KR102229135B1 - CMP pad conditioner with individually attached tips and method for producing the same - Google Patents

Abstract

The present invention relates to a CMP pad conditioner and a method of manufacturing the same, and more specifically, to condition a CMP pad used in a chemical mechanical polishing (CMP) process, which is a part of a semiconductor device manufacturing process, to always maintain its initial state. In the CMP pad conditioner, the present invention relates to a CMP pad conditioner with a new structure and a manufacturing method for maximizing the performance of a cutting tip constituting the CMP pad conditioner.

Description

CMP pad conditioner with individually attached tips and method for producing the same}

The present invention relates to a CMP pad conditioner and a method of manufacturing the same, and more specifically, to condition a CMP pad used in a chemical mechanical polishing (CMP) process, which is a part of a semiconductor device manufacturing process, to always maintain its initial state. In the CMP pad conditioner, the present invention relates to a CMP pad conditioner with a new structure and a manufacturing method for maximizing the performance of a cutting tip constituting the CMP pad conditioner.

In the existing CMP process, the CMP pad conditioner serves to improve the flowability of the slurry supplied to the pad and to keep the pad in the same state as the initial state by shaving the pad little by little.

In order to condition the CMP pad, diamond abrasive particles having excellent wear resistance are attached to the conditioner through plating, sintering, or fusing processes. As a substrate to which diamond abrasive particles are attached, Ni-base metal is generally used. The CMP process uses an acidic or alkaline chemical solution (slurry) to easily remove the metal film or oxide film. At this time, the substrate material on which the diamond is attached is dissolved by the chemical solution used to cause the diamond abrasive particles to fall off, or to cause scratches or contamination on the wafer due to the metal material dissolved from the substrate.

In order to solve the problem of a CMP pad conditioner formed by directly bonding abrasive particles such as diamond particles to a metal substrate by a thermal fusion method such as sintering, recently, a tip having a certain shape and size has been developed on a ceramic matrix. CVD CMP pad conditioners that collectively form a number of cutting tips by forming a diamond layer by depositing diamonds thereon are manufactured, but the ceramic substrate is warped during the CVD diamond deposition process using a high temperature. As a result, it has a problem that the flatness is distorted. In addition, since it is difficult to configure the size, height, and shape of the cutting tip in various ways in the process of manufacturing the cutting tip, it is difficult to implement various performances.

Therefore, there is a need to develop a new structured CMP pad conditioner that solves this problem.

Patent Publication No. 10-2012-0058303

As a result of a number of studies, the present inventors have completed the present invention by developing a new structured CMP pad conditioner that can maximize the performance of a cutting tip included in the previously developed CMP pad conditioner.

Therefore, the object of the present invention is not to collectively form cutting tips on a substrate, but after pre-fabricating a plurality of individual cutting tips having different structures, the manufactured individual cutting tips are placed on the substrate so as to have positions suitable for each purpose. It is to provide an individual cutting tip-attached CMP pad conditioner with improved tool life and performance by attaching it using a binder layer and a method of manufacturing the same.

Another object of the present invention is to manufacture various types of individual cutting tips in advance and then bond them to the substrate, so that various cutting tip shapes can be implemented in one substrate, thereby diversifying the functions of one conditioner and the scope of its application. It is to provide an individual cutting tip attached CMP pad conditioner and a method of manufacturing the same that can increase.

Another object of the present invention is that when a defective cutting tip is found in a finished product, it is possible to replace only the defective cutting tip instead of discarding the entire product, so that the defective product can be recycled and the individual cutting tip attached CMP pad conditioner is easy to produce. And a manufacturing method thereof.

Another object of the present invention is that in the case of a CMP pad conditioner manufactured by depositing a diamond layer by CVD, it satisfies all various conditions such as workability, chemical resistance, and coefficient of thermal expansion when selecting a raw material due to the problem of thermal deformation of the material generated during CVD coating. There were many restrictions on the selection of materials because the materials to be ordered had to be selected, but through the configuration of individually prefabricating cutting tips and then attaching them to the substrate, it is possible to escape the constraints caused by the thermal deformation problem of the material, resulting in ultra-fine cutting tips and materials. It is to provide an individual cutting tip attached CMP pad conditioner with ease of selection and a manufacturing method thereof.

The object of the present invention is not limited to the above-mentioned object, and even if not explicitly mentioned, the object of the invention that one of ordinary skill in the art can recognize from the description of the detailed description of the invention to be described later may naturally be included. .

In order to achieve the object of the present invention described above, first, the present invention is a substrate; A plurality of binder layers formed on the upper surface of the substrate corresponding to each position where the cutting tip for CMP pad conditioning is to be formed; And a plurality of individual cutting tips that are individually prepared separately and disposed on the binder layer to be coupled and fixed to the substrate.

