JP3606047B2 - 基板の製造方法 - Google Patents

基板の製造方法 Download PDF

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Publication number
JP3606047B2
JP3606047B2 JP13244698A JP13244698A JP3606047B2 JP 3606047 B2 JP3606047 B2 JP 3606047B2 JP 13244698 A JP13244698 A JP 13244698A JP 13244698 A JP13244698 A JP 13244698A JP 3606047 B2 JP3606047 B2 JP 3606047B2
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JP
Japan
Prior art keywords
affinity
region
fluid
base
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13244698A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11330666A (ja
JPH11330666A5 (enExample
Inventor
貞男 神戸
関　　俊一
均 福島
浩史 木口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP13244698A priority Critical patent/JP3606047B2/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to PCT/JP1999/002524 priority patent/WO1999059386A1/ja
Priority to DE69939420T priority patent/DE69939420D1/de
Priority to CNA2005100676068A priority patent/CN1697598A/zh
Priority to KR1020007000370A priority patent/KR100597015B1/ko
Priority to EP99919593A priority patent/EP1011298B1/en
Priority to CNB99801138XA priority patent/CN1247054C/zh
Publication of JPH11330666A publication Critical patent/JPH11330666A/ja
Priority to US09/630,444 priority patent/US6733868B1/en
Priority to US10/796,056 priority patent/US20040169004A1/en
Application granted granted Critical
Publication of JP3606047B2 publication Critical patent/JP3606047B2/ja
Publication of JPH11330666A5 publication Critical patent/JPH11330666A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Structure Of Printed Boards (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP13244698A 1998-05-14 1998-05-14 基板の製造方法 Expired - Fee Related JP3606047B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP13244698A JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法
DE69939420T DE69939420D1 (de) 1998-05-14 1999-05-14 Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats
CNA2005100676068A CN1697598A (zh) 1998-05-14 1999-05-14 用于形成特定图形的衬底及其制造方法
KR1020007000370A KR100597015B1 (ko) 1998-05-14 1999-05-14 특정 패턴 형성용 기판, 박막 형성 기판 및 기판의 제조 방법
EP99919593A EP1011298B1 (en) 1998-05-14 1999-05-14 Substrate for formation of special pattern, and method of manufacture of substrate
CNB99801138XA CN1247054C (zh) 1998-05-14 1999-05-14 薄膜衬底
PCT/JP1999/002524 WO1999059386A1 (en) 1998-05-14 1999-05-14 Substrate for formation of special pattern, and method of manufacture of substrate
US09/630,444 US6733868B1 (en) 1998-05-14 2000-08-02 Substrate for forming specific pattern, and method for manufacturing same
US10/796,056 US20040169004A1 (en) 1998-05-14 2004-03-10 Substrate for forming specific pattern, and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13244698A JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004216984A Division JP4100378B2 (ja) 2004-07-26 2004-07-26 パターン形成用基板およびその製造方法

Publications (3)

Publication Number Publication Date
JPH11330666A JPH11330666A (ja) 1999-11-30
JP3606047B2 true JP3606047B2 (ja) 2005-01-05
JPH11330666A5 JPH11330666A5 (enExample) 2005-03-03

Family

ID=15081561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13244698A Expired - Fee Related JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法

Country Status (7)

Country Link
US (2) US6733868B1 (enExample)
EP (1) EP1011298B1 (enExample)
JP (1) JP3606047B2 (enExample)
KR (1) KR100597015B1 (enExample)
CN (2) CN1247054C (enExample)
DE (1) DE69939420D1 (enExample)
WO (1) WO1999059386A1 (enExample)

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JP3606047B2 (ja) * 1998-05-14 2005-01-05 セイコーエプソン株式会社 基板の製造方法
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JP4151652B2 (ja) * 2005-01-11 2008-09-17 セイコーエプソン株式会社 識別コード描画方法
JP4855467B2 (ja) 2005-07-01 2012-01-18 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 濡れヒステリシスが低い疎水性表面被覆、その堆積方法、微細要素および使用
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JP5206154B2 (ja) * 2008-06-27 2013-06-12 富士通株式会社 配線基板の製造方法
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JP5402511B2 (ja) * 2009-10-19 2014-01-29 セイコーエプソン株式会社 液晶装置及びその製造方法、並びに電子機器
JP5797883B2 (ja) * 2010-06-07 2015-10-21 住友電気工業株式会社 プリント配線板用基板
US8828484B2 (en) * 2013-01-28 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. Self-alignment due to wettability difference of an interface
CN103213940B (zh) * 2013-03-15 2016-04-06 北京工业大学 一种基于微纳米尺度使材料具有两种不同浸润性的方法
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USD765327S1 (en) * 2013-06-27 2016-08-30 The Procter & Gamble Company Pad
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WO2016194968A1 (ja) * 2015-06-02 2016-12-08 株式会社村田製作所 金属層の形成方法
DE102015224992A1 (de) * 2015-12-11 2017-06-14 Robert Bosch Gmbh Verfahren zum mikrostrukturierten Aufbringen einer Flüssigkeit oder Paste auf eine Oberfläche
KR20200131807A (ko) * 2018-03-16 2020-11-24 에이지씨 가부시키가이샤 막이 부착된 기재
JP2021181158A (ja) * 2018-08-20 2021-11-25 Ａｇｃ株式会社 膜付き基材の製造方法

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Also Published As

Publication number Publication date
CN1247054C (zh) 2006-03-22
EP1011298A1 (en) 2000-06-21
JPH11330666A (ja) 1999-11-30
KR100597015B1 (ko) 2006-07-06
US20040169004A1 (en) 2004-09-02
KR20010021806A (ko) 2001-03-15
EP1011298A4 (en) 2003-08-27
CN1697598A (zh) 2005-11-16
US6733868B1 (en) 2004-05-11
WO1999059386A1 (en) 1999-11-18
DE69939420D1 (de) 2008-10-09
EP1011298B1 (en) 2008-08-27
CN1274516A (zh) 2000-11-22

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