CN101870086A - CMP trimmer and manufacture method thereof - Google Patents
CMP trimmer and manufacture method thereof Download PDFInfo
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- CN101870086A CN101870086A CN201010164685A CN201010164685A CN101870086A CN 101870086 A CN101870086 A CN 101870086A CN 201010164685 A CN201010164685 A CN 201010164685A CN 201010164685 A CN201010164685 A CN 201010164685A CN 101870086 A CN101870086 A CN 101870086A
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- cmp
- base material
- face
- teat
- diamond abrasive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A kind of CMP trimmer, with finishing face that the polishing pad subtend of CMP device contacts on be fixed with diamond abrasive, above-mentioned diamond abrasive is fixed on the CMP trimmer main body by the coat of metal, above-mentioned CMP trimmer main body is made of resin.
Description
Technical field
The present invention relates to carry out CMP trimmer and the manufacture method thereof used in the finishing of polishing pad of CMP (chemically mechanical polishing) device of polishing of semiconductor wafer etc.
The application advocates priority 2009-158619 number based on Japanese patent application 2009-107858 number of application on April 27th, 2009 and the Japanese patent application of application on July 3rd, 2009, and these contents are herein incorporated.
Background technology
Along with the development of semiconductor industry, the necessity of the surface of metal, semiconductor, pottery etc. being carried out high-precision accurately machined processing method improves, and particularly semiconductor wafer along with the raising of its integrated level, requires nano level Surface Finishing.For this high-precision Surface Finishing of correspondence, usually semiconductor wafer is used CMP (chemically mechanical polishing) polishing of porous CMP pad.
The CMP pad produces pore and stops up or compression along with polishing, its surface state gradually changes.So, undesirable phenomenons such as polishing velocity reduction or inhomogeneous polishing take place.Therefore, to by regularly to the surface of CMP pad carry out grinding the surface state maintenance of CMP pad is constant, keep good polishing condition and study.
As the CMP dresser that uses for the CMP pad is carried out grinding, for example known shown in patent documentation 1, possess base metal (base material or main body), be formed on base metal surface (towards the face of CMP pad side) coating and be fixed on diamond abrasive on the base metal by this coating.
Patent documentation 1: TOHKEMY 2002-239905 communique
As other CMP trimmer, the trimmer that also exists patent documentation 2 to be put down in writing.This trimmer abrasive material on the finishing face of trimmer main body disperses, and forms fixing abrasive material.The trimmer main body is the pottery system, and keeping also on abrasive material, fixed abrasive binder course is formed by low-temperature sintered ceramics.
Patent documentation 2: TOHKEMY 2008-132573 communique
Yet,, further precise treatment is also expected in its surface finish processing along with semi-conductive superfine linearize development.Therefore, the finishing on the pad surface that polished semiconductor is used also needs further high accuracy control, the finishing under the expectation light load.But in the above-mentioned CMP trimmer, owing to consider that corrosion resistance, main body mainly use stainless steel or pottery, the deadweight of trimmer increases, and is difficult to carry out the finishing under the light load.
In order to realize the finishing under the light load, the resinification of main body is also studied.Yet, under the situation of resin body, can realize the lightweight of CMP trimmer, but when diamond abrasive directly is fixed on resin body, because finishing is ground resin and the finishing performance is produced harmful effect.
Therefore, need cover resin body with the metallic plate that is fixed with diamond abrasive.Though but can be directly fixed in the resin, because of problems such as the insufficient generation diamond abrasive of bonding force come off by electrodeposited coating.Therefore, also consider to use fixed diamond abrasive materials such as sintering bonding agent, but with fixedly comparing of being undertaken by electrodeposited coating, unfavorable aspect cost.In addition, because may be at the inner fine crack etc. that produces of diamond abrasive because of thermal shock, there is broken danger in diamond abrasive.
As the prior art of main body and the metallic plate that is fixed with diamond abrasive being fixed, known patent document 3,4 technology of being put down in writing with bonding agent.
Patent documentation 3: TOHKEMY 2005-171185 communique
Patent documentation 4: Japanese kokai publication hei 10-211664 communique
Summary of the invention
A scheme of the present invention relates to the CMP trimmer, with finishing face that the polishing pad subtend of CMP device contacts on be fixed with diamond abrasive, described diamond abrasive is fixed on the described CMP trimmer main body by the coat of metal, and described CMP trimmer main body is made of resin.After the coat of metal that comprises described diamond abrasive and described main body are shaped as independent parts respectively, engage and be one.At this moment, can realize the lightweight of CMP trimmer, and suppress the generation of the underbead crack that caused because of thermal shock etc., diamond abrasive can be fixed on the main body equably simultaneously.
In the CMP trimmer that another program of the present invention relates to, be provided with along the side surface part of described main body crooked bends around all, on the thickness direction of the described coat of metal at the peripheral end of the described coat of metal.At this moment, the rigidity of the coat of metal raises, and can guarantee the flatness of the face of repairing.Because diamond abrasive is fixed on the finishing face equably, can prevent that slurry from penetrating into bonding plane from peripheral part, helps to guarantee adhesive strength.
Described CMP trimmer main body also can be made of engineering resins such as polyphenylene oxide, polyphenylene sulfides.At this moment, can select hear resistance, material of main part that corrosion resistance is high according to purposes.
Another scheme of the present invention relates to the manufacture method of CMP trimmer, this manufacture method is used to be manufactured on the CMP trimmer that is fixed with diamond abrasive on the finishing face that contacts with the polishing pad subtend of CMP device, and described manufacture method comprises: the operation that forms substrate coating on the finishing face on the CMP trimmer main body; On described substrate coating, form the operation of Ni bottoming coating; The operation of on described Ni bottoming coating, arranging diamond abrasive; On described Ni bottoming coating, make and imbed the operation that coating is further grown up and fixed described diamond abrasive; With the operation that covers the integral body of described finishing face with coating.Like this, can be manufactured on the CMP trimmer that is fixed with diamond abrasive on the finishing face equably.
Another scheme of the present invention relates to the manufacture method of CMP trimmer, this manufacture method is used to be manufactured on the CMP trimmer that is fixed with diamond abrasive on the finishing face that contacts with the polishing pad subtend of CMP device, and described manufacture method comprises: the operation that forms substrate coating on the coat of metal is grown up with substrate; On described substrate coating, form the operation of Ni bottoming coating; The operation of on described Ni bottoming coating, arranging diamond abrasive; On described Ni bottoming coating, make and imbed the operation that coating is grown up and fixed described diamond abrasive; Cover the operation of the integral body of described finishing face with coating; With the coat of metal that will comprise described diamond abrasive from described growth with the operation on the described finishing face of strippable substrate and the resin system of sticking on CMP trimmer main body.At this moment, can realize lightweight and easily that resin body is integrated with the coat of metal that comprises diamond abrasive.
Can further comprise: after forming described substrate coating, on described substrate coating, paste mask, in the sectional hole patterns of described mask, arrange the operation of diamond abrasive with predetermined pattern perforation; With pre-fix described diamond abrasive by prime coat, peel off described mask subsequently, make and imbed that coating is grown up and the operation of formal fixing described diamond abrasive.At this moment, can control the Pareto diagram of diamond abrasive arbitrarily.