In a preferred embodiment, the plurality of individual cutting tips have different top surface areas and are individually formed at a specific position of the substrate according to each top surface area.

In a preferred embodiment, the larger the top area of the individual cutting tip is, the more it is formed on the edge of the substrate, and the smaller the top area is, the more it is formed in the center of the substrate.

In a preferred embodiment, the upper surface area of the individual cutting tips formed on the edge of the substrate is 40 × 40 μm ² to 100 × 100 μm ² .

In a preferred embodiment, the upper surface area of the individual cutting tips formed in the center of the substrate is 20 × 20㎛ ² ~ 40 × 40㎛ ² smaller than the upper surface area of the individual cutting tips formed on the edge of the substrate.

In a preferred embodiment, the plurality of individual cutting tips have different tip heights and are individually formed at a specific location on the substrate according to each tip height.

In a preferred embodiment, the larger the tip height is, the higher the tip is formed at the edge of the substrate, and the smaller the tip is, the lower the tip is formed at the center of the substrate.

In a preferred embodiment, the individual cutting tip is a body formed of a sapphire, silicon, ceramic material; And a diamond coating layer formed on the body.

In a preferred embodiment, it further comprises a diamond surface coating layer formed on the side surface of the body and the exposed surface of the diamond coating layer.

In a preferred embodiment, the substrate is further formed with a plurality of receiving grooves on its surface to accommodate the binder layer and the lower portion of the individual cutting tip.

In a preferred embodiment, the plurality of individual cutting tips are different in one or more of a spacing and a size between the individual cutting tips within a certain area of the substrate.

In a preferred embodiment, the substrate includes a surface protective layer formed of a material having high chemical stability on its upper surface.

In addition, the present invention comprises the steps of preparing a plurality of individual cutting tips; Forming a binder layer on the upper surface of the substrate corresponding to a predetermined position where the prepared individual cutting tips are to be formed; And disposing the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate.

In addition, the present invention comprises the steps of preparing a plurality of individual cutting tips; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips having the binder layer underneath them at a predetermined position on the upper surface of the substrate, and attaching the individual cutting tips to the substrate. Provides.

In addition, the present invention comprises the steps of preparing a plurality of individual cutting tips; Forming a plurality of receiving grooves on the upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer in the receiving groove; And disposing the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate.

In addition, the present invention comprises the steps of preparing a plurality of individual cutting tips; Forming a plurality of receiving grooves on the upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips having the binder layer formed below them in the receiving groove.

In a preferred embodiment, before forming the binder layer or the receiving groove on the surface of the substrate, forming a surface protection layer on the surface of the substrate; further includes.

In a preferred embodiment, the binder layer or the receiving groove is formed on the surface protection layer.

In a preferred embodiment, the preset position at which the prepared individual cutting tips are to be formed is determined according to one or more of the top surface area and the tip height of the individual cutting tips.

In a preferred embodiment, the larger one or more of the upper surface area and the tip height of the individual cutting tip is formed at the edge of the substrate, and the smaller one or more of the upper surface area and the tip height is formed at the center of the substrate. .

In a preferred embodiment, the individual cutting tips attached to the substrate are formed to have at least one of a distance and a size different between the individual cutting tips within a certain area of the substrate.

The individual cutting tip-attached CMP pad conditioner and its manufacturing method of the present invention described above have the following effects.

First, according to the present invention, instead of collectively forming cutting tips on a substrate, a plurality of individual cutting tips having different structures are pre-fabricated, and then a binder on the substrate so that the manufactured individual cutting tips have positions suitable for each purpose. Tool life and performance are improved by attaching using layers.

In addition, according to the present invention, since various types of individual cutting tips are manufactured in advance and then bonded to the substrate, various cutting tip shapes can be implemented in one substrate, thereby diversifying the functions of one conditioner and the scope of its application. Can increase

In addition, according to the present invention, when a defective cutting tip is found in a finished product, not the entire product is discarded, but only the defective cutting tip can be replaced, so that the defective product can be recycled and production is easy.

In addition, according to the present invention, in the case of a CMP pad conditioner manufactured by depositing a diamond layer by CVD, it satisfies all various conditions such as workability, chemical resistance, and thermal expansion coefficient when selecting a raw material due to the thermal deformation problem of the material generated during CVD coating. Since the material must be selected, there were many restrictions on material selection, but through the configuration of individually prefabricating the cutting tip and attaching it to the substrate, it is possible to escape the constraints caused by the thermal deformation problem of the material, resulting in ultra-fine cutting tips and material selection. Has the ease of.

