JPS5698835A - Method of recognition of semiconductor pellet - Google Patents
Method of recognition of semiconductor pelletInfo
- Publication number
- JPS5698835A JPS5698835A JP132280A JP132280A JPS5698835A JP S5698835 A JPS5698835 A JP S5698835A JP 132280 A JP132280 A JP 132280A JP 132280 A JP132280 A JP 132280A JP S5698835 A JPS5698835 A JP S5698835A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- detection
- external shape
- corners
- defect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To intend to shorten the recognition time of a pellet of a whole wafer by abridging the pellet detection which can be judged to be defect from the disorder of the external shape. CONSTITUTION:A pellet 2 which is projected to a TV monitor 4 which partitions to 4 corners S1-S4 and the intermediated portion S5 by parallel lines vertically crossed with parallel lines, and performs a scanning detection by binary signals independently and respectively. When the output signals at four corners are compared with the standard value, the defects at corners can be detected and the position of the pellet on the wafer can be also detected from the judgement of the external shape. In case of the defect of the external shape, an XY stand is carried at high velocity and a pellet having a good external shape is carried on by jumping the pellet having the external defect (2a-2e). On the other hand, the detection of a failure mark is performed approximately at the same time. Accordingly, since the detection can be dispensed with only the scanning in the intermediate potion S2, the necessary detection time is shortened. Thus, the necessary time for detection of the whole wafer can be shortened.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP132280A JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP132280A JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5698835A true JPS5698835A (en) | 1981-08-08 |
JPS634348B2 JPS634348B2 (en) | 1988-01-28 |
Family
ID=11498250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP132280A Granted JPS5698835A (en) | 1980-01-11 | 1980-01-11 | Method of recognition of semiconductor pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5698835A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59211239A (en) * | 1983-05-17 | 1984-11-30 | Nec Corp | Semiconductor pellet arraying machine |
JPS6085520A (en) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | Pattern inspecting method |
US5881888A (en) * | 1995-10-23 | 1999-03-16 | Kabushiki Kaisha Shinkawa | Wafer die pick-up method |
US6628818B1 (en) * | 1999-03-31 | 2003-09-30 | Nec Machinery Corporation | Method for recognizing images of fine work pieces and pickup apparatus employing the method |
-
1980
- 1980-01-11 JP JP132280A patent/JPS5698835A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59211239A (en) * | 1983-05-17 | 1984-11-30 | Nec Corp | Semiconductor pellet arraying machine |
JPS6085520A (en) * | 1983-10-17 | 1985-05-15 | Hitachi Ltd | Pattern inspecting method |
US5881888A (en) * | 1995-10-23 | 1999-03-16 | Kabushiki Kaisha Shinkawa | Wafer die pick-up method |
US6628818B1 (en) * | 1999-03-31 | 2003-09-30 | Nec Machinery Corporation | Method for recognizing images of fine work pieces and pickup apparatus employing the method |
Also Published As
Publication number | Publication date |
---|---|
JPS634348B2 (en) | 1988-01-28 |
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