JPS645095A - Formation of conductive pattern - Google Patents

Formation of conductive pattern

Info

Publication number
JPS645095A
JPS645095A JP62160422A JP16042287A JPS645095A JP S645095 A JPS645095 A JP S645095A JP 62160422 A JP62160422 A JP 62160422A JP 16042287 A JP16042287 A JP 16042287A JP S645095 A JPS645095 A JP S645095A
Authority
JP
Japan
Prior art keywords
conductive pattern
substrate
high accuracy
ink jetting
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62160422A
Other languages
Japanese (ja)
Inventor
Shoichi Iwatani
Jun Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP62160422A priority Critical patent/JPS645095A/en
Publication of JPS645095A publication Critical patent/JPS645095A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

PURPOSE:To form a conductive pattern of high accuracy easily, by forming the conductive pattern on a substrate using an ink jetting printer. CONSTITUTION:Conductive liquid is deposited successively on a substrate 1 using an ink jetting printer to form a conductive pattern. In order to obtain a predetermined conductive pattern 8, the ink jetting head 7 or the substrate 1 is moved in X and Y directions relatively, thereby any conductive pattern an user likes 8 can be formed easily. Since the position of the head 7 relative to that of the substrate 1 can be controlled with high accuracy and easily by computer processing, the conductive pattern 8 of high accuracy can be formed easily.
JP62160422A 1987-06-26 1987-06-26 Formation of conductive pattern Pending JPS645095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62160422A JPS645095A (en) 1987-06-26 1987-06-26 Formation of conductive pattern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62160422A JPS645095A (en) 1987-06-26 1987-06-26 Formation of conductive pattern

Publications (1)

Publication Number Publication Date
JPS645095A true JPS645095A (en) 1989-01-10

Family

ID=15714582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62160422A Pending JPS645095A (en) 1987-06-26 1987-06-26 Formation of conductive pattern

Country Status (1)

Country Link
JP (1) JPS645095A (en)

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06115947A (en) * 1992-10-05 1994-04-26 E I Du Pont De Nemours & Co Bayer's packing body composition
WO1999038176A1 (en) * 1998-01-22 1999-07-29 Matsushita Electric Industrial Co., Ltd. Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device
WO1999059386A1 (en) * 1998-05-14 1999-11-18 Seiko Epson Corporation Substrate for formation of special pattern, and method of manufacture of substrate
JP2000106278A (en) * 1997-09-02 2000-04-11 Seiko Epson Corp Manufacture of organic el element and the organic el element
JP2002042585A (en) * 2000-07-31 2002-02-08 Asahi Glass Co Ltd Manufacturing method for resin window plate material with conductive printed layer
WO2002031068A1 (en) * 2000-10-13 2002-04-18 Ulvac, Inc. Ink-jet ink and process for producing the same
US6419746B1 (en) 1994-12-16 2002-07-16 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
JP2002320894A (en) * 2001-04-27 2002-11-05 Kyocera Corp Discharge device
JP2004031362A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031361A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031363A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031360A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004055555A (en) * 1997-09-02 2004-02-19 Seiko Epson Corp Composition for hole injection transport layer, organic el element, and manufacturing method
JP2004111367A (en) * 1997-09-02 2004-04-08 Seiko Epson Corp Hole injection transport layer composition, organic el element and manufacturing method thereof
KR100429851B1 (en) * 2001-05-07 2004-05-03 김수경 A conductive ink containing an ultrafine particle metal and method for preparing the same
US6855367B2 (en) * 2001-04-20 2005-02-15 Atsushita Electric Industrial Co., Ltd. Method of producing electronic parts, and member for production thereof
JP2006344870A (en) * 2005-06-10 2006-12-21 Toppan Printing Co Ltd Resistance element and method of adjusting resistance value thereof
KR100678419B1 (en) * 2005-04-01 2007-02-02 삼성전기주식회사 Method for surface treatment of board, method for forming wiring and wiring substrate
WO2007057528A1 (en) * 2005-11-14 2007-05-24 Astrium Sas Method for producing a non-developable surface printed circuit and the thus obtained printed circuit
JP2007281757A (en) * 2006-04-05 2007-10-25 Seiko Epson Corp Piezoelectric thin film resonator and method of manufacturing the same
JP2008108737A (en) * 2007-11-16 2008-05-08 Seiko Epson Corp Active matrix substrate, electro-optical device, manufacturing method of electro-optical device and electronic equipment
US7442405B2 (en) 1997-03-21 2008-10-28 Canon Kabushiki Kaisha Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate
JP2009044755A (en) * 2008-09-30 2009-02-26 Seiko Epson Corp Piezoelectric thin film resonator and method of manufacturing the same
US8178188B2 (en) 2001-04-20 2012-05-15 Panasonic Corporation Base layer for manufacturing an electronic component by an etching process
WO2013065683A1 (en) 2011-11-02 2013-05-10 富士フイルム株式会社 Base material for forming electroconductive pattern, circuit board, and method for producing each
US10197659B2 (en) 2013-09-25 2019-02-05 Fujifilm Corporation Pattern quality management chart, pattern quality management method, and pattern formation method