These technical effects of the present invention are not limited only to the ranges mentioned above, and even if not explicitly mentioned, the effects of the invention that can be recognized by those of ordinary skill in the art from the description of specific details for the implementation of the invention described later are also Of course it is included.

1A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to an embodiment of the present invention, FIG. 1B is a partially enlarged plan view, and FIG. 1C is a cross-sectional view taken along line AA shown in FIG. 1B.
2A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, FIG. 2B is a partially enlarged plan view, FIG. 2C is a cross-sectional view taken along line AA shown in FIG. 2B, and FIG. 2D is FIG. It is a plan view showing a modified example of.
3A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, FIG. 3B is a partially enlarged plan view, and FIG. 3C is a cross-sectional view taken along line AA shown in FIG. 3B.
FIG. 4A is a schematic view showing an implementation example of various shapes of individual tips attached to the substrate of the present invention, and FIGS. 4B and 4C illustrate different methods of implementing the top surface among the shapes shown in FIG. 4A. .
5A and 5B are partial cross-sectional schematic views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, respectively.
6A and 6B are partial cross-sectional schematic views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, respectively.
7A to 7D are schematic plan views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention.
8A and 8B are partial side sectional views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention.

Terms used in the present invention have selected general terms that are currently widely used as possible while taking functions of the present invention into consideration, but this may vary according to the intention or precedent of a technician working in the field, the emergence of new technologies, and the like. In addition, in certain cases, there are terms arbitrarily selected by the applicant, and in this case, the meaning of the terms will be described in detail in the description of the corresponding invention. Therefore, the terms used in the present invention should be interpreted based on the general meaning of the term and the contents described throughout the specification of the present invention, not a simple name of the term.

Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features or It is to be understood that the presence or addition of numbers, steps, actions, components, parts or combinations thereof does not preclude the possibility of preliminary exclusion.

Terms such as first and second may be used to describe various constituent elements, but the constituent elements should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

Hereinafter, the technical configuration of the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. The same reference numerals used to describe the present invention throughout the specification denote the same elements. In addition, in describing the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

The technical feature of the present invention is that after pre-fabricating a plurality of individual cutting tips having different structures at least one of top area, tip height, shape, and size, a plurality of pre-fabricated individual cutting tips are suited for each purpose. It is a CMP pad conditioner having a structure formed by independently attaching it to a specific position on a substrate using a binder layer and a method of manufacturing the same.

A conventionally known CMP pad conditioner is a CVD CMP pad conditioner having a cutting tip with improved chemical resistance by forming a plurality of tip bodies having a uniform shape and size on a ceramic substrate and depositing a diamond layer on it by CVD method. Is being manufactured, but in the case of a CMP pad conditioner that forms a diamond coating layer in a CVD method without using abrasive particles to form cutting tips at once, the ceramic substrate is warped during the CVD diamond deposition process using a high temperature. There was a problem of distorting flatness, second, there was a problem that it was difficult to implement various cutting tip shapes in one substrate, and third, even if one defective cutting tip is found in the finished product, the entire product must be discarded, and fourth This is because there was a problem that it was difficult to implement the cutting tip.

However, according to the CMP pad conditioner and its manufacturing method of the present invention, since the individual cutting tips are separated from the substrate, pre-fabricated, and manufactured by attaching to the substrate, it is possible to solve the problems of the conventional CMP pad conditioner described above.

In particular, when manufacturing a CMP pad conditioner in which a diamond coating layer is formed on a large-diameter disk or pellet type by the conventional method, a high temperature process of 800~2500℃ is performed to grow the diamond coating layer. The thermal deformation of the material results in different heights of the cutting tips, resulting in uneven wear that quickly wears out the diamond coating layer located in the area where the thermal deformation is large, shortening the life of the CMP pad conditioner. However, since the individual cutting tip of the present invention uses a fine cell, the cell size is very small, so the risk of thermal deformation of the material can be prevented. As a result, the life of the CMP pad conditioner can be extended. It is possible to prevent non-uniform wear of the pad, thereby bringing the advantage of stably obtaining the polishing rate of the wafer.

Accordingly, the individual cutting tip attached CMP pad conditioner of the present invention includes a substrate; A plurality of binder layers formed on the upper surface of the substrate corresponding to each position where the cutting tip for CMP pad conditioning is to be formed; And a plurality of individual cutting tips that are separately prepared and separated, respectively, and disposed on the binder layer to be coupled and fixed to the substrate.

