TWI723256B - Workpiece carrier and manufacturing method of workpiece carrier - Google Patents
Workpiece carrier and manufacturing method of workpiece carrier Download PDFInfo
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- TWI723256B TWI723256B TW107110240A TW107110240A TWI723256B TW I723256 B TWI723256 B TW I723256B TW 107110240 A TW107110240 A TW 107110240A TW 107110240 A TW107110240 A TW 107110240A TW I723256 B TWI723256 B TW I723256B
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- workpiece
- planetary wheel
- front side
- hole
- recesses
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 83
- 239000011347 resin Substances 0.000 claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 51
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- 239000000057 synthetic resin Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 238000003780 insertion Methods 0.000 claims description 72
- 230000037431 insertion Effects 0.000 claims description 72
- 238000000034 method Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 abstract description 3
- 238000000227 grinding Methods 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000010354 integration Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910001315 Tool steel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 241001425726 Vindula arsinoe Species 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
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- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
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- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Catalysts (AREA)
- Gears, Cams (AREA)
Abstract
Description
本發明係有關一種藉由研磨裝置研磨加工氧化物晶圓、矽晶圓、玻璃、藍寶石、陶瓷、水晶等薄板狀的工件時,用於保持工件之工件遊星輪及工件遊星輪的製造方法。 The invention relates to a method for manufacturing a workpiece star wheel and a workpiece star wheel for holding the workpiece when a thin plate-shaped workpiece such as oxide wafer, silicon wafer, glass, sapphire, ceramic, crystal, etc. is polished by a grinding device.
習知藉由研磨裝置研磨加工矽晶圓等工件的雙面或單面時,在具有工件保持孔的工件遊星輪保持工件(參見專利文獻1至4等)。
It is known that when both sides or one side of a workpiece such as a silicon wafer is polished by a polishing device, the workpiece is held by a workpiece pinion wheel having a workpiece holding hole (see
由於成為工件遊星輪之本體的遊星輪基板係由SK鋼或不銹鋼等硬質的金屬材料所形成,因此,直接將工件保持在遊星輪基板上鑽出的工件保持孔時,研磨加工中工件接觸到工件保持孔之內周面,工件會有產生裂痕或欠缺等損傷之虞。 Since the planetary wheel substrate that becomes the body of the workpiece planetary wheel is formed of hard metal materials such as SK steel or stainless steel, when the workpiece is directly held in the workpiece holding hole drilled on the planetary wheel substrate, the workpiece touches during the grinding process. The inner peripheral surface of the workpiece holding hole may be damaged by cracks or defects.
在此,如專利文獻1至4所揭示,沿著工件保持孔之內周面安裝合成樹脂製之軟質的插入部,進行防止研磨加工中之工件的損傷之處理。
Here, as disclosed in
專利文獻1記載,工件保持孔之內周面在圓周方向隔開間距設置突出部,藉由射出成型於突出部之間也填充樹脂部,使樹脂部與金屬板一體化。進一步,藉由在突出部的上方部分及下方部分形成倒角部,成為可以防止樹脂部在上下方向掉落而脫落之結構。
另外,專利文獻2記載,藉由沿著遊星輪基板的工件保持孔之內周面設置溝,以合成樹脂材料滑入其溝之方式進行射出成型,而設置軟質之環狀的插入部。
In addition,
另一方面,專利文獻3記載,藉由在徑方向將形成工件保持孔之遊星輪本體的內壁面製成凹形狀,縮短插入部之上面部及下面部之徑方向的長度,並減少插入部之磨損或變形的結構。
On the other hand,
進一步,專利文獻4揭示使用於薄物的工件之研磨加工的金屬遊星輪。雖然在此種金屬遊星輪的工件保持孔中也設置有樹脂塗佈保持部(插入部),但是在金屬遊星輪以樹脂塗佈保持部不會剝離之方式設置小徑的孔,該孔被填充成為樹脂塗佈保持部的一部分之樹脂。 Furthermore, Patent Document 4 discloses a metal star wheel used for grinding and processing thin workpieces. Although the resin coating holding part (insertion part) is also provided in the workpiece holding hole of this metal star wheel, the metal star wheel is provided with a small diameter hole so that the resin coating holding part will not peel off. Fill with the resin that becomes a part of the resin coating holding portion.
[先前技術文獻] [Prior Technical Literature]
[專利文獻1]日本特開第2002-18708號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2002-18708
[專利文獻2]日本特開第2009-12086號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2009-12086
[專利文獻3]日本特開第2010-179375號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2010-179375
[專利文獻4]日本實用新案登錄第3086591號公報 [Patent Document 4] Japanese Utility Model Registration No. 3086591 Bulletin
然而,專利文獻1、2中揭示的工件遊星輪係平面視凹凸地加工遊星輪基板的工件保持孔之內周面,由於在成為突出部的部分之上面或下面形成倒角以減薄厚度,而使得突出部容易變形。因此,此種加工難以適用於如專利文獻4所揭示之薄物用的工件遊星輪。
However, the workpiece planetary gear trains disclosed in
因此,本發明之目的在於提供一種即使遊星輪基板薄時,也可以防止樹脂插入部之徑方向的脫離或表背方向的掉落等脫落之工件遊星輪及工件遊星輪的製造方法。 Therefore, the object of the present invention is to provide a workpiece planetary wheel and a method of manufacturing a workpiece planetary wheel that can prevent the resin insertion part from being detached in the radial direction or falling off in the front and back direction even when the planetary wheel substrate is thin.
