JP2018167383A - Work carrier and method for manufacturing work carrier - Google Patents

Abstract

To provide a work carrier which can prevent falling of a resin insert part such as removal thereof in a radial direction, falling-off thereof in a front and rear direction even if a carrier substrate is thin.SOLUTION: A work carrier in which a resin insert part 3 is provided along an inner peripheral surface of a work holding hole 2 which is formed on a metal carrier substrate 1. A front side recess 4A and a rear side recess 4B, which are individually recessed in a front and rear direction, are formed alternately in a circumferential direction on the carrier substrate which becomes an outer marginal part 13 of the work holding hole, and the front side recess and the rear side recess are provided with a continuous through-hole part 8 which penetrates the front and rear direction. Further, a synthetic resin material, which becomes the resin insert part, is filled in the front recess, the rear recess and the through-hole part, and a portion along an inner peripheral surface of the work holding hole.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a work carrier used for holding a work when a thin plate-like work such as an oxide wafer, silicon wafer, glass, sapphire, ceramics, and quartz is polished by a polishing apparatus, and a method for manufacturing the work carrier. Is.

  It is known to hold a workpiece on a workpiece carrier having a workpiece holding hole when both surfaces or one surface of a workpiece such as a silicon wafer is polished by a polishing apparatus (see Patent Documents 1-4 and the like).

  Since the carrier substrate that is the main body of the work carrier is formed of a hard metal material such as SK steel or stainless steel, if the workpiece is held directly in the workpiece holding hole drilled in the carrier substrate, May come into contact with the inner peripheral surface of the work holding hole, and the work may be damaged such as cracking or chipping.

  Therefore, as disclosed in Patent Documents 1-4, a soft resin-made insert is attached along the inner peripheral surface of the work holding hole to prevent damage to the work during polishing. .

  In Patent Document 1, protrusions are provided on the inner peripheral surface of the work holding hole at intervals in the circumferential direction, and the resin part is filled between the protrusions by injection molding. It is described that it is integrated into a plate. Furthermore, by forming chamfered portions at the upper and lower portions of the protruding portion, the resin portion can be prevented from falling off in the vertical direction.

  Also, in Patent Document 2, a groove is provided along the inner peripheral surface of the work holding hole of the carrier substrate, and a soft ring-shaped insert is provided by injection molding so that a synthetic resin material enters the groove. Is described.

  On the other hand, in Patent Document 3, the inner wall surface of the carrier body that forms the work holding hole is formed in a concave shape in the radial direction, thereby shortening the radial length of the upper surface portion and the lower surface portion of the insert. A structure that reduces wear and deformation of the is described.

  Further, Patent Document 4 discloses a metal carrier for use in polishing a thin workpiece. A resin coat holding part (insert) is also provided in the work holding hole of this metal carrier, but a small diameter hole is provided in the metal carrier so that the resin coat holding part is not peeled off, and a part of the resin coat holding part is provided in the hole. Is filled with a resin.

JP 2002-18708 A JP 2009-12086 A JP 2010-179375 A Utility Model Registration No. 3086591

  However, the work carriers disclosed in Patent Documents 1 and 2 have the inner peripheral surface of the work holding hole of the carrier substrate processed into irregularities in plan view, and the thickness is obtained by chamfering the upper surface and the lower surface of the portion that becomes the protruding portion. If the thickness is made thin, the protruding portion is easily deformed. For this reason, it is difficult to apply such processing to a work carrier for thin objects as disclosed in Patent Document 4.

  Accordingly, the present invention provides a work carrier and a work carrier manufacturing method capable of preventing the resin insert portion from falling off such as detachment in the radial direction and removal in the front and back direction even when the carrier substrate is thin. It is an object.

  In order to achieve the above object, a work carrier according to the present invention is a work carrier provided with a resin insert portion along an inner peripheral surface of a work holding hole formed in a metal carrier substrate, the work holding The carrier substrate that is the outer edge of the hole is formed with front and back recesses recessed in the front and back directions alternately in the circumferential direction, and in the front and back direction continuous to the front and back recesses. A through-hole portion that penetrates is provided, and a synthetic resin material serving as a resin insert portion is filled in a portion along the inner peripheral surface of the front-side concave portion, the back-side concave portion and the through-hole portion, and the workpiece holding hole. To do.

  Here, it is preferable that the said front side recessed part and the said back side recessed part are provided at intervals in the circumferential direction. Moreover, the said through-hole part can be set as the structure provided for every between the said front side recessed part and the said back side recessed part.

