CN1344483A - 在双侧设有金属层的电绝缘基板材料上引入接触孔的方法 - Google Patents

在双侧设有金属层的电绝缘基板材料上引入接触孔的方法 Download PDF

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CN1344483A
CN1344483A CN00805159A CN00805159A CN1344483A CN 1344483 A CN1344483 A CN 1344483A CN 00805159 A CN00805159 A CN 00805159A CN 00805159 A CN00805159 A CN 00805159A CN 1344483 A CN1344483 A CN 1344483A
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M·赫尔曼
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Abstract

在至少一个金属层(2)上敷设的抗蚀层(3)用电磁辐射(S)这样地结构化,使之通过刻蚀可以给金属层(2)设置以后的接触孔的孔图案。然后优选地借助于激光束达到在基板材料(1)中引入接触孔。

Description

在双侧设有金属层的电绝缘基板材料上引入接触孔的方法
由EP-A-00 62 300中公知一种生产电路板的方法，在该方法中用一种双侧覆铜的基板材料作为原始材料。在机械地钻通孔之后，通过化学的和后续电镀的金属沉积，在孔壁上和覆铜层上敷设一个镀铜层。接着在全平面上敷设抗蚀层，然后通过激光束选择性地重新将其去掉，从而通过刻蚀掉如此暴露出的铜层构成所期望的线路图案。
在由US-A-3 265 546公知的生产电路板的方法中，首先把以后的接触孔的孔图案借助于光刻技术转移到铜覆层上，然后通过后续的刻蚀敷设在覆铜层上。然后通过化学刻蚀去掉覆铜层的孔区暴露的基板材料以制成接触孔。
在一个类似地由EP-A-01 64 564公知的生产电路板的或者生产多层电路板的中间层的方法中，把以后的接触孔的孔图案同样地借助于光刻技术和接着的刻蚀引入覆铜层中。通过把这样结构化的覆铜层用作掩膜，然后把不受保护的基板材料借助于激光束去掉，其中，对面的覆铜层将终止这样的去除。
还有在另一个由CH-A-681758公知的生产电路板或者生产多层电路板的中间层的方法中，把以后的接触孔的孔图案，也借助于光刻技术和后续的刻蚀，敷设在一面的覆铜层中或者敷设在双面的覆铜层中。通过把这样结构化的覆铜层用作抗蚀的孔掩膜，用等离子刻蚀把接触孔引入基板材料中。
还已经公知，通过激光打孔把以后的接触孔的孔图案引入双侧覆铜的基板材料的一侧金属层中或者双侧金属层中。这里借助于UV激光或者IR激光产生直径在毫米范围的孔图案。打孔过程是一个逐个连续的过程，并且在此也涉及相对地高的时间消耗。此外，在激光打孔时必须圆形或者螺线形地去掉多层中的孔的区域中的铜。在激光打直径150微米或者100微米的孔时，每个通孔依赖于所采用的激光要去掉最多5微米的铜。这种去铜还受限于：在去铜时在去铜处上方出现一个等离子区，这个等离子区防碍进一步地引入激光能量。此外，以后的去铜步骤不能够用同样的功率进行，因为不然就会降低在其下的有机基板材料在孔缘上的附着。在例如达17微米的覆铜层中，孔的敷设用四到五个工序达到。
本发明的任务是在一个用于在双侧敷金属层的电绝缘的基板材料上引入接触孔的方法，它快速并且用很小的费用在一个金属层或者在双面金属层中产生孔图案。
本发明的任务通过以下的方法步骤完成：
a)在至少一个金属层上敷设抗蚀层；
b)在以后的接触孔的区域中把抗蚀层用电磁辐射重新去掉；
c)把在步骤(b)中暴露出的金属层的区域刻蚀到基板材料的表面；
d)在基板材料中引入接触孔。
这就是说，在根据本发明的方法中，仿照由EP-A-00 62 300公知的制造印刷电路图案的方案，通过借助于电磁辐射结构化抗蚀层，然后接着刻蚀产生孔图案。这里，通过电磁辐射以较高的速度圆形或者螺旋形地去除以后接触孔的区域中的薄抗蚀层。在后续的选择性刻蚀工艺中，同时地产生孔图案的所有孔，这较逐个连续地打孔显著地节省了很多时间。
本发明方法的优越扩展由从属权利要求说明。
根据权利要求2的安排，在刻蚀过程后把不再需要的抗蚀层完全地去掉。然后可以按照由EP-A-00 62 300公知的方法，采用原先使用的激光装置，进一步处理设有接触孔的基板材料，以制成电路板或者完成中间层。例如可以通过化学的和后续电镀的金属沉积或者通过溅射产生敷设在基板材料上的金属层。然而根据权利要求3，优选地从双侧覆铜的基板材料出发，它可以用很少的费用生产，并且在印刷电路板技术中已经很长时间证明是可靠的。
根据权利要求4，采用金属的抗蚀层使其借助电磁辐射结构化有非常良好的结果。
此外尤其表明，如果根据权利要求5采用锌或者锌铅合金作抗蚀层是特别有利的。这种抗蚀层一方面例如可以用激光容易地结构化，而另一方面在刻蚀时可以保证可靠地保护位于下面的金属层。
根据权利要求6优选地通过无电流的金属沉积敷设金属的抗蚀层，因为这可以用特别经济的方式进行。
根据权利要求7还可以采用有机材料作抗蚀层。这样可以以特别简单的方式根据权利要求8通过电浸涂胶或者通过静电涂层来敷设这种有机抗蚀层。根据权利要求9，优选地通过激光器产生电磁辐射，因为激光束特别适于剥离或者蒸发期望区域中的抗蚀层。根据权利要求10激光束相对于基板材料的运动优选地应可以自由编程，就是说，用激光束快速地进行孔图案的轮廓描绘，而且还特别容易变更。
根据权利要求11可以以简单的方式通过等离子刻蚀在基板材料上引入接触孔。
根据权利要求12借助于激光束在基板材料中引入接触孔，从而可以充分地防止金属层的欠刻蚀。
根据权利要求13的安排是，在基板材料中引入作为由金属层限界的盲孔的接触孔。这样的措施既可以适用于生产电路板，也可以适用于生产多层电路板的中间层。
而根据权利要求14还可以在基板材料中把接触孔敷设成通孔。然而在这个方案中需要在双面金属层上设相应的接触孔的孔图案。
下面详细地说明附图中示出的本发明的实施例。附图中
图1至图6是不同工艺段在双侧设有金属层的基板材料上引入盲孔的非常简化的示意图，而
图7至12是不同工艺段在双侧设有金属层的基板材料上引入通孔的非常简化的示意图。
根据图1从双侧设有金属层2的电绝缘基板材料1开始，在所示的实施例中金属层2涉及的覆铜例如有10微米的厚度。
根据图2，在金属层2上敷设一个抗蚀层3。在所述实施例中，通过无电流的沉积厚度例如是1微米的锌产生抗蚀层3。
沉积抗蚀层3后，根据图3，在以后的接触孔区域400中借助于电磁辐射S去掉上侧的抗蚀层。在图3中通过箭头标示的电磁辐射S在所述的实施例中通过Nd：YAG激光器产生。此时用扫描的方法进行激光去除，其中相应的孔图形的区域400例如直径是100微米。
根据图3通过选择地激光去除抗蚀层3暴露的上面金属层2的区域，然后根据图4刻蚀至基板材料1的表面，其中为此可以使用在刻蚀技术中常规的刻蚀液。在刻蚀过程中在金属层2中引入的孔在图3中通过用401标示的区域标明。
根据图5在结构化上面金属层2之后，完全地剥除抗蚀层3。
在剥除抗蚀层3后，再根据图6在基板材料1中引入用4标示的接触孔。在所示的实施例中，借助于激光束产生以盲孔构成的接触孔4，在图4中用箭头LS标示激光束。此外，根据由EP-A-0 164 564公知的方法，结构化的上面的金属层2起掩膜的作用，而下面的金属层终止用准分子激光进行的基板材料去除作业。
图7至图12所示的方案中，图7和图8相应于上面已经说明的图1和图2。
根据图9不论是上侧的还是下侧的抗蚀层3，在以后的接触孔区域400内，借助于电磁辐射S重新去除。然后根据图10把这样暴露的金属层2的区域，在上侧和下侧刻蚀到基板材料1的表面。
在从图11可清楚看到的抗蚀层3的剥离以后，根据图12，在基板材料中引入构成为通孔的接触孔40。这里还是借助于激光束去除基板材料以构成接触孔40，激光束在图12中通过箭头LS标示。