為了達成前述目的,本發明之工件遊星輪係沿著形成在金屬製之遊星輪基板上的工件保持孔之內周面設置樹脂插入部,其中,在成為前述工件保持孔的外緣部之前述遊星輪基板上,於圓周方向交替地形成有分別向表背方向凹陷之表側凹部及背側凹部,且,通孔部係設置為與前述表側凹部及背側凹部連續並貫穿前述表背方向,且沿著前述表側凹部、背側凹部及通孔部以及前述工件保持孔之內周面的部分填充有成為樹脂插入部之合成樹脂材料。 In order to achieve the foregoing object, the workpiece planetary gear system of the present invention is provided with a resin insertion portion along the inner peripheral surface of the workpiece holding hole formed on the metal planetary planetary plate, wherein the outer edge portion of the workpiece holding hole becomes the aforementioned The planetary wheel substrate is alternately formed in the circumferential direction with front side recesses and back side recesses respectively recessed in the front and back direction, and the through holes are provided to be continuous with the front side recesses and the back side recesses and penetrate the front and back directions, And the part along the inner peripheral surface of the said front side recessed part, back side recessed part, and through-hole part, and the said workpiece|work holding hole is filled with the synthetic resin material which becomes a resin insertion part.
在此,前述表側凹部及前述背側凹部較佳為設置在圓周方向隔開間距。又,可以是前述通孔部設置在每個前述表側凹部及前述背側凹部之間的結構。 Here, it is preferable that the said front side recessed part and the said back side recessed part are provided with the space|interval in the circumferential direction. Furthermore, it may be a structure in which the said through-hole part is provided between each of the said front side recessed part and the said back side recessed part.
進一步,可以是在前述表側凹部及背側凹部的底面設置突起部或孔部,並在前述突起部的周圍或前述孔部的內部填充前述樹脂插入部之一部分的結構。並且,可以是在前述表側凹部及背側凹部之前述工件保持孔的中心側設置狹窄部的結構。 Further, it is possible to provide protrusions or holes on the bottom surfaces of the front and back recesses, and fill a part of the resin insertion portion around the protrusions or inside the holes. Furthermore, it may be a structure in which a narrow part is provided in the center side of the said workpiece|work holding hole of the said front side recessed part and a back side recessed part.
進一步,工件遊星輪的製造方法的發明具備:遮罩形成工序,用以以預定的繪製圖案在前述遊星輪基板的表面及背面形成遮罩;附著工序,用以使蝕刻液附著於形成遮罩之前述遊星輪基板上;及設置工序,用以對藉由前述蝕刻液加工之前述遊星輪基板設置前述樹脂插入部。 Furthermore, the invention of the manufacturing method of the workpiece planetary wheel includes: a mask forming process for forming a mask on the surface and back of the planetary wheel substrate with a predetermined drawing pattern; and an attaching process for attaching an etching solution to the forming mask On the planetary wheel substrate; and a setting process for setting the resin insertion portion on the planetary wheel substrate processed by the etching solution.
此種結構的本發明之工件遊星輪,係於工件保持孔之外緣部的圓周方向交替地設置分別向表背方向凹陷之表側凹部及背側凹部。因此,藉由填充在表側凹部及背側凹部的合成樹脂材料,可以防止樹脂插入部在表背方向掉落。 The workpiece planetary wheel of the present invention with such a structure is arranged alternately in the circumferential direction of the outer edge of the workpiece holding hole with front side recesses and back side recesses respectively recessed in the front and back direction. Therefore, the synthetic resin material filled in the front-side recesses and the back-side recesses can prevent the resin insertion portion from falling in the front-back direction.
另外,由於通孔部係設置為與表側凹部及背側凹部連續並貫穿表背方向並被填充合成樹脂材料,因此,除了可以防止樹脂插入部之徑方向的脫離以外,還可以使樹脂插入部難以剝離。 In addition, since the through hole is provided to be continuous with the front and back recesses and penetrates the front and back directions and is filled with synthetic resin material, in addition to preventing the resin insertion part from detaching in the radial direction, the resin insertion part can also be made It is difficult to peel off.
進一步,由於表側凹部及背側凹部並未向工件保持孔的中心突出於徑方向,因此,即使遊星輪基板薄時也可以適用。尤其是藉由在圓周方向隔開間距設置表側凹部及背側凹部,變成在表側凹部及背側凹部的兩側殘餘全部厚度之遊星輪基板,可以使遊星輪基板更難以產生變形。 Furthermore, since the front-side concave portion and the back-side concave portion do not protrude in the radial direction toward the center of the workpiece holding hole, it can be applied even when the planetary wheel substrate is thin. In particular, by providing the front side recesses and the back side recesses at intervals in the circumferential direction, it becomes the cruise star board with the entire thickness remaining on both sides of the front side recesses and the back side recesses, making it more difficult to deform the cruise ship board.
另外,藉由在每個表側凹部及背側凹部之間設置通孔部,透過通孔部所有的表側凹部及背側凹部在圓周方向連續地一體化,因此可以使樹脂插入部更難以剝離。 In addition, by providing a through hole between each of the front side recesses and the back side recesses, all the front side recesses and the back side recesses passing through the through hole are continuously integrated in the circumferential direction, so that the resin insertion part can be made more difficult to peel off.
進一步,藉由在表側凹部及背側凹部的底面設置突起部或孔部,在其周圍或孔部的內部填充樹脂插入部之一部分,可以確實地抑制樹脂插入部之徑方向的移動,提高與遊星輪基板之一體性。 Furthermore, by providing protrusions or holes on the bottom surfaces of the front and back recesses, and filling a part of the resin insertion portion around or inside the holes, the radial movement of the resin insertion portion can be reliably suppressed, and the A physical nature of the base plate of the cruiser.
另外,藉由在表側凹部及背側凹部之工件保持孔的中心側設置狹窄部,可以確實地抑制樹脂插入部之徑方向的移動,提高與遊星輪基板之一體性。 In addition, by providing a narrow part on the center side of the workpiece holding hole of the front side recess and the back side recess, the radial movement of the resin insertion part can be reliably suppressed, and the integration with the planetary wheel substrate can be improved.