If necessary, the substrate may further include a binder layer and a plurality of receiving grooves for accommodating the lower part of the individual cutting tip on its surface. When the receiving groove is formed, a binder layer is formed inside the receiving groove and individual cutting into the receiving groove. Since the tip is inserted and fixed, there is an effect that the fixing force between the substrate and individual cutting tips can be further strengthened. In addition, the substrate may include a surface protective layer formed of a material having high chemical stability on its upper surface.

Here, the plurality of individual cutting tips may have at least one of a top area, a tip height, a size, and a shape different from each other.

Next, the method of manufacturing an individual cutting tip attached CMP pad conditioner of the present invention comprises: preparing a plurality of individual cutting tips; Forming a binder layer on the upper surface of the substrate corresponding to a predetermined position where the prepared individual cutting tips are to be formed; And disposing each of the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate; including or preparing a plurality of individual cutting tips; Forming a plurality of receiving grooves on an upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer in the receiving groove; And disposing the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate. If necessary, forming a surface protection layer on the surface of the substrate before forming the binder layer or the receiving groove on the surface of the substrate; may further include.

1A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to an embodiment of the present invention, FIG. 1B is a partially enlarged plan view, and FIG. 1C is a cross-sectional view taken along line A-A shown in FIG. 1B. 2A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, FIG. 2B is a partially enlarged plan view, FIG. 2C is a cross-sectional view taken along line AA shown in FIG. 2B, and FIG. 2D is FIG. It is a plan view showing a modified example of. 3A is a schematic plan view of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, FIG. 3B is a partially enlarged plan view, and FIG. 3C is a cross-sectional view taken along line A-A shown in FIG. 3B. FIG. 4A is a schematic view showing an implementation example of various shapes of individual tips attached to the substrate of the present invention, and FIGS. 4B and 4C illustrate different methods of implementing the top surface among the shapes shown in FIG. 4A. . 5A and 5B are partial cross-sectional schematic views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention, respectively. 6A and 6B are partial cross-sectional schematic views of a CMP pad conditioner with individual cutting tips according to another embodiment of the present invention. FIGS. 7A to 7D are individual cutting tip attachment types according to another embodiment of the present invention. It is a schematic plan view of a CMP pad conditioner.

Referring to Figs. 1A to 3C showing a schematic plan view, a partial enlarged plan view, and a cross-sectional view taken along line AA of an individual cutting tip attached CMP pad conditioner according to various embodiments of the present invention, an individual cutting tip attached type CMP pad according to the present invention The conditioner 100 includes a substrate 110, a binder layer 120, and an individual cutting tip 130.

Here, the substrate 110 is a disk-shaped flat plate, and the diameter thereof may be in the range of 90 to 120 millimeters as the diameter of a general CMP pad conditioner. The material of the substrate 110 may be any material used for the substrate of a known CMP pad conditioner such as metal, alloy, polymer, ceramic, carbon products, and mixtures thereof, and stainless steel may be used as an embodiment. .

In particular, the substrate 110 may further include a surface protective layer 112 formed on the upper surface of the substrate 110 to improve chemical resistance to various chemical substances used in the CMP process. Is not limited as long as it is a material having excellent chemical stability, such as a carbide material, a ceramic material including _{SiC or Si 3} N _{4 , or a composite ceramic material including at least one of SiO 2} or Al ₂ O _{3, but as an embodiment sapphire is} Can be used.

The binder layer 120 is for firmly fixing a plurality of individual cutting tips 130 on the upper surface of the substrate 110 and corresponds to each position where the individual cutting tips 130 for CMP pad conditioning are formed, so that the substrate 110 It is formed on the upper surface. Polymer, plastic, epoxy resin, rubber, acrylic, silicone polymer material, as long as it is a binder material having chemical resistance to various chemicals used in the CMP process is not limited, but an acrylic adhesive may be used as an embodiment. . The thickness of the binder layer 120 is experimentally determined as an acrylic adhesive, and is within a range capable of exhibiting sufficient bonding force to maintain the bonding between the substrate 110 and the individual cutting tips 130 even in a number of CMP processes.

The individual cutting tips 130 are disposed on the upper surface of the substrate, that is, on the binder layer 120 formed on the upper surface, and are fixedly coupled to the substrate 110 to condition the CMP pad. Alternatively, the binder layer 120 is not prepared for each segment but is individually pre-fabricated and prepared, and each separated individual cutting tip 130 is formed on the upper surface of the substrate 110 at a preset position where the individual cutting tip 130 will be located. It has a configuration that is firmly coupled by ). Here, the preset position where the individual cutting tips 130 will be located is designed to arrange cutting tips having different structures on the substrate in consideration of tool life and optimum CMP pad conditioning efficiency, depending on the purpose of use of the CMP pad conditioner. Means location.

