JPS59139640A - Measuring device for integrated circuit - Google Patents

Measuring device for integrated circuit

Info

Publication number
JPS59139640A
JPS59139640A JP1432583A JP1432583A JPS59139640A JP S59139640 A JPS59139640 A JP S59139640A JP 1432583 A JP1432583 A JP 1432583A JP 1432583 A JP1432583 A JP 1432583A JP S59139640 A JPS59139640 A JP S59139640A
Authority
JP
Japan
Prior art keywords
measurement
program
measuring
wafer
editing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1432583A
Other languages
Japanese (ja)
Inventor
Nobuo Arai
Masao Kishibe
Kazuhiko Matsuda
Original Assignee
Ando Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ando Electric Co Ltd filed Critical Ando Electric Co Ltd
Priority to JP1432583A priority Critical patent/JPS59139640A/en
Publication of JPS59139640A publication Critical patent/JPS59139640A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Abstract

PURPOSE:To measure an element at high speed by editing a program for measurement and a test pattern in response to positional coordinates on a wafer. CONSTITUTION:A measurement start signal is transmitted over a measurement starting control section 32 in a tester 3 from a measurement starting signal generating section 22 in a prober 2. Consequently, a positional coordinate signal from a positional coordinate generating section 21 in the prober 2 is read by a positional coordinate recognizing section 31 in the tester 3. A measurement program editing section 35 in the tester 3 edits a program for measuring an integrated circuit element to be measured in a wafer 1 through corresponding with an editing table 36. When there is no program edited by the editing table 36 in high-speed processing containing sections 37, 38, a program for measurement and a test patter from a large capacitance containing section 39 are transferred to the high-speed processing containing sections 37, 38. A probe card 24 in the prober 2 is brought into contact with the integrated circuit element on the wafer 1, and a program for measurement from a measuring section 34 is transferred to the element 1 on the wafer 1 through the probe card 24. When measurement is completed, the measuring section 34 transmits the results of measurement over a measurement-result processing section 33.
JP1432583A 1983-01-31 1983-01-31 Measuring device for integrated circuit Pending JPS59139640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1432583A JPS59139640A (en) 1983-01-31 1983-01-31 Measuring device for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1432583A JPS59139640A (en) 1983-01-31 1983-01-31 Measuring device for integrated circuit

Publications (1)

Publication Number Publication Date
JPS59139640A true JPS59139640A (en) 1984-08-10

Family

ID=11857917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1432583A Pending JPS59139640A (en) 1983-01-31 1983-01-31 Measuring device for integrated circuit

Country Status (1)

Country Link
JP (1) JPS59139640A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027538A (en) * 1988-06-27 1990-01-11 Tokyo Electron Ltd Inspection device
JP2014085180A (en) * 2012-10-22 2014-05-12 Murata Mfg Co Ltd Inspection device, inspection method, and inspection program of electronic component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827501A (en) * 1971-08-13 1973-04-11
JPS4991658A (en) * 1973-01-05 1974-09-02
JPS568836A (en) * 1979-07-03 1981-01-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacturing system for semiconductor device
JPS5690269A (en) * 1979-12-25 1981-07-22 Toshiba Corp Measuring method for semiconductor integrated circuit
JPS5727042A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Inspecting method for wafer
JPS582039A (en) * 1981-06-25 1983-01-07 Fujitsu Ltd Test method for semiconductor substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4827501A (en) * 1971-08-13 1973-04-11
JPS4991658A (en) * 1973-01-05 1974-09-02
JPS568836A (en) * 1979-07-03 1981-01-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacturing system for semiconductor device
JPS5690269A (en) * 1979-12-25 1981-07-22 Toshiba Corp Measuring method for semiconductor integrated circuit
JPS5727042A (en) * 1980-07-25 1982-02-13 Hitachi Ltd Inspecting method for wafer
JPS582039A (en) * 1981-06-25 1983-01-07 Fujitsu Ltd Test method for semiconductor substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027538A (en) * 1988-06-27 1990-01-11 Tokyo Electron Ltd Inspection device
JP2014085180A (en) * 2012-10-22 2014-05-12 Murata Mfg Co Ltd Inspection device, inspection method, and inspection program of electronic component

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