Further, a protrusion or a hole is provided on the bottom surface of the front-side recess and the back-side recess, and a part of the resin insert portion is filled around the protrusion or inside the hole. can do.
Moreover, it can be set as the structure by which the narrow part is provided in the center side of the said workpiece | work holding hole of the said front side recessed part and a back side recessed part.

  Furthermore, the invention of the method for manufacturing a work carrier includes a step of masking the front and back surfaces of the carrier substrate with a predetermined drawing pattern, a step of attaching an etchant to the masked carrier substrate, and a process using the etchant. A step of providing the resin insert portion on the carrier substrate.

  The work carrier of the present invention configured as described above is provided with front-side recesses and back-side recesses recessed in the front and back directions alternately in the circumferential direction of the outer edge portion of the work holding hole. For this reason, the synthetic resin material filled in the front side recess and the back side recess can prevent the resin insert part from coming off in the front and back direction.

  Moreover, since the through-hole part penetrated in the front-and-back direction which continued in the front-side recessed part and the back-side recessed part is provided, and the synthetic resin material is filled, the resin insert part can be prevented from coming off in the radial direction. Can be made difficult to peel off.

  Furthermore, since the front-side recess and the back-side recess do not protrude in the radial direction toward the center of the work holding hole, it can be applied even when the carrier substrate is thin. In particular, by providing the front-side recess and the back-side recess with an interval in the circumferential direction, the carrier substrate of the full thickness is left on both sides of the front-side recess and the back-side recess, thereby making the carrier substrate less likely to be deformed. be able to.

  In addition, by providing the through-hole portion between the front-side recess and the back-side recess, all the front-side recesses and the back-side recess are continuously integrated in the circumferential direction via the through-hole portion, so that the resin insert portion Can be made more difficult to peel off.

  Furthermore, by providing protrusions or holes on the bottom surfaces of the front-side recess and the back-side recess and filling a part of the resin insert part around or inside the hole part, it is possible to reliably suppress the radial movement of the resin insert part. Thus, the integrity with the carrier substrate can be enhanced.

  Further, by providing the narrow portion on the center side of the work holding hole of the front side recess and the back side recess, the movement of the resin insert portion in the radial direction can be surely suppressed and the integrity with the carrier substrate can be improved.

  Furthermore, if the invention is a method for manufacturing a work carrier, an etching process is performed by attaching an etchant to a carrier substrate masked with a predetermined drawing pattern, and a step of providing a resin insert portion is performed. A work carrier having high integration with the resin insert portion can be efficiently manufactured.

It is a top view which expands and demonstrates the outer edge part vicinity of the workpiece holding hole of the workpiece | work carrier of this Embodiment. It is a perspective view which expands and demonstrates the outer edge part vicinity of the workpiece | work holding hole of the workpiece | work carrier of this Embodiment. It is a top view explaining schematic structure of a work carrier. It is a top view of the front side of the carrier substrate for demonstrating the process of the manufacturing method of the work carrier of this Embodiment. It is a top view of the back side of the carrier substrate for demonstrating the process of the manufacturing method of the work carrier of this Embodiment. It is sectional drawing seen in the AA arrow direction of FIG. 3A. It is sectional drawing seen in the BB arrow direction of FIG. 3B. It is the perspective view which showed the state with which the carrier substrate and the resin insert part were integrated. It is a perspective view which expands and demonstrates the outer edge part vicinity of the workpiece | work holding hole of the workpiece | work carrier of Example 1. FIG. It is sectional drawing seen in the CC arrow direction of FIG. It is sectional drawing seen in the DD arrow direction of FIG. It is a perspective view which expands and demonstrates the outer edge part vicinity of the workpiece | work holding hole of the workpiece | work carrier of Example 2. FIG. FIG. 9 is a cross-sectional view illustrating a configuration in which a resin insert portion is provided on the inner peripheral surface of a work holding hole of Example 2 at a position in the direction of arrows EE in FIG. 8. FIG. 9 is a cross-sectional view illustrating a configuration in which a resin insert portion is provided on the inner peripheral surface of a work holding hole of Example 2 at a position in the direction of arrow F-F in FIG. 8. It is a top view which expands and demonstrates the outer edge part vicinity of the workpiece | work holding hole of the workpiece | work carrier of Example 3. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A, 1B, and 2 are diagrams for explaining the configuration of the work carrier 10 of the present embodiment, in which FIG. 2 shows the overall schematic configuration, and FIGS. 1A and 1B are the outer edge portions of the workpiece holding hole 2. The vicinity of 13 is shown enlarged.

