JPS60261685A - 多層構造に対する貫通接触孔形成装置 - Google Patents

多層構造に対する貫通接触孔形成装置

Info

Publication number
JPS60261685A
JPS60261685A JP60103632A JP10363285A JPS60261685A JP S60261685 A JPS60261685 A JP S60261685A JP 60103632 A JP60103632 A JP 60103632A JP 10363285 A JP10363285 A JP 10363285A JP S60261685 A JPS60261685 A JP S60261685A
Authority
JP
Japan
Prior art keywords
layer
substrate
lower layer
multilayer structure
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60103632A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0371236B2 (enExample
Inventor
フリードリツヒ、バツハマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS60261685A publication Critical patent/JPS60261685A/ja
Publication of JPH0371236B2 publication Critical patent/JPH0371236B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP60103632A 1984-05-18 1985-05-15 多層構造に対する貫通接触孔形成装置 Granted JPS60261685A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3418593 1984-05-18
DE3418593.3 1984-05-18

Publications (2)

Publication Number Publication Date
JPS60261685A true JPS60261685A (ja) 1985-12-24
JPH0371236B2 JPH0371236B2 (enExample) 1991-11-12

Family

ID=6236273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60103632A Granted JPS60261685A (ja) 1984-05-18 1985-05-15 多層構造に対する貫通接触孔形成装置

Country Status (3)

Country Link
US (1) US4644130A (enExample)
EP (1) EP0164564A1 (enExample)
JP (1) JPS60261685A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02143492A (ja) * 1988-11-24 1990-06-01 Ibiden Co Ltd 高密度多層プリント配線板の製造方法
JPH03502075A (ja) * 1988-08-12 1991-05-16 ロジヤース　コーポレイシヨン フルオロ重合体材料をレーザー穿孔する方法

Families Citing this family (59)