That is, if the top surface area, tip height, size, shape, arrangement interval, etc. of the individual cutting tips 130 that are attached to the upper surface of the substrate 110 are variously combined, individual cutting tip attachment types having different structures and functions This is because the CMP pad conditioner 100 can be implemented.

Referring to FIGS. 1A to 1C showing the first embodiment, a plurality of individual cutting tips 130 have different top areas, which are individually formed at a specific position of the substrate 110 according to each top area. I can see that. In particular, as shown in FIGS. 1A to 1C, the larger the upper surface area of the individual cutting tips 130 is, the larger the upper surface area is, the larger the edge of the substrate 110 is, and the smaller the upper surface area may be formed in the center of the substrate 110. As described above, attaching to a specific position on the substrate 110 according to the upper surface area of the individual cutting tips 130 is a disk-shaped CMP pad conditioner 100, since the peripheral speed of the edge portion is faster than the peripheral speed of the center when rotating. This is because a lot of work is done under a lot of pressure, and the cutting tip located at the edge wears more. In consideration of these operating conditions, the upper surface area of the individual cutting tips 130 formed at the edges in the present invention is ^{selected within the range of 40×40 μm 2} to 100×100 μm ² and individual cutting tips 130 formed in the center. ) Can be selected within the range of 20 × 20㎛ ² ~ 40 × 40㎛ ^2. In this way, if the individual cutting tips 130 having a large top area and a blunt and large size are placed on the edge of the substrate 110, and individual cutting tips that are small and sharp toward the center are arranged, the individual cutting tips 130 at the center and the edge are arranged. It is possible to minimize the wear deviation between the. When the wear deviation is minimized in this way, the life of the tool can be increased.Efficient conditioning is also performed by a small, sharp individual cutting tip on the center side roughening the pad surface, and a blunt and large individual cutting tip on the edge side smoothly cutting the pad surface. You can do it.

Referring to FIGS. 2A to 2C showing a second embodiment, a plurality of individual cutting tips 130 have different tip heights and are individually formed at a specific position of the substrate according to each tip height, in particular FIG. As shown in 2c, as an embodiment of the individual cutting tip 130, the larger the tip height 135 is, the larger the tip height 135 is formed at the edge of the substrate 110, and the smaller the tip height 135 is formed at the center of the substrate 110. Can be.

A general CMP pad conditioner is a disk type, and if the height of the cutting tip is uniform across the entire surface of the disk, diamond uneven wear may occur due to the circumferential speed (abrasion of the cutting tip located at the edge of the disk with a fast circumferential speed is Faster), and when the edge of the cutting tip is rounded due to wear of the cutting tip, the conditioning efficiency decreases, and a certain conditioning efficiency cannot be obtained. As a method to improve this problem, a method of varying the height between the cutting tips so that new cutting tips can be continuously generated may be proposed, but since the conventional method cannot provide a step difference of several steps, the height difference is made uniform. It was difficult, but if the individual cutting tips 130 are used as in the present invention, the height of each cutting tip can be different, and individual cutting tips having different heights can be selectively attached to a desired position within the substrate. There is an advantage that can sustain conditioning efficiency that cannot be achieved with the existing CMP pad conditioner structure.

The most efficient arrangement is that the tip height 135 of the individual cutting tip 130 attached to the edge of the substrate 110 is the highest, as shown in FIG. 2C, and the tip height of the individual cutting tip 130 increases as it approaches the center. Although it may be uniformly lowered, it can be said that it is advantageous in terms of maintaining conditioning efficiency just to manufacture by varying the height between individual cutting tips 130 in multiple stages so that new cutting tips can continue to work. In other words, the most efficient arrangement is to have the tip height 135 with the center concave when viewed from the top of the CMP pad conditioner, but the effect can be achieved even if it is manufactured in various shapes such as convex shape and cross shape.

As a modified example of the second embodiment described above, as shown in FIG. 2D, a configuration of increasing the density of the cutting tip at the edge may be taken. In other words, when the CMP pad conditioner 100 is in a disk shape, the peripheral speed of the edge portion during rotation is faster than the peripheral speed of the center, so the more pressure is applied to the edge, the more work is done and the cutting tip located at the edge wears more, preventing this. This is because the density of individual cutting tips at the edge is increased to make the diamond wear rate between individual cutting tips uniform in the pad conditioner, thereby prolonging the lifespan.

As a third embodiment, the above-described first embodiment and the second embodiment are combined, and as shown in FIGS. 3A to 3C, the top area 134 increases toward the edge of the substrate 110 while increasing the tip height 135. The individual cutting tip 130 that increases is attached, the top surface area 134 is narrowed toward the center of the substrate 110 and the tip height 135 may be formed so that the individual cutting tip 130 is attached.

