TWI723256B - 工件遊星輪及工件遊星輪的製造方法 - Google Patents

工件遊星輪及工件遊星輪的製造方法 Download PDF

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Publication number
TWI723256B
TWI723256B TW107110240A TW107110240A TWI723256B TW I723256 B TWI723256 B TW I723256B TW 107110240 A TW107110240 A TW 107110240A TW 107110240 A TW107110240 A TW 107110240A TW I723256 B TWI723256 B TW I723256B
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TW
Taiwan
Prior art keywords
workpiece
planetary wheel
front side
hole
recesses
Prior art date
Application number
TW107110240A
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English (en)
Chinese (zh)
Other versions
TW201836768A (zh
Inventor
杉山將貴
Original Assignee
日商創技股份有限公司
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Publication date
Application filed by 日商創技股份有限公司 filed Critical 日商創技股份有限公司
Publication of TW201836768A publication Critical patent/TW201836768A/zh
Application granted granted Critical
Publication of TWI723256B publication Critical patent/TWI723256B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Gears, Cams (AREA)
  • Catalysts (AREA)
TW107110240A 2017-03-30 2018-03-26 工件遊星輪及工件遊星輪的製造方法 TWI723256B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017068834A JP6792106B2 (ja) 2017-03-30 2017-03-30 ワークキャリア及びワークキャリアの製造方法
JP2017-068834 2017-03-30

Publications (2)

Publication Number Publication Date
TW201836768A TW201836768A (zh) 2018-10-16
TWI723256B true TWI723256B (zh) 2021-04-01

Family

ID=63844586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107110240A TWI723256B (zh) 2017-03-30 2018-03-26 工件遊星輪及工件遊星輪的製造方法

Country Status (4)

Country Link
JP (1) JP6792106B2 (ko)
KR (1) KR102447660B1 (ko)
CN (1) CN108687656B (ko)
TW (1) TWI723256B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102434418B1 (ko) * 2022-03-10 2022-08-22 (주)뉴이스트 반도체 웨이퍼의 연마 공정에 사용되는 캐리어 제조 방법
CN115847281A (zh) * 2022-12-07 2023-03-28 西安奕斯伟材料科技有限公司 一种硅片的双面抛光用的载具以及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000024912A (ja) * 1998-07-10 2000-01-25 Kishida Seisakusho:Kk 脆性薄板の平面研磨における保持装置
JP2009012086A (ja) * 2007-07-02 2009-01-22 Speedfam Co Ltd ワークキャリア
WO2015080295A1 (ja) * 2013-11-29 2015-06-04 Hoya株式会社 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法
CN205835021U (zh) * 2016-07-18 2016-12-28 湖南普照信息材料有限公司 游星轮

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3086591B2 (ja) 1994-06-15 2000-09-11 三洋電機株式会社 監視用ビデオカメラ
JPH10135137A (ja) * 1996-10-31 1998-05-22 Semiconductor Energy Lab Co Ltd 結晶性半導体作製方法
JP2001179615A (ja) * 1999-12-27 2001-07-03 Seiko Epson Corp 研磨用キャリア、表面研磨装置及び表面研磨方法
AU2001271022B2 (en) * 2000-07-05 2006-08-17 Astellas Pharma Inc. Propane-1,3-dione derivatives
MY118114A (en) * 2000-07-10 2004-08-30 Sumitomo Bakelite Co Holder for polished work and manufacturing method thereof
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
KR20020018708A (ko) 2000-09-04 2002-03-09 구광시 자기기록매체의 제조방법
KR100398141B1 (ko) * 2000-10-12 2003-09-13 아남반도체 주식회사 화학적 기계적 연마 슬러리 조성물 및 이를 이용한반도체소자의 제조방법
KR100890458B1 (ko) 2007-07-27 2009-03-26 (주식회사)문창 스테인레스 강판제 물탱크
JP2009260272A (ja) * 2008-03-25 2009-11-05 Panasonic Corp 基板の加工方法および半導体チップの製造方法ならびに樹脂接着層付き半導体チップの製造方法
JP2010179375A (ja) 2009-02-03 2010-08-19 Sumco Corp 被研磨物キャリア及び研磨製品の製造方法
JP5578704B2 (ja) * 2010-03-09 2014-08-27 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
JP2012169316A (ja) * 2011-02-10 2012-09-06 Think Laboratory Co Ltd エッチングマスク付基材及びその製造方法
CN104759983A (zh) * 2015-02-11 2015-07-08 苏州新美光纳米科技有限公司 游星轮
JP6800402B2 (ja) * 2016-10-06 2020-12-16 スピードファム株式会社 ワークキャリア及びワークキャリアの製造方法
CN107457689B (zh) * 2017-10-03 2024-04-05 德清晶生光电科技有限公司 用于单面打磨的游星轮

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000024912A (ja) * 1998-07-10 2000-01-25 Kishida Seisakusho:Kk 脆性薄板の平面研磨における保持装置
JP2009012086A (ja) * 2007-07-02 2009-01-22 Speedfam Co Ltd ワークキャリア
WO2015080295A1 (ja) * 2013-11-29 2015-06-04 Hoya株式会社 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法
CN205835021U (zh) * 2016-07-18 2016-12-28 湖南普照信息材料有限公司 游星轮

Also Published As

Publication number Publication date
JP2018167383A (ja) 2018-11-01
JP6792106B2 (ja) 2020-11-25
CN108687656B (zh) 2021-05-28
TW201836768A (zh) 2018-10-16
CN108687656A (zh) 2018-10-23
KR102447660B1 (ko) 2022-09-26
KR20180111523A (ko) 2018-10-11

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