Pre-fix the operation of described diamond abrasive and the operation of formal fixing described diamond abrasive and carry out several times respectively, the peripheral end that also can further be included in the coat of metal that comprises described diamond abrasive makes the operation of bend crooked on the thickness direction of the described coat of metal and the growth of described coat of metal one.At this moment, make the flatness of finishing face and guaranteed, and diamond abrasive is fixed in the coat of metal of finishing face equably.
According to described each scheme, can provide lightweight and diamond abrasive the stable CMP trimmer of main body and the manufacture method of this trimmer of also being fixed in equably.
Another scheme of the present invention relates to the CMP dresser, possess base material (main body) and be configured on the described base material and the outstanding from the teeth outwards metallic plate that is formed with cutting edge, described CMP dresser pads with the opposed CMP in described surface by described cutting edge pair and executes grinding, described base material is made of resin material, described base material and described metallic plate are bonding mutually by bonding agent, and be outstanding described of oriented subtend on the one side at least in the face of described base material side of the face of described metallic plate side and described metallic plate of described base material, and form the teat of top and this face butt.
The CMP dresser that another scheme relates to according to the present invention, being formed with to described of subtend outstanding teat on the one side at least in the face of base material side towards the face of metallic plate side and metallic plate of base material, the top of described teat and with described butt of this teat subtend.Because the top of teat and also bonding by bonding agent with the face butt of this teat subtend, and the bonding agent that is clipped in the gap beyond the teat between base material and metallic plate is also bonding with these base materials and metallic plate, thus base material and metallic plate bonding securely be mutual state of locating.
Realize by the top of teat with the face butt of this teat subtend mutual location along the bonding direction (being the laminating direction of base material and metallic plate) of base material and metallic plate, and precision is good.Specifically, coating adhesive and mutual extrusion between the face of subtend and when bonding, bonding agent be clipped in teat the top and and the face of this teat subtend between, with their mutual extrusion and during butt, the residue bonding agent flow to the gap portion beyond the teat.
According to this structure, with the deal of bonding agent or crawling and the distribution of the power of base material and metallic plate mutual extrusion etc. is irrelevant, precision that can be good carry out teat the top and with the butt of the face of this teat subtend.Therefore, can realize base material towards the high-precision mutual location of the face towards the base material side of the face and the metallic plate of metallic plate side, prevent mutual non-parallel ground tilted configuration between these faces, and can make these base materials and metallic plate stably bonding.
Like this, by forming teat, the bond area between the face of bonding agent and the described teat of formation increases, so the adhesive strength of base material and metallic plate is further enhanced.And then, go up coating adhesive by the outer surface (being side etc.) beyond the described top of teat, described outer surface plays fixed effect, therefore can fully guarantee particularly for the direction of described quadrature in the adhesive strength that makes the direction of delaminate that base material separates with metallic plate.
The top of described teat can be formed on corresponding to the plane of the face of this teat subtend on.At this moment, can fully improve the described top of mutual butt and described degree of adhesion.Therefore, can fully improve above-mentioned adhesive strength.
Described teat can be formed with a plurality of, is set to from described the outstanding height that forms this teat mutually the same.At this moment, these teats to be to be dispersed in the state on described that this teat forms, respectively with the face butt of the subtend of described teat.Therefore, base material support metal plate stably.These teats since be set at from described the outstanding height that forms this teat mutually the same, base material can be further support metal plate stably, and can fully guarantee teat and with the contact area of the face of this teat subtend, thereby improve adhesive strength.
The peripheral part of described metallic plate can be formed with along the thickness direction of described metallic plate and cover the tubular cap of the peripheral part of described base material.At this moment, the metallic plate self rigidity is improved, and can guarantee to dispose the flatness on the described surface of cutting edge.According to the shape of cap,, between metallic plate and base material, immerse with slurry so can prevent polishing processing, thereby above-mentioned adhesive strength can be steady in a long-term from the edge of opening portion of the described cap of CMP pad configured separate.
By cap is set, base material and metallic plate when bonding, can be made the residue bonding agent that flows laterally from central authorities between these base materials and the metallic plate arrive outside distance and prolonging.Therefore, can prevent that bonding agent from draining to the outside between base material and metallic plate.
Can be formed with convex curved surface in the outer peripheral edges portion towards the face of described metallic plate side of described base material, be formed with concave curved surface corresponding to the shape of described convex curved surface in the outer peripheral edges portion towards the face of described base material side of described metallic plate.At this moment, when bonding, the mutual driving fit of convex curved surface and concave curved surface comes butt, so the salable bonding agent that is clipped between base material and the metallic plate with base material and metallic plate.Can prevent bonding agent between the convex curved surface of subtend and the concave curved surface to flows outside, thereby prevent that further bonding agent from draining to the outside.
On described base material, can be formed with ring-type flanging portion with the edge of opening portion butt of described cap.At this moment, with base material and metallic plate when bonding, as mentioned above,, also can limit this bonding agent further to flows outside by flanging portion even when the residue bonding agent that flows laterally from central authorities arrives described edge of opening portion.Therefore, can prevent that bonding agent from draining to the outside.
In the CMP dresser that the another scheme of the present invention relates to, the area occupation ratio in the described teat form at this teat described can be set in 20～78% the scope.At this moment, can fully guarantee the bond area with the face of described teat subtend, and guarantee adhesive strength.
When the CMP pad is carried out grinding, with respect to from described CMP pad to the metallic plate externally applied forces, teat stably supports described metallic plate.Therefore, stable for the grinding performance of CMP pad.
Part beyond the teat between base material and metallic plate fully guarantees to overflow the gap of (holding) residue bonding agent, thereby further improves the positional precision of base material and metallic plate.
The described area occupation ratio of teat was set at less than 20% o'clock, can not fully guarantee the bond area of base material and metallic plate, and adhesive strength reduces as a result.At this moment, metallic plate might be peeled off from base material.When the CMP pad is carried out grinding, with respect to from described CMP pad to the metallic plate externally applied forces, teat is the support metal plate stably, described metallic plate surperficial yielding, and cutting edge becomes inhomogeneous to the contact of CMP pad, and grinding performance becomes unstable as a result.
The described area occupation ratio of teat is set at and surpasses at 78% o'clock, be clipped in teat the top and and the face of this teat subtend between bonding agent in the residue bonding agent base material and metallic plate when bonding, even to pushing between them, also are being difficult to described Clearance Flow.At this moment, base material and metallic plate are bonding with the state of mutual inclination, and cutting edge becomes inhomogeneous to the contact of CMP pad, and grinding performance becomes unstable.
The area that described teat can be set at the top of this teat increases towards the outside gradually from described the central authorities that this teat forms.At this moment, the metallic plate that teat supports is because its distortion is inhibited laterally gradually from central authorities, and intensity is improved.
When the CMP pad is carried out grinding, in the metallic plate of the CMP dresser that rotates, to compare with its central authorities, Outboard Sections contacts with the CMP pad morely, and be applied in big external force, but,, compare with central authorities with respect to described external force by said structure, the rigidity in the outside of this metallic plate is improved, therefore, can prevent the metallic plate distortion, thus stable to the grinding performance of CMP pad.
According to the CMP dresser that described scheme relates to, the base material and the mutual precision of metallic plate that accompany bonding agent between can making it are located well, and can be stably bonding, thereby adhesive strength improves.