進一步,藉由工件遊星輪之製造方法的發明,可以藉由經過使蝕刻液附著於以預定的繪製圖案形成遮罩之遊星輪基板並進行蝕刻加工,設置樹脂插入部的工序,可以有效地製造遊星輪基板及樹脂插入部之一體性高的工件遊星輪。 Furthermore, with the invention of the manufacturing method of the workpiece planetary wheel, the etching solution can be applied to the planetary wheel substrate with the mask formed in a predetermined drawing pattern, and then the etching process is carried out, and the resin insertion part can be provided, which can be effectively manufactured. The planetary wheel base plate and the resin insert part is a high-integrity workpiece planetary wheel.
1、1A、1B、1C:遊星輪基板 1. 1A, 1B, 1C: base plate of cruise ship
2:工件保持孔 2: Workpiece holding hole
3、3A、3B、3C:樹脂插入部 3. 3A, 3B, 3C: resin insert
4A、4C、6A、7A:表側凹部 4A, 4C, 6A, 7A: surface side recess
4B、4D、6B、7B:背側凹部 4B, 4D, 6B, 7B: dorsal recess
5A、5B:遮罩部 5A, 5B: Mask part
8、8A:通孔部 8, 8A: Through hole
10:工件遊星輪 10: Workpiece star wheel
11:外形部 11: Appearance Department
13:外緣部 13: Outer edge
31:圓環部 31: Ring part
32、34、36:填充部 32, 34, 36: filling part
33、33A:孔填充部 33, 33A: Hole filling part
35:柱狀部 35: columnar part
41、61:底面 41, 61: Bottom
42:圓柱部(突起部) 42: Cylindrical part (protruding part)
62:圓筒部(孔部) 62: Cylinder part (hole part)
71:側面 71: side
為讓本發明之敘述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下: 圖1A係將本實施形態之工件遊星輪的工件保持孔之外緣部附近擴大以說明的平面圖;圖1B係將本實施形態之工件遊星輪的工件保持孔之外緣部附近擴大以說明的立體圖;圖2係說明工件遊星輪之大致結構的平面圖;圖3A係用以說明本實施形態之工件遊星輪的製造方法之工序的遊星輪基板之表面的平面圖;圖3B係用以說明本實施形態之工件遊星輪的製造方法之工序的遊星輪基板之背面的平面圖;圖4A係從圖3A之A-A箭頭方向看的剖面圖;圖4B係從圖3B之B-B箭頭方向看的剖面圖;圖5係顯示遊星輪基板與樹脂插入部被一體化之狀態的立體圖;圖6係將實施例1之工件遊星輪的工件保持孔之外緣部附近擴大以說明的立體圖;圖7A係從圖6之C-C箭頭方向看的剖面圖;圖7B係從圖6之D-D箭頭方向看的剖面圖;圖8係將實施例2之工件遊星輪的工件保持孔之外緣部附近擴大以說明的立體圖;圖9A係說明圖8之E-E箭頭方向的位置中在實施例2的工件保持孔之內周面設置樹脂插入部的結構之剖面圖;圖9B係說明圖8之F-F箭頭方向的位置中在實施例2的工件保持孔之內周面設置樹脂插入部的結構之剖面圖;以及圖10係將實施例3之工件遊星輪的工件保持孔之外緣部附近擴大以說明的平面圖。 In order to make the description of the present invention and other objectives, features, advantages and embodiments more comprehensible, the description of the accompanying drawings is as follows: Fig. 1A is a plan view showing the vicinity of the outer edge of the workpiece holding hole of the workpiece planetary wheel of this embodiment enlarged for explanation; Fig. 1B is an enlarged view of the vicinity of the outer edge of the workpiece holding hole of the workpiece planetary wheel of this embodiment for explanation 3D view; Figure 2 is a plan view illustrating the general structure of the workpiece star wheel; Figure 3A is a plan view of the surface of the star wheel substrate used to illustrate the steps of the manufacturing method of the workpiece star wheel of this embodiment; Figure 3B is used to illustrate this embodiment Figure 4A is a cross-sectional view from the direction of arrow AA in Figure 3A; Figure 4B is a cross-sectional view from the direction of arrow BB in Figure 3B; Figure 4A is a cross-sectional view from the direction of arrow AA in Figure 3A; Figure 4B is a cross-sectional view from the direction of arrow BB in Figure 3B; 5 is a perspective view showing the state where the planetary wheel base plate and the resin insertion part are integrated; FIG. 6 is a perspective view showing the vicinity of the outer edge of the workpiece holding hole of the workpiece planetary wheel of Example 1 enlarged for explanation; FIG. 7A is from FIG. 6 Fig. 7B is a cross-sectional view from the direction of the DD arrow in Fig. 6; Fig. 8 is an enlarged perspective view of the vicinity of the outer edge of the workpiece holding hole of the workpiece planetary wheel of Example 2 for explanation; 9A is a cross-sectional view illustrating a structure in which a resin insertion portion is provided on the inner peripheral surface of the workpiece holding hole of Example 2 in the position of the EE arrow in FIG. 8; FIG. 9B is a sectional view illustrating the position in the FF arrow direction of FIG. 8 The cross-sectional view of the structure in which the resin insertion portion is provided on the inner peripheral surface of the workpiece holding hole of Example 2; and FIG. 10 is a plan view illustrating the vicinity of the outer edge of the workpiece holding hole of the workpiece planetary wheel of Example 3 in an enlarged manner.
