is fixed to the card fixing unit 6.

  The card fixing unit 6 is a member that supports the probe card 5. The card fixing unit 6 is provided on the upper side surface of the housing 2. With the probe card 5 attached to the card fixing portion 6, each probe 23 of the probe card 5 is brought into contact with each electrode of the semiconductor wafer 17 placed on the upper side surface of the inspection stage 4.

  The wafer stocker W is a part for storing a plurality of semiconductor wafers 17. The semiconductor wafers 17 accommodated in the wafer stocker W are taken out one by one by an arm (not shown) of the transfer device, placed on the inspection stage 4 and inspected.

  There are a plurality of types of structures of the inspection stage 4, and specific examples thereof will be shown below.

  A first conventional example is shown in FIG. The inspection stage 4 includes a θ stage unit 25, a Z-axis stage unit 26, a chuck top 27, an alignment camera 28, and a wafer lifter 29.

  The θ stage unit 25 is a mechanism for rotating the semiconductor wafer 17 supported on the chuck top 27. The θ stage unit 25 supports the Z-axis stage unit 26, the chuck top 27, the alignment camera 28, and the wafer lifter 29, and rotates the semiconductor wafer 17 together therewith. The θ stage unit 25 mainly includes a base plate 31, a rotating plate 32, and a drive motor 33.

  The base plate 31 is fixed to the guide plate 15 of the Y-axis linear guide portion 8 and is moved in the X-axis direction and the Y-axis direction by the X-axis linear guide portion 7 and the Y-axis linear guide portion 8. The rotating plate 32 is rotatably attached to the upper side surface of the base plate 31. In a state where the drive motor 33 is supported by the base plate 31, the rotation shaft 33 </ b> A is connected to the rotation plate 32 via the connection fixing member 35, and the rotation plate 32 is rotated by a set angle. . Thus, the semiconductor wafer 17 is rotated by the set angle via the Z-axis stage portion 26 and the chuck top 27 by rotating the rotating plate 32 by the set angle by the drive motor 33.

  The Z-axis stage unit 26 is a mechanism for supporting the chuck top 27 and moving it in the Z-axis direction (vertical direction). The Z-axis stage unit 26 includes a guide mounting plate 37, a mounting block 38, and a linear guide 39.

  The guide mounting plate 37 is fixed to the rotating plate 32 of the θ stage unit 25 and rotates together with the rotating plate 32. The mounting block 38 is supported by the guide mounting plate 37 via the linear guide 39 while supporting the chuck top 27. The linear guide 39 is a member that is provided between the guide mounting plate 37 and the mounting block 38, and loves to move the mounting block 38 in the Z-axis direction. Further, an elevating mechanism (not shown) for moving the mounting block 38 in the Z-axis direction is provided.

  The chuck top 27 is a member for supporting the semiconductor wafer 17, aligning the electrodes of the semiconductor wafer 17 with the probes 23 of the probe card 5, and bringing them into contact with each other. The chuck top 27 is provided with a vacuum mechanism (not shown) for sucking and supporting the semiconductor wafer 17, a heating mechanism (not shown) for heating the semiconductor wafer 17, and the like.

  The alignment camera 28 is a camera for aligning each probe 23 of the probe card 5 with respect to the semiconductor wafer 17. The alignment camera 28 is provided on the outer peripheral edge of the chuck top 27. With this alignment camera 28, each probe 23 of the probe card 5 is photographed, the position of each probe 23 is specified, and alignment with respect to the semiconductor wafer 17 is performed.

  The wafer lifter 29 is a mechanism for lifting the semiconductor wafer 17. The wafer lifter 29 lifts the semiconductor wafer 17 on the chuck top 27 to create a gap between the surface of the chuck top 27 and the semiconductor wafer 17 so that an arm (not shown) of the transfer device can be taken in and out. ing. The wafer lifter 29 includes a support column 41, a plate 42, and lift pins 43. A plurality of columns 41 are fixed to the rotating plate 32 of the θ stage unit 25 side by side. The plate 42 is supported by the support columns 41 and supports the lift pins 43. The lift pin 43 is passed through a through hole 27 </ b> A formed in the chuck top 27 while being supported by the plate 42. The upper end portion of the lift pin 43 protrudes from the upper surface of the chuck top 27 relatively when the chuck top 27 is lowered by the Z-axis stage portion 26, and the upper surface of the chuck top 27 relatively moves as the chuck top 27 rises. It is supposed to be buried from.