Description of drawings
Fig. 1 is the side cross-sectional view of the CMP trimmer in the embodiment of the present invention;
Fig. 2 is the enlarged drawing of the abrasive material of the CMP trimmer in the embodiment of the present invention;
Fig. 3 A to Fig. 3 F is used to make the sectional view of each operation of the CMP trimmer of one embodiment of the present invention for expression;
Fig. 4 A to Fig. 4 E is used to make the amplification sectional view of diamond abrasive fixed part of each operation of the CMP trimmer of one embodiment of the present invention for expression;
Fig. 5 is the side cross-sectional view of the CMP dresser in the second embodiment of the invention;
Fig. 6 is the A2-A2 sectional view of Fig. 5;
Fig. 7 is the side cross-sectional view of the cutting edge of the CMP dresser in the second embodiment of the invention being amplified expression;
Fig. 8 A to Fig. 8 F is the key diagram of the manufacturing sequence of the CMP dresser in the second embodiment of the invention;
Fig. 9 A to Fig. 9 E in the manufacturing to the CMP dresser in the second embodiment of the invention, the partial enlarged drawing that describes of the manufacturing sequence of cutting edge;
Figure 10 is the side cross-sectional view of the CMP dresser in the third embodiment of the invention;
Figure 11 is the side cross-sectional view of the CMP dresser variation in the expression third embodiment of the invention;
Figure 12 is the side cross-sectional view of the CMP dresser in the four embodiment of the invention;
Figure 13 is the side cross-sectional view of the CMP dresser in the four embodiment of the invention;
Figure 14 is the bonding key diagram of base material and metallic plate in the CMP dresser;
Figure 15 is the bonding key diagram of base material and metallic plate in the CMP dresser.
Symbol description
11 CMP trimmers
12 main bodys
14 finishing faces
16 coats of metal
18 diamond abrasives
110 prime coats
112 imbed coating
114 bends
116 coat of metal growth substrates
118 substrate coating
The 120 Ni coating that feels secure
122 sealing masks
21,211,221,231,241 CMP dressers
22 base materials
The face towards the applying metal plate side of 22A base material
22C, 232C convex curved surface
22D flanging portion
23,213 teats
25,235 caps
26 applying metal plates (metallic plate)
The surface towards CMP pad side of 26A applying metal plate
The face towards the base material side of 26B applying metal plate
The 26C concave curved surface
28 diamond abrasives (cutting edge)
The B2 bonding agent
The specific embodiment
Below, embodiments of the present invention are elaborated.Fig. 1 is the sketch of the CMP trimmer 11 in the expression embodiment of the present invention.CMP trimmer 11 comprises with axes O 1 being roughly discoideus main body 12, the coat of metal 16 and the diamond abrasive 18 at center.The material of main body 12 can be resin, but as preferred embodiment, can enumerate vitrification points such as PPE, PPS and be 211 ℃, water absorption rate and be 0.050% polyphenylene resinous materials.Further, the coat of metal 16 comprises substrate coating 118, Ni bottoming coating 120, prime coat 110 and imbeds coating 112.Can further be formed with coating (diagram omit) on the coating 112 imbedding.
The bight 12A of the periphery of face main body 12, that be configured in polishing pad (diagram is omitted) side is complete all with R shape chamfering.The coat of metal 16 is arranged on the face that is disposed at the polishing pad side of main body 12, at the peripheral end of the coat of metal 16, is formed with R shape along the bight 12A of the periphery of aforementioned body 12 crooked bend 114 on the thickness direction of the coat of metal 16.The radius of curvature indefinite in the cross section of bight 12A, but be preferably 0.1mm～3.0mm, more preferably 0.5mm～1.0mm.The cross section of bend 114 also preferably has equal radius of curvature.
Diamond abrasive 18 preferred average grain diameters about equally.The average grain diameter indefinite of diamond abrasive 18, but for example be preferably 140 μ m～250 μ m.Diamond abrasive 18 is arranged on the face that is disposed at the polishing pad side of the coat of metal 16, is formed with finishing face 14.The arrangement of abrasive material can then be arranged according to clathrate isotactic set pattern.
As shown in Figure 2, a plurality of diamond abrasives 18 are arranged on the Ni bottoming coating 120, form prime coats 110 and imbed coating 112 and imbed diamond abrasive 18 from Ni bottoming coating 120, are fixed as individual layer thus on finishing face 14.Imbedding on the coating 112,, only forming stage portion 112A with the thickness projection of prime coat 110 at the position corresponding with prime coat 110.Thus, diamond abrasive 18 is from the only outstanding ormal weight in the surface of the stage portion 112A that imbeds coating 112 (be preferably abrasive material average grain diameter about 10～30%).On the coat of metal 112,, also can on the coat of metal 16, further form coatings (diagram is omitted) such as plating noble metal in order to improve corrosion resistance etc.
For CMP trimmer 11, the finishing face of making 14 and parallel subtend of the pad interface of CMP device and contact are in the position of the rotation that departs from above-mentioned polishing pad, around above-mentioned axes O 1 rotation, and main body 12 itself is also shaken in the interior periphery on pad surface, is used to repair above-mentioned polishing pad.
Next, the manufacture method to the CMP trimmer in the embodiment of the present invention describes.Fig. 3 A～Fig. 3 F and Fig. 4 A～Fig. 4 E show an embodiment of the manufacture method of CMP trimmer 1.In the method, the coat of metal 16 and main body 12 are respectively as independent parts manufacturing.
On the discoideus coat of metal growth substrate 116 that constitutes by electric conductors such as stainless steels, form the substrate coating 118 of 80 μ m thickness by spraying plating, on this substrate coating 118, form the Ni bottoming coating 120 (with reference to Fig. 3 A) of 0.5 μ m thickness.In the present embodiment, any coating all can be used as Ni coating.The cross sectional shape of the external diameter of coat of metal growth substrate 116 and upper end peripheral part 116A is owing to identical with the shape of main body 12, so bend 114 also can form one with the coat of metal 16.
Then, on Ni bottoming coating 120, paste sealing mask 122 (with reference to Fig. 3 B and Fig. 4 A), in electric bath groove, make diamond abrasive 18 sedimentation in the hole of sealing mask 122 dispose (with reference to Fig. 4 B) with predetermined pattern perforation.In the present embodiment, for example use the diamond abrasive of particle diameter #100, the thickness that seal mask 122 this moment for example is 80 μ m, and the aperture is 250 μ m.
Afterwards, pre-fix diamond abrasive 18 (with reference to Fig. 3 C, Fig. 4 C) by prime coat 110.In the present embodiment, by pre-fixing of carrying out of prime coat 110 by imbedding 15 μ m at first first operation and change electroplating bath and further imbed two operations of second operation of 35 μ m and carry out.Between first operation and second operation, remove the diamond abrasive in the hole that is not deposited in sealing mask 122 and fix incomplete diamond abrasive because plural diamond abrasive is deposited in to make in the hole.Pre-fix operation and also can carry out by what prime coat 110 carried out, remove fixing incomplete diamond abrasive after pre-fixing with an operation.
After the pre-fixing of diamond abrasive 18 finished, peel seal mask 122 (with reference to Fig. 4 D) formed by spraying plating and to imbed coating 112 and imbed diamond abrasive 18, formal thus fixed diamond abrasive material 18 (with reference to Fig. 3 D, Fig. 4 E).In the present embodiment, formal fixing operation also divides two operations to carry out, and the thickness of imbedding coating 112 finally is 60 μ m.Undertaken formally fixing by being divided into two operations, can control the thickness of imbedding coating 112 exactly.Formal fixing operation also can be carried out with an operation.In order to improve corrosion resistance etc., imbedding the coating that further forms thickness 16 μ m on the coating 112.