以下,參見圖式說明本發明之實施形態。圖1A、1B及圖2係說明本實施形態之工件遊星輪10的結構之圖,圖2係顯示全體之大致結構,圖1A及圖1B係擴大顯示工件保持孔2的外緣部13附近。
Hereinafter, the embodiments of the present invention will be described with reference to the drawings. 1A, 1B and FIG. 2 are diagrams illustrating the structure of the workpiece
工件遊星輪10係安裝於研磨加工薄板狀的工件之雙面或單面的平面研磨裝置而使用。例如,研磨加工工件之雙面的平面研磨裝置具備:定盤之上定盤及下定盤、配置於此上定盤及下定盤的中心部之太陽齒輪、及配置於上定盤及下定盤的外周側之內齒輪。上定盤、下定盤、太陽齒輪及內齒輪分別自由旋轉。
The workpiece
另外,如圖2所示之工件遊星輪10係配置於平面研磨裝置的上定盤與下定盤之間。工件遊星輪10係由金屬製之遊星輪基板1形成圓板狀的本體。在此遊星輪基板1鑽出例如複數的圓形之工件保持孔2,‧‧‧。並且,沿著工件保持孔2之內周面設置樹脂插入部3。
In addition, the workpiece
在此工件遊星輪10中,在外形部11上設置有與太陽齒輪及內齒輪嚙合之齒部(省略圖式),藉由太陽齒輪及內齒輪的旋轉而進行自轉及公轉。並且,藉由工件遊星輪10的自轉及公轉,配置於工件遊星輪10之工件保持孔2內之工件的雙面藉由上定盤與下定盤被研磨。
In the workpiece
由金屬板以圓板狀切出遊星輪基板1。可以使用不銹鋼(SUS)、高碳鉻軸承鋼、碳工具鋼(SK鋼)、高速度工具鋼、合金工具鋼、高張力鋼、鈦等作為金屬板。
The star
尤其是研磨加工薄板狀的工件時,使用薄的遊星輪基板1。例如,使用0.1mm至1.0mm左右的厚度(表背方向的高度)之遊星輪基板1。另外,
因應工件的厚度使用0.7mm以下,進一步使用0.5mm以下的厚度之薄的遊星輪基板1。
In particular, when polishing a thin-plate-shaped workpiece, a thin
另一方面,藉由合成樹脂材料成型樹脂插入部3。作為合成樹脂材料,可以使用聚醯胺(PA)、聚縮醛(POM)、聚醯亞胺(PI)、聚氯乙烯(PVC)、聚醯胺醯亞胺(PAI)、聚碳酸酯(PC)、環氧(EP)等樹脂或玻璃環氧、布烘烤樹脂(Cloth-inserted bakelite)等纖維強化塑膠等。
On the other hand, the
在藉由如後述之射出成型設置樹脂插入部3的情況,使用熱可塑性樹脂。另外,在藉由熱壓接合設置樹脂插入部3的情況,使用熱硬化性樹脂。
When the
在成為本實施形態之工件保持孔2的外緣部13之遊星輪基板1中,為提高與樹脂插入部3之一體性,如圖1A及圖1B所示,於圓周方向交替地形成分別向表背方向凹陷之表側凹部4A及背側凹部4B。
In the star
以從遊星輪基板1的表側向背側凹陷之平面視時,表側凹部4A形成為長方形狀。表側凹部4A之表背方向的深度成為遊星輪基板1之厚度的一半左右。
When viewed in a plan view recessed from the front side to the back side of the
另一方面,從表側凹部4A在工件保持孔2的圓周方向隔開間距設置背側凹部4B,以從遊星輪基板1的背側向表側凹陷之平面視時,背側凹部4B形成為長方形狀的。背側凹部4B之表背方向的深度成為遊星輪基板1之厚度的一半左右。
On the other hand, the back side recesses 4B are provided at intervals in the circumferential direction of the
在此,由於以平面視之方式看時表側凹部4A及背側凹部4B之間分離,因此,其之間殘存全部厚度之遊星輪基板1的本體。亦即,雖然表側凹部4A及背側凹部4B係工件保持孔2的中心側開放,但是除了後述之角落部附近之外,圓周方向的兩側及徑方向的深側為被遊星輪基板1的本體支持之狀態。
Here, since the front side recessed
並且,在每個表側凹部4A及背側凹部4B之間,設置有通孔部8。此通孔部8係貫穿表背方向的孔,在表側凹部4A及背側凹部4B處分別形成連續之空間。
In addition, a through
詳細而言,通孔部8係以連接表側凹部4A之遠側(與工件保持孔2之中心為相反側)的角落部及背側凹部4B之遠側的角落部之方式,例如形成平面視橢圓狀。因此,在表側凹部4A(或背側凹部4B)及通孔部8重疊的位置,從遊星輪基板1的表側向背側(或從遊星輪基板1的背側向表側)之凹陷欠缺而成為貫穿的孔。另外,也可以以與表側凹部4A(或背側凹部4B)接觸之方式設置通孔部。在此情況下,從遊星輪基板1的表側向背側(或從遊星輪基板1的背側向表側)之凹陷不產生欠缺。
In detail, the through-
如圖5所示,在此通孔部8中,以成為樹脂插入部3的一部分之方式合成樹脂材料被填充而形成孔填充部33,成為阻止樹脂插入部3的徑方向之移動的抵抗部。由於孔填充部33與遊星輪基板1的厚度為相同厚度,因此,可以作為強力的卡止部。
As shown in FIG. 5, in this through-
亦即,樹脂插入部3係由形成為與工件保持孔2的直徑大致相同的直徑之環狀的圓環部31、形成於表側凹部4A及背側凹部4B的內空之複數之長方體狀的填充部32,‧‧‧、及形成於通孔部8之內部空間的複數之孔填充部33,‧‧‧所構成。此圓環部31、複數之填充部32,‧‧‧、複數之孔填充部33,‧‧‧係藉由合成樹脂材料一體地成型。
That is, the
然後,一邊參見圖3A、3B及圖4A、4B一邊說明本實施形態之工件遊星輪10的製造方法。
首先,在遊星輪基板1的表面及背面以預定的繪製圖案進行遮罩形成。詳細而言,使用以CAD/CAM系統等製作的數據,從雷射繪圖機等製作高精度之繪製圖案的原版。
Next, referring to FIGS. 3A and 3B and FIGS. 4A and 4B, the method of manufacturing the workpiece
另外,對遊星輪基板1的表面及背面進行用以除去氧化膜之酸處理或電解研磨等前處理。然後,在遊星輪基板1的表面及背面之整面分別塗佈光阻劑。
In addition, the front and back surfaces of the