Claims (14)

1.用于在双侧设有金属层(2)的电绝缘的基板材料(1)中，引入接触孔(4；40)的方法，具有下述的方法步骤：
a)在至少一个金属层(2)上敷设抗蚀层(3)；
b)在以后的接触孔(4；40)的区域中把抗蚀层(3)用电磁辐射(S)重新去掉；
c)把在步骤b)中暴露出的金属层(2)的区域刻蚀到基板材料(1)的表面；
d)在基板材料(1)中引入接触孔(4；40)。
2.根据权利要求1所述的方法，其特征在于，在步骤c)进行的刻蚀之后，完全地去除抗蚀层(3)。
3.根据权利要求1或2所述的方法，其特征在于，从双侧覆铜的基板材料(1)开始。
4.根据以上权利要求之一所述的方法，其特征在于，采用一种金属的抗蚀层(3)。
5.根据权利要求4所述的方法，其特征在于，用锌或者锌铅合金作抗蚀层(3)。
6.根据权利要求4或者5所述的方法，其特征在于，通过无电流的金属沉积敷设抗蚀层(3)。
7.根据权利要求1至3之一所述的方法，其特征在于，用有机材料作抗蚀层(3)。
8.根据权利要求7所述的方法，其特征在于，通过电浸涂胶或者通过静电涂层敷设抗蚀层(3)。
9.根据以上权利要求之一所述的方法，其特征在于，电磁辐射(S)通过激光器产生。
10.根据权利要求9所述的方法，其特征在于，激光束相对于基板材料(1)的运动可以自由编程。
11.根据以上权利要求之一所述的方法，其特征在于，在步骤d)中通过等离子刻蚀在基板材料(1)中引入接触孔(4；40)。
12.根据权利要求1至10之一所述的方法，其特征在于，在步骤d)中通过激光束(LS)在基板材料(1)中引入接触孔。
13.根据以上权利要求之一所述的方法，其特征在于，在步骤d)中的接触孔(4)作为用金属层(2)限制的盲孔引入基板材料(1)中。
14.根据权利要求1至12之一所述的方法，其特征在于，在步骤d)中的接触孔(40)作为通孔引入基板材料(1)中。
CN00805159A 1999-03-16 2000-03-16 在双侧设有金属层的电绝缘基板材料上引入接触孔的方法 Pending CN1344483A (zh)

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