The coat of metal that comprises diamond abrasive 18 16 that the cutting element that the use point of a knife is sharp etc. will be formed on the coat of metal growth substrate 116 is peeled off (with reference to Fig. 3 E) from coat of metal growth substrate 116.Mechanicalness intensity increases the coat of metal of peeling off 16 by the bend 114 that is formed with ring-type at peripheral part, and thus, the coat of metal 16 can not be out of shape because of residual stress etc., can guarantee flatness.
At last, on the resin system main body 12 of making, paste the coat of metal 16 (with reference to Fig. 3 F) by other operation.Main body 12 can form by machining, also can form by injection moulding.In the present embodiment, pasting the coat of metal 16 to main body 12 for example uses two kinds of liquid mixed type bonding agents to carry out.Also can use two-sided tape to replace bonding agent, can carry out the moulding of main body 12 and the stickup of the coat of metal 16 simultaneously by the inserts moulding in addition.
By bend 114 is set, when being assemblied in the coat of metal 16 on the main body 12, need not to carry out contraposition.Cover a side part to main body 12 by bend 114, in finishing, the border of the coat of metal 16 and main body 12 can not contact with slurry, and slurry does not enter into the border of the coat of metal 16 and main body 12, can prevent that therefore the coat of metal 16 from peeling off from main body 12.
By being made of resin main body 12, can realize lightweight, and compare making easily with stainless steel main body, realize that thus the cost of CMP trimmer reduces.When using the resin of poor heat resistance such as polycarbonate-based, the wafer flatness of polishing can be insufficient, is 211 ℃, water absorption rate when being 0.050% PPO, PPS resin but use vitrification point, can obtain good flatness.
By with the coat of metal 16 fixed diamond abrasive materials, diamond abrasive can be fixed on the main body equably.And then, can select hear resistance, material of main part that corrosion resistance is high according to purposes.
By the manufacture method of the application's record, can easily make the CMP trimmer that possesses resin system main body and on finishing face, be fixed with diamond abrasive equably.Can make the arbitrary graphic pattern that is arranged as of diamond abrasive on the finishing face.
In the present embodiment, resin system main body 12 is made respectively with the coat of metal 16 that comprises diamond abrasive 18, but also can directly form the coat of metal 16 that comprises diamond abrasive 18 on the face that is disposed at the polishing pad side of main body 12.
As shown in figure 14, prepare to go up the structure of outstanding and fixed diamond abrasive material (cutting edge) 2112 in the above-mentioned embodiment at the surperficial 2102A towards CMP pad side of metallic plate 2102 (upper surface among Figure 14), the face 2102B towards base material 2103 sides (lower surface among Figure 14) of metallic plate 2102 is bonding mutually by bonding agent B2 with the face 2103A towards metallic plate 2102 sides (upper surface among Figure 14) in the resin base material 2103.
Yet, as mentioned above, use bonding agent B2 that metallic plate 2102 and base material 2103 when bonding, are thought that there are the following problems.As shown in figure 15, with metallic plate 2102 and base material 2103 when bonding, owing to be clipped in the deal of the bonding agent B2 between them or crawling and with the distribution of the power of their mutual extrusion etc., the face 2102B of the metallic plate 2102 of subtend and the face 2103A of base material 2103 might be bonding with the state of mutual inclination.At this moment, the diamond abrasive 2112 that is configured on the surperficial 2102A of metallic plate 2102 contacts unevenly with the CMP pad, and the result can not carry out the processing of precision good grinding to the CMP pad.
And then with metallic plate 2102 and base material 2103 when bonding, the power of their mutual extrusion is strong excessively, and when perhaps the deal of bonding agent B2 was too much, remaining bonding agent B2 was exposed to the outside between metallic plate 2102 and base material 2103, might damage products appearance.
In addition, in the example of Figure 15, the face 2102B of metallic plate 2102 and the face 2103A of base material 2103 are the plane, but this moment, with respect to the external force of the direction (direction of delaminate) of these faces 2102B, 2103A quadrature, might can not guarantee adhesive strength.
Therefore, requirement can with between accompany the base material of bonding agent and the mutual precision of metallic plate is located well and CMP dresser stably bonding, that adhesive strength improves.The second following embodiment is with head it off.
[second embodiment]
As shown in Figure 5 and Figure 6, the CMP dresser 21 in the second embodiment of the invention possesses: forming discoideusly, is the base material 22 of center rotation with axes O 2; Be configured on the base material 22 the outstanding discoideus applying metal plate (metallic plate) 26 that forms diamond abrasive (cutting edge) 28 on surperficial 26A.CMP dresser 21 is used for the CMP device, implements grinding by 28 pairs of opposed CMP pads of the surperficial 26A with applying metal plate 26 of diamond abrasive (not shown).The CMP pad is to enforcement polishing processing such as semiconductor wafers.
In base material 22, be formed with the ring-type convex curved surface 22C that extends along the circumferencial direction of base material 22 towards the outer peripheral edges portion of the face 22A of applying metal plate 26 sides (upside among Fig. 5).
On the face 22A of base material 22, be formed with a plurality of cylindric or discoideus teats 23.Teat 23 is outstanding towards the face 26B towards base material 22 sides (downside among Fig. 5) of the applying metal plate 26 of the face 22A subtend of these teat 23 formation, and top and face 26B butt.The top of teat 23 be formed on corresponding to the plane of the face 26B of these teat 23 subtends on.
The diameter of teat 23 for example is set in the scope of 1～5mm.It is mutually the same that these teats 23 are set the projecting height height of axes O 2 (promptly along) of the face 22A that forms from this teat 23 for.The height of teat 23 for example is set in the scope of 0.1～1.0mm.These teats 23 are separated from each other configuration, are provided with the gap that can hold bonding agent B2 between the adjacent teat 23.In the vertical view of Fig. 6, the gross area of teat 23 shared area occupation ratio in the face 22A gross area is set in 20～78% the scope.
As shown in Figure 7, applying metal plate 26 comprises substrate coating 218, Ni bottoming coating 220, prime coat 210 and imbeds coating 212.Can further be formed with coating (diagram omit) on the coating 212 imbedding.
Among Fig. 5, the outer peripheral edges portion of the face 26B in applying metal plate 26 is formed with the concave curved surface 26C with the convex curved surface 22C subtend of base material 22.Concave curved surface 26C forms the ring-type of extending along circumferencial direction in the outer peripheral edges portion of applying metal plate 26.In the present embodiment, between these convex curved surfaces 22C and concave curved surface 26C, be formed with the gap that holds bonding agent B2.
Concave curved surface 26C is formed with the thickness direction (being axes O 2 directions) along above-mentioned applying metal plate 26 and the tubular cap 25 of covering substrates 22 peripheral parts at the peripheral part of applying metal plate 26.The edge of opening portion of cap 25 (being the lower edge portion among Fig. 5) seamlessly with the outer peripheral face driving fit of base material 22.
Among Fig. 7, the average grain diameter of diamond abrasive 28 about equally.Diamond abrasive 28 is given prominence to and is arranged on the above-mentioned surperficial 26A from the surperficial 26A towards CMP pad side of applying metal plate 26, forms finishing face 24.The arrangement of these diamond abrasives 28 can then be arranged according to clathrate isotactic set pattern.
