KR100206642B1 - Rotary arm and device chuck part of handler - Google Patents

Abstract

An IC handler is provided which simplifies the structure of the measuring unit 4 for testing a device under test and can shorten index time.

The device chucks 21 are attached to the three arms 3b protruding in the radial direction at an angular interval of 120 ° from the rotary shaft 3a of the rotary arm 3. In addition, a flat half ring cam 24 having a circumferential surface of approximately inverted triangular shape and two sides of the inverted triangular vertex as the cam working portions 24a and 24b is formed. It is attached to the casing of the IC handler concentrically with the rotation shaft 3a so as to be disposed at a predetermined position on the upper portion of the measuring section 4. Rotation is freely attached to each device chuck of a cam follower 21b that follows the cam action portion of the cam.

Since each device chuck is driven by the cam follower at the rotation of the rotary arm, the device is gradually lowered when conveying the device under test from the soak stage 5 to the measuring section 4. When conveying a test device from the measurement part to the egg stage 6, it raises gradually.

Therefore, it becomes possible to arrange | position a measurement part in the low position like the bottom face of the thermostat 2, and can simplify a structure. In addition, in each part of the soak stage, the measuring unit, and the egg stage, the device chuck only needs to perform the shortest lifting movement, so that the index time can be shortened.

Description

Rotary arm and handler of handler

1 is a principal front view showing the structure of a main part of an embodiment of an IC handler according to the present invention with a focus on a measurement part;

FIG. 2 is a schematic perspective view showing the structure of the rotary arm and the device chuck used in the IC handler of FIG. 1 together with their periphery.

3 is a principle plan view showing the configuration of a main part of an example of a conventional horizontal transfer type IC handler.

4 is a principal front view showing the structure of the rotary arm and the device chuck used in the IC handler of FIG.

FIG. 5 is a flowchart for explaining the operation of the rotary arm and the device chuck of the IC handler shown in FIG.

* Explanation of symbols for main parts of the drawings

1: IC handler 2: Thermostat

3: rotary arm 4: measuring unit

5: Soak Stage 6: Egg Stage

7: DUT 8: Unloader

8x: X carrier arm 8y: Y carrier arm

9: empty tray buffer stage 10: loader

11: loader carrier arm 12: tray carrier

21: device chuck

[Industrial use]

BACKGROUND OF THE INVENTION Field of the Invention [0002] The present invention generally returns for testing an IC in an IC test apparatus (generally referred to as an IC tester) for testing a semiconductor device, especially an IC (semiconductor integrated circuit), which is a representative example, and further carries out a test processing of the tested IC A semiconductor device conveyance processing apparatus (generally referred to as an IC handler) used for the purpose of the present invention. More specifically, a single IC under test (generally referred to as a DUT) in a measurement unit (also called a test unit) of an IC tester. It relates to the structure of the rotary arm and the device chuck part of the IC handler which can further shorten the time (usually called index time) from the end of the measurement to the start of the next test under test.

[Background]

Fig. 3 schematically shows an example of the configuration of an IC handler called a conventional horizontal transfer method using a rotary arm and a device chuck. In the figure inside the housing of the IC handler 1, the loader part 10, the empty tray buffer stage 9, and the unloader part 8 are arrange | positioned from the left side to the right side of the figure along one side of the lower side. In the figure, a plurality of trays are accommodated in the loader unit 10 on the far left, and a plurality of ICs (DUTs) to be tested are stored in each tray from now on.

The loader carrier arm 11 carries out two DUTs in this example from the tray at the uppermost end of the tray group accommodated in the loader section 10 and transfers them to the turntable 5 called the soak stage. In order to define the position to receive the DUT 7, the turntable 5 is formed by two rows of positioning concave portions formed at approximately equiangular intervals, each of which having four sides of a square surrounded by an upward inclined surface, and the turntable 5 has one row. It is comprised so that two DUTs 7 may fall to each position recessed part of 2 rows every time pitch rotation rotates. The DUT 7 carried on the turntable 5 is transferred to the measuring section 4 by means of a rotary arm (called a contact arm; 3). The rotary arm 3 sucks out two DUTs 7 from each of the positioning recesses of the turntable 5, and transfers the DUTs 7 to the measurement unit 4.