  The inspection stage 4 configured as described above operates as follows.

  The semiconductor wafer 17 before inspection is stored in the wafer stocker W. When testing the semiconductor wafer 17, the semiconductor wafer 17 accommodated in the wafer stocker W is supported from below by the arm of the transfer device and transferred to the chuck top 27 of the inspection stage 4. When the transferred semiconductor wafer 17 is placed on the chuck top 27, it is first placed on the lift pins 43. Before the semiconductor wafer 17 is placed, the chuck top 27 is lowered by the Z-axis stage portion 26 and the lift pins 43 are relatively raised, and extend upward from the upper side surface of the chuck top 27. As a result, the semiconductor wafer 17 is first placed on the upper end of the lift pins 43, and a gap is formed between the semiconductor wafer 17 and the upper surface of the chuck top 27. Remove the arm from this gap. Next, the chuck top 27 is raised, the lift pins 43 are lowered, and the semiconductor wafer 17 is placed on the upper side surface of the chuck top 27.

  Next, prior to the inspection, the electrodes formed on the semiconductor wafer 17 are aligned with the probe 23 that is a contact for electrical inspection provided facing the semiconductor wafer 17. For this alignment, the tip of the probe 23 is imaged from the outer peripheral edge of the chuck top 27 by the alignment camera 28 provided on the inspection stage 4. Next, based on the coordinates of each tip obtained by image processing of the photographed image, the XYZθ direction is adjusted using software so that each tip properly contacts the corresponding electrode of the semiconductor wafer 17, and the probe is adjusted. 23 and the electrode are aligned.

  Next, the chuck top 27 is raised, the electrodes of the semiconductor wafer 17 and the probes 23 of the probe card 5 are brought into contact with each other, and electrical inspection is performed.

  At this time, since the semiconductor integrated circuit incorporated as a component in the product may operate at a high temperature, the semiconductor wafer 17 is usually kept at a high temperature by heating. That is, the semiconductor wafer 17 is inspected at a high temperature.

  Next, a second conventional example is shown in FIG. The inspection stage 4 includes a Z-axis stage unit 45, a bearing 46, a chuck top 47, an alignment camera 48, and a wafer lifter 49.

  The Z-axis stage unit 45 is a mechanism for supporting the chuck top 47 and moving it in the Z-axis direction (vertical direction). The Z-axis stage unit 45 includes a base plate 51, a guide mounting plate 52, a placement block 53, and a linear guide 54. The base plate 51 is fixed to the guide plate 15 of the Y-axis linear guide portion 8 and supports the guide mounting plate 52. The overall configuration of the Z-axis stage unit 45 is the same as that of the Z-axis stage unit 26 of the first conventional example.

  The bearing 46 is a member for supporting the chuck top 47 rotatably with respect to the Z-axis stage unit 45. The chuck top 47 is set with respect to the Z-axis stage unit 45 by a θ-stage unit (not shown) while being vertically supported by the Z-axis stage unit 45 and rotatably supported by the bearing 46. It is rotated by an angle.

  The chuck top 47 is a member for supporting the semiconductor wafer 17, aligning the electrodes of the semiconductor wafer 17 with the probes 23 of the probe card 5, and bringing them into contact with each other. The chuck top 47 is provided with a vacuum mechanism (not shown) for sucking and supporting the semiconductor wafer 17, a heating mechanism (not shown) for heating the semiconductor wafer 17, and the like.

  Further, the chuck top 47 incorporates a θ stage portion (not shown). By this θ stage portion, the chuck top 47 can be rotated with respect to the Z-axis stage portion 45.

