JP7410053B2 - ポジ型ドライフィルムレジスト及びエッチング方法 - Google Patents
ポジ型ドライフィルムレジスト及びエッチング方法 Download PDFInfo
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- JP7410053B2 JP7410053B2 JP2020561381A JP2020561381A JP7410053B2 JP 7410053 B2 JP7410053 B2 JP 7410053B2 JP 2020561381 A JP2020561381 A JP 2020561381A JP 2020561381 A JP2020561381 A JP 2020561381A JP 7410053 B2 JP7410053 B2 JP 7410053B2
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- G—PHYSICS
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- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
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- G—PHYSICS
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- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
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- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (11)
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| JP2005215137A (ja) | 2004-01-28 | 2005-08-11 | Fuji Photo Film Co Ltd | 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置 |
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| JP2017078852A (ja) | 2015-10-21 | 2017-04-27 | 富士フイルム株式会社 | ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置 |
| JP2017120435A (ja) | 2017-03-01 | 2017-07-06 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
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| JPS514415A (ko) | 1974-06-27 | 1976-01-14 | Nissan Motor | |
| US4756988A (en) | 1982-09-29 | 1988-07-12 | Minnesota Mining And Manufacturing Company | Multilayer dry-film negative-acting photoresist |
| DE4107390A1 (de) * | 1991-03-08 | 1992-09-10 | Hoechst Ag | Gefaerbtes, positiv arbeitendes, lichtempfindliches aufzeichnungsmaterial und verfahren zur herstellung sowohl positiver als auch negativer farbpruefbilder unter verwendung dieses materials |
| JPH0635200A (ja) * | 1992-07-17 | 1994-02-10 | Fuji Photo Film Co Ltd | 感光性転写シート及びレジストパターン形成方法 |
| JPH09166876A (ja) * | 1995-12-18 | 1997-06-24 | Mitsubishi Chem Corp | 中間膜組成物及びこれを用いた基板上への感光膜の形成方法 |
| JP2002341525A (ja) | 2001-05-14 | 2002-11-27 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト転写材料およびそれを用いた基板表面の加工方法 |
| JP4622612B2 (ja) | 2005-03-24 | 2011-02-02 | 日本製紙ケミカル株式会社 | ポジ型感光性樹脂積層シート及びその製造方法 |
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| JP2005215137A (ja) | 2004-01-28 | 2005-08-11 | Fuji Photo Film Co Ltd | 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置 |
| JP2008176276A (ja) | 2006-12-18 | 2008-07-31 | Jsr Corp | ドライフィルムおよびマイクロレンズとその製法 |
| JP2013505484A (ja) | 2009-09-30 | 2013-02-14 | コーロン インダストリーズ インク | ドライフィルムフォトレジスト |
| JP2017078852A (ja) | 2015-10-21 | 2017-04-27 | 富士フイルム株式会社 | ドライフィルムレジスト、回路配線の製造方法、回路配線、入力装置および表示装置 |
| JP2017120435A (ja) | 2017-03-01 | 2017-07-06 | 富士フイルム株式会社 | 感光性転写材料、パターン形成方法およびエッチング方法 |
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| JPWO2020129845A1 (ja) | 2021-11-04 |
| KR20210104072A (ko) | 2021-08-24 |
| CN113168097A (zh) | 2021-07-23 |
| TWI814964B (zh) | 2023-09-11 |
| WO2020129845A1 (ja) | 2020-06-25 |
| TW202034080A (zh) | 2020-09-16 |
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