The rotary arm 3 has three arms 3b attached to the rotational shaft 3a at approximately equiangular intervals, and the three arms 3b rotate to sequentially turn the DUT 7 to the measuring unit 4. The transfer operation and the operation of guiding the completed test IC completed by the measurement unit 4 to the rotating arm called the egg stage 6 are performed. The egg stage 6 may have the same structure as the rotary arm 3. In addition, the soak stage 5, the rotary arm 3, and the measuring unit 4 are housed in a thermostat (generally called a chamber; 2) in which the handler 1 is installed in the housing, and the DUT 7 is placed in the thermostat. It is comprised so that it may hold and test in (2), and to test. Moreover, the arm stage is normally in the state in which any one arm is arrange | positioned in the thermostat 2.

The tested DUT taken out by the egg stage 6 disposed outside the outlet of the thermostat 2 is transferred to the unloader section 8. The unloader section 8 includes a Y carrier arm 8y movable in the Y direction (vertical direction in the drawing) and a Y carrier having a chuck 8d for picking up the tested DUT from the arm of the egg stage 6. An X carrier arm 8x for transporting the arm 8y in the X direction (the transverse direction in the drawing) is provided, and in this example, three trays 8a, 8b, 8c are arranged. The tested DUT received from the egg stage 6 is classified and stored in any of the three trays 8a, 8b and 8c in this example based on the measurement result. For example, a good product is stored in the tray 8a, a first type of quantitative product (e.g., an IC that needs to be retested) is stored in the tray 8b, and the second type of defective product (e.g., a completely poor IC) is stored in the tray 8c. ) Is stored. These classifications are performed by the X carrier arm 8x.

Moreover, the tray emptied by the loader part 10 is accommodated in the empty tray buffer stage 9 provided in the right side in the figure of the loader part 10. As shown in FIG. The tray accommodated in this empty tray buffer stage 9 is transferred to the unloader section 8 by the tray carrier 12 when necessary. For example, when the tray of any of the unloader sections 8 becomes full, it is transported onto the full tray and used for storing the IC.

The rotary arm 3 will be described in more detail. As described above, the rotary arm 3 has a rotation shaft 3a, and three arms 3b protrude radially from the rotation shaft 3a at an angular interval of 120 degrees. As shown in FIG. 4, the device chuck 21 is freely attached to the vertical end surface (outer plane) of each arm 3b in the vertical direction via the linear guide 21a. Further, since the tension coil springs 22 are provided in the vertical direction between the lower portions of the device chucks 21 and the upper portions of the corresponding arms 3b, the device chucks 21 are each coil springs 22. Is normally pushed upward by the tension force of the arm), and is stopped at a predetermined position (uppermost position) of the cross section in the vertical direction of each arm 3b. In addition, the chamber insulation wall 28 of the thermostat 2 is the heat insulating material 28b in this example, the aluminum plate 28a attached to the outer surface of the heat insulating material 28b, and the stainless steel attached to the inner surface of the heat insulating material 28b. It has a three-layer structure composed of plates 28c.

As shown in FIG. 4, the DUT receiving position 5a of the soak stage 5, the measuring unit 4, and the DUT receiving position 6a of the egg stage 6 are shown. In the phase, a contact in cylinder 32, a contact press cylinder 33 and a contact out cylinder 34 are used to lower the device chuck 21, respectively. The contact in cylinder 32 is used to lower the device chuck 21 to a predetermined position approaching it in order to adsorb and hold the DUT at the DUT exchange position 5a of the soak stage 5. The contact press cylinder 33 is used in the measuring section 4 to drop the device chuck 21 which adsorbed and held the DUT to electrically contact the lead of the DUT with the IC socket 4b. The contact out cylinder 34 is used to lower the device chuck 21 to a predetermined position approaching it in order to release the DUT held in the DUT receiving position 6a of the egg stage 6.

The measuring section 4 is installed at the bottom of the thermostat 2, and is attached to the hollow spacing frame 4g and the spacing frame 4g attached to the performance board 4f of the IC tester. And a socket guide 4c and an IC socket 4b disposed in the socket guide 4c. The IC socket 4b is attached to the socket board 4e attached to the bottom of the socket guide 4c through the adapter socket 4d. The spacing frame 4g is made of a heat insulating material, is fitted to the through hole 39 formed in the heat insulation wall 28 at the bottom of the thermostat 2, and the performance board 4f is disposed on the bottom of the spacing frame 4g. Is attached. Therefore, the spacing frame 4g is selected in the shape and size to be fitted to the through hole 39 of the heat insulation wall 28, and the performance board 4f is disposed outside the thermostat 2, while the IC The socket 4b is arrange | positioned in the state which protruded into the thermostat from the bottom surface of the thermostat 2.

