JPH041503B2 - - Google Patents

Info

Publication number
JPH041503B2
JPH041503B2 JP57177353A JP17735382A JPH041503B2 JP H041503 B2 JPH041503 B2 JP H041503B2 JP 57177353 A JP57177353 A JP 57177353A JP 17735382 A JP17735382 A JP 17735382A JP H041503 B2 JPH041503 B2 JP H041503B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
stage
lead
frame
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57177353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5966157A (ja
Inventor
Akihiro Kubota
Rikio Sugiura
Tsuyoshi Aoki
Michio Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57177353A priority Critical patent/JPS5966157A/ja
Priority to CA000438288A priority patent/CA1217876A/en
Priority to EP83306055A priority patent/EP0108502B1/en
Priority to DE8383306055T priority patent/DE3379008D1/de
Priority to IE2368/83A priority patent/IE55078B1/en
Priority to KR1019830004765A priority patent/KR860000410B1/ko
Priority to US06/539,781 priority patent/US4984059A/en
Publication of JPS5966157A publication Critical patent/JPS5966157A/ja
Publication of JPH041503B2 publication Critical patent/JPH041503B2/ja
Priority to US08/001,613 priority patent/USRE35109E/en
Granted legal-status Critical Current

Links

Classifications

    • H10W70/442—
    • H10W72/00—
    • H10W70/40—
    • H10W70/411—
    • H10W70/475—
    • H10W74/016—
    • H10W74/111—
    • H10W74/121—
    • H10W74/131—
    • H10W72/534—
    • H10W72/5445—
    • H10W72/5449—
    • H10W72/5522—
    • H10W74/00—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/916—Narrow band gap semiconductor material, <<1ev

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57177353A 1982-10-08 1982-10-08 半導体装置及びその製造方法 Granted JPS5966157A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP57177353A JPS5966157A (ja) 1982-10-08 1982-10-08 半導体装置及びその製造方法
CA000438288A CA1217876A (en) 1982-10-08 1983-10-04 Semiconductor device and a method for fabricating the same
EP83306055A EP0108502B1 (en) 1982-10-08 1983-10-06 A plastics moulded semiconductor device and a method of producing it
DE8383306055T DE3379008D1 (en) 1982-10-08 1983-10-06 A plastics moulded semiconductor device and a method of producing it
IE2368/83A IE55078B1 (en) 1982-10-08 1983-10-07 A plastics moulded semiconductor device and a method of producing it
KR1019830004765A KR860000410B1 (ko) 1982-10-08 1983-10-07 반도체장치 및 그 조립방법
US06/539,781 US4984059A (en) 1982-10-08 1983-10-07 Semiconductor device and a method for fabricating the same
US08/001,613 USRE35109E (en) 1982-10-08 1993-01-07 Semiconductor device and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57177353A JPS5966157A (ja) 1982-10-08 1982-10-08 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS5966157A JPS5966157A (ja) 1984-04-14
JPH041503B2 true JPH041503B2 (ref) 1992-01-13

Family

ID=16029481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57177353A Granted JPS5966157A (ja) 1982-10-08 1982-10-08 半導体装置及びその製造方法

Country Status (7)

Country Link
US (2) US4984059A (ref)
EP (1) EP0108502B1 (ref)
JP (1) JPS5966157A (ref)
KR (1) KR860000410B1 (ref)
CA (1) CA1217876A (ref)
DE (1) DE3379008D1 (ref)
IE (1) IE55078B1 (ref)

Families Citing this family (89)

