JP2016119391A - Imprint mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imprint mold used by winding around a roll, where the irregular pattern formation region of an electroformed mold can be used effectively.SOLUTION: An imprint mold 10 is constituted of a disc-like electroformed mold body 1 having an irregular pattern 2 formed on the surface, and an extension part 3 integrated with the electroformed mold body 1 and extending to the periphery thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imprint mold used in an imprint method for transferring a fine uneven pattern to a resist applied on a substrate, and more particularly to a flexible imprint mold.

  Imprinting is a process in which a mold with a concavo-convex pattern (generally called a mold, stamper, or template) is pressed against a resist coated on a transfer substrate, and the resist is mechanically deformed or fluidized to form a fine pattern. This is a technology for precisely transferring to a resist film. There are fine uneven patterns ranging from about 10 nm to about 100 μm. It is economical because once a mold is fabricated, nano-level microstructures can be easily and repeatedly molded, and it is economical, and because it is a transfer technology with little harmful waste and emissions, it can be used in various fields such as the semiconductor field. Application to is expected.

  As an imprint method, a method using a web handling technology such as roll-to-roll has been proposed. For example, a fine concavo-convex pattern is formed on a conveyance path between a feeding device that feeds out a flexible long sheet to be processed (for example, a resin film or an inorganic substrate) and a winding device that winds up the sheet. This is an imprint method that includes a roll mold (also referred to as a mold roll or a stamper roll) on the surface, and conveys a sheet from a feeding device to a winding device while bringing the roll mold into contact with the processing surface of the sheet. Thereby, it becomes possible to emboss the resin film continuously and efficiently and to form a pattern on the resist applied on the sheet.

  The roll mold is manufactured by, for example, winding a sheet-shaped thin mold (mold sheet) having a concavo-convex pattern around a roll serving as a rotating shaft, and welding the opposite ends of the mold sheet that makes one round of the roll. How to do is known.

  The mold sheet as described above can be produced using a master mold (master) having a fine uneven pattern of nano-order or sub-micron order on the surface, but the production of this master mold requires time and cost. For this reason, it is difficult to increase the size of the mold itself. Therefore, as a method for producing a large-area mold from a master mold of a general size, a technique is also known in which a plurality of replica molds are produced from a master mold and the replica molds are joined to make a large-area mold ( For example, Patent Documents 1 and 2) and Patent Document 2 disclose transfer to a film-like transfer material by a roll-to-roll method using a roll mold in which a large-area resin mold is wound around a roll body. Has been.

  In recent years, technology has been developed to improve the brightness of LEDs by providing fine concavo-convex shapes on the surface of a sapphire substrate, which is the substrate of LED (Leaser eliminate diode), and its patterned sapphire substrate (PSS: Patterned Sapphire Substrate) The imprint method is also attracting attention as a method for producing the film.

JP2012-118520A JP 2014-80017 A

  When the roll-to-roll type imprint method is adopted in the production of the PSS described above, a nickel (Ni) electroforming mold having fine irregularities is wound around the surface of a roll having a predetermined diameter (for example, a diameter of 300 mm), and a tape It is conceivable that a resin mold for PSS is produced by imprinting a roll-to-roll method from this roll mold using a roll mold fixed with the roll mold. At this time, the thickness of the Ni electroforming mold is about several tens of μm to several hundreds of μm. However, in order to attach the mold to the roll, there is a step between the surface of the roll and the surface of the Ni electroforming mold. Become. Generally, a silicon (Si) wafer is used as a master of the Ni electroforming mold, and the size of the Ni electroforming mold is a normal circular shape that is substantially equal to the size of the master.

  In the production of the resin mold, it is possible to produce the resin mold so that the concave / convex pattern formation region of the resin mold is closer to, preferably equal to, the concave / convex pattern formation region of the Ni electroforming mold. The uneven pattern can be used more effectively and is economical.

  However, if an electroformed mold is used more effectively and a resin mold is to be produced, there is a risk that the coating area will spread to the periphery of the electroformed mold during resist application. When the resist spreads around the electroforming mold, the resist enters between the electroforming mold and the roll, and the resist at the stepped portion remains after imprinting, which causes a transfer failure after the next time. For example, when a UV (ultraviolet) curable resist is used, the resist that has entered between the electroforming mold and the roll is hardened by UV irradiation and remains like burrs. This causes a defect that remains as a defect.