Although not specifically described, a plurality of individual cutting tips different from at least one of the top surface area, tip height, and shape, such as a structure in which cutting tip density is different as shown in FIG. 2D in the substrate shown in FIGS. 1A and 3A, Various combinations including the technical idea of the present invention may be implemented by arranging one or more of the intervals and sizes between individual cutting tips to be different within a certain area.

Looking in more detail for the individual cutting tip 130 with reference to FIGS. 4A to 4C, the individual cutting tip 130 that is separated from the substrate 110 and is pre-fabricated includes a body 131 and a diamond coating layer 132 I can see that. As an embodiment, as shown in FIGS. 4A to 4C, the upper surface of the individual cutting tip 130 is formed in parallel with the ground as a whole, or at least a part thereof is formed in parallel, so that individual cutting as shown in FIGS. 5A to 6B At least a portion of the upper surface of the tip 130 forms a plane parallel to the upper surface of the substrate 110, or as another embodiment, the upper surface of the individual cutting tip 130 forms a cylinder as a whole and the upper surface forms a cone. It can be formed to form a smooth curved surface.

The main body 131 is formed of sapphire, silicon, and ceramic materials, and the shape may be implemented in various shapes according to the conditioning conditions of the CMP pad. It may be formed in parallel or in a stepped shape with a step, and the top surface may be formed to form a cone or a smooth curved surface while forming a cylinder as a whole.

The diamond coating layer 132 is formed on the body 131 to cut the CMP pad, and may be formed by depositing diamond on the body 131 by a CVD method or the like. Here, the shape of the upper surface of the individual cutting tip 130 may be formed in advance on the upper surface of the main body 131 as shown in FIG. 4B and then implemented by a method of forming a diamond coating layer 132, as shown in FIG. 4C. As described above, the upper surface of the main body 131 may be formed as a flat surface, and then the diamond coating layer formed thereon may be processed into a desired shape using a known method such as etching or mechanical processing. If necessary, to extend the life of the individual cutting tip 130, the diamond surface coating layer 133 of the main body 131 except for the lower surface bonded to the binder layer 120, all sides and the exposed surface of the diamond coating layer 132 It can be formed to surround.

Through this configuration, the CMP pad conditioner with individual cutting tips of the present invention prepares individual cutting tips 130 having various types of shapes in advance and then bonds them to the substrate 110. It is possible to implement a shaped cutting tip. In addition, the CMP pad conditioner with cutting tips of various shapes has a variety of functions compared to the existing CMP pad conditioner, so the range that can be used is very wide. That is, in the existing CMP pad conditioner, there are many limitations in implementing the shape of the cutting tip, so the type of cutting tip shape is limited, and it was difficult to implement various cutting tip shapes in one CMP pad conditioner.

Next, looking at the manufacturing method of the individual cutting tip attached CMP pad conditioner of the present invention through FIGS. 5A to 6B, the first embodiment is the method shown in FIGS. 5A and 6A, and the individual cutting tip 130 is shown in FIG. 4A. As shown in FIG. 4C, after preparing a plurality of pieces, forming a binder layer 120 corresponding to a preset position at which the individual cutting tips 130 prepared on the upper surface of the substrate 110 will be formed, the binder layer ( It can be seen that the individual cutting tips 130 prepared on the 120) are arranged so that the individual cutting tips 130 are attached to the substrate 110. In particular, the method illustrated in FIG. 6A may further perform a step of forming the surface protection layer 112 on the surface of the substrate 110 before forming the binder layer 120 on the surface of the substrate 110. When the surface protection layer 112 is further formed in this way, the binder layer 120 is formed on the surface protection layer 112.

The second embodiment is the method shown in FIGS. 5B and 6B, and after preparing a plurality of individual cutting tips 130 in the same manner as in the first embodiment, the binder layer 120 is not directly formed on the substrate 110, and the substrate First, a plurality of receiving grooves 111 are formed in correspondence with a preset position at which the individual cutting tips 130 prepared on the upper surface of 120 will be formed, and then a binder layer 120 is formed inside the receiving groove 111, and The individual cutting tips 130 are attached on the substrate 110 by the binder layer 120 in such a manner that the lower part of the individual cutting tips 130 is inserted into the receiving groove. In particular, the method illustrated in FIG. 6B may further perform the step of forming the surface protection layer 112 on the surface of the substrate 110 before forming the receiving groove 111 on the surface of the substrate 110. When the surface protection layer 112 is further formed in this way, the receiving groove 111 is formed on the surface protection layer 112.