  The alignment camera 48 is an alignment camera that is provided on the outer peripheral edge of the chuck top 47 and identifies each probe 23 for alignment. The alignment camera 48 is attached to the mounting block 53 of the Z-axis stage unit 45 via an attachment stay 56. The alignment camera 48 is positioned on the outer peripheral edge of the chuck top 47 while being supported by the mounting stay 56.

  The wafer lifter 49 is a mechanism for lifting the semiconductor wafer 17. The wafer lifter 49 includes a support frame 58, a plate 59, lift pins 60, and an air cylinder 61. The support frame 58 is attached to the lower surface of the chuck top 47 and supports the entire wafer lifter 49. The plate 59 is slidably supported by the support frame 58 while supporting the lift pins 60. The lift pin 60 is supported by the plate 59 and passes through a through hole 47 </ b> A formed in the chuck top 47. The air cylinder 61 is supported by the support frame 58, and the piston shaft 61 </ b> A is attached to the plate 59. The lift pins 60 supported by the plate 59 are moved up and down by the air cylinder 61, and the upper ends of the lift pins 60 protrude from the upper surface of the chuck top 47 and are buried.

  With the above configuration, when the semiconductor wafer 17 is inspected, the semiconductor wafer 17 accommodated in the wafer stocker W is supported by the arm of the transfer device and transferred to the chuck top 47 of the inspection stage 4. When the transferred semiconductor wafer 17 is placed on the chuck top 47, the lift pins 60 are first raised by the air cylinder 61. As a result, the semiconductor wafer 17 is placed on the upper end of the lift pin 60, the arm is removed from the gap between the semiconductor wafer 17 and the upper surface of the chuck top 47, and the lift pin 60 is lowered by the air cylinder 61. Is placed on the upper surface of the chuck top 47.

  Next, the alignment camera 48 images each probe 23 of the probe card 5 from the outer peripheral edge of the chuck top 47, specifies the position of each probe 23 by image processing, and adjusts the XYZθ direction for alignment.

  Next, the chuck top 47 is raised, and the electrodes of the semiconductor wafer 17 and the probes 23 of the probe card 5 are brought into contact with each other to perform inspection.

As an example of the inspection stage 4, one described in Patent Document 1 is known.
JP-A-2-21650

  However, in the first conventional example, since the alignment camera 28 is attached to the chuck top 27, the alignment camera 28 rotates with the rotation of the chuck top 27 and the position of the alignment camera 28 shifts. If the position of the alignment camera 28 is shifted, calculation by software used for alignment becomes complicated, which increases the cost of the software and causes an alignment error.

  In the second conventional example, the alignment camera 48 is not displaced as in the first conventional example. However, in the wafer lifter 49 of the second conventional example, a dedicated lifting mechanism (for lifting and lowering the lift pins 60) is provided. Since it is necessary to provide the air cylinder 61), the manufacturing cost increases.

  Moreover, it is very difficult to install the air cylinder 61 in a limited space inside the Z-axis stage unit 45. If the air cylinder 61 is forcibly incorporated into the Z-axis stage part 45, the whole is bulky in the height direction. Further, in the case of the wafer lifter 49 in which the lift pins 60 are moved up and down by the air cylinder 61, the straightness accuracy is not so good, so that the mounting position of the semiconductor wafer 17 on the chuck top 47 varies.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an inspection stage and an inspection apparatus that improve accuracy by suppressing displacement caused by the structure of an alignment camera or a wafer lifter. There is.

  The inspection stage according to the present invention is made to solve such a problem, and is an inspection stage that supports and aligns an inspection target plate, and a chuck top that directly supports the inspection target plate; A Z-axis stage unit that moves the chuck top in the vertical direction, a θ stage unit that rotates the chuck top, an alignment camera that images and aligns the inspection target plate supported by the chuck top, and the inspection A wafer lifter that lifts the target plate, the θ stage portion is provided between the Z-axis stage portion and the chuck top, the alignment camera is attached to the Z-axis stage portion, and the wafer lifter is The lower end is fixed to the base and supported by the upper end of each column The first plate, the second plate supported by the first plate while allowing rotation, and the plurality of through holes formed in the chuck top while being supported by the second plate. And a lift pin.