  The work carrier 10 is used by being mounted on a flat polishing apparatus that polishes both or one side of a thin plate-like work. For example, a flat surface polishing machine that polishes both sides of a workpiece is an upper and lower surface plate that is a surface plate, a sun gear disposed at the center of the upper surface plate and the lower surface plate, and outer peripheries of the upper and lower surface plates. And an internal gear arranged on the side. The upper surface plate, the lower surface plate, the sun gear, and the internal gear are each rotatable.

And the work carrier 10 as shown in FIG. 2 is arrange | positioned between the upper surface plate and lower surface plate of a plane polishing apparatus.
The work carrier 10 has a disk-shaped main body formed of a metal carrier substrate 1. In the carrier substrate 1, for example, a plurality of circular work holding holes 2,. A resin insert portion 3 is provided along the inner peripheral surface of the workpiece holding hole 2.

  The work carrier 10 is provided with a tooth portion (not shown) that meshes with the sun gear and the internal gear in the outer shape portion 11, and rotates and revolves as the sun gear and the internal gear rotate. Then, as the work carrier 10 rotates and revolves, both surfaces of the work arranged in the work holding hole 2 of the work carrier 10 are polished by the upper surface plate and the lower surface plate.

  The carrier substrate 1 is cut out from a metal plate into a disk shape. As the metal plate, stainless steel (SUS), high carbon chromium bearing steel, carbon tool steel (SK steel), high speed tool steel, alloy tool steel, high tensile steel, titanium, and the like can be used.

  In particular, when a thin plate workpiece is polished, a thin carrier substrate 1 is used. For example, a carrier substrate 1 having a thickness of about 0.1 mm to 1.0 mm (height in the front and back direction) is used. Further, a thin carrier substrate 1 having a thickness of 0.7 mm or less, further 0.5 mm or less is used depending on the thickness of the workpiece.

  On the other hand, the resin insert portion 3 is formed of a synthetic resin material. Synthetic resin materials include resins such as polyamide (PA), polyacetal (POM), polyimide (PI), polyvinyl chloride (PVC), polyamideimide (PAI), polycarbonate (PC), epoxy (EP), and glass epoxy. Fiber reinforced plastics such as cloth bake can be used. As will be described later, when the resin insert portion 3 is provided by injection molding, a thermoplastic resin is used. Moreover, when providing the resin insert part 3 by thermocompression bonding, a thermosetting resin is used.

  In order to improve the integrity with the resin insert portion 3 on the carrier substrate 1 that becomes the outer edge portion 13 of the work holding hole 2 of the present embodiment, as shown in FIGS. 1A and 1B, alternately in the circumferential direction, A front side recess 4A and a back side recess 4B that are recessed in the front and back directions are formed.

  4 A of front side recessed parts are formed in a rectangular shape by planar view hollowed toward the back side from the front side of the carrier substrate 1. The depth of the front side recess 4 </ b> A in the front and back direction is about half of the thickness of the carrier substrate 1.

  On the other hand, the back-side recess 4 </ b> B provided at a distance from the front-side recess 4 </ b> A in the circumferential direction of the work holding hole 2 is formed in a rectangular shape in plan view that is recessed from the back side of the carrier substrate 1 toward the front side. The depth in the front-back direction of the back-side recess 4B is about half of the thickness of the carrier substrate 1.

  Here, since the front side recess 4A and the back side recess 4B are separated from each other in plan view, the main body of the carrier substrate 1 having the full thickness remains between them. That is, the front side recess 4A and the back side recess 4B are open on the center side of the work holding hole 2, but both sides in the circumferential direction and the depth side in the radial direction are formed on the carrier substrate 1 except for the vicinity of the corners described later. It is in a state supported by the main body.

  A through-hole portion 8 is provided between the front side recess 4A and the back side recess 4B. The through-hole portion 8 is a hole penetrating in the front-back direction, and a continuous space is formed in each of the front-side recess 4A and the back-side recess 4B.

Specifically, the through-hole portion 8 is, for example, a plane so as to connect the corner portion on the back side of the front-side recess 4A (the side opposite to the center of the workpiece holding hole 2) and the corner portion on the back side of the back-side recess 4B. It is formed in a visual oval shape. For this reason, at the position where the front side concave portion 4A (or the back side concave portion 4B) and the through hole portion 8 overlap each other, a recess from the front side of the carrier substrate 1 toward the back side (or from the back side to the front side of the carrier substrate 1) is cut and penetrated. It becomes a hole.
Moreover, a through-hole part can also be provided so that 4 A of front side recessed parts (or back side recessed part 4B) may be contact | connected. In this case, there is no chipping in the recess from the front side of the carrier substrate 1 to the back side (or from the back side to the front side of the carrier substrate 1).

