JPS6436040A - Parametric inspection apparatus for semiconductor device - Google Patents
Parametric inspection apparatus for semiconductor deviceInfo
- Publication number
- JPS6436040A JPS6436040A JP62191674A JP19167487A JPS6436040A JP S6436040 A JPS6436040 A JP S6436040A JP 62191674 A JP62191674 A JP 62191674A JP 19167487 A JP19167487 A JP 19167487A JP S6436040 A JPS6436040 A JP S6436040A
- Authority
- JP
- Japan
- Prior art keywords
- measuring
- criterion
- judgement
- item
- measuring item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Or Calibration Of Command Recording Devices (AREA)
Abstract
PURPOSE:To enhance the productivity by a method wherein, if a measured result contains a measuring item other than a criterion for judgement in a process to measure a number of measuring items for each lot under an identical measuring condition, the measuring item other than the criterion for judgement is measured again for all lots. CONSTITUTION:A tip part of a probe of a probing device 2 is brought into contact with an electrode pad of a test element chip formed on a semiconductor wafer; an inspection signal of a prescribed measuring item is supplied to a test element; a measuring part 1a to receive the signal is installed; a judgement part 1b is installed in order to compare a measured result by the measuring part 1a with a criterion for judgement for each predetermined measuring item and to detect the existence of the measuring item indicating a measured value other than the criterion. A memory 1c is installed in order to store a judged result by the judgement part 1b as a data for each measuring item; a data analysis part 1d is installed in order to examine whether any measuring item other than the criterion is to be inspected again or not. Accordingly, it is possible to appropriately change or correct a manufacturing process on the basis of an analyzed result.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62191674A JP2519064B2 (en) | 1987-07-31 | 1987-07-31 | Parametric inspection method for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62191674A JP2519064B2 (en) | 1987-07-31 | 1987-07-31 | Parametric inspection method for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6436040A true JPS6436040A (en) | 1989-02-07 |
JP2519064B2 JP2519064B2 (en) | 1996-07-31 |
Family
ID=16278569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62191674A Expired - Lifetime JP2519064B2 (en) | 1987-07-31 | 1987-07-31 | Parametric inspection method for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519064B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04242122A (en) * | 1991-01-14 | 1992-08-28 | Hitachi Ltd | Safety-test supporting apparatus |
JP2003207542A (en) * | 2001-11-15 | 2003-07-25 | Agilent Technol Inc | Electronic test system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53140567A (en) * | 1977-05-13 | 1978-12-07 | Hitachi Ltd | Inspection method and device for electronic parts |
JPS62154639A (en) * | 1985-12-26 | 1987-07-09 | Sharp Corp | Semiconductor selector |
-
1987
- 1987-07-31 JP JP62191674A patent/JP2519064B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53140567A (en) * | 1977-05-13 | 1978-12-07 | Hitachi Ltd | Inspection method and device for electronic parts |
JPS62154639A (en) * | 1985-12-26 | 1987-07-09 | Sharp Corp | Semiconductor selector |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04242122A (en) * | 1991-01-14 | 1992-08-28 | Hitachi Ltd | Safety-test supporting apparatus |
JP2003207542A (en) * | 2001-11-15 | 2003-07-25 | Agilent Technol Inc | Electronic test system |
Also Published As
Publication number | Publication date |
---|---|
JP2519064B2 (en) | 1996-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080517 Year of fee payment: 12 |