  With the above configuration, by attaching the alignment camera to the Z-axis stage unit, a specific point can be accurately photographed without following the rotation of the chuck top by the θ stage unit. In addition, the support of the wafer lifter is fixed to the base, and the lift pin is passed through the through hole of the chuck top, so that the lift pin does not follow the vertical movement of the chuck top by the Z-axis stage portion. The upper end portion of the chuck protrudes from the upper side surface of the chuck top as the chuck top moves up and down. Further, since the second plate is supported by the first plate in a state of allowing rotation, the lift pin rotates following the rotation of the chuck top by the θ stage portion.

  The elevating mechanism of the Z-axis stage unit is preferably provided at a central position surrounded by each support of the wafer lifter.

  With this configuration, the lifting mechanism can be stored in a compact manner.

  Between the first plate and the second plate, there is provided connecting means for connecting in a state in which mutual rotation is allowed, and the lift pin does not follow up and down by the Z-axis stage part, but by the θ stage part It is desirable to follow the rotation.

  According to the above configuration, the lift pin moves up and down while allowing the chuck top to rotate, and moves up and down from the upper side surface of the chuck top.

  It is desirable to provide a slide mechanism for supporting each lift pin passed through each through-hole so as to be slidable in the vertical direction.

  With the above configuration, the lift pin slides accurately in the vertical direction by supporting the lift pin with the slide mechanism.

  The slide mechanism is preferably provided on a slide support plate fixed to the chuck top side.

  With the above configuration, the slide support plate fixed to the chuck top side rotates with the chuck top and supports the lift pins via the slide mechanism.

  An inspection apparatus according to the present invention is an inspection apparatus that supports and aligns an inspection target plate and performs electrical inspection by bringing a probe into contact with an electrode of the inspection target plate, and supports and positions the inspection target plate. Each inspection stage is used as an inspection stage to be combined.

  With this configuration, the alignment camera and the wafer lifter are favorably supported as in the case of the inspection stage.

  As described above, according to the present invention, the following effects can be obtained.

  By attaching the alignment camera to the Z-axis stage unit, the specific point can be accurately captured without following the rotation of the chuck top by the θ stage unit. The target plate can be accurately aligned.

  In addition, since the camera does not move following the rotation of the chuck top, the structure of software used for aligning the electrodes formed on the semiconductor wafer or the like with the contact is simplified, and the cost can be reduced. it can.

  Since the lift pin is moved in the vertical direction relative to the chuck top, a lift pin vertical movement mechanism is not required. As a result, the relative vertical movement mechanism between the lift pin and the chuck top is simplified, and the cost can be reduced.

  In addition, since the lift pin follows the rotation of the chuck top, it is not necessary to increase the diameter of the through hole through which the lift pin passes. As a result, heat is not released from the through hole having a large hole diameter, and uneven heating can be eliminated. Thereby, the uniformity of the temperature rise of the semiconductor wafer at the time of the electrical inspection under heating can be ensured.

  Since the elevating mechanism of the Z-axis stage portion is provided at the center position surrounded by the respective columns of the wafer lifter and the elevating mechanism is stored compactly, the inspection stage can be miniaturized.

  A connecting means for connecting the first plate and the second plate in a state allowing mutual rotation is provided, and the lift pin allows rotation of the chuck top following the rotation by the θ stage portion. Thus, the semiconductor wafer or the like supported by the tip end portion of the lift pin can be placed at an accurate position on the upper surface of the chuck top. it can.

  By supporting the lift pins with the slide mechanism, the lift pins slide accurately in the vertical direction, so that the semiconductor wafer or the like supported by the tip of the lift pins is accurately supported, and the chuck pin is accurately positioned on the top surface of the chuck top. Can be placed.

  The slide mechanism is provided on a slide support plate fixed to the chuck top side, and the slide support plate fixed to the chuck top side supports the lift pins through the slide mechanism while rotating together with the chuck top. Therefore, the lift pin can be moved up and down accurately with respect to the chuck top.

