JPS645095A - Formation of conductive pattern - Google Patents
Formation of conductive patternInfo
- Publication number
- JPS645095A JPS645095A JP62160422A JP16042287A JPS645095A JP S645095 A JPS645095 A JP S645095A JP 62160422 A JP62160422 A JP 62160422A JP 16042287 A JP16042287 A JP 16042287A JP S645095 A JPS645095 A JP S645095A
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- substrate
- high accuracy
- ink jetting
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
PURPOSE:To form a conductive pattern of high accuracy easily, by forming the conductive pattern on a substrate using an ink jetting printer. CONSTITUTION:Conductive liquid is deposited successively on a substrate 1 using an ink jetting printer to form a conductive pattern. In order to obtain a predetermined conductive pattern 8, the ink jetting head 7 or the substrate 1 is moved in X and Y directions relatively, thereby any conductive pattern an user likes 8 can be formed easily. Since the position of the head 7 relative to that of the substrate 1 can be controlled with high accuracy and easily by computer processing, the conductive pattern 8 of high accuracy can be formed easily.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160422A JPS645095A (en) | 1987-06-26 | 1987-06-26 | Formation of conductive pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160422A JPS645095A (en) | 1987-06-26 | 1987-06-26 | Formation of conductive pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS645095A true JPS645095A (en) | 1989-01-10 |
Family
ID=15714582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62160422A Pending JPS645095A (en) | 1987-06-26 | 1987-06-26 | Formation of conductive pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS645095A (en) |
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06115947A (en) * | 1992-10-05 | 1994-04-26 | E I Du Pont De Nemours & Co | Bayer's packing body composition |
WO1999038176A1 (en) * | 1998-01-22 | 1999-07-29 | Matsushita Electric Industrial Co., Ltd. | Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
WO1999059386A1 (en) * | 1998-05-14 | 1999-11-18 | Seiko Epson Corporation | Substrate for formation of special pattern, and method of manufacture of substrate |
JP2000106278A (en) * | 1997-09-02 | 2000-04-11 | Seiko Epson Corp | Manufacture of organic el element and the organic el element |
JP2002042585A (en) * | 2000-07-31 | 2002-02-08 | Asahi Glass Co Ltd | Manufacturing method for resin window plate material with conductive printed layer |
WO2002031068A1 (en) * | 2000-10-13 | 2002-04-18 | Ulvac, Inc. | Ink-jet ink and process for producing the same |
US6419746B1 (en) | 1994-12-16 | 2002-07-16 | Canon Kabushiki Kaisha | Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof |
JP2002320894A (en) * | 2001-04-27 | 2002-11-05 | Kyocera Corp | Discharge device |
JP2004031362A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031361A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031363A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031360A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004055555A (en) * | 1997-09-02 | 2004-02-19 | Seiko Epson Corp | Composition for hole injection transport layer, organic el element, and manufacturing method |
JP2004111367A (en) * | 1997-09-02 | 2004-04-08 | Seiko Epson Corp | Hole injection transport layer composition, organic el element and manufacturing method thereof |
KR100429851B1 (en) * | 2001-05-07 | 2004-05-03 | 김수경 | A conductive ink containing an ultrafine particle metal and method for preparing the same |
US6855367B2 (en) * | 2001-04-20 | 2005-02-15 | Atsushita Electric Industrial Co., Ltd. | Method of producing electronic parts, and member for production thereof |
JP2006344870A (en) * | 2005-06-10 | 2006-12-21 | Toppan Printing Co Ltd | Resistance element and method of adjusting resistance value thereof |
KR100678419B1 (en) * | 2005-04-01 | 2007-02-02 | 삼성전기주식회사 | Method for surface treatment of board, method for forming wiring and wiring substrate |
WO2007057528A1 (en) * | 2005-11-14 | 2007-05-24 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
JP2007281757A (en) * | 2006-04-05 | 2007-10-25 | Seiko Epson Corp | Piezoelectric thin film resonator and method of manufacturing the same |
JP2008108737A (en) * | 2007-11-16 | 2008-05-08 | Seiko Epson Corp | Active matrix substrate, electro-optical device, manufacturing method of electro-optical device and electronic equipment |
US7442405B2 (en) | 1997-03-21 | 2008-10-28 | Canon Kabushiki Kaisha | Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate |
JP2009044755A (en) * | 2008-09-30 | 2009-02-26 | Seiko Epson Corp | Piezoelectric thin film resonator and method of manufacturing the same |
US8178188B2 (en) | 2001-04-20 | 2012-05-15 | Panasonic Corporation | Base layer for manufacturing an electronic component by an etching process |
WO2013065683A1 (en) | 2011-11-02 | 2013-05-10 | 富士フイルム株式会社 | Base material for forming electroconductive pattern, circuit board, and method for producing each |
US10197659B2 (en) | 2013-09-25 | 2019-02-05 | Fujifilm Corporation | Pattern quality management chart, pattern quality management method, and pattern formation method |