As shown in FIG. 5, when the hole filling portion 33 is formed by filling the through-hole portion 8 with a synthetic resin material so as to become a part of the resin insert portion 3, the radial direction of the resin insert portion 3 is formed. It becomes a resistance part that prevents movement.
Since the hole filling portion 33 has the same thickness as the carrier substrate 1, it can be a strong catch.

  That is, the resin insert portion 3 includes a ring-shaped portion 31 formed in a ring shape having a diameter similar to the diameter of the workpiece holding hole 2 and a rectangular parallelepiped filling portion formed in the inner space of the front-side concave portion 4A and the back-side concave portion 4B. .. And a hole filling portion 33 formed in the inner space of the through hole portion 8. The annular portion 31, the filling portions 32, ... and the hole filling portions 33, ... are integrally formed of a synthetic resin material.

Next, the manufacturing method of the work carrier 10 of this Embodiment is demonstrated, referring FIG. 3A, 3B and FIG. 4A, 4B.
First, the front and back surfaces of the carrier substrate 1 are masked with a predetermined drawing pattern. Specifically, an original of a high-precision drawing pattern is created from a laser plotter or the like using data created by a CAD / CAM system or the like.

  In addition, the front surface and the back surface of the carrier substrate 1 are subjected to a pretreatment such as an acid treatment for removing an oxide film or electrolytic polishing. Subsequently, a photoresist is applied to the entire front surface and back surface of the carrier substrate 1.

  Then, printing is performed by exposing the front surface and the back surface of the carrier substrate 1 coated with a photoresist using the original pattern. The illustrated masking portions 5A and 5B show the photoresist layer left after development after baking.

  In short, on the surface of the carrier substrate 1, as shown in FIGS. 3A and 4A, the masking portion 5A is a portion other than the front-side concave portions 4A,... And the through-hole portions 8,. In addition, on the back surface of the carrier substrate 1, as shown in FIGS. 3B and 4B, the masking portion 5B other than the back-side concave portions 4B,...

  Further, the etching solution is sprayed and adhered to the front surface and the back surface of the masked carrier substrate 1. By the adhesion of this etching solution, the exposed surface of the carrier substrate 1 other than the masking portions 5A and 5B is removed, and the front side concave portion 4A and the back side concave portion 4B that are recessed in the front and back directions, and the through hole portion 8 that penetrates in the front and back directions are formed. Will be.

  The front side concave portion 4A and the back side concave portion 4B are dissolved to a desired depth, and the masking portions 5A and 5B are removed when the through hole portion 8 has penetrated, and cleaning and drying are performed. Through the steps so far, as shown in FIG. 1B, the front side concave portion 4 </ b> A, the back side concave portion 4 </ b> B, and the through hole portion 8 are formed in the outer edge portion 13 of the work holding hole 2 of the carrier substrate 1.

  The resin insert portion 3 is provided on the inner peripheral surface of the work holding holes 2... Of the carrier substrate 1 etched in this way. The resin insert portion 3 is provided by injection molding or thermocompression bonding of a synthetic resin material.

In the injection molding, a mold frame is installed at a position to be the inner surface of the work holding hole 2, and a synthetic resin material heated and melted is injected into a space between the mold frame and the outer edge portion 13 of the carrier substrate 1. Solidify by cooling. Since the through-hole part 8 is continuously formed in the front side recessed part 4A and the back side recessed part 4B, a synthetic resin material can flow in.
On the other hand, in the case of thermocompression bonding, the resin insert portion 3 can be provided by laminating a prepreg to obtain a desired shape and pressurizing by heating and pressing.

Next, the effect | action of the manufacturing method of the work carrier 10 of this Embodiment and the work carrier 10 is demonstrated.
The work carrier 10 according to the present embodiment configured as described above is provided with front-side recesses 4A and back-side recesses 4B, which are recessed in the front and back directions, alternately in the circumferential direction of the outer edge portion 13 of the work holding hole 2. Furthermore, the through-hole part 8 penetrated in the front and back direction which followed the front side recessed part 4A and the back side recessed part 4B is provided.

  When the front side concave portion 4A, the back side concave portion 4B, and the through hole portion 8 are provided with the filling portions 32 and 32 and the hole filling portion 33, respectively, which are part of the resin insert portion 3, the resin insert portion 3 moves in the circumferential direction. It is possible to prevent (shift).