* Cited by examiner, † Cited by third party
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JPS61230344A (ja) * 1985-04-05 1986-10-14 Toray Silicone Co Ltd 樹脂封止型半導体装置
JPS6344750A (ja) * 1986-08-12 1988-02-25 Shinko Electric Ind Co Ltd 樹脂封止型半導体装置の製造方法およびこれに用いるリ−ドフレ−ム
JPS63213347A (ja) * 1987-02-27 1988-09-06 Mitsubishi Electric Corp 半導体装置
JPH0724275B2 (ja) * 1987-11-06 1995-03-15 三菱電機株式会社 半導体装置
JP2706077B2 (ja) * 1988-02-12 1998-01-28 株式会社日立製作所 樹脂封止型半導体装置及びその製造方法
JPH0215663A (ja) * 1988-07-04 1990-01-19 Tomoegawa Paper Co Ltd リードフレーム用両面接着テープ
JP2522524B2 (ja) * 1988-08-06 1996-08-07 株式会社東芝 半導体装置の製造方法
JPH0650749B2 (ja) * 1989-06-28 1994-06-29 株式会社東芝 半導体装置及びその製造方法
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
JPH0693469B2 (ja) * 1989-11-28 1994-11-16 株式会社東芝 樹脂封止型半導体装置
US5168345A (en) * 1990-08-15 1992-12-01 Lsi Logic Corporation Semiconductor device having a universal die size inner lead layout
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5440170A (en) * 1990-09-10 1995-08-08 Fujitsu Limited Semiconductor device having a die pad with rounded edges and its manufacturing method
KR920018907A (ko) * 1991-03-23 1992-10-22 김광호 반도체 리드 프레임
JP2509422B2 (ja) * 1991-10-30 1996-06-19 三菱電機株式会社 半導体装置及びその製造方法
DE69231290D1 (de) * 1991-12-27 2000-08-31 Fujitsu Ltd Halbleitervorrichtung und Verfahren zu ihrer Herstellung
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
JP3088193B2 (ja) * 1992-06-05 2000-09-18 三菱電機株式会社 Ｌｏｃ構造を有する半導体装置の製造方法並びにこれに使用するリードフレーム
JPH06209054A (ja) * 1993-01-08 1994-07-26 Mitsubishi Electric Corp 半導体装置
US5291061A (en) * 1993-04-06 1994-03-01 Micron Semiconductor, Inc. Multi-chip stacked devices
USRE40061E1 (en) 1993-04-06 2008-02-12 Micron Technology, Inc. Multi-chip stacked devices
US5596172A (en) * 1993-05-07 1997-01-21 Motorola, Inc. Planar encapsulation process
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
JPH07176677A (ja) * 1993-08-31 1995-07-14 Texas Instr Inc <Ti> 低コストリードフレームの設計及び製造方法
US5585600A (en) * 1993-09-02 1996-12-17 International Business Machines Corporation Encapsulated semiconductor chip module and method of forming the same
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
DE19581837T1 (de) * 1994-11-10 1997-10-02 Micron Technology Inc Mehrlagiger Leitungsrahmen für eine Halbleitervorrichtung
US5965936A (en) 1997-12-31 1999-10-12 Micron Technology, Inc. Multi-layer lead frame for a semiconductor device
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
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US5872398A (en) * 1996-01-11 1999-02-16 Micron Technology, Inc. Reduced stress LOC assembly including cantilevered leads
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US6277225B1 (en) * 1996-03-13 2001-08-21 Micron Technology, Inc. Stress reduction feature for LOC lead frame
US5733800A (en) * 1996-05-21 1998-03-31 Micron Technology, Inc. Underfill coating for LOC package
US6384333B1 (en) 1996-05-21 2002-05-07 Micron Technology, Inc. Underfill coating for LOC package
JP3870301B2 (ja) * 1996-06-11 2007-01-17 ヤマハ株式会社 半導体装置の組立法、半導体装置及び半導体装置の連続組立システム
US5717246A (en) 1996-07-29 1998-02-10 Micron Technology, Inc. Hybrid frame with lead-lock tape
US5759875A (en) * 1996-10-04 1998-06-02 Micron Technology, Inc. Reduced filler particle size encapsulant for reduction in die surface damage in LOC packages and method of use
US6072228A (en) 1996-10-25 2000-06-06 Micron Technology, Inc. Multi-part lead frame with dissimilar materials and method of manufacturing
US5847445A (en) * 1996-11-04 1998-12-08 Micron Technology, Inc. Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same
US5907769A (en) * 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6001672A (en) 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
JP3398004B2 (ja) * 1997-03-24 2003-04-21 ローム株式会社 パッケージ型半導体装置の構造
US5923081A (en) 1997-05-15 1999-07-13 Micron Technology, Inc. Compression layer on the leadframe to reduce stress defects