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EP0228694A3 (en) * 1985-12-30 1989-10-04 E.I. Du Pont De Nemours And Company Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer
US4877480A (en) * 1986-08-08 1989-10-31 Digital Equipment Corporation Lithographic technique using laser for fabrication of electronic components and the like
US5061840A (en) * 1986-10-14 1991-10-29 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5179262A (en) * 1986-10-14 1993-01-12 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US5053171A (en) * 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
US4985985A (en) * 1987-07-01 1991-01-22 Digital Equipment Corporation Solenoidal thin film read/write head for computer mass storage device and method of making same
US4972287A (en) * 1987-07-01 1990-11-20 Digital Equipment Corp. Having a solenoidal energizing coil
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
DE3728283A1 (de) * 1987-08-25 1989-03-09 Flachglas Ag Verfahren und vorrichtung zum zuschneiden zur herstellung von verbundsicherheitsglasscheiben bestimmter verbundfolien
JPH01184861A (ja) * 1988-01-13 1989-07-24 Toshiba Corp レーザ光によるトリミング方法
US5221422A (en) * 1988-06-06 1993-06-22 Digital Equipment Corporation Lithographic technique using laser scanning for fabrication of electronic components and the like
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
FR2637151A1 (fr) * 1988-09-29 1990-03-30 Commissariat Energie Atomique Procede de realisation de connexions electriques a travers un substrat
JPH02102071A (ja) * 1988-10-11 1990-04-13 Olympus Optical Co Ltd イオン流記録ヘッドの製造方法
GB8825219D0 (en) * 1988-10-27 1988-11-30 Mbm Technology Ltd Fine featured electrical circuits
JPH02198193A (ja) * 1989-01-27 1990-08-06 Hitachi Seiko Ltd プリント基板の穴明け方法
JPH0734508B2 (ja) * 1989-04-10 1995-04-12 三菱電機株式会社 多層配線板
US4961259A (en) * 1989-06-16 1990-10-09 Hughes Aircraft Company Method of forming an interconnection by an excimer laser
JP2501473B2 (ja) * 1989-10-05 1996-05-29 シャープ株式会社 配線基板の製造方法
DE4002039A1 (de) * 1990-01-24 1991-07-25 Pelz Ernst Erpe Vertrieb Verfahren zum materialabhebenden bearbeiten von holzwerkstuecken sowie danach hergestelltes holzwerkstueck
US5118299A (en) * 1990-05-07 1992-06-02 International Business Machines Corporation Cone electrical contact
US5105537A (en) * 1990-10-12 1992-04-21 International Business Machines Corporation Method for making a detachable electrical contact
DE4108155A1 (de) * 1991-03-14 1992-09-17 Reinshagen Kabelwerk Gmbh Verfahren zur herstellung von mindestens zweilagigen schaltungen mit durchkontaktierung
US5221426A (en) * 1991-11-29 1993-06-22 Motorola Inc. Laser etch-back process for forming a metal feature on a non-metal substrate
JP3290495B2 (ja) * 1992-04-21 2002-06-10 キヤノン株式会社 インクジェット記録ヘッドの製造方法
DE4228274C2 (de) * 1992-08-26 1996-02-29 Siemens Ag Verfahren zur Kontaktierung von auf einem Träger angeordneten elektronischen oder optoelektronischen Bauelementen
EP0677985B1 (en) * 1994-04-14 1999-05-26 Hewlett-Packard GmbH Method of manufacturing printed circuit boards
US5536579A (en) * 1994-06-02 1996-07-16 International Business Machines Corporation Design of high density structures with laser etch stop
JPH07336055A (ja) * 1994-06-06 1995-12-22 Hitachi Seiko Ltd レーザ加工方法及びその装置
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
GB9420182D0 (en) * 1994-10-06 1994-11-23 Int Computers Ltd Printed circuit manufacture
US6175084B1 (en) 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
JP3112059B2 (ja) * 1995-07-05 2000-11-27 株式会社日立製作所 薄膜多層配線基板及びその製法
US5826330A (en) * 1995-12-28 1998-10-27 Hitachi Aic Inc. Method of manufacturing multilayer printed wiring board
US6043453A (en) * 1996-02-23 2000-03-28 Hitachi Via Mechanics Ltd. Apparatus for laser processing with a mechanical cutter
DE19620095B4 (de) * 1996-05-18 2006-07-06 Tamm, Wilhelm, Dipl.-Ing. (FH) Verfahren zur Herstellung von Leiterplatten
US7062845B2 (en) 1996-06-05 2006-06-20 Laservia Corporation Conveyorized blind microvia laser drilling system
US6631558B2 (en) 1996-06-05 2003-10-14 Laservia Corporation Blind via laser drilling system
WO1997046349A1 (en) 1996-06-05 1997-12-11 Burgess Larry W Blind via laser drilling system
US5827386A (en) * 1996-06-14 1998-10-27 International Business Machines Corporation Method for forming a multi-layered circuitized substrate member
JPH10242617A (ja) 1997-02-28 1998-09-11 Murata Mfg Co Ltd セラミックグリーンシートの加工方法及びレーザ加工装置
FR2766654B1 (fr) * 1997-07-28 2005-05-20 Matsushita Electric Works Ltd Procede de fabrication d'une carte de circuit imprime
KR100336829B1 (ko) * 1998-04-10 2002-05-16 모기 쥰이찌 다층 배선 기판의 제조 방법
US6057180A (en) * 1998-06-05 2000-05-02 Electro Scientific Industries, Inc. Method of severing electrically conductive links with ultraviolet laser output
JP2000031640A (ja) * 1998-07-08 2000-01-28 Ibiden Co Ltd プリント配線板及びその製造方法
CN1344483A (zh) 1999-03-16 2002-04-10 西门子公司 在双侧设有金属层的电绝缘基板材料上引入接触孔的方法
US6354000B1 (en) 1999-05-12 2002-03-12 Microconnex Corp. Method of creating an electrical interconnect device bearing an array of electrical contact pads
ATE233985T1 (de) 1999-09-30 2003-03-15 Siemens Ag Verfahren und einrichtung zum laserbohren von laminaten
DE50002499D1 (de) 1999-09-30 2003-07-10 Siemens Ag Verfahren und einrichtung zum laserbohren von organischen materialien
DE10145184B4 (de) * 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
US20040112881A1 (en) * 2002-04-11 2004-06-17 Bloemeke Stephen Roger Circle laser trepanning
DE10219388A1 (de) * 2002-04-30 2003-11-20 Siemens Ag Verfahren zur Erzeugung einer Grabenstruktur in einem Polymer-Substrat
DE10249868B3 (de) * 2002-10-25 2004-04-29 Siemens Ag Verfahren zum Bohren von Löchern in einem aus Polymermaterial mit Glasfaserverstärkung gebildeten Substrat
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
CN112788850A (zh) * 2020-12-24 2021-05-11 苏州禾弘电子科技有限公司 一种电路板盲孔梯形形状制造方法
EP4190945A1 (en) * 2021-12-01 2023-06-07 Rohde & Schwarz GmbH & Co. KG Method of manufacturing a metal-coated workpiece, metal-coated workpiece, and manufacturing system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591083A (ja) * 1982-06-28 1984-01-06 Hitachi Ltd エネルギビ−ムによる穴あけ加工法
JPS5927791A (ja) * 1982-08-06 1984-02-14 Hitachi Ltd 複合材料穴あけ方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4030190A (en) * 1976-03-30 1977-06-21 International Business Machines Corporation Method for forming a multilayer printed circuit board
US4328410A (en) * 1978-08-24 1982-05-04 Slivinsky Sandra H Laser skiving system
US4370175A (en) * 1979-12-03 1983-01-25 Bernard B. Katz Method of annealing implanted semiconductors by lasers
US4414059A (en) * 1982-12-09 1983-11-08 International Business Machines Corporation Far UV patterning of resist materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS591083A (ja) * 1982-06-28 1984-01-06 Hitachi Ltd エネルギビ−ムによる穴あけ加工法
JPS5927791A (ja) * 1982-08-06 1984-02-14 Hitachi Ltd 複合材料穴あけ方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03502075A (ja) * 1988-08-12 1991-05-16 ロジヤース　コーポレイシヨン フルオロ重合体材料をレーザー穿孔する方法
JPH02143492A (ja) * 1988-11-24 1990-06-01 Ibiden Co Ltd 高密度多層プリント配線板の製造方法

Also Published As

Publication number Publication date
EP0164564A1 (de) 1985-12-18
US4644130A (en) 1987-02-17
JPH0371236B2 (enExample) 1991-11-12

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