As shown in the figure, a plurality of (many) diamond abrasives 28 are arranged on the Ni bottoming coating 220, form prime coats 210 and imbed coating 212 and imbed diamond abrasive 28 from Ni bottoming coating 220, are fixed as individual layer thus on finishing face 24.Thus, diamond abrasive 28 is from the only outstanding ormal weight in the surface of imbedding coating 212.On applying metal plate 26,, coatings such as further forming the plating noble metal on the coating 212 can imbedded in order to improve corrosion resistance etc.
Next, utilize Fig. 8 A～Fig. 8 F and Fig. 9 A～Fig. 9 E that the manufacture method of CMP dresser 21 is described.The applying metal plate 26 of CMP dresser 21 and base material 22 are respectively as independent parts manufacturing.
At first, the manufacturing to applying metal plate 26 describes.
Shown in Fig. 8 A, on the applying metal plate growth substrate 216 that constitutes by stainless steel etc., form the substrate coating 218 of 80 μ m thickness by spraying plating, on this substrate coating 218, form the Ni bottoming coating 220 of 0.5 μ m thickness.In the present embodiment, any coating all can be used as Ni coating.The shape set of applying metal plate growth substrate 216 is and the face 26B corresponding shape of above-mentioned applying metal plate 26 that therefore by forming applying metal plate 26, cap 25 and this concave curved surface 26C also form one with described applying metal plate 26.The for example available SUS rolled plate of making like this of Ni coating that comprises substrate coating 218 and Ni bottoming coating 220 replaces.Also can use by punch process etc. tabular SUS rolled plate is implemented pull and stretch processing, is shaped to the structure of the shape shown in Fig. 8 A.
Then, shown in Fig. 8 B and Fig. 9 A, after (or on above-mentioned SUS rolled plate) pastes the sealing mask 222 with predetermined pattern (clathrate etc.) perforation on the Ni bottoming coating 220, shown in Fig. 9 B, in electric bath groove, diamond abrasive 28 is fallen at the inner hole deposition that seals mask 222 dispose.In the present embodiment, use the diamond abrasive 28 of average grain diameter #100, the thickness of for example setting sealing mask 222 is 80 μ m, and the aperture is 250 μ m.
Then, shown in Fig. 9 C, pre-fix diamond abrasive 28 by prime coat 210.In the present embodiment, by pre-fixing of carrying out of prime coat 210 by at first diamond abrasive 28 being imbedded 15 μ m first operation and change electroplating bath and further imbed two operations of second operation of 35 μ m and carry out.Between first operation and second operation, remove the diamond abrasive in the hole that is not deposited in sealing mask 222 respectively and fix incomplete diamond abrasive because plural diamond abrasive is deposited in to make in the hole.Pre-fix operation and also can carry out by what prime coat 210 carried out, remove fixing incomplete diamond abrasive after pre-fixing with an operation.
After pre-fixing diamond abrasive 28 like this, shown in Fig. 9 D, peel seal mask 222.
Then, shown in Fig. 8 D and Fig. 9 E, imbed coating 212, imbed diamond abrasive 28, formal thus fixed diamond abrasive particle 28 by spraying plating formation.In the present embodiment, formal fixing operation also divides two operations to carry out, and the thickness of imbedding coating 212 finally is 60 μ m.Undertaken formally fixing by being divided into two operations, can control the thickness of imbedding coating 212 exactly.Formal fixing operation also can be carried out with an operation.In order to improve corrosion resistance etc., the coating that further forms thickness 16 μ m on the coating 212 can imbedded.
Then, shown in Fig. 8 E, the cutting element that the use point of a knife is sharp etc. will comprise the applying metal plate 26 of diamond abrasive 28 and peel off from coat of metal growth substrate 216.Mechanicalness intensity increases the applying metal plate of peeling off 26 by being formed with cap 25, and thus, applying metal plate 26 can not be out of shape because of residual stress etc., can guarantee flatness.
On the other hand, base material 22 moulding by injection moulding.Make its curing after being filled in the mould by resin materials such as engineering plastics, take out, form base material 22 with said structure from mould with fusion.Base material 22 also can be by the formation such as machining beyond the injection moulding.
At last, shown in Fig. 8 F, on base material 22, paste applying metal plate 26.In the present embodiment, pasting applying metal plate 26 to base material 22 uses two kinds of liquid mixed type bonding agent B2 to carry out.
Before these base materials 22 and applying metal plate 26 are fitted, use point gum machine in the face 26B of the face 22A of base material 22 or applying metal plate 26, to be coated with the roughly bonding agent B2 of equal and quantitative on the one side at least.The coating weight of bonding agent B2 is set at and face 22A, face 26B between teat 23 beyond the suitable deal of gap portion, and be coated on the top end face of teat 23, this way is owing to guarantee to design bond area, and fully obtains designing bonding force and more preferably.
On base material 22 during applying applying metal plate 26, because applying metal plate 26 is provided with cap 25, thus guide the outer peripheral face of the edge of opening portion of above-mentioned cap 25 along base material 22, thus need not applying metal plate 26 and base material 22 mutual contrapositions.Like this, can make CMP dresser 21.
As mentioned above, CMP dresser 21 according to present embodiment, on the face 22A of applying metal plate 26 sides, forming of base material 22 towards the outstanding teat 23 of face 26B of the applying metal plate 26 of subtend, the top of above-mentioned teat 23 and with the face 26B butt of these teat 23 subtends.Because the top of teat 23 and face 26B butt are also bonding by bonding agent B2, and the bonding agent B2 that is clipped in the gap beyond the teat 23 between base material 22 and the applying metal plate 26 also makes this base material 22 bonding with applying metal plate 26, thus base material 22 bonding securely with applying metal plate 26 be the state of locating mutually.
According to this structure, with the deal of bonding agent B2 or crawling and the distribution of the power of base material 22 and applying metal plate 26 mutual extrusion etc. is irrelevant, precision that can be good carry out teat 23 the top and with the butt of the face 26B of these teat 23 subtends.Therefore, can realize the high-precision mutual location of the face 26B towards base material 22 sides towards the face 22A and the applying metal plate 26 of applying metal plate 26 sides of base material 22, prevent mutual non-parallel ground tilted configuration between this face 22A, the face 26B, and can make this base material 22 stably bonding mutually with applying metal plate 26.
Like this, by forming teat 23, the bond area between the face 22A of bonding agent B2 and the above-mentioned teat 23 of formation increases, so the adhesive strength of base material 22 and applying metal plate 26 is further enhanced.And then, go up coating adhesive B2 by the outer surface (symbol 23C shown in Figure 5) beyond the top in teat 23, therefore above-mentioned outer surface 23C plays fixed effect, can fully guarantee particularly for the adhesive strength that makes the direction of delaminate that base material 22 separates with applying metal plate 26 in axes O 2 directions.
Since the top of teat 23 be formed on corresponding to the plane of the face 26B of these teat 23 subtends on, can fully improve the above-mentioned top of mutual butt and the adaptation of face 26B.Therefore, can fully improve above-mentioned adhesive strength.