As a modified example of the first and second embodiments, the binder layer 120 is not formed on the substrate 110, but the binder layer 120 is formed under the prepared individual cutting tips 130, and then the substrate 110 Of course, it is possible to form the cutting tip 130 on the substrate by attaching it to a preset position of ). In this case, a modification of the first embodiment includes preparing a plurality of individual cutting tips; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips having the binder layer underneath them at a predetermined position on the upper surface of the substrate; and, a modified example of the second embodiment includes individual cutting. Preparing a plurality of tips; Forming a plurality of receiving grooves on the upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips having the binder layer formed below them in the receiving groove.

According to the above-described method of manufacturing a CMP pad conditioner with individual cutting tips of the present invention, a predetermined position at which the plurality of individual cutting tips 130 prepared on the substrate 110 will be formed is the upper area and the tip of the individual cutting tips 130. It may be determined according to any one or more of the heights, and furthermore, it is preferable that it is adjusted to be formed to be different from one or more of the intervals and sizes between the individual cutting tips 130 within a certain area of the substrate 110. Through various combinations of these individual cutting tips 130, it is possible to provide a CMP pad conditioner having a structure optimized for the purpose of use of the CMP pad conditioner.

In addition, according to the method of manufacturing a CMP pad conditioner with individual cutting tips of the present invention, in the case of a conventional CMP pad conditioner, if a single defect in the shape of the cutting tip or the size of the cutting tip occurs during product inspection, the manufactured CMP pad conditioner is Although it should be discarded, when manufacturing a CMP pad conditioner by attaching individual cutting tips to each substrate as in the present invention, even if defects in the shape or dimensions of the cutting tips are confirmed, it is not necessary to discard the whole but replace only the defective cutting tips. It is possible to prevent production loss.

7A to 7D are schematic plan views of an individual cutting tip attached type CMP pad conditioner according to another embodiment of the present invention, and FIGS. 8A and 8B are an individual cutting tip attached type according to another embodiment of the present invention. It shows a part of the side cross-sectional view of the CMP pad conditioner.

7A to 7D show a plurality of individual cutting tips 130 having different top surface area, tip height, shape, size, etc. in a state in which the top surface of the substrate 110 is flat as described above, at a specific position and at different intervals. It shows implementation examples installed in various combinations so as to have.

Although not specifically described, FIGS. 8A and 8B show a state in which the upper surface of the substrate 110 has a primary shape rather than a flat surface. Since individual cutting tips can be very easily attached to a desired location using a binder layer on a certain shape of the substrate by the above-described method, a wide range of pad conditioning characteristics can be realized.

Although the present invention has been shown and described with a preferred embodiment as described above, it is not limited to the above-described embodiment, and within the scope not departing from the spirit of the present invention, to those of ordinary skill in the art. Various changes and modifications will be possible.

100: CMP pad conditioner for attaching individual cutting tips
110: substrate 111: receiving groove 112: surface protection layer
120: binder layer 130: individual cutting tip
131: main body 132: diamond coating layer
133: diamond surface coating layer 134: top area
135: tip height

Claims (21)

Board; A plurality of binder layers formed on the upper surface of the substrate corresponding to each position where the cutting tip for CMP pad conditioning is to be formed; And a plurality of individual cutting tips that are individually prepared and separated, respectively, and disposed on the binder layer to be coupled and fixed to the substrate,
The individual cutting tip is formed of a sapphire, silicon, ceramic material, the body as a whole forming a polygonal column or cylinder; And a diamond coating layer formed on the upper body of the body, wherein at least a portion of the upper surface of the individual cutting tip is a plane parallel to the upper surface of the substrate.
The method of claim 1,
The individual cutting tip attached type CMP pad conditioner, characterized in that the plurality of individual cutting tips have different top surface areas and are individually formed at a specific position of the substrate according to each top surface area.
The method of claim 2,
Individual cutting tip attachment type CMP pad conditioner, characterized in that the larger the upper surface area of the individual cutting tips is formed on the edge of the substrate, and the smaller the upper surface area is formed at the center of the substrate.

