JPS5698835A - Method of recognition of semiconductor pellet - Google Patents

Method of recognition of semiconductor pellet

Info

Publication number
JPS5698835A
JPS5698835A JP132280A JP132280A JPS5698835A JP S5698835 A JPS5698835 A JP S5698835A JP 132280 A JP132280 A JP 132280A JP 132280 A JP132280 A JP 132280A JP S5698835 A JPS5698835 A JP S5698835A
Authority
JP
Japan
Prior art keywords
pellet
detection
external shape
corners
defect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP132280A
Other languages
Japanese (ja)
Other versions
JPS634348B2 (en
Inventor
Masuzo Ikumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP132280A priority Critical patent/JPS5698835A/en
Publication of JPS5698835A publication Critical patent/JPS5698835A/en
Publication of JPS634348B2 publication Critical patent/JPS634348B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To intend to shorten the recognition time of a pellet of a whole wafer by abridging the pellet detection which can be judged to be defect from the disorder of the external shape. CONSTITUTION:A pellet 2 which is projected to a TV monitor 4 which partitions to 4 corners S1-S4 and the intermediated portion S5 by parallel lines vertically crossed with parallel lines, and performs a scanning detection by binary signals independently and respectively. When the output signals at four corners are compared with the standard value, the defects at corners can be detected and the position of the pellet on the wafer can be also detected from the judgement of the external shape. In case of the defect of the external shape, an XY stand is carried at high velocity and a pellet having a good external shape is carried on by jumping the pellet having the external defect (2a-2e). On the other hand, the detection of a failure mark is performed approximately at the same time. Accordingly, since the detection can be dispensed with only the scanning in the intermediate potion S2, the necessary detection time is shortened. Thus, the necessary time for detection of the whole wafer can be shortened.
JP132280A 1980-01-11 1980-01-11 Method of recognition of semiconductor pellet Granted JPS5698835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP132280A JPS5698835A (en) 1980-01-11 1980-01-11 Method of recognition of semiconductor pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP132280A JPS5698835A (en) 1980-01-11 1980-01-11 Method of recognition of semiconductor pellet

Publications (2)

Publication Number Publication Date
JPS5698835A true JPS5698835A (en) 1981-08-08
JPS634348B2 JPS634348B2 (en) 1988-01-28

Family

ID=11498250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP132280A Granted JPS5698835A (en) 1980-01-11 1980-01-11 Method of recognition of semiconductor pellet

Country Status (1)

Country Link
JP (1) JPS5698835A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211239A (en) * 1983-05-17 1984-11-30 Nec Corp Semiconductor pellet arraying machine
JPS6085520A (en) * 1983-10-17 1985-05-15 Hitachi Ltd Pattern inspecting method
US5881888A (en) * 1995-10-23 1999-03-16 Kabushiki Kaisha Shinkawa Wafer die pick-up method
US6628818B1 (en) * 1999-03-31 2003-09-30 Nec Machinery Corporation Method for recognizing images of fine work pieces and pickup apparatus employing the method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211239A (en) * 1983-05-17 1984-11-30 Nec Corp Semiconductor pellet arraying machine
JPS6085520A (en) * 1983-10-17 1985-05-15 Hitachi Ltd Pattern inspecting method
US5881888A (en) * 1995-10-23 1999-03-16 Kabushiki Kaisha Shinkawa Wafer die pick-up method
US6628818B1 (en) * 1999-03-31 2003-09-30 Nec Machinery Corporation Method for recognizing images of fine work pieces and pickup apparatus employing the method

Also Published As

Publication number Publication date
JPS634348B2 (en) 1988-01-28

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