A guide pin 4a for guiding the device chuck 21 protrudes from the surface of the socket guide 4c. The device chuck 21 is guided by the device chuck 21 when the device chuck 21 descends. ), The DUT adsorbed and held is positioned at a predetermined position of the IC socket 4b. In addition, the performance board 4f is electrically connected to the test head 43 of the IC tester via the contact pin 41a.

Next, the operation of the rotary arm and the device chuck portion having the above configuration will be described with reference to FIG.

(a) The rotary arm 3 is rotated by 120 degrees, whereby one device chuck 21 at a predetermined position (topmost position) approaches the DUT transfer position 5a of the soak stage 5. , The contact-in cylinder 32 is turned on (operated), and the device chuck 21 is forcibly strengthened from a predetermined position (topmost position) against the elastic force of the coil spring 22, and the suction pad thereof. 21c is in contact with the DUT.

(b) Next, a vacuum generator that sucks air from the suction pad 21c is operated to firmly adsorb and hold the DUT to the suction pad 21c.

(c) Next, the contact-in cylinder 32 is turned off (operation stopped), and as a result, the device chuck 21 which sucks and holds the DUT is moved to a predetermined position (uppermost position) by the tension force of the coil spring 22. To rise).

(d) Next, when the rotary arm 3 is rotated again by 120 degrees, the device chuck 21 is also rotated by 120 degrees, and when it reaches the measuring section 4, the IC socket of the measuring section 4 ( It is arrange | positioned at the predetermined position which approached 4b).

(e) Next, the contact press cylinder 33 is turned on, the device chuck 21 is forcibly lowered against the elastic force of the coil spring 22, and the lead of the DUT sucked and held is connected to the socket 4b. Contact with the contact of the control panel) and it is electrically connected reliably.

(f) Next, a test signal is applied from the IC tester to the DUT via the test head 43, and various electrical characteristics (voltage, current, etc.) of the DUT are measured. During this measurement, the lead of the DUT is in pressure contact with the contact of the IC socket 4b.

(g) When the measurement is completed, the contact press cylinder 33 is turned off, and as a result, the device chuck 21 sucks and holds the measured DUT by the tensile force of the coil spring 22 to a predetermined position (the uppermost portion). Position).

(h) Next, when the rotary arm 3 is rotated again by 120 °, the device chuck 21 is also rotated by 120 °, and when the DUT receiving position 6a of the egg stage 6 is reached, It is arranged at a predetermined position approaching the DUT receiving position 6a.

(i) Next, the contact-out cylinder 34 is turned on, the device chuck 21 is forcibly strengthened by the elastic force of the coil spring 22, and the tested DUT is applied to the DUT of the egg stage 6. It is located just above the receiving position 6a.

(j) Next, since the vacuum generator is turned off and the negative pressure applied to the adsorption pad 21c at the lower end of the device chuck 21 is released, the test completed DUT that has been adsorbed and held is released to release the egg. It falls in the positioning recessed part of the DUT receiving position 6a of the stage 6.

(k) Next, the contact out cylinder 34 is turned off, and as a result, the device chuck 21 is raised to a predetermined position (uppermost position) by the tension force of the coil spring 22.

(l) Next, the rotary arm 3 is rotated again by 120 degrees, and the device chuck 21 is also rotated by 120 degrees, and is disposed at a predetermined position approaching the DUT transfer position 5a of the soak stage 5, Then, the operations of steps (a) to (l) are repeated again.

By the way, in order to improve the throughput (processing capacity) of the IC handler, the time from the end of measurement of one DUT to the start of measurement of the next DUT (generally referred to as index time) becomes important.