Furthermore, the front side recesses 4A and the back side recesses 4B are alternately formed in the circumferential direction on both the front side and the back side of the carrier substrate 1, and the filling portions 32 and 32 are provided in the inner spaces thereof, whereby the carrier substrate 1 Since it is sandwiched between the filling portions 32, 32, it is possible to prevent the resin insert portion 3 from falling off in both the front and back directions of the carrier substrate 1.
For example, when the resin insert portion 3 is provided by injection molding or thermocompression bonding, shrinkage occurs when cooled and solidified. However, the filling portions 32 and 32 formed by the front-side concave portion 4A and the back-side concave portion 4B are formed on both surfaces of the carrier substrate 1. If provided, even if the resin insert portion 3 contracts somewhat, it can be prevented from falling off.

  Moreover, the hole filling part 33 provided in the through-hole part 8 penetrating in the front and back direction serves as a resistance part that prevents the resin insert part 3 from moving in the radial direction. That is, even if the resin insert portion 3 shrinks or the like and a radial shift toward the center of the workpiece holding hole 2 is likely to occur, the hole filling portion 33 is caught and can be prevented from coming off (peeling). .

  Furthermore, since the front-side recess 4A and the back-side recess 4B do not protrude in the radial direction toward the center of the work holding hole 2 such as a convex tooth, it can be applied even when the carrier substrate 1 is thin. For example, the present invention can be applied to a carrier substrate 1 having a thickness of 1.0 mm or less used for polishing a thin plate workpiece. Further, even a thin carrier substrate 1 having a thickness of 0.7 mm or less, further 0.5 mm or less, which is used when a thinner workpiece is polished, can be applied.

  In the work carrier 10 of the present embodiment, the front-side recess 4A and the back-side recess 4B are provided at intervals in the circumferential direction, so that the full thickness carrier substrate 1 is provided on both sides of the front-side recess 4A and the back-side recess 4B. Is left. For this reason, the front side concave portion 4A and the back side concave portion 4B, which are reduced in thickness, are supported by the three sides (excluding the vicinity of the corner portion) on both sides and the back side, and thus are less likely to be deformed.

  Moreover, peeling of the resin insert part 3 can be made more difficult to occur by providing the through-hole part 8 between the front side concave part 4A and the back side concave part 4B. That is, the resin insert portion 3 exposed on the polishing surface is more likely to be worn or deformed than the carrier substrate 1 during polishing, but is the same as the carrier substrate 1 like the hole filling portion 33 formed in the through hole portion 8. If it has thickness, even if it uses repeatedly for grinding | polishing process, it can be made hard to produce peeling of the resin insert part 3. FIG.

  Furthermore, all the front-side recesses 4A and the back-side recesses 4B are continuously integrated in the circumferential direction on the inner side of the carrier substrate 1 (the side opposite to the center of the work holding hole 2) via the hole filling portion 33. If it is made, the resin insert part 3 can be made harder to peel off.

  And if it is the manufacturing method of the work carrier 10 of this Embodiment, it etches by attaching etching liquid to the carrier substrate 1 masked by the predetermined drawing pattern, and passes through the process of providing the resin insert part 3. Thereby, the work carrier 10 with high integrity of the carrier substrate 1 and the resin insert portion 3 can be efficiently manufactured.

  Hereinafter, Example 1 of a form different from the work carrier 10 described in the above embodiment will be described with reference to FIGS. 6, 7A, and 7B. Note that the description of the same or equivalent parts as the contents described in the above embodiment will be described using the same terms or the same reference numerals.

  In the embodiment, the hole filling portion 33 formed in the through hole portion 8 as the resistance portion has been described. In the first embodiment, a case will be described in which a cylindrical portion 42 serving as a resistance portion is additionally provided on the bottom surface 41 of the front-side recess 4C and the back-side recess 4D.

  In the carrier substrate 1A of the first embodiment, a cylindrical portion 42 is provided in the front-side recess 4C and the back-side recess 4D at substantially the center in plan view as shown in FIG. The cylindrical portion 42 is a protruding portion that extends upward (or downward) from the bottom surface 41 of the front-side recess 4C (or the back-side recess 4D). The height of the cylindrical portion 42 is equal to the depth of the front-side recess 4C (or the back-side recess 4D) and is about half of the carrier substrate 1A.