The method of claim 3,
Individual cutting tip attached type CMP pad conditioner, characterized in that the upper surface area of the individual cutting tips formed on the edge of the substrate is 40 × 40㎛ ² ~ 100 × 100㎛ ^2.
The method of claim 3,
Individual cutting tip attachment type, characterized in that the upper surface area of individual cutting tips formed at the center of the substrate is smaller than the upper surface area of individual cutting tips formed at the edge of the substrate and is 20×20 μm ² ~ 40×40 μm ² CMP pad conditioner.
The method of claim 1,
The plurality of individual cutting tips have different tip heights and are individually formed at a specific position of the substrate according to each tip height.
The method of claim 6,
Individual cutting tip attached CMP pad conditioner, characterized in that the larger the tip height is formed at the edge of the substrate, and the smaller the tip height is formed at the center of the substrate.
delete The method of claim 1,
Individual cutting tip attached CMP pad conditioner, characterized in that it further comprises a diamond surface coating layer formed on the side surface of the body and the exposed surface of the diamond coating layer.
The method according to any one of claims 1 to 7,
The substrate is an individual cutting tip attached type CMP pad conditioner, characterized in that a plurality of receiving grooves for receiving the binder layer and the individual cutting tip lower portion are further formed on the surface thereof.

The method according to any one of claims 1 to 7,
The individual cutting tip attachment type CMP pad conditioner, characterized in that at least one of a distance and a size between the individual cutting tips is different within a predetermined area of the substrate.
The method according to any one of claims 1 to 7,
The substrate is an individual cutting tip attached CMP pad conditioner, characterized in that it further comprises a surface protection layer formed on the upper surface.
Preparing a plurality of individual cutting tips; Forming a binder layer on the upper surface of the substrate corresponding to a predetermined position where the prepared individual cutting tips are to be formed; And disposing the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate;
The preset position at which the prepared individual cutting tips are to be formed is determined according to any one or more of the top surface area and the tip height of the individual cutting tips,
The individual cutting tip is formed of a sapphire, silicon, ceramic material, the body as a whole forming a polygonal column or cylinder; And a diamond coating layer formed on the body, wherein at least a portion of the upper surface of the individual cutting tip is a plane parallel to the upper surface of the substrate.
Preparing a plurality of individual cutting tips; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips on which the binder layer is formed at a predetermined position on the upper surface of the substrate, respectively,
The preset position at which the prepared individual cutting tips are to be formed is determined according to any one or more of the top surface area and the tip height of the individual cutting tips,
The individual cutting tip is formed of a sapphire, silicon, ceramic material, the body as a whole forming a polygonal column or cylinder; And a diamond coating layer formed on the body, wherein at least a portion of the upper surface of the individual cutting tip is a plane parallel to the upper surface of the substrate.
Preparing a plurality of individual cutting tips; Forming a plurality of receiving grooves on the upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer in the receiving groove; And disposing the prepared individual cutting tips on the binder layer so that the individual cutting tips are attached to the substrate;
The preset position at which the prepared individual cutting tips are to be formed is determined according to any one or more of the top surface area and the tip height of the individual cutting tips,
The individual cutting tip is formed of a sapphire, silicon, ceramic material, the body as a whole forming a polygonal column or cylinder; And a diamond coating layer formed on the body, wherein at least a portion of the upper surface of the individual cutting tip is a plane parallel to the upper surface of the substrate.
Preparing a plurality of individual cutting tips; Forming a plurality of receiving grooves on the upper surface of the substrate corresponding to a predetermined position at which the prepared individual cutting tips are to be formed; Forming a binder layer under the prepared individual cutting tips; And attaching the individual cutting tips to the substrate by disposing individual cutting tips having the binder layer formed below them in the accommodating groove, respectively,
The preset position at which the prepared individual cutting tips are to be formed is determined according to any one or more of the top surface area and the tip height of the individual cutting tips,
The individual cutting tip is formed of a sapphire, silicon, ceramic material, the body as a whole forming a polygonal column or cylinder; And a diamond coating layer formed on the body, wherein at least a portion of the upper surface of the individual cutting tip is a plane parallel to the upper surface of the substrate.
The method of any one of claims 13, 15, 16,
Forming a surface protection layer on the surface of the substrate before forming the binder layer or the receiving groove on the surface of the substrate; Individual cutting tip attached CMP pad conditioner manufacturing method, characterized in that it further comprises.
The method of claim 17,
The method of manufacturing a CMP pad conditioner with individual cutting tips, characterized in that the binder layer or the receiving groove is formed on the surface protection layer.
delete The method according to any one of claims 13 to 16,
Individual cutting, characterized in that the larger one or more of the top surface area and the tip height of the individual cutting tip is formed on the edge of the substrate, and the smaller one or more of the top surface area and the tip height is formed in the center of the substrate. A method of manufacturing a tip-attached CMP pad conditioner.
The method according to any one of claims 13 to 16,
The individual cutting tip attached to the substrate is a method of manufacturing an individual cutting tip attached CMP pad conditioner, characterized in that at least one of the intervals and sizes between the individual cutting tips are formed differently within a certain area of the substrate.

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