JPH0136707B2 - - Google Patents

Info

Publication number
JPH0136707B2
JPH0136707B2 JP57138583A JP13858382A JPH0136707B2 JP H0136707 B2 JPH0136707 B2 JP H0136707B2 JP 57138583 A JP57138583 A JP 57138583A JP 13858382 A JP13858382 A JP 13858382A JP H0136707 B2 JPH0136707 B2 JP H0136707B2
Authority
JP
Japan
Prior art keywords
sample
parts
adsorption
sample adsorption
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57138583A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5929435A (ja
Inventor
Yoshio Hokotani
Yoshihisa Namikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57138583A priority Critical patent/JPS5929435A/ja
Priority to US06/521,610 priority patent/US4520421A/en
Publication of JPS5929435A publication Critical patent/JPS5929435A/ja
Publication of JPH0136707B2 publication Critical patent/JPH0136707B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/903—Work holder for electrical circuit assemblages or wiring systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP57138583A 1982-08-11 1982-08-11 試料支持装置 Granted JPS5929435A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57138583A JPS5929435A (ja) 1982-08-11 1982-08-11 試料支持装置
US06/521,610 US4520421A (en) 1982-08-11 1983-08-09 Specimen supporting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57138583A JPS5929435A (ja) 1982-08-11 1982-08-11 試料支持装置

Publications (2)

Publication Number Publication Date
JPS5929435A JPS5929435A (ja) 1984-02-16
JPH0136707B2 true JPH0136707B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-08-02

Family

ID=15225507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57138583A Granted JPS5929435A (ja) 1982-08-11 1982-08-11 試料支持装置

Country Status (2)

Country Link
US (1) US4520421A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5929435A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (287)

* Cited by examiner, † Cited by third party
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JPH0828205B2 (ja) * 1989-10-27 1996-03-21 株式会社日立製作所 ウエハ搬送装置
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US5184398A (en) * 1991-08-30 1993-02-09 Texas Instruments Incorporated In-situ real-time sheet resistance measurement method
US5213349A (en) * 1991-12-18 1993-05-25 Elliott Joe C Electrostatic chuck
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WO1994011944A1 (en) * 1992-11-06 1994-05-26 Varian Associates, Inc. Electrostatic wafer clamp
US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
US5822171A (en) * 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
US6141203A (en) * 1994-03-03 2000-10-31 Sherman; Arthur Electrostatic chuck
JPH07321176A (ja) * 1994-05-20 1995-12-08 Hitachi Ltd 基板搬送方法
US5670066A (en) * 1995-03-17 1997-09-23 Lam Research Corporation Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
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KR100463782B1 (ko) * 1995-09-20 2005-04-28 가부시끼가이샤 히다치 세이사꾸쇼 정전흡착전극및그제작방법
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US6055150A (en) * 1996-05-02 2000-04-25 Applied Materials, Inc. Multi-electrode electrostatic chuck having fuses in hollow cavities
US5751537A (en) * 1996-05-02 1998-05-12 Applied Materials, Inc. Multielectrode electrostatic chuck with fuses
US6441514B1 (en) 1997-04-28 2002-08-27 Ultratech Stepper, Inc. Magnetically positioned X-Y stage having six degrees of freedom
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US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
US6219219B1 (en) * 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
GB2354114A (en) * 1999-09-13 2001-03-14 Gareth John Monkman Micro-scale electrostatic gripper
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6686598B1 (en) 2000-09-01 2004-02-03 Varian Semiconductor Equipment Associates, Inc. Wafer clamping apparatus and method
US6780696B1 (en) * 2000-09-12 2004-08-24 Alien Technology Corporation Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
US20040066601A1 (en) * 2002-10-04 2004-04-08 Varian Semiconductor Equipment Associates, Inc. Electrode configuration for retaining cooling gas on electrostatic wafer clamp
US7199994B1 (en) * 2004-01-12 2007-04-03 Advanced Micro Devices Inc. Method and system for flattening a reticle within a lithography system
KR100773723B1 (ko) 2005-09-08 2007-11-06 주식회사 아이피에스 플라즈마 처리장치
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JP6356516B2 (ja) * 2014-07-22 2018-07-11 東芝メモリ株式会社 プラズマ処理装置およびプラズマ処理方法
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