  As shown in FIGS. 7A and 7B, when the synthetic resin material is filled around the cylindrical portion 42 so as to become a part of the resin insert portion 3 </ b> A and the filling portion 32 is formed, the cylindrical portion 42 is It becomes a resistance part which prevents the movement of the resin insert part 3A in the radial direction.

  The height (effect) of the function as the resistance portion varies depending on the shape of the protrusion. As shown in FIGS. 7A and 7B, the angle θ formed by the side surface on the back side (the side opposite to the center of the work holding hole 2) of the cylindrical portion 42 and the bottom surface 41 is about 90 °. As the angle θ increases, the function of preventing the resin insert portion 3A from moving in the center direction of the work holding hole 2 becomes higher. The angle θ is preferably 70 ° or more, but more preferably 90 ° or more. If the angle θ is an obtuse angle and tilted to the back side, a stronger hook can be obtained. Further, the shape of the side surface of the cylindrical portion 42 is not limited to a linear shape in a side view, and may be a shape having a curved shape or an unevenness.

  Furthermore, the shape of the protrusions provided in the front-side recess 4C and the back-side recess 4D is not limited to a cylindrical shape, and can be various shapes such as a rectangular parallelepiped shape and a polygonal column shape. Regardless of the shape of the protrusion, it is possible to exert a movement suppressing function that prevents the resin insert 3A from moving in the radial direction.

  The cylindrical portion 42 can be formed by masking a portion that becomes the cylindrical portion 42 in the front side concave portion 4C and masking a portion that becomes the cylindrical portion 42 in the back side concave portion 4D in the masking step. .

  In the injection molding, a mold frame is installed at a position to be the inner surface of the work holding hole 2, and a synthetic resin material heated and melted is injected into a space between the mold frame and the outer edge portion 13 of the carrier substrate 1A. Solidify by cooling. If the protruding portion is the cylindrical portion 42, the synthetic resin material can be wound around without any gap.

  Further, if the cylindrical portion 42 is additionally provided as a resistance portion for preventing the resin insert portion 3A from moving in the radial direction in the front side concave portion 4C and the back side concave portion 4D, the resin insert portion 3A contracts and the center of the work holding hole 2 Even if a radial shift toward the surface is likely to occur, the cylindrical portion 42 is caught and can be prevented from coming off (peeling). In short, the effect of the cylindrical portion 42 is added to the function of preventing the hole filling portion 33 from coming off.

Further, since the cylindrical portion 42 is the carrier substrate 1A itself and is formed of a hard metal material, it has a strong resistance to the movement of the resin insert portion 3A and reliably prevents the separation and peeling. Can do.
Other configurations and operational effects of the first embodiment are substantially the same as those of the above-described embodiment and other embodiments, and thus description thereof is omitted.

  Hereinafter, Example 2 of a form different from the work carrier 10 described in the embodiment and Example 1 will be described with reference to FIGS. 8, 9A, and 9B. Note that the description of the same or equivalent parts as those described in the above embodiment or Example 1 will be described using the same terms or the same reference numerals.

  In the first embodiment, the case where the cylindrical portion 42 is added to the bottom surface 41 of the front side concave portion 4C and the back side concave portion 4D as the resistance portion has been described. In the second embodiment, a case where a cylindrical portion 62 is provided as a hole portion serving as a resistance portion on the bottom surface 61 of the front side concave portion 6A and the back side concave portion 6B will be described.

  In the carrier substrate 1B of the second embodiment, a cylindrical portion 62 is provided at a substantially center in a plan view as shown in FIG. 8 in the front side recess 6A and the back side recess 6B provided in the outer edge portion 13 of the workpiece holding hole 2. . The cylindrical portion 62 is a hole that penetrates from the bottom surface 61 of the front side recess 6A (or the back side recess 6B) toward the lower (or upper) surface. The depth of the cylindrical portion 62 is about half that of the carrier substrate 1B.

  9A and 9B, when the columnar portion 35 is formed by filling the synthetic resin material so as to become a part of the resin insert portion 3B, the columnar portion 35 is It becomes a resistance part which prevents the movement of the resin insert part 3B in the radial direction.

  The resin insert portion 3B includes an annular portion 31 formed in a ring shape, a rectangular parallelepiped filling portion 34 formed in the inner space of the front side concave portion 6A and the back side concave portion 6B, a cylindrical portion 62,. ... Are formed by cylindrical columnar portions 35,... Formed inside, and hole filling portions 33,. The annular part 31, the filling part 34, ..., the columnar part 35, ... and the hole filling part 33, ... are integrally formed of a synthetic resin material.

