JPS6436040A - Parametric inspection apparatus for semiconductor device - Google Patents

Parametric inspection apparatus for semiconductor device

Info

Publication number
JPS6436040A
JPS6436040A JP62191674A JP19167487A JPS6436040A JP S6436040 A JPS6436040 A JP S6436040A JP 62191674 A JP62191674 A JP 62191674A JP 19167487 A JP19167487 A JP 19167487A JP S6436040 A JPS6436040 A JP S6436040A
Authority
JP
Japan
Prior art keywords
measuring
criterion
judgement
item
measuring item
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62191674A
Other languages
Japanese (ja)
Other versions
JP2519064B2 (en
Inventor
Jun Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP62191674A priority Critical patent/JP2519064B2/en
Publication of JPS6436040A publication Critical patent/JPS6436040A/en
Application granted granted Critical
Publication of JP2519064B2 publication Critical patent/JP2519064B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enhance the productivity by a method wherein, if a measured result contains a measuring item other than a criterion for judgement in a process to measure a number of measuring items for each lot under an identical measuring condition, the measuring item other than the criterion for judgement is measured again for all lots. CONSTITUTION:A tip part of a probe of a probing device 2 is brought into contact with an electrode pad of a test element chip formed on a semiconductor wafer; an inspection signal of a prescribed measuring item is supplied to a test element; a measuring part 1a to receive the signal is installed; a judgement part 1b is installed in order to compare a measured result by the measuring part 1a with a criterion for judgement for each predetermined measuring item and to detect the existence of the measuring item indicating a measured value other than the criterion. A memory 1c is installed in order to store a judged result by the judgement part 1b as a data for each measuring item; a data analysis part 1d is installed in order to examine whether any measuring item other than the criterion is to be inspected again or not. Accordingly, it is possible to appropriately change or correct a manufacturing process on the basis of an analyzed result.
JP62191674A 1987-07-31 1987-07-31 Parametric inspection method for semiconductor devices Expired - Lifetime JP2519064B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62191674A JP2519064B2 (en) 1987-07-31 1987-07-31 Parametric inspection method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62191674A JP2519064B2 (en) 1987-07-31 1987-07-31 Parametric inspection method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS6436040A true JPS6436040A (en) 1989-02-07
JP2519064B2 JP2519064B2 (en) 1996-07-31

Family

ID=16278569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62191674A Expired - Lifetime JP2519064B2 (en) 1987-07-31 1987-07-31 Parametric inspection method for semiconductor devices

Country Status (1)

Country Link
JP (1) JP2519064B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242122A (en) * 1991-01-14 1992-08-28 Hitachi Ltd Safety-test supporting apparatus
JP2003207542A (en) * 2001-11-15 2003-07-25 Agilent Technol Inc Electronic test system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140567A (en) * 1977-05-13 1978-12-07 Hitachi Ltd Inspection method and device for electronic parts
JPS62154639A (en) * 1985-12-26 1987-07-09 Sharp Corp Semiconductor selector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53140567A (en) * 1977-05-13 1978-12-07 Hitachi Ltd Inspection method and device for electronic parts
JPS62154639A (en) * 1985-12-26 1987-07-09 Sharp Corp Semiconductor selector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04242122A (en) * 1991-01-14 1992-08-28 Hitachi Ltd Safety-test supporting apparatus
JP2003207542A (en) * 2001-11-15 2003-07-25 Agilent Technol Inc Electronic test system

Also Published As

Publication number Publication date
JP2519064B2 (en) 1996-07-31

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