  Hereinafter, an inspection stage and an inspection apparatus according to embodiments of the present invention will be described with reference to the accompanying drawings. The entire configuration of the inspection apparatus according to the present embodiment is substantially the same as that of the conventional inspection apparatus, and therefore, here, the description will focus on the inspection stage portion. The same members as those in the conventional inspection apparatus are denoted by the same reference numerals, and the description thereof is omitted.

  The inspection stage 71 of this embodiment is fixedly supported on the guide plate 15 of the Y-axis linear guide portion 8. The inspection stage 71 includes a Z-axis stage portion 72, a bearing 73, a mounting ring 74, a chuck top 75, an alignment camera 76, and a wafer lifter 77.

  The Z-axis stage unit 72 is a mechanism for supporting the semiconductor wafer 17 placed on the chuck top 75 and moving it in the Z-axis direction (vertical direction). The Z-axis stage unit 72 includes a base plate 80, a guide mounting plate 81, a mounting block 82, a linear guide 83, and an elevating mechanism 84.

  The base plate 80 is a plate material for supporting the entire Z-axis stage unit 72. The base plate 80 is fixed to the guide plate 15 of the Y-axis linear guide portion 8 and slides with the guide plate 15 in the Y-axis direction.

  The guide mounting plate 81 is a plate material for supporting the mounting block 82 and moving it up and down. The guide mounting plate 81 is integrally provided on the peripheral edge of the base plate 80 in the vertical direction.

  The mounting block 82 is a member for supporting the chuck top 75 and moving it up and down. The mounting block 82 is supported by the guide mounting plate 81 via the linear guide 83 in a state where the chuck top 75 is supported. The mounting block 82 includes an outer cylinder part 86 and an intermediate plate part 87.

  The outer cylinder part 86 is a cubic block provided with a circular hole in the center. An intermediate plate portion 87 is provided in the center hole of the outer cylinder portion 86 at an intermediate position in the vertical direction. The intermediate plate portion 87 is a member for supporting the outer cylinder portion 86 and connecting it to the lifting mechanism 84.

  The linear guide 83 is a member for slidably connecting the guide mounting plate 81 and the mounting block 82. The linear guide 83 includes a rail 90 and a guide 91. The rail 90 is provided in the direction perpendicular to the guide mounting plate 81. The guide 91 is fixed to the mounting block 82 while being slidably fitted to the rail 90. Thereby, the mounting block 82 is supported by the guide mounting plate 81 so as to be slidable in the vertical direction.

  The elevating mechanism 84 is a device for elevating the mounting block 82 in the vertical direction. The elevating mechanism 84 includes a drive motor 93, a lead screw 94, a screw bearing 95, and a lead nut 96.

  The drive motor 93 is fixed to the base plate 80 and rotates the lead screw 94. The lead screw 94 is disposed upward through the base plate 80 and the middle plate portion 87 of the mounting block 82. A thread is provided on the outer peripheral surface of the lead screw 94. The screw bearing 95 rotatably supports the lead screw 94 on the base plate 80. The lead nut 96 is screwed into the lead screw 94 while being fixed to the middle plate portion 87 of the mounting block 82. As a result, the drive motor 93 rotates the lead screw 94 by a set angle, so that the mounting block 82 is accurately raised and lowered by a set distance via the lead nut 96.

  The bearing 73 is a member for supporting the chuck top 75 rotatably with respect to the Z-axis stage unit 72. The inner ring 73 </ b> A of the bearing 73 is fixed to the mounting block 82 of the Z-axis stage unit 72. The outer ring 73 </ b> B of the bearing 73 is fixed to the mounting ring 74.

  The mounting ring 74 is a member that supports the chuck top 75 while being supported by the outer ring 73 </ b> B of the bearing 73. The mounting ring 74 includes a θ stage portion (not shown). The θ stage unit is a device for rotating the chuck top 75 with respect to the Z-axis stage unit 72 by a set angle. The θ stage unit rotates the chuck top 75 by a slight angle to align the probe 23 and the electrode of the semiconductor wafer 17.