  In the work carrier 10 of Example 2 configured in this way, the front side recesses 6A and the back side recesses 6B that are recessed in the front and back directions are alternately provided in the circumferential direction of the outer edge portion 13 of the work holding hole 2, and the front side recesses are provided. The cylindrical part 62 of 6A and the back side recessed part 6B is provided with the columnar part 35 which is a part of the resin insert part 3B.

  The columnar portion 35 extended inside the cylindrical portion 62 is caught and detached even if a radial shift toward the center of the work holding hole 2 is likely to occur due to shrinkage of the resin insert portion 3B. It becomes a resistance part to prevent. In short, the effect of the columnar portion 35 is added to the function of preventing the hole filling portion 33 from coming off.

  Here, the shape of the hole provided in the front side recess 6A and the back side recess 6B is not limited to a cylindrical shape, and may be various shapes such as a rectangular tube shape and a polygonal tube shape. Regardless of the shape of the hole, it is possible to exhibit a movement suppressing function that prevents the resin insert portion 3B from moving in the radial direction.

Further, in the work carrier 10 of the second embodiment, the filling portion 34,... Provided in the front-side concave portion 6A and the back-side concave portion 6B exhibits a circumferential anti-rotation function and a front-back direction prevention function. Since the hole filling portion 33 provided in the cylinder 8 and the columnar portion 35 provided in the cylindrical portion 62 provide a circumferential rotation preventing function and a radial movement suppressing function. High integrity between the carrier substrate 1B and the resin insert portion 3B can be ensured.
In addition, about the other structure and effect of Example 2, since it is substantially the same as the said embodiment or another Example, description is abbreviate | omitted.

  Hereinafter, Example 3 of a form different from the work carrier 10 described in the embodiment and Examples 1 and 2 will be described with reference to FIG. Note that the description of the same or equivalent parts as those described in the above embodiment or Examples 1 and 2 will be described using the same terms or the same reference numerals.

  In the embodiment and Examples 1 and 2, the cylindrical portion 42 or the cylindrical portion 62 is provided on the bottom surface 41, 61 of the hole filling portion 33 of the through-hole portion 8 and the front side concave portions 4C, 6A and the back side concave portions 4D, 6B to provide resistance. The case where it is set as a part has been described. In the third embodiment, a case will be described in which the resistance portion is formed by the shape of the front side recess 7A and the back side recess 7B in plan view.

  As shown in FIG. 10, the resistance portion of the third embodiment is a narrow portion formed by side surfaces 71 and 71 that are inclined surfaces of the front-side recess 7A and the back-side recess 7B. That is, the side surface 71 is inclined in a direction extending from the center side of the work holding hole 2 toward the outside. As a result, the front-side recess 7A and the back-side recess 7B have a narrowed portion with a narrow open side (center side of the work holding hole 2) in plan view, and are formed in a trapezoidal shape (wedge shape) with a wide back side as a whole. Is done.

  Here, as the resistance portion, it is only necessary to form a narrow portion in which the center side of the work holding hole 2 is narrowed in a plan view in the front side concave portion 7A and the back side concave portion 7B. Therefore, the side surface 71 is limited to a linear inclined surface. It may be curvilinear rather than being done. For example, the narrow side portion can be provided on the center side of the workpiece holding hole 2 by forming the front side concave portion 7A and the back side concave portion 7B in a T shape, a Y shape, or a flask shape in a plan view.

  The through-hole portion 8A is, for example, an ellipse in plan view so as to connect the apex portion on the back side (opposite side of the center of the work holding hole 2) of the front-side recess portion 7A and the apex portion on the back side of the back-side recess portion 7B. Formed. For this reason, at the position where the front side concave portion 7A (or the back side concave portion 7B) and the through hole portion 8A overlap each other, a recess from the front side to the back side of the carrier substrate 1C (or from the back side to the front side of the carrier substrate 1C) is cut and penetrated. It becomes a hole.

When the through hole 8A is filled with the synthetic resin material so as to be a part of the resin insert 3C to form the hole filling portion 33A, a resistance portion that prevents the resin insert 3C from moving in the radial direction; Become.
Since the hole filling portion 33 </ b> A has the same thickness as the carrier substrate 1, it can be a strong catch.

  Further, when the filling portion 36 is formed by filling the inner space of the trapezoidal front side concave portion 7A and the back side concave portion 7B with the synthetic resin material so as to become a part of the resin insert portion 3C, the wedge-shaped filling portion 36 is In the narrow portion, it becomes difficult to move to the center side of the workpiece holding hole 2 and becomes a resistance portion that prevents the resin insert portion 3C from moving in the radial direction.

