DE69939420D1 - Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats - Google Patents

Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats

Info

Publication number
DE69939420D1
DE69939420D1 DE69939420T DE69939420T DE69939420D1 DE 69939420 D1 DE69939420 D1 DE 69939420D1 DE 69939420 T DE69939420 T DE 69939420T DE 69939420 T DE69939420 T DE 69939420T DE 69939420 D1 DE69939420 D1 DE 69939420D1
Authority
DE
Germany
Prior art keywords
substrate
preparation
production
special patterns
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69939420T
Other languages
English (en)
Inventor
Sadao Kanbe
Shunichi Seki
Hitoshi Fukushima
Hiroshi Kiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE69939420D1 publication Critical patent/DE69939420D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pest Control & Pesticides (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Structure Of Printed Boards (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE69939420T 1998-05-14 1999-05-14 Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats Expired - Lifetime DE69939420D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13244698A JP3606047B2 (ja) 1998-05-14 1998-05-14 基板の製造方法
PCT/JP1999/002524 WO1999059386A1 (fr) 1998-05-14 1999-05-14 Substrat pour la formation de motifs speciaux et procede de fabrication d'un tel substrat

Publications (1)

Publication Number Publication Date
DE69939420D1 true DE69939420D1 (de) 2008-10-09

Family

ID=15081561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69939420T Expired - Lifetime DE69939420D1 (de) 1998-05-14 1999-05-14 Substrat zur bildung von speziellen mustern, und verfahren zur herstellung des substrats

Country Status (7)

Country Link
US (2) US6733868B1 (de)
EP (1) EP1011298B1 (de)
JP (1) JP3606047B2 (de)
KR (1) KR100597015B1 (de)
CN (2) CN1247054C (de)
DE (1) DE69939420D1 (de)
WO (1) WO1999059386A1 (de)

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JP3606047B2 (ja) * 1998-05-14 2005-01-05 セイコーエプソン株式会社 基板の製造方法
JP2002340989A (ja) * 2001-05-15 2002-11-27 Semiconductor Energy Lab Co Ltd 測定方法、検査方法及び検査装置
US6973710B2 (en) * 2001-08-03 2005-12-13 Seiko Epson Corporation Method and apparatus for making devices
JP4039035B2 (ja) 2001-10-31 2008-01-30 セイコーエプソン株式会社 線パターンの形成方法、線パターン、電気光学装置、電子機器、非接触型カード媒体
US20030108725A1 (en) * 2001-12-10 2003-06-12 Matthew Hamilton Visual images produced by surface patterning
GB0207350D0 (en) * 2002-03-28 2002-05-08 Univ Sheffield Surface
JP4068883B2 (ja) * 2002-04-22 2008-03-26 セイコーエプソン株式会社 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
JP2004066138A (ja) * 2002-08-07 2004-03-04 Fujimori Gijutsu Kenkyusho:Kk 薄膜形成方法及びパターン形成方法並びにパターン形成装置
US6969166B2 (en) 2003-05-29 2005-11-29 3M Innovative Properties Company Method for modifying the surface of a substrate
GB0313569D0 (en) * 2003-06-12 2003-07-16 Plasso Technology Ltd Method
GB0316926D0 (en) * 2003-07-18 2003-08-27 Eastman Kodak Co Method of coating
KR100623227B1 (ko) * 2004-05-27 2006-09-19 학교법인 영남학원 오프셋 인쇄방식을 이용한 적층형 전자소자 제조방법
FR2872911B1 (fr) * 2004-07-07 2006-09-15 Commissariat Energie Atomique Procede de localisation d'une espece chimique ou biologique sur un substrat, microsysteme d'analyse et biopuce
GB0424005D0 (en) * 2004-10-29 2004-12-01 Eastman Kodak Co Method of coating
DE102004058209A1 (de) * 2004-12-02 2006-06-08 Printed Systems Gmbh Verfahren und Vorrichtung zur Erzeugung von Strukturen aus Funktionsmaterialien
JP5258302B2 (ja) * 2004-12-30 2013-08-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 有機電子デバイスおよび方法
JP4151652B2 (ja) * 2005-01-11 2008-09-17 セイコーエプソン株式会社 識別コード描画方法
JP4855467B2 (ja) * 2005-07-01 2012-01-18 コミサリア ア レネルジー アトミック エ オ ゼネルジー アルテルナティブ 濡れヒステリシスが低い疎水性表面被覆、その堆積方法、微細要素および使用
US20070259114A1 (en) * 2006-05-02 2007-11-08 Boston Scientific Scimed, Inc. Partially coated workpieces and method and system for making the same
JP4929115B2 (ja) * 2007-09-28 2012-05-09 本田技研工業株式会社 船外機用塗装金属製品及び同製造方法
JP5206154B2 (ja) * 2008-06-27 2013-06-12 富士通株式会社 配線基板の製造方法
US8173552B2 (en) * 2009-08-04 2012-05-08 Intel Corporation Method of fabricating an identification mark utilizing a liquid film assisted by a laser
JP5402511B2 (ja) * 2009-10-19 2014-01-29 セイコーエプソン株式会社 液晶装置及びその製造方法、並びに電子機器
JP5797883B2 (ja) * 2010-06-07 2015-10-21 住友電気工業株式会社 プリント配線板用基板
US8828484B2 (en) * 2013-01-28 2014-09-09 Taiwan Semiconductor Manufacturing Co., Ltd. Self-alignment due to wettability difference of an interface
CN103213940B (zh) * 2013-03-15 2016-04-06 北京工业大学 一种基于微纳米尺度使材料具有两种不同浸润性的方法
EP2799154A1 (de) * 2013-05-03 2014-11-05 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Schlitzblasbeschichtungsverfahren, Vorrichtung, und Substrat
USD765327S1 (en) * 2013-06-27 2016-08-30 The Procter & Gamble Company Pad
US9305807B2 (en) * 2014-02-27 2016-04-05 Palo Alto Research Center Incorporated Fabrication method for microelectronic components and microchip inks used in electrostatic assembly
WO2016194968A1 (ja) * 2015-06-02 2016-12-08 株式会社村田製作所 金属層の形成方法
DE102015224992A1 (de) * 2015-12-11 2017-06-14 Robert Bosch Gmbh Verfahren zum mikrostrukturierten Aufbringen einer Flüssigkeit oder Paste auf eine Oberfläche
JPWO2019177120A1 (ja) * 2018-03-16 2021-03-25 Ａｇｃ株式会社 膜付き基材
JP2021181158A (ja) * 2018-08-20 2021-11-25 Ａｇｃ株式会社 膜付き基材の製造方法

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JPH07245467A (ja) * 1994-03-07 1995-09-19 Ibiden Co Ltd プリント配線基板の製造方法
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JP3606047B2 (ja) * 1998-05-14 2005-01-05 セイコーエプソン株式会社 基板の製造方法

Also Published As

Publication number Publication date
EP1011298A4 (de) 2003-08-27
CN1697598A (zh) 2005-11-16
JP3606047B2 (ja) 2005-01-05
CN1247054C (zh) 2006-03-22
WO1999059386A1 (fr) 1999-11-18
EP1011298B1 (de) 2008-08-27
US20040169004A1 (en) 2004-09-02
KR20010021806A (ko) 2001-03-15
CN1274516A (zh) 2000-11-22
JPH11330666A (ja) 1999-11-30
US6733868B1 (en) 2004-05-11
KR100597015B1 (ko) 2006-07-06
EP1011298A1 (de) 2000-06-21

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Legal Events

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8364 No opposition during term of opposition