Owing to be formed with a plurality of teats 23, these teats 23 form state on face 22A to be dispersed in it, respectively with the face 26B butt of the subtend of above-mentioned teat 23.Therefore, base material 22 can stably support applying metal plate 26.These teats 23 are owing to be set at from the outstanding height of the face 22A that forms this teat 23 mutually the same, base material 22 can further stably support applying metal plate 26, and can fully guarantee teat 23 and with the contact area of the face 26B of these teat 23 subtends, thereby improve adhesive strength.
Be formed with from the peripheral part of applying metal plate 26 and extend and form the cap 25 of tubular, the part of applying metal plate 26 sides in the peripheral part of cap 25 covering substrates 22 at the thickness direction (being axes O 2 directions) of above-mentioned applying metal plate 26.Thus, applying metal plate 26 self rigidity improve, and can guarantee to dispose the flatness of the surperficial 26A of diamond abrasive 28.
According to the shape of cap 25, from the edge of opening portion of the above-mentioned cap of CMP pad configured separate, so can prevent polishing processing with slurry from immersing between applying metal plate 26 and the base material 22, thereby above-mentioned adhesive strength can long-term stability.
By cap 5 is set, with base material 22 and applying metal plate 26 when bonding, can makes between this base material 22 and the applying metal plate 26 from the residue bonding agent B2 of radially mediad flows outside and arrive outside distance prolongation.Therefore, can prevent that bonding agent B2 from draining to the outside between base material 22 and applying metal plate 26.
The area occupation ratio of teat 23 in forming the face 22A of this teat 23 is set in 20～78% the scope, thus can fully guarantee the bond area with the face 26B of above-mentioned teat 23 subtends, and guarantee adhesive strength.
When the CMP pad is carried out grinding, with respect to from above-mentioned CMP pad to applying metal plate 26 externally applied forces, teat 23 stably supports above-mentioned applying metal plate 26.Therefore, stable for the grinding performance of CMP pad.
Part beyond the teat 23 between base material 22 and applying metal plate 26 fully guarantees to overflow the gap of residue bonding agent B2, thereby further improves the positional precision of base material 22 and applying metal plate 26.
The above-mentioned area occupation ratio of teat 23 was set at less than 20% o'clock, can not fully guarantee the bond area of base material 22 and applying metal plate 26, and adhesive strength reduces as a result.At this moment, applying metal plate 26 might be peeled off from base material 22.When the CMP pad is carried out grinding, with respect to from above-mentioned CMP pad to applying metal plate 26 externally applied forces, teat 23 can not stably support applying metal plate 26, the surperficial 26A of above-mentioned applying metal plate 26 is yielding, and the contact of 28 pairs of CMP pads of diamond abrasive becomes inhomogeneous, and grinding performance becomes unstable as a result.
The above-mentioned area occupation ratio of teat 23 was set at above 78% o'clock, be clipped in teat 23 the top and and the face 26B of these teat 23 subtends between bonding agent B2 in the residue bonding agent with base material 22 and applying metal plate 26 when bonding, even to pushing between them, also be difficult to above-mentioned Clearance Flow.At this moment, base material 22 is bonding with the state of mutual inclination with applying metal plate 26, and the contact of 28 pairs of CMP pads of diamond abrasive becomes inhomogeneous, and grinding performance becomes unstable.
By making base material 22 be resin system, can realize lightweight, and compare making easily with stainless steel base material in the past, realize that thus the cost of CMP dresser 21 reduces.
Think that thermal deformations can take place above-mentioned base material 22 when base material 22 used the low resin of hear resistance such as polycarbonate-based, can not fully guarantee the flatness of the semiconductor wafer that polished by the CMP pad.Therefore, above-mentioned as present embodiment, be that 211 ℃, water absorption rate are the engineering plastics of excellent heat resistances such as 0.050% PPO, PPS resin by using vitrification point, can obtain the good flatness of semiconductor wafer.
By utilizing the structure fixed diamond abrasive material 28 of above-mentioned applying metal plate 26, diamond abrasive 28 can be fixed on the base material 22 with required configuration, overhang.And then, because applying metal plate 26 and base material 22 be as independent parts manufacturing, so can select the material of hear resistance, base material 22 that corrosion resistance is high according to purposes.
By above-mentioned manufacture method, can make the CMP dresser 21 that possesses resin base material 22 and on finishing face 24, be fixed with diamond abrasive 28 equably with comparalive ease.
[the 3rd embodiment]
Next, utilize Figure 10 and Figure 11 that the 3rd embodiment of the present invention is described.
Attached to the parts identical with same-sign with above-mentioned embodiment, omit its explanation.
CMP dresser 211 in the 3rd embodiment is with the difference of the CMP dresser 21 of above-mentioned embodiment, and the area that teat 23 is set at its top increases towards the outside gradually from the central authorities of the face 22A that forms this teat 23.
Among Figure 10, on the face 22A of base material 22, stand and be provided with a plurality of cylindric or discoideus teats 23, and these teats 23 form mutually the same shape.And in the CMP dresser 211 in the present embodiment, these teats 23 are configured to from the radially central authorities of face 22A intensive gradually towards the outside.
The interval that these teats 23 are configured between the adjacent teat 23 narrows down towards the outside gradually from the central authorities of face 22A.Thus, the area of plane on teat 23 tops increases towards the outside gradually from above-mentioned central authorities on the whole.
As mentioned above, according to the CMP dresser 211 in the present embodiment, because the area that teat 23 is set at its top increases towards the outside gradually from the central authorities of the face 22A that forms this teat 23, so applying metal plate 26 that teat 23 supports, its distortion is inhibited gradually towards the outside from central authorities, thereby intensity improves.
When the CMP pad is carried out grinding, in the applying metal plate 26 of the CMP dresser 211 that rotates, compare with its central authorities, Outboard Sections contacts with the CMP pad morely, and be applied in big external force, but by said structure, with respect to above-mentioned external force, compare with central authorities, the rigidity in the outside of applying metal plate 26 is improved.Therefore, can prevent applying metal plate 26 distortion, thus stable to the grinding performance of CMP pad.
Figure 11 shows the variation of the CMP dresser 211 in the 3rd embodiment.
As shown in figure 11, CMP dresser 221 is formed with a plurality of cylindric or discoideus teats 23 on the face 22A of base material 22.These teats 23 in the configuration of the radially inner side of face 22A are different mutually with the shape of these teats 23 that dispose in the outside.
Specifically, among these teats 23, set for bigger at the diameter of the teat 23 of the radial outside of face 22A configuration than diameter at the teat 23 of the radially inner side configuration of face 22A.Thus, the top end face area of each teat 23 increases towards the outside gradually from the central authorities of face 22A.
[the 4th embodiment]
Next, utilize Figure 12 that the 4th embodiment of the present invention is described.
Attached to the parts identical with same-sign with above-mentioned embodiment, omit its explanation.
Convex curved surface 232C, its height corresponding with the upright projecting height that is located at the teat 23 on the face 22A and with the top of above-mentioned teat 23 for simultaneously, and corresponding formation of concave curved surface 26C of the shape of convex curved surface 232C and the face 26B of the applying metal plate 26 of subtend.Thus, the mutual driving fit of the concave curved surface 26C of the convex curved surface 232C of base material 22 and applying metal plate 26 ground butt.