  The chuck top 75 is a member for supporting the semiconductor wafer 17, aligning the electrodes of the semiconductor wafer 17 with the probes 23, and bringing them into contact with each other. The chuck top 75 is provided with a vacuum mechanism (not shown) for sucking and supporting the semiconductor wafer 17, a heating mechanism (not shown) for heating the semiconductor wafer 17, and the like. The chuck top 75 is moved in the vertical direction by the Z-axis stage unit 72, rotated by the θ stage unit, moved in the X-axis direction by the X-axis linear guide unit 7, and moved in the Y-axis direction by the Y-axis linear guide unit 8. To be moved to.

  The alignment camera 76 is a camera for aligning each electrode of the semiconductor wafer 17 and each probe 23 of the probe card 5. The alignment camera 76 is attached to the mounting block 82 of the Z-axis stage unit 72 via an attachment stay 98. The alignment camera 76 is attached to the Z-axis stage 72 side so that it does not move following the rotation of the chuck top 75. The alignment camera 76 is positioned on the outer peripheral edge of the chuck top 75 while being supported by the mounting stay 98.

  The wafer lifter 77 is a mechanism for lifting the semiconductor wafer 17 on the chuck top 75 and creating a gap between the surface of the chuck top 75 and the semiconductor wafer 17. The wafer lifter 77 includes a support column 100, a first plate 101, a second plate 102, a connecting rod 103, lift pins 104, and a slide support plate 105.

  The support column 100 is vertically arranged with its base end fixed to the base plate 80. Four struts 100 are provided around the lead screw 94 of the lifting mechanism 84. Thus, each support column 100 is disposed in the mounting block 82 so as to cover the outside of the lifting mechanism 84. Specifically, each support column 100 is slidably passed through a hole provided in the middle plate portion 87 of the mounting block 82, and each support column 100 is provided so as to cover the lead screw 94 of the elevating mechanism 84.

  The first plate 101 is a member that supports the second plate 102 by being supported by the upper end of each support column 100. The first plate 101 supports the second plate 102 in a state where the second plate 102 is allowed to rotate.

  The second plate 102 is a member for supporting the lift pins 104 to move up and down. The second plate 102 supports the lift pins 104 in a state of being rotatably supported by the first plate first plate 101.

  The connecting rod 103 is a rod that connects the first plate 101 and the second plate 102 in a state in which the rotation between the first plate 101 and the second plate 102 is allowed. The connecting rod 103 is rotatably supported by a bearing 106 on the first plate 101 and is fixed to the second plate 102. As a result, the second plate 102 is rotatably supported with respect to the first plate 101.

  The first plate 101, the second plate 102, the connecting rod 103, and the bearing 106 constitute connecting means for allowing the chuck top 75 to rotate and rotating the lift pin 104 together with the chuck top 75 and moving it up and down. ing.

  The lift pins 104 are respectively passed through the three through holes 75 </ b> A formed in the chuck top 75 while being supported by the second plate 102. The through hole 75 </ b> A is provided in a direction (vertical direction) perpendicular to the upper side surface of the chuck top 75. The upper end portion of the lift pin 104 protrudes from the upper surface of the chuck top 75 relatively when the chuck top 75 is lowered by the Z-axis stage portion 72, and the upper surface of the chuck top 75 is relatively moved when the chuck top 75 rises. It is supposed to be buried from.

  The slide support plate 105 is a plate material for rotating the lift pin 104 together with the chuck top 75 while allowing the lift pin 104 to move up and down, and supporting and rotating the lift pin 104. The slide support plate 105 is fixed to the mounting ring 74 and is rotated together with the chuck top 75 at the θ stage portion. The slide support plate 105 is provided with three holes through which the lift pins 104 pass. A slide mechanism 108 is provided in each hole. The slide mechanism 108 is configured to accurately position and support the horizontal direction of the lift pin 104 while allowing the lift pin 104 to move up and down. Specifically, the slide mechanism 108 includes a ball bush, a ball spline, or the like. By accurately moving the lift pins 104 up and down by the slide mechanism 108, the semiconductor wafer 17 supported by the upper ends of the lift pins 104 is accurately lowered and placed on the upper surface of the chuck top 75 at an accurate position. ing. This facilitates alignment between the probe 23 and each electrode of the semiconductor wafer 17.