When the index time is shortened, the throughput of the IC handler is improved. Therefore, in the conventional IC handler shown in FIG. 4, the contact press cylinder 33 of the step e of FIG. 5 is turned on, and the measuring section 4 When the device chuck 21 positioned at the lower side of the cylinder is lowered, the contact-in cylinder 32 of step (a) is turned on at the same time, and the device chuck 21 positioned at the soak stage 5 is configured to drop. Therefore, during the device measurement of step (f), the suction operation of the device of the staff (b) and the raising operation of the device chuck of the step (c) are performed. Similarly, since the contact-out cylinder of step (i) is turned on along with the operation of step (e), the dropping operation of the device chuck 21 located in the egg stage 6 is performed. During the measurement of the device of f), the device is released in step (j) and the raising operation of the device chuck in step (h) is performed.

When the above index time is analyzed, (1) the time when the contact press cylinder 33 is turned off and the device chuck 21 rises in step (g), (2) steps (d) and (h) And (l), the time when each arm 3b rotates by 120 °, and (3) the time when the contact press cylinder 33 is turned on and the device chuck 21 falls in step (e). There are three types, and the sum of them becomes an index type.

In the conventional IC handler, in order to shorten the time of (1) and (3), the position of the IC socket 4b is changed to the position of the DUT exchange position 5a or egg stage 6 of the soak stage 5. It is arrange | positioned at substantially the same height as the DUT receiving position 6a, and the raising / lowering stroke of the device chuck 21 is made substantially the same as the DUT receiving position 5a and the DUT receiving position 6a. In the performance board 4f, various electrical and electronic components necessary for measurement are mounted. On the other hand, since the inside of the thermostat 2 is up to 125 ° C, the performance board 4f is not affected by high temperature. ) Needs to be insulated to some extent from inside the thermostat and attached to the outside. For this reason, the spacing frame 4g which consists of heat insulating materials as mentioned above is prepared, and it adheres in the through-hole 39 formed in the heat insulation wall 28 of the bottom of the thermostat 2, and the performance board 4f is thermostat 2 ), The IC socket 4b is projected to a predetermined position in the thermostat, and the stroke of the lifting and lowering of the device chuck 21 in the measuring section 4 is shortened.

However, a socket guide 4c, a socket board 4e, an IC socket 4b, and the like are attached to the spacing frame 4g, and a performance board 4f is attached to the bottom of the spacing frame 4g. Therefore, the spacing frame 4g must be firmly constituted by a heat insulating material. For this reason, there exists a fault which becomes a cost increase. Moreover, since the space | interval between the socket board 4e and the performance board 4f becomes long, it must connect them with a lead wire, and there exists a possibility that it may adversely affect measurement accuracy. In addition, there was a drawback that the assembling work of the measuring unit 4 was complicated and the working time was long.

[Overview of invention]

An object of the present invention is to provide an IC handler which can eliminate the need for protruding an IC socket of a measuring unit into a thermostat, simplify the structure of the measuring unit and reduce index time.

According to the present invention, a device having a rotational axis, the rotary arm of which three arms protrude radially from the rotational axis at an angular interval of 120 degrees, and a device freely attached to the vertical cross section of each arm of the rotary arm. The chuck, the planar semi-ring cam which has a substantially inverted triangular shape, and the two sides between the vertices of the inverted triangle serve as a cam action portion, and the cam that acts on the cam action portion of the cam. A handler having a cam follower freely attached to each device chuck, and having the cam attached to the housing of the IC handler concentrically with the rotation shaft such that the vertex of the inverted triangle of the cam is disposed at a predetermined position above the measurement unit. Provided, the above object is achieved.

According to the above configuration, the inverted triangular cam has a cam working portion inclined downward with respect to the rotational direction of the rotoring arm and a cam working portion inclined upward with respect to the vertex of the inverted triangle. Therefore, the device chuck is driven by the cam follower of the device chuck following the downwardly inclined cam acting portion of the cam when the DUT is conveyed from the soak stage that sends and receives the DUT to the device chuck to the measuring unit for testing the DUT. When the device chuck is gradually lowered and the device chuck reaches the measurement section, it is disposed at a predetermined position above the IC socket of the measurement section. On the other hand, when the DUT is transferred from the measurement section to the egg stage, the cam inclined upwardly. Since the cam follower of the device chuck is driven to the acting portion, the device is gradually raised so that when the device chuck reaches the egg stage, it is disposed at a predetermined position above the DUT receiving position of the egg stage. Therefore, in each part of the soak stage, the measuring unit, and the egg stage, the device chuck only needs to perform the shortest lifting movement, thereby reducing the index time. In addition, since the device chuck is moved from the predetermined position (the uppermost position) to the position where the measurement chuck has been reached, the IC socket can be lowered by a distance corresponding to the drop distance of the device chuck. Therefore, it is not necessary to protrude the IC socket into the thermostat, and the structure of the measuring section can be simplified.