並且,使用繪製圖案的原版,對藉由光阻劑塗佈之遊星輪基板1的表面及背面曝光,並進行烘焙。圖示之遮罩部5A、5B顯示烘焙後顯影而殘餘的光阻劑層。
And, using the original plate with the drawing pattern, the surface and the back surface of the
簡而言之,如圖3A及圖4A所示,在遊星輪基板1的表面上,複數之表側凹部4A,‧‧‧及複數之通孔部8,‧‧‧以外成為遮罩部5A。另外,如圖3B及圖4B所示,在遊星輪基板1的背面上,複數之背側凹部4B,‧‧‧及通孔部8以外成為遮罩部5B。
In short, as shown in FIGS. 3A and 4A, on the surface of the planetary
進一步,對形成遮罩之遊星輪基板1的表面及背面噴霧蝕刻液並使其附著。藉由此蝕刻液的附著,遮罩部5A、5B以外之遊星輪基板1的露出面被去除,成為形成向表背方向凹陷之表側凹部4A及背側凹部4B、以及貫穿表背方向之通孔部8。
Furthermore, the etching liquid is sprayed and adhered to the surface and the back surface of the
表側凹部4A及背側凹部4B被溶解至所期望的深度,在通孔部8貫穿的階段,貫穿除去遮罩部5A、5B,進行清洗及乾燥。如圖1B所示,在到此為止的工序中,在遊星輪基板1之工件保持孔2的外緣部13形成表側凹部4A、背側凹部4B、及通孔部8。
The front side recessed
對藉如此蝕刻加工的遊星輪基板1的複數之工件保持孔2,‧‧‧之內周面設置樹脂插入部3。藉由合成樹脂材料的射出成型或熱壓接合設置樹脂插入部3。
For the plural
在射出成型時,在成為工件保持孔2的內側面之位置設置模板,在該模板與遊星輪基板1的外緣部13之間的空間中將加熱熔融之合成樹脂材料射出注入,藉由冷卻使其固化。由於通孔部8係形成為連續於表側凹部4A及背側凹部4B,因此,合成樹脂材料可以流入。另一方面,熱壓接合的話,可以藉由將預浸料層合成所期望的形狀,並進行加熱加壓的擠壓,而設置樹脂插入部3。
During injection molding, a template is set at the position that becomes the inner surface of the
以下,說明本實施形態之工件遊星輪10及工件遊星輪10的製造方法之作用。此種結構的本實施形態之工件遊星輪10係將向表背方向分別凹陷之表側凹部4A及背側凹部4B交替地設置在工件保持孔2的外緣部13之圓周方向。進一步,設置通孔部8,其與表側凹部4A及背側凹部4B連續並貫穿表背方向。
Hereinafter, the function of the manufacturing method of the workpiece
在此表側凹部4A、背側凹部4B、與通孔部8分別設置樹脂插入部3的一部分之填充部32、32及孔填充部33,則可以防止樹脂插入部3在圓周方向移動(位移)。
The front side recessed
進一步,由於藉由在遊星輪基板1的表側及背側的雙方上,於圓周方向交替地形成表側凹部4A及背側凹部4B,在該內部空間分別設置填充部32、32,遊星輪基板1被填充部32、32夾住,因此,可以對遊星輪基板1的表面和背面之任一方向防止樹脂插入部3脫落。例如,在藉由射出成型或熱壓接合設置樹脂插入部3之情形,雖然在冷卻使其固化時會引起收縮,但是只要是在遊星輪基板1的雙面上設置藉由表側凹部4A及背側凹部4B的填充部32、32,則即使樹脂插入部3稍微収縮也可以防止脫落。
Furthermore, since the front side recesses 4A and the back side recesses 4B are alternately formed in the circumferential direction on both the front side and the back side of the planetary
另外,設置在貫穿表背方向之通孔部8的孔填充部33成為阻止樹脂插入部3之徑方向的移動之抵抗部。亦即,即使樹脂插入部3產生收縮等,像是可能引起向工件保持孔2的中心之徑方向的位移的情況下,也可以是孔填充部33成為卡止部而防止脫落(剝離)。
In addition, the
進一步,由於表側凹部4A及背側凹部4B未向如凸齒之工件保持孔2的中心突出於徑方向,因此,即使遊星輪基板1薄時也可以適用。例如,可以適用於用於薄板狀的工件之研磨加工的1.0mm以下之遊星輪基板1。另外,可以適用於用於更薄之工件的研磨加工之情形的0.7mm以下,進一步即使0.5mm以下之厚度的薄的遊星輪基板1也可以適用。
Furthermore, since the front side recessed
本實施形態之工件遊星輪10中,由於在圓周方向將表側凹部4A及背側凹部4B隔開間距設置,在表側凹部4A及背側凹部4B的兩側分別殘餘全部厚度之遊星輪基板1。因此,成為更薄厚度之表側凹部4A及背側凹部4B變成被兩側及遠側的三邊(除了角落部附近)支持而難以產生變形。
In the workpiece
另外,藉由在每個表側凹部4A及背側凹部4B之間設置通孔部8,可以使樹脂插入部3更難以產生剝離。亦即,雖然露出於研磨面的樹脂插入部3在研磨加工時相較遊星輪基板1容易產生磨損或變形,但是只要是如形成於通孔部8的孔填充部33與遊星輪基板1為相同厚度,就可以使其即使重複用於研磨加工也難以產生樹脂插入部3的剝離。
In addition, by providing the through
進一步,只要是透過此種孔填充部33,使所有的表側凹部4A及背側凹部4B在遊星輪基板1的內部側(與工件保持孔2之中心為相反側)也與圓周方向連續而一體化,就可以使樹脂插入部3更難以剝離。
Furthermore, as long as the
並且,藉由本實施形態之工件遊星輪10的製造方法,藉由經過使蝕刻液附著於以預定的繪製圖案形成遮罩之遊星輪基板1上並進行蝕刻加
工,設置樹脂插入部3的工序,可以有效地製造遊星輪基板1與樹脂插入部3之一體性高的工件遊星輪10。
In addition, with the method of manufacturing the workpiece
以下,一邊參見圖6、圖7A、圖7B一邊說明與前述實施形態說明之工件遊星輪10為另一形態的實施例1。另外,使用相同用語或相同符號說明與前述實施形態中所說明之內容為相同或均等的部分。
Hereinafter, while referring to FIGS. 6, 7A, and 7B, the first embodiment in which the workpiece