[Action]
In the inspection apparatus including the probe unit 31 configured as described above, the inspection is performed as follows.

  One semiconductor wafer 17 is taken out by an arm (not shown) of the transfer device and placed on the chuck top 75. At this time, the chuck top 75 is lowered by the elevating mechanism 84. Specifically, the lead screw 94 is rotated by the drive motor 93 and the lead nut 96 is lowered, and the chuck top 75 is lowered via the intermediate plate portion 87, the outer cylinder portion 86, the θ stage portion 74, and the like. .

  As a result, the lift pins 104 of the wafer lifter 77 supported by the base plate 80 relatively rise and extend from the upper side surface of the chuck top 75. The semiconductor wafer 17 is placed on the upper end portion of the extended lift pins 104.

  Next, the chuck top 75 is raised by the rotation of the drive motor 93. Thereby, the lift pins 104 are relatively lowered, and the semiconductor wafer 17 is placed on the upper side surface of the chuck top 75.

  Next, the chuck top 75 is processed in the X-axis direction by the X-axis linear guide unit 7 by processing the image of the probe 23 taken by the alignment camera 76 and the image of the electrode of the semiconductor wafer 17 taken by another camera (not shown). , Moved in the Y-axis direction by the Y-axis linear guide portion 8 and rotated by the θ stage portion, so that the electrodes of the semiconductor wafer 17 and the probe 23 are aligned with each other. Next, the electrode and the probe 23 are brought into contact with each other by being moved upward by the Z-axis stage unit 72.

[effect]
By attaching the alignment camera 76 to the Z-axis stage unit 72, a specific point can be accurately captured without following the rotation of the chuck top 75 by the θ stage unit 74. Image processing makes it possible to accurately align the semiconductor wafer 17. As a result, since the alignment camera 76 does not move following the rotation of the chuck top 75, the structure of software used to align the electrodes formed on the semiconductor wafer 17 and the probe 23 becomes simple, and the software is produced. Cost can be reduced.

  In order to move the lift pin 104 in the vertical direction relative to the chuck top 75, the vertical movement mechanism of the lift pin 104 can be omitted. As a result, the relative vertical movement mechanism of the lift pins 104 and the chuck top 75 is simplified, and the cost can be reduced.

  Further, since the lift pin 104 is caused to follow the rotation of the chuck top 75, it is not necessary to increase the diameter of the through hole through which the lift pin 104 passes. As a result, heat is not released from the through hole having a large hole diameter, and uneven heating can be eliminated. Thereby, when an electrical inspection is performed under heating, unevenness does not occur in the temperature rise of the heated semiconductor wafer 17, and uniformity can be ensured.

  Since the elevating mechanism 84 of the Z-axis stage unit 72 is provided at the center position surrounded by the respective pillars 100 of the wafer lifter 77 and the elevating mechanism 84 is accommodated in a compact manner, the inspection stage 71 can be reduced in size. Cost reduction can be achieved. As a result, the inspection apparatus equipped with the inspection stage 71 can also be reduced in size, and the cost can be reduced.

  The chuck top includes a connecting means for connecting the first plate 101 and the second plate 102 in a state in which the first plate 101 and the second plate 102 are allowed to rotate. The lift pin 104 follows the rotation by the θ stage unit 74. The upper and lower surfaces of the chuck top 75 are moved up and down while allowing the rotation of 75. Further, since the lift pins 104 are accurately slid in the vertical direction by supporting the lift pins 104 by the slide mechanism 108, the chuck top 75 is in a state where the semiconductor wafer 17 supported by the tip portions of the lift pins 104 is accurately supported. Can be placed at an accurate position on the upper surface of the. As a result, the subsequent alignment between the electrode and the probe 23 is facilitated, and the workability during inspection is improved.