Detailed Description of the Preferred Embodiments

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2. In addition, in these figures, the same code | symbol is attached | subjected to the part corresponding to FIG. 3 and FIG. 4, and description is abbreviate | omitted unless it is necessary.

In this embodiment, the cam 24 is attached concentrically with the rotary shaft 3a of the rotary arm 3 near the rotary arm 3. The cam 24 has a substantially half-ring shape in plan view, and a portion (circumferential surface) extending downward has a substantially inverted triangle shape (see FIG. 1), and a two-sided cam working portion having the inverted triangle vertex interposed therebetween. Act as. Moreover, the cam follower 21b which follows the cam action | operation part of the said cam is freely rotatable to each device chuck 21 which the lifting and lowering is attached to the vertical cross section of each arm 3b of the rotary arm 3 freely. Attached.

On the other hand, the measurement unit 4 is provided on the bottom surface of the thermostat 2, and the IC socket 4b attached to the performance board 4f via the adapter socket 4d is located at the bottom of the thermostat 2; It is arrange | positioned under the through-hole 39 formed in the chamber heat insulation wall 28. As shown in FIG. The socket guide 4c is also directly attached to the performance board 4f. By screwing the socket guide 4c into the chamber insulation wall 28, the IC socket 4b is fixed at a predetermined position, and the through hole It is in the state exposed to the thermostat side via 39.

The cam 24 has a plurality of support pillars 29 whose upper half-ring-like upper portions are similarly formed in an arc shape concentric with the rotation shaft 3a and slumped from the chamber insulation wall 28 of the ceiling of the thermostat 2. The cam holder 25, which is screwed to the lower end thereof, is screwed so as to be concentric with the rotation shaft 3a. Accordingly, the cam 24 is fixed and does not perform a movement for driving the cam follower 21b. In this specification, the cam 24 is referred to as a cam. In this case, as is apparent from FIG. The vertex of the inverted triangular portion is fixed to the cam holder 25 so as to contact the cap follower 21b which is freely attached to the device chuck 21 positioned above the measuring section 4. Therefore, the cam action part of the cam 24 has the part 24a which inclines downward with respect to the rotation direction of the rotary arm 3, and the part 24b which inclines upward with respect to the vertex of an inverted triangle. .

By providing the cam 24 and the cam follower 21b having the above-described configuration, two of the three device chucks 21 rotating together (measured from the sock stage 5) when the rotary arm 3 rotates by 120 °. The cam follower 21b of the divider chuck that rotates to the section 4 and the device chuck that rotates from the measurement section 4 to the egg stage 6 is formed by the downward cam action portion 24a and the upward cam action portion ( Followed by 24b), the device chuck 21 which rotates from the soak stage 5 to the measuring unit 4 gradually descends downward along the cam inclined portion 24a which is inclined downward. When the upper portion of (4) is reached, the device chuck 21 which is in the lowest position and the device chuck 21 which rotates from the measuring section 4 to the egg stage 6 is inclined upward. When it rises upward gradually along the action part 24b, and reaches the upper part of the egg stage 6, The device chuck 21 returns to the original predetermined position (topmost position).

In other words, each device chuck 21 adsorbs the DUT at a predetermined position above the DUT exchange position 5a of the soak stage 5, and then rotates by 120 ° so that the IC socket of the measurement unit 4 is rotated. Reach to the top of 4b. Since the cam follower 21b follows the cam acting portion 24a which is inclined downward of the cam 24 while this 120 ° is rotated, the device chuck 21 is coil spring from the usual predetermined position (topmost position). In response to the elastic force of (22), it gradually descends to the downward position, and when the rotation of 120 ° is completed, the inverted triangle vertex of the cam 24 is in contact with the cam follower 21b of the device chuck 21. (Figure 1). At this time, the device chuck 21 is at the predetermined position of the upper part of the measurement part 4, and is also at the lowest point position. By the operation of the above-mentioned contact press cylinder 33 at this position, the DUT is reliably contacted with the IC socket 4b on the performance board 4f of the IC tester to perform a predetermined measurement. When the rotary arm 3 is rotated 120 degrees again after the end of the measurement, this time the cam follower 21b follows the cam acting portion 24b inclined upward of the cam 24. Reference numeral 21 is gradually raised from the lowest point position by the elastic force of the coil spring 22 to return to the original normal predetermined position (top position). Thus, when the rotation of 120 ° is finished, the device chuck 21 is at a predetermined position above the DUT receiving position 6a of the egg stage 6.

