JPH0352247A - Semiconductor testing apparatus - Google Patents

Semiconductor testing apparatus

Info

Publication number
JPH0352247A
JPH0352247A JP18806689A JP18806689A JPH0352247A JP H0352247 A JPH0352247 A JP H0352247A JP 18806689 A JP18806689 A JP 18806689A JP 18806689 A JP18806689 A JP 18806689A JP H0352247 A JPH0352247 A JP H0352247A
Authority
JP
Japan
Prior art keywords
standard
distribution
judged
deviation
defective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18806689A
Other languages
Japanese (ja)
Inventor
Takashi Mitsuhata
Original Assignee
Seiko Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instr Inc filed Critical Seiko Instr Inc
Priority to JP18806689A priority Critical patent/JPH0352247A/en
Publication of JPH0352247A publication Critical patent/JPH0352247A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make it possible to judge a sample outside the distribution as a defective product by determining a standard based on deviation, and performing judgment.
CONSTITUTION: Good products and defective products are judged based on a constant standard 9 with respect to the measured values of the tests of electric characteristics. Thereafter, a deviation is obtained from the measured values. A standard 12 is obtained from the deviation by computation. The good products and the defective products are judged again based on the standard from deviation 12. Therefore, when the distribution of the measured values of the samples with respect to the constant standard 9 is a distribution 10, the sample 11 which is located at a position outside the distribution 10 is judged as the defective product by the judgment with the standard 12. In this way, the sample which is located at the position outside the distribution and which has problems in comparison with the other samples is not judged as an acceptable product.
COPYRIGHT: (C)1991,JPO&Japio
JP18806689A 1989-07-20 1989-07-20 Semiconductor testing apparatus Pending JPH0352247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18806689A JPH0352247A (en) 1989-07-20 1989-07-20 Semiconductor testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18806689A JPH0352247A (en) 1989-07-20 1989-07-20 Semiconductor testing apparatus

Publications (1)

Publication Number Publication Date
JPH0352247A true JPH0352247A (en) 1991-03-06

Family

ID=16217110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18806689A Pending JPH0352247A (en) 1989-07-20 1989-07-20 Semiconductor testing apparatus

Country Status (1)

Country Link
JP (1) JPH0352247A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007113968A1 (en) * 2006-03-31 2007-10-11 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit testing method and information recording medium
JP2008002900A (en) * 2006-06-21 2008-01-10 Nec Electronics Corp Screening method, system, and program for semiconductor devices
JP2009188418A (en) * 2006-02-17 2009-08-20 Test Advantage Inc Method for data analysis and equipment
WO2010137488A1 (en) * 2009-05-29 2010-12-02 株式会社村田製作所 Product inspection device, product inspection method, and computer program
JP2014063914A (en) * 2012-09-21 2014-04-10 Renesas Electronics Corp Semiconductor inspection device, semiconductor inspection method and program

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009188418A (en) * 2006-02-17 2009-08-20 Test Advantage Inc Method for data analysis and equipment
WO2007113968A1 (en) * 2006-03-31 2007-10-11 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit testing method and information recording medium
US7719301B2 (en) 2006-03-31 2010-05-18 Panasonic Corporation Testing method of semiconductor integrated circuit and information recording medium
JP2008002900A (en) * 2006-06-21 2008-01-10 Nec Electronics Corp Screening method, system, and program for semiconductor devices
WO2010137488A1 (en) * 2009-05-29 2010-12-02 株式会社村田製作所 Product inspection device, product inspection method, and computer program
CN102449645A (en) * 2009-05-29 2012-05-09 株式会社村田制作所 Product inspection device, product inspection method, and computer program
JPWO2010137488A1 (en) * 2009-05-29 2012-11-12 株式会社村田製作所 Product inspection device, product inspection method, and computer program
JP5477382B2 (en) * 2009-05-29 2014-04-23 株式会社村田製作所 Product inspection device, product inspection method, and computer program
US9037436B2 (en) 2009-05-29 2015-05-19 Murata Manufacturing Co., Ltd. Product inspection device, product inspection method, and computer program
US9870343B2 (en) 2009-05-29 2018-01-16 Murata Manufacturing Co., Ltd. Product inspection device, product inspection method, and computer program
JP2014063914A (en) * 2012-09-21 2014-04-10 Renesas Electronics Corp Semiconductor inspection device, semiconductor inspection method and program

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