  The slide mechanism 108 is provided on the slide support plate 105 fixed to the chuck top 75 side, and the slide mechanism 108 is rotated while the slide support plate 105 fixed to the chuck top 75 side rotates together with the chuck top 75. Thus, the lift pin 104 is supported, so that the lift pin 104 can be accurately moved up and down with respect to the chuck top 75.

[Modification]
Although the inspection stage 71 and the inspection apparatus according to the present embodiment are applied to the inspection apparatus for the semiconductor wafer 17, the inspection stage 71 and the inspection apparatus are applied to all inspection target plates that are placed on the upper surface of the chuck top 75 and need to be accurately positioned. be able to. Also in this case, the same operations and effects as described above can be achieved.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

It is a section perspective view showing the inspection stage concerning the embodiment of the present invention. It is a perspective view which shows the conventional inspection apparatus. It is sectional drawing which shows the conventional inspection apparatus. It is sectional drawing which shows the conventional inspection apparatus. It is a perspective view which shows the X-axis linear guide part and Y-axis linear guide part of the conventional inspection apparatus. It is sectional drawing which shows the test | inspection stage which concerns on a 1st prior art example. It is sectional drawing which shows the inspection stage which concerns on a 2nd prior art example. It is sectional drawing which shows the test | inspection stage which concerns on embodiment of this invention.

Explanation of symbols

1: Inspection device, 2: Housing, 3: Linear guide, 5: Probe card, 6: Card fixing part, 7: X-axis linear guide part, 8: Y-axis linear guide part, Base, 13: Y-axis base 71: Inspection stage 72: Z-axis stage part 73: Bearing 74: θ stage part 75: Chuck top 76: Alignment camera 77: Wafer lifter 80: Base plate 81: Guide mounting plate 82 : Placement block, 83: Linear guide, 84: Elevating mechanism, 86: Outer cylinder part, 87: Middle plate part, 90: Rail, 91: Guide, 93: Drive motor, 94: Lead screw, 95: Screw bearing, 96: lead nut, 98: mounting stay, 100: support, 101: first plate, 102: second plate, 103: connecting rod, 104: lift pin, 105: screw Id support plate 108: slide mechanism.

Claims (6)

An inspection stage for supporting and aligning the inspection target plate,
A chuck top that directly supports the inspection object plate;
A Z-axis stage for moving the chuck top in the vertical direction;
A θ stage unit for rotating the chuck top;
An alignment camera that images and positions the inspection object plate supported by the chuck top;
A wafer lifter for lifting the inspection object plate,
The θ stage part is provided between the Z axis stage part and the chuck top, and the alignment camera is attached to the Z axis stage part.
The wafer lifter is supported in a state where a plurality of support columns vertically arranged with a lower end fixed to a base, a first plate supported on the upper end of each support, and the first plate allowing rotation. An inspection stage, comprising: a second plate that is formed, and lift pins that are respectively passed through a plurality of through holes formed in the chuck top while being supported by the second plate. The inspection stage according to claim 1,
An inspection stage, wherein the elevating mechanism of the Z-axis stage portion is provided at a central position surrounded by each support of the wafer lifter. The inspection stage according to claim 1 or 2,
A connecting means for connecting the first plate and the second plate in a state in which mutual rotation is allowed is provided, and the lift pin does not follow up and down by the Z-axis stage unit, and is rotated by the θ stage unit. Inspection stage characterized by following. The inspection stage according to any one of claims 1 to 3,
An inspection stage comprising a slide mechanism for supporting each lift pin passed through each through hole so as to be slidable in a vertical direction. The inspection stage according to claim 4,
An inspection stage, wherein the slide mechanism is provided on a slide support plate fixed to the chuck top side. An inspection apparatus that supports and aligns an inspection target plate and performs electrical inspection by bringing a probe into contact with an electrode of the inspection target plate,
An inspection apparatus using the inspection stage according to claim 1 as an inspection stage for supporting and aligning the inspection object plate.

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