JPH11330666A5 - - Google Patents

Info

Publication number
JPH11330666A5
JPH11330666A5 JP1998132446A JP13244698A JPH11330666A5 JP H11330666 A5 JPH11330666 A5 JP H11330666A5 JP 1998132446 A JP1998132446 A JP 1998132446A JP 13244698 A JP13244698 A JP 13244698A JP H11330666 A5 JPH11330666 A5 JP H11330666A5
Authority
JP
Japan
Prior art keywords
affinity
fluid
thin film
base
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998132446A
Other languages
English (en)
Japanese (ja)
Other versions
JP3606047B2 (ja
JPH11330666A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP13244698A external-priority patent/JP3606047B2/ja
Priority to JP13244698A priority Critical patent/JP3606047B2/ja
Priority to PCT/JP1999/002524 priority patent/WO1999059386A1/ja
Priority to KR1020007000370A priority patent/KR100597015B1/ko
Priority to EP99919593A priority patent/EP1011298B1/en
Priority to CNB99801138XA priority patent/CN1247054C/zh
Priority to DE69939420T priority patent/DE69939420D1/de
Priority to CNA2005100676068A priority patent/CN1697598A/zh
Publication of JPH11330666A publication Critical patent/JPH11330666A/ja
Priority to US09/630,444 priority patent/US6733868B1/en
Priority to US10/796,056 priority patent/US20040169004A1/en
Publication of JP3606047B2 publication Critical patent/JP3606047B2/ja
Application granted granted Critical
Publication of JPH11330666A5 publication Critical patent/JPH11330666A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP13244698A 1998-05-14 1998-05-14 基板の製造方法 Expired - Fee Related JP3606047B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP13244698A JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法
DE69939420T DE69939420D1 (de) 1998-05-14 1999-05-14 Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats
CNA2005100676068A CN1697598A (zh) 1998-05-14 1999-05-14 用于形成特定图形的衬底及其制造方法
KR1020007000370A KR100597015B1 (ko) 1998-05-14 1999-05-14 특정 패턴 형성용 기판, 박막 형성 기판 및 기판의 제조 방법
EP99919593A EP1011298B1 (en) 1998-05-14 1999-05-14 Substrate for formation of special pattern, and method of manufacture of substrate
CNB99801138XA CN1247054C (zh) 1998-05-14 1999-05-14 薄膜衬底
PCT/JP1999/002524 WO1999059386A1 (en) 1998-05-14 1999-05-14 Substrate for formation of special pattern, and method of manufacture of substrate
US09/630,444 US6733868B1 (en) 1998-05-14 2000-08-02 Substrate for forming specific pattern, and method for manufacturing same
US10/796,056 US20040169004A1 (en) 1998-05-14 2004-03-10 Substrate for forming specific pattern, and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13244698A JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004216984A Division JP4100378B2 (ja) 2004-07-26 2004-07-26 パターン形成用基板およびその製造方法

Publications (3)

Publication Number Publication Date
JPH11330666A JPH11330666A (ja) 1999-11-30
JP3606047B2 JP3606047B2 (ja) 2005-01-05
JPH11330666A5 true JPH11330666A5 (enExample) 2005-03-03

Family

ID=15081561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13244698A Expired - Fee Related JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法

Country Status (7)

Country Link
US (2) US6733868B1 (enExample)
EP (1) EP1011298B1 (enExample)
JP (1) JP3606047B2 (enExample)
KR (1) KR100597015B1 (enExample)
CN (2) CN1247054C (enExample)
DE (1) DE69939420D1 (enExample)
WO (1) WO1999059386A1 (enExample)

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JP3606047B2 (ja) * 1998-05-14 2005-01-05 セイコーエプソン株式会社 基板の製造方法
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JP2004066138A (ja) * 2002-08-07 2004-03-04 Fujimori Gijutsu Kenkyusho:Kk 薄膜形成方法及びパターン形成方法並びにパターン形成装置
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GB0316926D0 (en) * 2003-07-18 2003-08-27 Eastman Kodak Co Method of coating
KR100623227B1 (ko) * 2004-05-27 2006-09-19 학교법인 영남학원 오프셋 인쇄방식을 이용한 적층형 전자소자 제조방법
FR2872911B1 (fr) * 2004-07-07 2006-09-15 Commissariat Energie Atomique Procede de localisation d'une espece chimique ou biologique sur un substrat, microsysteme d'analyse et biopuce
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JP4151652B2 (ja) * 2005-01-11 2008-09-17 セイコーエプソン株式会社 識別コード描画方法
JP4855467B2 (ja) 2005-07-01 2012-01-18 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 濡れヒステリシスが低い疎水性表面被覆、その堆積方法、微細要素および使用
US20070259114A1 (en) * 2006-05-02 2007-11-08 Boston Scientific Scimed, Inc. Partially coated workpieces and method and system for making the same
JP4929115B2 (ja) * 2007-09-28 2012-05-09 本田技研工業株式会社 船外機用塗装金属製品及び同製造方法
JP5206154B2 (ja) * 2008-06-27 2013-06-12 富士通株式会社 配線基板の製造方法
US8173552B2 (en) * 2009-08-04 2012-05-08 Intel Corporation Method of fabricating an identification mark utilizing a liquid film assisted by a laser
JP5402511B2 (ja) * 2009-10-19 2014-01-29 セイコーエプソン株式会社 液晶装置及びその製造方法、並びに電子機器
JP5797883B2 (ja) * 2010-06-07 2015-10-21 住友電気工業株式会社 プリント配線板用基板
US8828484B2 (en) * 2013-01-28 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. Self-alignment due to wettability difference of an interface
CN103213940B (zh) * 2013-03-15 2016-04-06 北京工业大学 一种基于微纳米尺度使材料具有两种不同浸润性的方法
EP2799154A1 (en) 2013-05-03 2014-11-05 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Slot-die coating method, apparatus, and substrate
USD765327S1 (en) * 2013-06-27 2016-08-30 The Procter & Gamble Company Pad
US9305807B2 (en) * 2014-02-27 2016-04-05 Palo Alto Research Center Incorporated Fabrication method for microelectronic components and microchip inks used in electrostatic assembly
WO2016194968A1 (ja) * 2015-06-02 2016-12-08 株式会社村田製作所 金属層の形成方法
DE102015224992A1 (de) * 2015-12-11 2017-06-14 Robert Bosch Gmbh Verfahren zum mikrostrukturierten Aufbringen einer Flüssigkeit oder Paste auf eine Oberfläche
KR20200131807A (ko) * 2018-03-16 2020-11-24 에이지씨 가부시키가이샤 막이 부착된 기재
JP2021181158A (ja) * 2018-08-20 2021-11-25 Ａｇｃ株式会社 膜付き基材の製造方法

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JP3606047B2 (ja) * 1998-05-14 2005-01-05 セイコーエプソン株式会社 基板の製造方法

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