  The resin insert portion 3C is formed in an annular portion 31 formed in a ring shape, a filling portion 36 formed in the inner space of the front side concave portion 7A and the rear side concave portion 7B, and an inner space of the through hole portion 8A. The hole filling portion 33A,. The annular portion 31, the filling portions 36, ... and the hole filling portions 33A, ... are integrally formed of a synthetic resin material.

  The work carrier 10 according to the third embodiment configured as described above has a substantially wedge-shaped front-side recess 7A and a back-side recess 7B that are recessed in the front and back directions alternately in the circumferential direction of the outer edge 13 of the work holding hole 2. It is done.

  The front-side recessed portion 7B and the back-side recessed portion 7B provided with a substantially wedge-shaped filling portion 36 in a plan view exhibit a circumferential anti-rotation function and an anti-removal function in the front and back directions, and a radial movement suppression function. Therefore, in addition to the function of the hole filling portion 33A formed in the through hole portion 8A, high integrity between the carrier substrate 1C and the resin insert portion 3C can be ensured.

Moreover, the resistance part by a narrow part can be combined with the resistance part by a projection part or a hole. Also in this case, it is possible to enhance the movement suppressing function that prevents the resin insert portion 3C from moving in the radial direction.
In addition, about the other structure and effect of Example 3, since it is substantially the same as that of the said embodiment or another Example, description is abbreviate | omitted.

  The embodiments and examples of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments and examples, and the gist of the present invention is not deviated. Design changes are included in the present invention.

  For example, in the said embodiment and Example, although the workpiece | work holding hole 2 demonstrated the circular workpiece | work carrier 10, it is not limited to this. For example, the present invention can be applied to a work carrier having a rectangular (including a square) work holding hole. In short, alternately forming in the circumferential direction of the inner peripheral surface of the rectangular work holding hole, the front side recess and the back side recess respectively recessed in the front and back directions, and forming the through-hole portion continuous to the front side recess and the back side recess, A rectangular resin insert portion can be provided along the inner peripheral surface. Furthermore, the workpiece holding hole may have another shape other than a circle and a rectangle.

  Moreover, in the said embodiment and Example, the case where the through-hole parts 8 and 8A were provided between front side recessed part 4A, 4C, 6A, 7A and back side recessed part 4B, 4D, 6B, 7B was demonstrated. However, the present invention is not limited to this, and it is not necessary to provide them between every other one or every other two.

DESCRIPTION OF SYMBOLS 10 Work carrier 1 Carrier board 13 Outer edge part 2 Work holding hole 3 Resin insert part 4A Front side recessed part 4B Back side recessed part 5A, 5B Masking part 1A Carrier board 3A Resin insert part 4C Front side recessed part 4D Back side recessed part 41 Bottom face 42 Cylindrical part (projection part)
1B Carrier substrate 6A Front side recess 6B Back side recess 61 Bottom surface 62 Cylindrical part (hole part)
1C Carrier substrate 3C Resin insert 7A Front side recess 7B Back side recess

Claims (6)

A work carrier provided with a resin insert along the inner peripheral surface of a work holding hole formed on a metal carrier substrate,
The carrier substrate that becomes the outer edge portion of the work holding hole is formed with front side recesses and back side recesses that are recessed in the front and back directions alternately in the circumferential direction,
A through-hole portion penetrating in the front-back direction continuous to the front-side recess and the back-side recess is provided,
A work carrier in which a synthetic resin material serving as a resin insert portion is filled in a portion along the inner peripheral surface of the front side concave portion, the back side concave portion, the through hole portion, and the work holding hole.   The work carrier according to claim 1, wherein the front-side recess and the back-side recess are provided at intervals in the circumferential direction.   The work carrier according to claim 2, wherein the through-hole portion is provided between the front-side concave portion and the back-side concave portion.   Protrusions or holes are provided on the bottom surfaces of the front and back recesses, and a part of the resin insert part is filled around the protrusions or inside the holes. The work carrier according to any one of claims 1 to 3.   The work carrier according to any one of claims 1 to 4, wherein a narrow portion is provided on a center side of the work holding hole of the front side concave portion and the back side concave portion. A method for producing a work carrier according to any one of claims 1 to 5,
Masking the front and back surfaces of the carrier substrate with a predetermined drawing pattern;
Attaching an etchant to the masked carrier substrate;
And a step of providing the resin insert portion on the carrier substrate processed by the etching solution.