Therefore, even if the measuring section 4 is located at a lower position than the soak stage 5 and the egg stage 6, in each of the parts of the soak stage 5, the measuring section 4, and the egg stage 6. The device chuck 21 can perform a predetermined operation only by performing the shortest lifting movement, and can shorten the index time. The position of the measuring section 4 can be lowered by a distance corresponding to the distance between the usual predetermined position (topmost position) of the device chuck and the lowest point position where the maximum distance drops by the downward cam action portion 24a. As shown in the figure, the measuring section 4 can be installed on the bottom surface of the thermostat 2, and the IC socket 4b is insulated at the same time as the conventional IC handler is insulated using the spacing frame 4g. It is not necessary to protrude in the thermostat 2. In addition, since the IC socket 4b can be attached onto the performance board 4f via the adapter socket 4d, there is no need to install the socket board 4e like the conventional IC handler, and furthermore, the socket board 4e. ) And the performance board 4f do not need to be connected by a lead wire. In addition, since the performance board 4f is fixed to the bottom wall of the thermostat 2 through the socket guide 4c, it is located below the thermostat 2 separated from the bottom wall of the thermostat 2. Therefore, the performance board 4f is not affected by the high temperature of the thermostat 2 only by insulating to some extent with the socket guide 4c or the like, and there is no need to use a special heat insulating member. In this way, the structure of the measuring part 4 can be simplified.

[Effects of the Invention]

As described above, according to the present invention, since the measurement unit 4 can be disposed on the bottom surface of the thermostat 2, a solid expensive spacing frame 4g or socket board 4e made of a heat insulating material can be used as in the prior art. Without need, the IC socket 4b and the socket guide 4c can be mounted directly on the performance board 4f. Therefore, the component material cost is reduced, and wiring by the lead wire between the socket board 4e and the performance board 4f is not required as in the prior art, and thus there is no fear of adversely affecting the measurement accuracy. In addition, since the assembling work of the measuring unit 4 is simplified, an economical measuring unit can be realized with shorter assembly time and improved workability.

In addition, a cam 24 having a planar half ring shape and a circumferential surface extending downwardly having a substantially inverted triangular shape arranged concentrically with the rotary shaft 3a of the rotary arm 3 on the upper part of the measuring part 4 is fixed. Since the device chuck 21 is configured to follow the cam), each device chuck 21 automatically moves when the device chuck 21 approaches the measuring unit 4 as the rotary arm 3 rotates. When it descends and moves away from the measurement part 4, it raises automatically. As a result, the lifting stroke on the measuring part 4 of the increased device chuck 21 can be made smaller than before by arranging the measuring part 4 on the bottom face of the thermostat 2. For example, the 40 mm in the conventional example shown in FIG. 4 is 20 mm in the present example shown in FIG. 1, and the index time is significantly shortened to 0.8 seconds in the present example compared to about 1.5 seconds in the prior art. Can significantly improve throughput.

Claims (1)

A rotor chuck having a rotation axis, wherein three arms protrude radially from the rotation axis at an angular interval of about 120 °, a device chuck freely attached to a vertical cross section of each arm of the rotary arm, and a peripheral surface A flat half-ring cam having this inverted triangular shape, and the two sides of the inverted triangular vertex serving as a cam action portion, and a rotational movement freely attached to the device chucks that follow the cam action portion of the cam. A cam follower, and the cam is attached to the housing of the handler concentrically with the rotating shaft so that the inverted triangular vertex of the cam is disposed at a predetermined position above the measuring unit, and the device under test is attached to the device chuck. When returning the device under test from the soak stage to the measuring section for testing the device under test, The device chuck is gradually lowered and the device chuck is configured to gradually raise the device chuck when the device under test is transferred from the measuring section to the egg stage, and the egg stage for carrying out the measuring stage and the test stage device. A handler which can be placed at a lower position.