Peripheral part at applying metal plate 26 is formed with the cylindric cap 235 that extends and cover the peripheral part of above-mentioned base material 22 along above-mentioned thickness direction (above-below direction among Figure 12) to base material 22 sides.Cap 235 end along applying metal plate 26 sides (upside among Figure 12) of above-mentioned thickness direction from the outer peripheral face of base material 22 covers central portion.The edge of opening portion of cap 235 is configured in the end with the applying metal plate 26 side opposition sides (downside among Figure 12) of the outer peripheral face of base material 22.The outer peripheral face driving fit of the inner peripheral surface of cap 235 and base material 22.
The base end part branch of above-mentioned applying metal plate 26 sides in cap 235 disposes above-mentioned concave curved surface 26C.For example be set in the scope of 0.1～6.0mm along distance H 2 from the end (bottom) of cap 235 and above-mentioned applying metal plate 26 side opposition sides concave curved surface 26C to the above-mentioned thickness direction of above-mentioned edge of opening portion.
Be formed with the 22D of flanging portion (projecting strip part) of and ring-type that along circumferencial direction extend outstanding towards radial outside in the bottom of the outer peripheral face of base material 22.The edge of opening portion butt of the upper surface of the 22D of flanging portion and cap 235.Be with simultaneously towards the face of radial outside and face among the 22D of flanging portion towards the radial outside of cap 235.
As mentioned above, according to the CMP dresser 231 in the present embodiment, with base material 22 and applying metal plate 26 when bonding, the mutual driving fit of convex curved surface 232C and concave curved surface 26C ground butt, so the salable bonding agent B2 that is clipped between base material 22 and the applying metal plate 26.Can prevent that bonding agent B2 from flowing to the outside between the convex curved surface 232C of subtend and concave curved surface 26C.
Owing on base material 22, be formed with the 22D of flanging portion with the ring-type of the edge of opening portion butt of the cap 235 of applying metal plate 26, so with base material 22 and applying metal plate 26 when bonding, as mentioned above, even when the residue bonding agent B2 from central authorities towards flows outside arrives above-mentioned edge of opening portion, also can limit bonding agent B2 by the 22D of flanging portion and further flow to the outside.Therefore, can prevent that bonding agent B2 from draining to the outside.
Next, utilize Figure 13 that the 4th embodiment of the present invention is described.
Attached to the parts identical with same-sign with above-mentioned embodiment, omit its explanation.
The teat 213 of the CMP dresser 241 in the 4th embodiment and top and face 22A butt outstanding at a plurality of face 22A towards subtend of on the face 26B of base material 22 sides, having of applying metal plate 26.
The teat 213 of applying metal plate 26 is configured in (above-mentioned gap) between the teat adjacent in the base material 22 23 respectively.These teats 213 form cylindric or discoideus, and its top is formed on the plane corresponding with face 22A.Teat 213 is set at from the outstanding height of its face 26B mutually the same.
Outer peripheral edges portion at the face 22A of base material 22 is formed with the convex curved surface 232C that replaces above-mentioned embodiment from the 22E of the portion that accumulates of face 22A depression.Accumulate the 22E of portion and form ring-type along the circumferencial direction of above-mentioned outer peripheral edges portion, and with the concave curved surface 26C of applying metal plate 26 to always configuration.
As mentioned above, according to the CMP dresser 241 in the present embodiment, on the face 26B of base material 22 sides, be formed with outstanding teat 213, the top of above-mentioned teat 213 and face 22A butt towards the face 22A of this face 26B subtend at applying metal plate 26.Base material 22 and applying metal plate 26 except above-mentioned bonding, the top of teat 213 and with the face 22A butt of these teat 213 subtends and bonding by bonding agent B2, adhesive strength further improves.
At this moment, go up coating adhesive B2 by the outer surface (symbol 213C shown in Figure 13) beyond the above-mentioned top in teat 213, above-mentioned outer surface 213C plays fixed effect, therefore can further increase the adhesive strength for above-mentioned direction of delaminate.
Because the outer peripheral edges portion at the face 22A of base material 22 is formed with from the 22E of the portion that accumulates of face 22A depression, with base material 22 and applying metal plate 26 when bonding, the residue bonding agent B2 that does not enter into above-mentioned gap flow to and accumulates in the 22E of portion and be housed inside wherein, can prevent to remain bonding agent B2 and drain to the outside between this base material 22 and applying metal plate 26.
The present invention is not limited to above-mentioned embodiment, can apply various changes without departing from the spirit and scope of the present invention.
For example, in second to the 4th embodiment,, except the teat 23 of base material 22, also can on the face 26B of applying metal plate 26, be formed with teat 213, but be not limited thereto forming in teat 23, the four embodiments on the face 22A of base material 22.
Teat 23,213 forms for the one side at least among the face 26B of the face 22A of base material 22 and applying metal plate 26, and outstanding and top and face 26B, face 22A butt get final product towards face 26B, the face 22A of subtend.Therefore, for example can on the face 26B of applying metal plate 26, be formed with teat 213, on base material 22, not form teat 23.
It is cylindric or discoideus that the shape of teat 23,213 is not limited to illustrate in the above-mentioned embodiment.Teat 23,213 can use that polygon prism shape, the many ribs beyond cylindric or discoideus is tabular, striated, clathrate, ring flat-plate shape, circular arc is tabular or different shape such as radial.But, be preferably residue bonding agent B2 can be between teat 23,213 free-pouring shape.
In the above-mentioned embodiment, be formed with a plurality of teats 23,213, but be not limited thereto, teat 23,213 also can only form one.But this moment, the shape of preferred teat 23,213 forms and can stably support applying metal plate 26.
In the manufacturing of applying metal plate 26, the shape set of applying metal plate growth substrate 216 is the face 26B corresponding shape with applying metal plate 26, by forming applying metal plate 26, cap 25 and concave curved surface 26C thereof also form one with above-mentioned applying metal plate 26, but are not limited thereto.
For example, at first make flat applying metal plate 26 after, can implement punch process or pull and stretch processing to the outer peripheral edges portion of this applying metal plate 26, form the profile of discoideus applying metal plate 26, and form cap 25,235 or its concave curved surface 26C.Applying metal plate 26 forms by plating Ni, but also can use other metal material beyond the plating Ni to form metallic plate 26.Specifically, for example can use tabular SUS rolled plate, above-mentioned SUS rolled plate be carried out pull and stretch processing, be shaped to shape with above-mentioned cap 25,235 by punching press etc. as metallic plate 26.
Can also be with the cutting edge shape that forms by Laser Processing etc., form other cutting edge that utilizes the diamond coated film of CVD (chemical vapour deposition (CVD)) method to form and substitute that fixed diamond abrasive material 28 uses as cutting edge on the surperficial 26A of applying metal plate 26.
The outer peripheral edges portion that can also form the face 22A that substitutes at base material 22 to the male conical portion of tilting with applying metal plate 26 side opposition sides along axes O 2 directions gradually towards the outside from above-mentioned 22 radially inner side forms convex curved surface 22C, 232C.
At this moment, in the outer peripheral edges portion of the face 26B of applying metal plate 26, can also form radially inner side from above-mentioned 26B towards the outside gradually to substituting concave curved surface 26C along the oblique recessed tapered portion of base material 22 inclinations of axes O 2.These male conical portions and recessed tapered portion constitute mutual driving fit ground butt.
In addition, above-mentioned embodiment and variation suitably can be constituted.In the scope that does not break away from purport of the present invention, also can suitably the inscape in the above-mentioned embodiment be replaced into known inscape.