US5982018A (en) * 1997-05-23 1999-11-09 Micron Technology, Inc. Thin film capacitor coupons for memory modules and multi-chip modules
US6054754A (en) * 1997-06-06 2000-04-25 Micron Technology, Inc. Multi-capacitance lead frame decoupling device
EP0887850A3 (en) 1997-06-23 2001-05-02 STMicroelectronics, Inc. Lead-frame forming for improved thermal performance
US6005286A (en) * 1997-10-06 1999-12-21 Micron Technology, Inc. Increasing the gap between a lead frame and a semiconductor die
US6515359B1 (en) * 1998-01-20 2003-02-04 Micron Technology, Inc. Lead frame decoupling capacitor semiconductor device packages including the same and methods
US6114756A (en) 1998-04-01 2000-09-05 Micron Technology, Inc. Interdigitated capacitor design for integrated circuit leadframes
US6297548B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6297960B1 (en) 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
US6124150A (en) 1998-08-20 2000-09-26 Micron Technology, Inc. Transverse hybrid LOC package
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
TW463346B (en) * 1999-05-04 2001-11-11 Sitron Prec Co Ltd Dual-leadframe package structure and its manufacturing method
US20030151120A1 (en) * 2000-06-28 2003-08-14 Hundt Michael J. Lead-frame forming for improved thermal performance
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US6444501B1 (en) 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
JP2003017645A (ja) * 2001-07-03 2003-01-17 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法
EP1451869B1 (en) * 2001-11-23 2012-07-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method of enveloping an integrated circuit
US6791842B2 (en) * 2002-11-12 2004-09-14 Kingpak Technology Inc. Image sensor structure
US20040109525A1 (en) * 2002-12-09 2004-06-10 Chieng Koc Vai Chieng Aka Michael Automatic chip counting system (process)
US6921967B2 (en) * 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
KR100673765B1 (ko) 2006-01-20 2007-01-24 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
KR100635514B1 (ko) * 2006-01-23 2006-10-18 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
JP4456092B2 (ja) 2006-01-24 2010-04-28 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100685853B1 (ko) * 2006-01-25 2007-02-22 삼성에스디아이 주식회사 유기전계발광표시장치 및 그 제조방법
KR100671641B1 (ko) * 2006-01-25 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688796B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시 장치 및 그의 제작 방법
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
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JP4633674B2 (ja) 2006-01-26 2011-02-16 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
KR100732808B1 (ko) * 2006-01-26 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치의 제조방법
KR100671639B1 (ko) * 2006-01-27 2007-01-19 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100688790B1 (ko) * 2006-01-27 2007-03-02 삼성에스디아이 주식회사 유기 전계 발광 표시장치 및 그 제조 방법
KR100732817B1 (ko) 2006-03-29 2007-06-27 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
US8116102B2 (en) * 2007-12-26 2012-02-14 Infineon Technologies Ag Integrated circuit device and method of producing
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CN103828041B (zh) * 2011-09-29 2016-07-06 夏普株式会社 半导体装置
US20210081013A1 (en) 2014-09-02 2021-03-18 Delta Electronics, Inc. Power supply apparatus
US10447166B2 (en) 2015-08-31 2019-10-15 Delta Electronics, Inc. Power module
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Also Published As

Publication number Publication date
IE55078B1 (en) 1990-05-23
IE832368L (en) 1984-04-08
EP0108502A2 (en) 1984-05-16
DE3379008D1 (en) 1989-02-23
KR860000410B1 (ko) 1986-04-17
EP0108502A3 (en) 1985-08-07
CA1217876A (en) 1987-02-10
JPS5966157A (ja) 1984-04-14
US4984059A (en) 1991-01-08
KR840006561A (ko) 1984-11-30
USRE35109E (en) 1995-12-05
EP0108502B1 (en) 1989-01-18

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