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06115947A (en) * 1992-10-05 1994-04-26 E I Du Pont De Nemours & Co Bayer's packing body composition
US6511545B2 (en) 1994-12-16 2003-01-28 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6761925B2 (en) 1994-12-16 2004-07-13 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6419746B1 (en) 1994-12-16 2002-07-16 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US6511358B2 (en) 1994-12-16 2003-01-28 Canon Kabushiki Kaisha Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof
US7442405B2 (en) 1997-03-21 2008-10-28 Canon Kabushiki Kaisha Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate
JP2000106278A (en) * 1997-09-02 2000-04-11 Seiko Epson Corp Manufacture of organic el element and the organic el element
JP2004111367A (en) * 1997-09-02 2004-04-08 Seiko Epson Corp Hole injection transport layer composition, organic el element and manufacturing method thereof
JP2004055555A (en) * 1997-09-02 2004-02-19 Seiko Epson Corp Composition for hole injection transport layer, organic el element, and manufacturing method
JP2004031360A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031363A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031362A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
JP2004031361A (en) * 1997-09-02 2004-01-29 Seiko Epson Corp Composition for hole injection transporting layer, organic el element and its manufacturing method
US6487774B1 (en) 1998-01-22 2002-12-03 Matsushita Electric Industrial Co., Ltd. Method of forming an electronic component using ink
US6979416B2 (en) 1998-01-22 2005-12-27 Matsushita Electric Industrial Co., Ltd. Method of forming an electronic component using ink
WO1999038176A1 (en) * 1998-01-22 1999-07-29 Matsushita Electric Industrial Co., Ltd. Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device
US6733868B1 (en) 1998-05-14 2004-05-11 Seiko Epson Corporation Substrate for forming specific pattern, and method for manufacturing same
WO1999059386A1 (en) * 1998-05-14 1999-11-18 Seiko Epson Corporation Substrate for formation of special pattern, and method of manufacture of substrate
JP2002042585A (en) * 2000-07-31 2002-02-08 Asahi Glass Co Ltd Manufacturing method for resin window plate material with conductive printed layer
WO2002031068A1 (en) * 2000-10-13 2002-04-18 Ulvac, Inc. Ink-jet ink and process for producing the same
US8178188B2 (en) 2001-04-20 2012-05-15 Panasonic Corporation Base layer for manufacturing an electronic component by an etching process
US6855367B2 (en) * 2001-04-20 2005-02-15 Atsushita Electric Industrial Co., Ltd. Method of producing electronic parts, and member for production thereof
US8507076B2 (en) 2001-04-20 2013-08-13 Panasonic Corporation Combination of base layer and ink for inkjet for manufacturing electronic component
US8247474B2 (en) 2001-04-20 2012-08-21 Panasonic Corporation Method of manufacturing base layer, ink for inkjet and electronic components
JP2002320894A (en) * 2001-04-27 2002-11-05 Kyocera Corp Discharge device
KR100429851B1 (en) * 2001-05-07 2004-05-03 김수경 A conductive ink containing an ultrafine particle metal and method for preparing the same
KR100678419B1 (en) * 2005-04-01 2007-02-02 삼성전기주식회사 Method for surface treatment of board, method for forming wiring and wiring substrate
JP2006344870A (en) * 2005-06-10 2006-12-21 Toppan Printing Co Ltd Resistance element and method of adjusting resistance value thereof
WO2007057528A1 (en) * 2005-11-14 2007-05-24 Astrium Sas Method for producing a non-developable surface printed circuit and the thus obtained printed circuit
US8481858B2 (en) 2005-11-14 2013-07-09 Astrium Sas Method for producing a non-developable surface printed circuit and the thus obtained printed circuit
JP2007281757A (en) * 2006-04-05 2007-10-25 Seiko Epson Corp Piezoelectric thin film resonator and method of manufacturing the same
JP2008108737A (en) * 2007-11-16 2008-05-08 Seiko Epson Corp Active matrix substrate, electro-optical device, manufacturing method of electro-optical device and electronic equipment
JP2009044755A (en) * 2008-09-30 2009-02-26 Seiko Epson Corp Piezoelectric thin film resonator and method of manufacturing the same
WO2013065683A1 (en) 2011-11-02 2013-05-10 富士フイルム株式会社 Base material for forming electroconductive pattern, circuit board, and method for producing each
US10197659B2 (en) 2013-09-25 2019-02-05 Fujifilm Corporation Pattern quality management chart, pattern quality management method, and pattern formation method

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