在前述實施形態中,說明在通孔部8所形成的孔填充部33作為抵抗部。在本實施例1中,說明在表側凹部4C及背側凹部4D的底面41追加設置成為抵抗部之圓柱部42的情形。
In the foregoing embodiment, the
如圖6所示,本實施例1之遊星輪基板1A中,在表側凹部4C及背側凹部4D上,設置圓柱部42於平面視之大致中央。此圓柱部42為從表側凹部4C(或背側凹部4D)的底面41向上方(或下方)延伸之突起部。此圓柱部42的高度與表側凹部4C(或背側凹部4D)的深度相等,為遊星輪基板1A的一半左右。
As shown in FIG. 6, in the
如圖7A及圖7B所示,在此圓柱部42的周圍以成為樹脂插入部3A的一部分之方式填充合成樹脂材料而形成填充部32時,圓柱部42成為阻止樹脂插入部3A之徑方向的移動之抵抗部。
As shown in FIGS. 7A and 7B, when the
作為此抵抗部之功能的高度(效果)因突起部的形狀而不同。如圖7A及圖7B所示,圓柱部42之遠側(與工件保持孔2之中心為相反側)的側面與底面41所成之角度θ係約90°。此角度θ愈大阻止樹脂插入部3A之向工件保持孔2的中心方向之移動的功能愈高。此角度θ係70°以上為佳,更佳為90°以上,如果角度θ成為鈍角向遠側傾斜,可以作為更強力的卡止部。另外,圓柱部42的側面的形狀也不限定於以側面視呈直線狀者,也可以是曲線狀或有凹凸的形狀。
The height (effect) as the function of this resistance part differs depending on the shape of the protrusion. As shown in FIGS. 7A and 7B, the angle θ formed by the side surface of the distal side of the cylindrical portion 42 (the side opposite to the center of the workpiece holding hole 2) and the
進一步,設置於表側凹部4C及背側凹部4D之突起部的形狀不限定於圓柱狀,可以設置為長方體狀、多角柱狀等各種形狀。無論突起部為任何形狀,都能夠發揮阻止樹脂插入部3A之徑方向的移動之移動抑制功能。
Furthermore, the shape of the protrusions provided in the front side recessed
可以藉由在遮罩形成工序中,在成為表側凹部4C內的圓柱部42之處進行遮罩形成,在成為背側凹部4D內的圓柱部42之處進行遮罩形成,而形成此圓柱部42。
In the mask forming step, mask formation is performed at the place where the
在射出成型時,在成為工件保持孔2之內側面的位置設置模板,將加熱熔融之合成樹脂材料射出注入於該模板與遊星輪基板1A的外緣部13之間的空間,藉由冷卻使其固化。只要是突起部係圓柱部42就可以使合成樹脂材料無間隙地環繞。
During injection molding, a template is set at a position that becomes the inner side of the
另外,在表側凹部4C及背側凹部4D上追加設置圓柱部42而作為阻止樹脂插入部3A之徑方向的移動之抵抗部的話,即使樹脂插入部3A產生收縮等,像是可能引起向工件保持孔2的中心之徑方向之位移的情況下,也可以圓柱部42成為卡止部而防止脫離(剝離)。簡而言之,變成在孔填充部33的脫離防止功能上,添加了圓柱部42的效果。
In addition, if the
進一步,由於此圓柱部42係遊星輪基板1A本身,且藉由硬質的金屬材料形成,因此,可以變成對樹脂插入部3A的移動強力地抵抗,確實地阻止脫離或剝離。另外,實施例1之此其他的結構及作用效果與前述實施形態或其他的實施例大致相同而省略說明。
Furthermore, since the
以下,一邊參見圖8、圖9A、圖9B一邊說明與在前述實施形態及實施例1說明之工件遊星輪10為另一形態的實施例2。另外,使用相同用語
或相同符號說明與前述實施形態或實施例1中所說明之內容為相同或均等的部分。
Hereinafter, referring to Figs. 8, 9A, and 9B, the second embodiment in which the workpiece
在前述實施例1中,說明在表側凹部4C及背側凹部4D的底面41追加圓柱部42作為抵抗部的情形。在本實施例2中,說明在表側凹部6A及背側凹部6B的底面61上,設置圓筒部62取代圓柱部42作為成為抵抗部之孔部的情形。
In the foregoing
本實施例2之遊星輪基板1B中,在設置於工件保持孔2的外緣部13之表側凹部6A及背側凹部6B上,如圖8所示,設置圓筒部62於平面視之大致中央。此圓筒部62係從表側凹部6A(或背側凹部6B)的底面61向下方(或上方)的面貫穿之孔部。此圓筒部62的深度成為遊星輪基板1B的一半左右。
In the
如圖9A及圖9B所示,在此圓筒部62之內部以成為樹脂插入部3B的一部分之方式填充合成樹脂材料而形成柱狀部35時,柱狀部35成為阻止樹脂插入部3B之徑方向的移動之抵抗部。
As shown in FIGS. 9A and 9B, when the
樹脂插入部3B係由形成為環狀的圓環部31、形成在表側凹部6A及背側凹部6B的內部空間之複數之長方體狀的填充部34,‧‧‧、形成於複數之圓筒部62,‧‧‧的內部的複數之圓柱狀的柱狀部35,‧‧‧、形成在通孔部8的內部空間的複數之孔填充部33,‧‧‧所構成。此圓環部31、複數之填充部34,‧‧‧、複數之柱狀部35,‧‧‧、與複數之孔填充部33係藉由合成樹脂材料一體地成型。
The
此種結構的實施例2之工件遊星輪10係在工件保持孔2的外緣部13之圓周方向交替地設置分別向表背方向凹陷之表側凹部6A及背側凹部6B,並且,在表側凹部6A及背側凹部6B的圓筒部62設置樹脂插入部3B之一部分的柱狀部35。
The workpiece
即使樹脂插入部3B產生收縮等,像是可能引起向工件保持孔2的中心之徑方向的位移的情況下,向此圓筒部62的內部延伸之柱狀部35也可以成為卡止部而成為防止脫離之抵抗部。簡而言之,變成在孔填充部33的脫離防止功能上,添加了柱狀部35的效果。
Even if the