Above preferred embodiments of the present invention have been disclosed for illustrative, but the present invention is not limited by these embodiment.Without departing from the spirit and scope of the present invention, the interpolation that can constitute, omission, displacement and other change.The present invention is not limited by above-mentioned explanation, and the scope of the claims of only being enclosed limits.
Claims (17)
1. CMP trimmer, with finishing face that the polishing pad subtend of CMP device contacts on be fixed with diamond abrasive, it is characterized in that,
Described diamond abrasive is fixed on the CMP trimmer main body by the coat of metal, and described CMP trimmer main body is made of resin.
2. CMP trimmer according to claim 1 is characterized in that,
After the coat of metal that comprises described diamond abrasive and described main body form as independent parts respectively, engage and be one.
3. CMP trimmer according to claim 1 is characterized in that,
The peripheral end of the described coat of metal be provided with along the side surface part of described main body full week, on the thickness direction of the described coat of metal crooked bend.
4. CMP trimmer according to claim 1 is characterized in that,
Described CMP trimmer main body is made of engineering resins such as polyphenylene oxide, polyphenylene sulfides.
5. a manufacture method is used to be manufactured on the CMP trimmer that is fixed with diamond abrasive on the finishing face that contacts with the polishing pad subtend of CMP device, it is characterized in that described manufacture method comprises:
On the finishing face on the CMP trimmer main body, form the operation of substrate coating;
On described substrate coating, form the operation of Ni bottoming coating;
The operation of on described Ni bottoming coating, arranging diamond abrasive;
On described Ni bottoming coating, make and imbed the operation that coating is further grown up and fixed described diamond abrasive; With
Cover the operation of the integral body of described finishing face with coating.
6. a manufacture method is used to be manufactured on the CMP trimmer that is fixed with diamond abrasive on the finishing face that contacts with the polishing pad subtend of CMP device, it is characterized in that described manufacture method comprises:
On growing up with substrate, the coat of metal forms the operation of substrate coating;
On described substrate coating, form the operation of Ni bottoming coating;
The operation of on described Ni bottoming coating, arranging diamond abrasive;
On described Ni bottoming coating, make and imbed the operation that coating is grown up and fixed described diamond abrasive;
Cover the operation of the integral body of described finishing face with coating; With
The coat of metal that will comprise described diamond abrasive from described growth with the operation on the described finishing face of strippable substrate and the resin system of sticking on CMP trimmer main body.
7. according to claim 5 or 6 described manufacture methods, it is characterized in that described manufacture method further comprises:
After forming described substrate coating, on described substrate coating, paste mask, in the sectional hole patterns of described mask, arrange the operation of diamond abrasive with predetermined pattern perforation; With
Pre-fix described diamond abrasive by prime coat, peel off described mask subsequently, make and imbed the operation that coating is grown up and formally fixed described diamond abrasive.
8. manufacture method according to claim 7 is characterized in that,
Pre-fixing the operation of described diamond abrasive and the operation of formal fixing described diamond abrasive carries out respectively several times.
9. manufacture method according to claim 6 is characterized in that, further comprises:
At the peripheral end of the coat of metal that comprises described diamond abrasive, the operation that bend crooked on the thickness direction of the described coat of metal and described coat of metal one are grown up.
10. a CMP dresser possesses base material and is configured on the described base material and the outstanding from the teeth outwards metallic plate that forms cutting edge,
Described CMP dresser pads with the opposed CMP in described surface by described cutting edge pair and executes grinding, it is characterized in that,
Described base material is made of resin material,
Described base material and described metallic plate are bonding mutually by bonding agent,
Described base material on the one side at least in the face of described base material side of the face of described metallic plate side and described metallic plate, described of oriented subtend is outstanding, and forms the teat of top and this face butt.
11. CMP dresser according to claim 10 is characterized in that,
The top of described teat be formed on corresponding to described plane of this teat subtend on.
12. CMP dresser according to claim 10 is characterized in that,
Described teat is formed with a plurality of, is set to from described the outstanding height that forms this teat mutually the same.
13. CMP dresser according to claim 10 is characterized in that,
Be formed with along the thickness direction of described metallic plate and cover the cap of tubular of the peripheral part of described base material at the peripheral part of described metallic plate.
14. CMP dresser according to claim 10 is characterized in that,
The outer peripheral edges portion towards the face of described metallic plate side at described base material is formed with convex curved surface,
Be formed with concave curved surface in the outer peripheral edges portion towards the face of described base material side of described metallic plate corresponding to the shape of described convex curved surface.
15. according to claim 13 or 14 described CMP dressers, it is characterized in that,
On described base material, be formed with ring-type flanging portion with the edge of opening portion butt of described cap.
16. CMP dresser according to claim 10 is characterized in that,
Area occupation ratio in the described teat form at this teat described is set in 20～78% the scope.
17. CMP dresser according to claim 10 is characterized in that,
The area that described teat is set at the top of this teat increases towards the outside gradually from described the central authorities that this teat forms.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009-107858 | 2009-04-27 | ||
| JP2009107858A JP2010253631A (en) | 2009-04-27 | 2009-04-27 | Cmp conditioner and manufacturing method for the same |
| JP2009158619A JP2011011303A (en) | 2009-07-03 | 2009-07-03 | Cmp pad conditioner |
| JP2009-158619 | 2009-07-03 |
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| Publication Number | Publication Date |
|---|---|
| CN101870086A true CN101870086A (en) | 2010-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010164685A Pending CN101870086A (en) | 2009-04-27 | 2010-04-16 | CMP trimmer and manufacture method thereof |
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| Country | Link |
|---|---|
| US (1) | US20100273402A1 (en) |
| CN (1) | CN101870086A (en) |
| TW (1) | TW201103699A (en) |
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| JP6968817B2 (en) * | 2016-04-06 | 2021-11-17 | エム キューブド テクノロジーズ， インコーポレイテッド | Diamond Complex CMP Pad Conditioner |
| KR102013386B1 (en) * | 2018-01-29 | 2019-08-22 | 새솔다이아몬드공업 주식회사 | Manufacturing method of pad conditioner by reverse plating and pad conditioner thereof |
| JP7284261B2 (en) * | 2019-06-28 | 2023-05-30 | 日本碍子株式会社 | Wafer mounting table and its manufacturing method |
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-
2010
- 2010-04-16 CN CN201010164685A patent/CN101870086A/en active Pending
- 2010-04-21 US US12/662,518 patent/US20100273402A1/en not_active Abandoned
- 2010-04-23 TW TW099112808A patent/TW201103699A/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658605A (en) * | 2012-05-02 | 2012-09-12 | 厦门钨业股份有限公司 | Manufacturing method of super-hard material high-wear-resistance precision support frame/block |
| CN102658605B (en) * | 2012-05-02 | 2015-05-20 | 厦门钨业股份有限公司 | Manufacturing method of super-hard material high-wear-resistance precision support frame/block |
| CN112223133A (en) * | 2019-07-15 | 2021-01-15 | 新韩钻石工业股份有限公司 | CMP pad conditioner and method of making the same |
| CN112223133B (en) * | 2019-07-15 | 2023-10-13 | 新韩钻石工业股份有限公司 | Chemical mechanical polishing pad conditioner and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201103699A (en) | 2011-02-01 |
| US20100273402A1 (en) | 2010-10-28 |
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Application publication date: 20101027 |