JP6792106B2 - ワークキャリア及びワークキャリアの製造方法 - Google Patents
ワークキャリア及びワークキャリアの製造方法 Download PDFInfo
- Publication number
- JP6792106B2 JP6792106B2 JP2017068834A JP2017068834A JP6792106B2 JP 6792106 B2 JP6792106 B2 JP 6792106B2 JP 2017068834 A JP2017068834 A JP 2017068834A JP 2017068834 A JP2017068834 A JP 2017068834A JP 6792106 B2 JP6792106 B2 JP 6792106B2
- Authority
- JP
- Japan
- Prior art keywords
- side recess
- work
- hole
- back side
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims description 80
- 239000011347 resin Substances 0.000 claims description 80
- 239000000758 substrate Substances 0.000 claims description 76
- 239000000463 material Substances 0.000 claims description 22
- 229920003002 synthetic resin Polymers 0.000 claims description 21
- 239000000057 synthetic resin Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 230000000873 masking effect Effects 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005498 polishing Methods 0.000 description 15
- 238000001746 injection moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910001315 Tool steel Inorganic materials 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Catalysts (AREA)
- Gears, Cams (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017068834A JP6792106B2 (ja) | 2017-03-30 | 2017-03-30 | ワークキャリア及びワークキャリアの製造方法 |
KR1020180027540A KR102447660B1 (ko) | 2017-03-30 | 2018-03-08 | 워크 캐리어 및 워크 캐리어의 제조 방법 |
CN201810250478.8A CN108687656B (zh) | 2017-03-30 | 2018-03-26 | 工件游星轮及工件游星轮的制造方法 |
TW107110240A TWI723256B (zh) | 2017-03-30 | 2018-03-26 | 工件遊星輪及工件遊星輪的製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017068834A JP6792106B2 (ja) | 2017-03-30 | 2017-03-30 | ワークキャリア及びワークキャリアの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018167383A JP2018167383A (ja) | 2018-11-01 |
JP6792106B2 true JP6792106B2 (ja) | 2020-11-25 |
Family
ID=63844586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017068834A Active JP6792106B2 (ja) | 2017-03-30 | 2017-03-30 | ワークキャリア及びワークキャリアの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6792106B2 (ko) |
KR (1) | KR102447660B1 (ko) |
CN (1) | CN108687656B (ko) |
TW (1) | TWI723256B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102434418B1 (ko) * | 2022-03-10 | 2022-08-22 | (주)뉴이스트 | 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법 |
CN115847281A (zh) * | 2022-12-07 | 2023-03-28 | 西安奕斯伟材料科技有限公司 | 一种硅片的双面抛光用的载具以及装置 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3086591B2 (ja) | 1994-06-15 | 2000-09-11 | 三洋電機株式会社 | 監視用ビデオカメラ |
JPH10135137A (ja) | 1996-10-31 | 1998-05-22 | Semiconductor Energy Lab Co Ltd | 結晶性半導体作製方法 |
JP3482130B2 (ja) * | 1998-07-10 | 2003-12-22 | 株式会社岸田製作所 | 脆性薄板の平面研磨における保持装置 |
JP2001179615A (ja) * | 1999-12-27 | 2001-07-03 | Seiko Epson Corp | 研磨用キャリア、表面研磨装置及び表面研磨方法 |
PL360294A1 (en) * | 2000-07-05 | 2004-09-06 | Yamanouchi Pharmaceutical Co.Ltd. | Propane-1,3-dione derivatives |
MY118114A (en) * | 2000-07-10 | 2004-08-30 | Sumitomo Bakelite Co | Holder for polished work and manufacturing method thereof |
JP3439726B2 (ja) * | 2000-07-10 | 2003-08-25 | 住友ベークライト株式会社 | 被研磨物保持材及びその製造方法 |
KR20020018708A (ko) | 2000-09-04 | 2002-03-09 | 구광시 | 자기기록매체의 제조방법 |
KR100398141B1 (ko) * | 2000-10-12 | 2003-09-13 | 아남반도체 주식회사 | 화학적 기계적 연마 슬러리 조성물 및 이를 이용한반도체소자의 제조방법 |
JP5114113B2 (ja) * | 2007-07-02 | 2013-01-09 | スピードファム株式会社 | ワークキャリア |
KR100890458B1 (ko) | 2007-07-27 | 2009-03-26 | (주식회사)문창 | 스테인레스 강판제 물탱크 |
JP2009260272A (ja) * | 2008-03-25 | 2009-11-05 | Panasonic Corp | 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法 |
JP2010179375A (ja) | 2009-02-03 | 2010-08-19 | Sumco Corp | 被研磨物キャリア及び研磨製品の製造方法 |
JP5578704B2 (ja) * | 2010-03-09 | 2014-08-27 | Shマテリアル株式会社 | 半導体素子搭載用基板及びその製造方法 |
JP2012169316A (ja) * | 2011-02-10 | 2012-09-06 | Think Laboratory Co Ltd | エッチングマスク付基材及びその製造方法 |
WO2015080295A1 (ja) * | 2013-11-29 | 2015-06-04 | Hoya株式会社 | 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法 |
CN104759983A (zh) * | 2015-02-11 | 2015-07-08 | 苏州新美光纳米科技有限公司 | 游星轮 |
CN205835021U (zh) * | 2016-07-18 | 2016-12-28 | 湖南普照信息材料有限公司 | 游星轮 |
JP6800402B2 (ja) * | 2016-10-06 | 2020-12-16 | スピードファム株式会社 | ワークキャリア及びワークキャリアの製造方法 |
CN107457689B (zh) * | 2017-10-03 | 2024-04-05 | 德清晶生光电科技有限公司 | 用于单面打磨的游星轮 |
-
2017
- 2017-03-30 JP JP2017068834A patent/JP6792106B2/ja active Active
-
2018
- 2018-03-08 KR KR1020180027540A patent/KR102447660B1/ko active IP Right Grant
- 2018-03-26 CN CN201810250478.8A patent/CN108687656B/zh active Active
- 2018-03-26 TW TW107110240A patent/TWI723256B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102447660B1 (ko) | 2022-09-26 |
TWI723256B (zh) | 2021-04-01 |
JP2018167383A (ja) | 2018-11-01 |
CN108687656B (zh) | 2021-05-28 |
TW201836768A (zh) | 2018-10-16 |
KR20180111523A (ko) | 2018-10-11 |
CN108687656A (zh) | 2018-10-23 |
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