在此,設置於表側凹部6A及背側凹部6B之孔部的形狀不限定於圓筒狀,也可以設置成矩形圓柱狀、多邊形圓柱狀等各種形狀。無論孔部為任何形狀,都可以發揮阻止樹脂插入部3B之徑方向的移動之移動抑制功能。
Here, the shape of the hole provided in the front side recessed
並且,在實施例2之工件遊星輪10中,由於藉由設置在表側凹部6A及背側凹部6B的複數之填充部34,‧‧‧發揮圓周方向的旋轉停止功能及朝表背方向的掉落防止功能,並藉由設置在通孔部8的複數之孔填充部33,‧‧‧與設置在複數之圓筒部62,‧‧‧的複數之柱狀部35,‧‧‧發揮圓周方向的旋轉停止功能及徑方向的移動抑制功能,因此,可以確保與遊星輪基板1B及樹脂插入部3B的高一體性。另外,實施例2之此其他的結構及作用效果與前述實施形態或其他的實施例大致相同而省略說明。
Moreover, in the workpiece
以下,一邊參見圖10一邊說明與前述實施形態及實施例1、2所說明之工件遊星輪10為另一形態的實施例3。另外,使用相同用語或相同符號說明與前述實施形態或實施例1、2所說明之內容為相同或均等的部分。
Hereinafter, referring to FIG. 10, it will be described that the workpiece
在前述實施形態及實施例1、2中,說明在通孔部8的孔填充部33以及表側凹部4C、6A及背側凹部4D、6B的底面41、61設置圓柱部42或圓筒部62作為抵抗部之情形。在本實施例3中,說明藉由表側凹部7A及背側凹部7B之平面視的形狀形成抵抗部之情形。
In the foregoing embodiment and Examples 1 and 2, it will be described that the
如圖10所示,本實施例3的抵抗部係藉由成為表側凹部7A及背側凹部7B的傾斜面之側面71、71形成的狹窄部。亦即,側面71係從工件保持孔2的中心側向外側於擴寬方向傾斜。此結果,表側凹部7A及背側凹部7B成為具有以平面視之開放側(工件保持孔2的中心側)變窄之狹窄部,在全體來看形成為遠側為寬梯形(楔形)。
As shown in FIG. 10, the resistance part of this Example 3 is a narrow part formed by the side surfaces 71 and 71 which become the inclined surface of the front side recessed
在此,由於在表側凹部7A及背側凹部7B上形成以平面視工件保持孔2的中心側變窄之狹窄部即可作為抵抗部,因此,側面71不限定於直線的傾斜面,也可以為曲線的傾斜面。例如,藉由將表側凹部7A及背側凹部7B以平面視形成為T字狀或Y字狀或燒瓶狀,也可以在工件保持孔2的中心側設置狹窄部。
Here, since the front side recessed
並且,通孔部8A係以連接表側凹部7A之遠側(與工件保持孔2之中心為相反側)的頂點部及背側凹部7B之遠側的頂點部之方式,例如,形成平面視橢圓狀。因此,在表側凹部7A(或背側凹部7B)及通孔部8A重疊的位置,從遊星輪基板1C的表側向背側(或從遊星輪基板1C的背側向表側)之形成之凹陷欠缺,而成為貫穿的孔。
In addition, the through-
在此通孔部8A中以成為樹脂插入部3C的一部分之方式填充合成樹脂材料而形成孔填充部33A時,成為阻止樹脂插入部3C之徑方向的移動之抵抗部。由於孔填充部33A成為與遊星輪基板1的厚度為相同厚度,因此,可以作為強力的卡止部。
When the through-
進一步,在梯形的表側凹部7A及背側凹部7B的內部空間以成為樹脂插入部3C的一部分之方式填充合成樹脂材料而形成填充部36時,楔形的填充部36在狹窄部變成不容易朝工件保持孔2的中心側移動之狀態,而成為阻止樹脂插入部3C之徑方向的移動之抵抗部。
Furthermore, when the inner space of the trapezoidal
樹脂插入部3C係由形成為環狀的圓環部31、形成在表側凹部7A及背側凹部7B的內部空間的複數之填充部36,‧‧‧、形成於通孔部8A的內部空間的複數之孔填充部33A所構成。此圓環部31、複數之填充部36,‧‧‧、與複數之孔填充部33A係藉由合成樹脂材料一體地成型。
The
此種結構的實施例3之工件遊星輪10係在工件保持孔2的外緣部13之圓周方向交替設置分別向表背方向凹陷之平面視大致楔形的表側凹部7A及背側凹部7B。
The workpiece
由於藉由設置在此表側凹部7A及背側凹部7B的複數之平面視大致楔形的填充部36,‧‧‧發揮圓周方向的旋轉停止功能及朝表背方向的掉落防止功能,並且發揮徑方向的移動抑制功能,因此,除了形成在通孔部8A之孔填充部33A的功能以外,還可以確保遊星輪基板1C及樹脂插入部3C的高一體性。
Due to the plurality of filling
另外,也可以在藉由狹窄部之抵抗部組合藉由突起部或孔部之抵抗部。此情形也可以提高阻止樹脂插入部3C之徑方向的移動之移動抑制功能。並且,實施例3之此其他的結構及作用效果與前述實施形態或其他的實施例大致相同而省略說明。
In addition, it is also possible to combine the resistance part by the protrusion part or the hole part in the resistance part by the narrow part. In this case, the movement suppression function of preventing the movement of the
以上,雖然參見圖式詳述本發明之實施形態及實施例,但是具體的結構不限定於此實施形態及實施例,在不脫離本發明之要旨的範圍之設計的變更也包含在本發明中。 Above, although the embodiments and embodiments of the present invention are described in detail with reference to the drawings, the specific structure is not limited to these embodiments and embodiments, and design changes within the scope not departing from the gist of the present invention are also included in the present invention .