-
1987
- 1987-06-26 JP JP62160422A patent/JPS645095A/en active Pending
Cited By (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06115947A (en) * | 1992-10-05 | 1994-04-26 | E I Du Pont De Nemours & Co | Bayer's packing body composition |
US6511545B2 (en) | 1994-12-16 | 2003-01-28 | Canon Kabushiki Kaisha | Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof |
US6761925B2 (en) | 1994-12-16 | 2004-07-13 | Canon Kabushiki Kaisha | Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof |
US6419746B1 (en) | 1994-12-16 | 2002-07-16 | Canon Kabushiki Kaisha | Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof |
US6511358B2 (en) | 1994-12-16 | 2003-01-28 | Canon Kabushiki Kaisha | Electron-emitting device, electron source substrate, electron source, display panel and image-forming apparatus, and production method thereof |
US7442405B2 (en) | 1997-03-21 | 2008-10-28 | Canon Kabushiki Kaisha | Method for production of electron source substrate provided with electron emitting element and method for production of electronic device using the substrate |
JP2000106278A (en) * | 1997-09-02 | 2000-04-11 | Seiko Epson Corp | Manufacture of organic el element and the organic el element |
JP2004111367A (en) * | 1997-09-02 | 2004-04-08 | Seiko Epson Corp | Hole injection transport layer composition, organic el element and manufacturing method thereof |
JP2004055555A (en) * | 1997-09-02 | 2004-02-19 | Seiko Epson Corp | Composition for hole injection transport layer, organic el element, and manufacturing method |
JP2004031360A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031363A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031362A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
JP2004031361A (en) * | 1997-09-02 | 2004-01-29 | Seiko Epson Corp | Composition for hole injection transporting layer, organic el element and its manufacturing method |
US6487774B1 (en) | 1998-01-22 | 2002-12-03 | Matsushita Electric Industrial Co., Ltd. | Method of forming an electronic component using ink |
US6979416B2 (en) | 1998-01-22 | 2005-12-27 | Matsushita Electric Industrial Co., Ltd. | Method of forming an electronic component using ink |
WO1999038176A1 (en) * | 1998-01-22 | 1999-07-29 | Matsushita Electric Industrial Co., Ltd. | Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
US6733868B1 (en) | 1998-05-14 | 2004-05-11 | Seiko Epson Corporation | Substrate for forming specific pattern, and method for manufacturing same |
WO1999059386A1 (en) * | 1998-05-14 | 1999-11-18 | Seiko Epson Corporation | Substrate for formation of special pattern, and method of manufacture of substrate |
JP2002042585A (en) * | 2000-07-31 | 2002-02-08 | Asahi Glass Co Ltd | Manufacturing method for resin window plate material with conductive printed layer |
WO2002031068A1 (en) * | 2000-10-13 | 2002-04-18 | Ulvac, Inc. | Ink-jet ink and process for producing the same |
US8178188B2 (en) | 2001-04-20 | 2012-05-15 | Panasonic Corporation | Base layer for manufacturing an electronic component by an etching process |
US6855367B2 (en) * | 2001-04-20 | 2005-02-15 | Atsushita Electric Industrial Co., Ltd. | Method of producing electronic parts, and member for production thereof |
US8507076B2 (en) | 2001-04-20 | 2013-08-13 | Panasonic Corporation | Combination of base layer and ink for inkjet for manufacturing electronic component |
US8247474B2 (en) | 2001-04-20 | 2012-08-21 | Panasonic Corporation | Method of manufacturing base layer, ink for inkjet and electronic components |
JP2002320894A (en) * | 2001-04-27 | 2002-11-05 | Kyocera Corp | Discharge device |
KR100429851B1 (en) * | 2001-05-07 | 2004-05-03 | 김수경 | A conductive ink containing an ultrafine particle metal and method for preparing the same |
KR100678419B1 (en) * | 2005-04-01 | 2007-02-02 | 삼성전기주식회사 | Method for surface treatment of board, method for forming wiring and wiring substrate |
JP2006344870A (en) * | 2005-06-10 | 2006-12-21 | Toppan Printing Co Ltd | Resistance element and method of adjusting resistance value thereof |
WO2007057528A1 (en) * | 2005-11-14 | 2007-05-24 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
US8481858B2 (en) | 2005-11-14 | 2013-07-09 | Astrium Sas | Method for producing a non-developable surface printed circuit and the thus obtained printed circuit |
JP2007281757A (en) * | 2006-04-05 | 2007-10-25 | Seiko Epson Corp | Piezoelectric thin film resonator and method of manufacturing the same |
JP2008108737A (en) * | 2007-11-16 | 2008-05-08 | Seiko Epson Corp | Active matrix substrate, electro-optical device, manufacturing method of electro-optical device and electronic equipment |
JP2009044755A (en) * | 2008-09-30 | 2009-02-26 | Seiko Epson Corp | Piezoelectric thin film resonator and method of manufacturing the same |
WO2013065683A1 (en) | 2011-11-02 | 2013-05-10 | 富士フイルム株式会社 | Base material for forming electroconductive pattern, circuit board, and method for producing each |
US10197659B2 (en) | 2013-09-25 | 2019-02-05 | Fujifilm Corporation | Pattern quality management chart, pattern quality management method, and pattern formation method |
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