雖然例如前述實施形態及實施例中說明工件保持孔2係圓形之工件遊星輪10,但是不限定於此。例如,對具有長方形(包含正方形)之工件保持孔的工件遊星輪也可以適用本發明。簡而言之,可以在長方形之工件保持孔的內周面之圓周方向交替地形成分別向表背方向凹陷之表側凹部及
背側凹部,並且,形成與表側凹部及背側凹部連續的通孔部,沿著其內周面設置長方形之樹脂插入部。進一步,工件保持孔也可以是圓形及長方形以外之其他的形狀。
For example, in the foregoing embodiments and examples, it has been described that the
另外,雖然在前述實施形態及實施例中說明在每個表側凹部4A、4C、6A、7A及背側凹部4B、4D、6B、7B之間設置通孔部8、8A之情形,但是不限定於此,可以是每隔1個或每隔2個等,而不需要在所有的間隔設置。
In addition, although the foregoing embodiments and examples describe the case where the through
1‧‧‧遊星輪基板 1‧‧‧The base plate of the cruiser
2‧‧‧工件保持孔 2‧‧‧Workpiece holding hole
3‧‧‧樹脂插入部 3‧‧‧Resin insert
4A‧‧‧表側凹部 4A‧‧‧Concavity on the front side
4B‧‧‧背側凹部 4B‧‧‧Back side recess
8‧‧‧通孔部 8‧‧‧Through hole
13‧‧‧外緣部 13‧‧‧Outer edge
41‧‧‧底面 41‧‧‧Bottom
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000024912A (en) * | 1998-07-10 | 2000-01-25 | Kishida Seisakusho:Kk | Device for retaining brittle thin plate being plane polished |
JP2009012086A (en) * | 2007-07-02 | 2009-01-22 | Speedfam Co Ltd | Workpiece carrier |
WO2015080295A1 (en) * | 2013-11-29 | 2015-06-04 | Hoya株式会社 | Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method |
CN205835021U (en) * | 2016-07-18 | 2016-12-28 | 湖南普照信息材料有限公司 | Erratic star wheel |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3086591B2 (en) | 1994-06-15 | 2000-09-11 | 三洋電機株式会社 | Surveillance video camera |
JPH10135137A (en) * | 1996-10-31 | 1998-05-22 | Semiconductor Energy Lab Co Ltd | Method of forming crystalline semiconductor |
JP2001179615A (en) * | 1999-12-27 | 2001-07-03 | Seiko Epson Corp | Polishing carrier, surface polishing device and surface polishing method |
WO2002002533A1 (en) * | 2000-07-05 | 2002-01-10 | Yamanouchi Pharmaceutical Co., Ltd. | Propane-1,3-dione derivatives |
MY118114A (en) * | 2000-07-10 | 2004-08-30 | Sumitomo Bakelite Co | Holder for polished work and manufacturing method thereof |
JP3439726B2 (en) * | 2000-07-10 | 2003-08-25 | 住友ベークライト株式会社 | Material to be polished and method of manufacturing the same |
KR20020018708A (en) | 2000-09-04 | 2002-03-09 | 구광시 | Manufacturing method of magnetic recording medium |
KR100398141B1 (en) * | 2000-10-12 | 2003-09-13 | 아남반도체 주식회사 | Chemical mechanical polishing slurry composition and planarization method using same for semiconductor device |
KR100890458B1 (en) | 2007-07-27 | 2009-03-26 | (주식회사)문창 | Stainless steel water storage tank |
JP2009260272A (en) * | 2008-03-25 | 2009-11-05 | Panasonic Corp | Method of processing substrate, method of manufacturing semiconductor chip and method of manufacturing semiconductor chip with resin adhesion layer |
JP2010179375A (en) | 2009-02-03 | 2010-08-19 | Sumco Corp | Grinding object carrier and manufacturing method of ground product |
JP5578704B2 (en) * | 2010-03-09 | 2014-08-27 | Shマテリアル株式会社 | Semiconductor device mounting substrate and manufacturing method thereof |
JP2012169316A (en) * | 2011-02-10 | 2012-09-06 | Think Laboratory Co Ltd | Base material with etching mask and manufacturing method thereof |
CN104759983A (en) * | 2015-02-11 | 2015-07-08 | 苏州新美光纳米科技有限公司 | Travelling starwheel |
JP6800402B2 (en) * | 2016-10-06 | 2020-12-16 | スピードファム株式会社 | Work carrier and manufacturing method of work carrier |
CN107457689B (en) * | 2017-10-03 | 2024-04-05 | 德清晶生光电科技有限公司 | A star wheel that moves for single face is polished |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000024912A (en) * | 1998-07-10 | 2000-01-25 | Kishida Seisakusho:Kk | Device for retaining brittle thin plate being plane polished |
JP2009012086A (en) * | 2007-07-02 | 2009-01-22 | Speedfam Co Ltd | Workpiece carrier |
WO2015080295A1 (en) * | 2013-11-29 | 2015-06-04 | Hoya株式会社 | Carriers for polishing, manufacturing method for carriers for polishing, and magnetic disc substrate manufacturing method |
CN205835021U (en) * | 2016-07-18 | 2016-12-28 | 湖南普照信息材料有限公司 | Erratic star wheel |
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