  The present invention has been made in view of the above circumstances, and provides an imprint mold capable of producing a resin mold by effectively using an uneven pattern region of an electroforming mold during resin mold production. For the purpose.

The imprint mold of the present invention is an imprint mold having a concavo-convex pattern on the surface, which is used by being wound around a roll,
A disc-shaped electroformed mold main body having an uneven pattern formed on the surface;
It is comprised from the expansion part extended in the circumference | surroundings of the electroforming mold main body integrated with the electroforming mold main body.

  The imprint mold of the present invention includes an expansion portion, a plate-like member having a center hole having a shape that matches the outer peripheral shape of the electroformed mold body, and a thin plate having an outer shape larger than the outer shape of the electroformed mold body. The electroformed mold main body is fitted into the center hole of the plate member, and the plate member and the electroformed mold main body are bonded and integrated on the thin plate.

  The imprint mold of the present invention is configured such that the extended portion is a thin plate with a counterbore portion provided with a counterbore portion having a shape coinciding with the outer peripheral shape of the electroforming mold body, and the electroforming mold is formed on the counterbore portion of the thin plate with the counterbore portion. By fitting and bonding the main body, the electroformed mold main body and the extended portion can be integrated.

  Alternatively, the imprint mold of the present invention is formed of a plate-like member having a center hole having a shape that matches the outer peripheral shape of the electroformed mold main body, and the electroformed mold main body in the center hole of the plate-like member. , And the plate-shaped member and the electroformed mold main body are connected and integrated at the periphery of the electroformed mold main body.

  In the imprint mold of the present invention, the step between the surface of the extended portion and the surface of the electroformed mold body is preferably 10 μm or less.

  The imprint mold of the present invention is an imprint mold having a concavo-convex pattern on its surface, which is used by being wound around a roll, around the disc-shaped electroformed mold main body formed with the concavo-convex pattern on the surface. Since it has an extended part that extends, when it is wound around a roll and used as a roll mold, the resist solution is molded even when the resist solution is applied to the entire area where the uneven pattern is formed. Can be kept in the surface. Therefore, the resist solution can be prevented from entering between the mold and the roll, and transfer failure during imprinting by the roll-to-roll method can be suppressed.

It is the top view and sectional view of the mold for imprint of a 1st embodiment. It is a figure which shows typically the preparation process of the mold for imprint of 1st Embodiment. It is a perspective view which shows the mold for imprint wound around the roll. It is a figure which shows a part of apparatus for implementing the imprint method by a roll-to-roll system. It is a figure which shows typically the resist application area | region on the mold for imprint. It is a figure which shows typically the process until it produces a roll metal mold | die from an original disk. It is a figure which shows typically the process until it produces an uneven | corrugated pattern processed goods using a film mold. It is a figure which shows typically the preparation process of the mold for imprint of 2nd Embodiment. It is a figure which shows typically the preparation process of the mold for imprint of 3rd Embodiment.

  Hereinafter, although an embodiment of the present invention is described using a drawing, the present invention is not limited to this. In addition, in order to make it easy to visually recognize, the scale of each component in the drawing is appropriately changed from the actual one.

<Imprint mold of the first embodiment>
FIG. 1 is a plan view and a cross-sectional view schematically showing an imprint mold 10 according to the first embodiment of the present invention.

The imprint mold 10 is an imprint mold having a concavo-convex pattern 2 on the surface, which is used by being wound around a roll. The disc-shaped electroformed mold body 1 having the concavo-convex pattern 2 formed on the surface, It is comprised from the expansion part 3 extended around the electroforming mold main body 1 integrated with the casting mold main body 1. As shown in FIG.
In the present embodiment, the extended portion 3 includes a plate-like member 4 having a center hole having a shape that matches the outer peripheral shape of the electroformed mold body 1, and a thin plate 5 having an outer shape larger than the outer shape of the electroformed mold body 1. The imprint mold 10 is formed by fitting the electroformed mold main body 1 into the center hole of the plate-like member 4, and bonding the plate-like member 4 and the electroformed mold main body 1 onto the thin plate 5. Is.

  The imprint mold 10 is flexible enough to be wound around a roll, and an appropriate range varies depending on the material, but the thickness is preferably 20 to 300 μm, more preferably 50 to 200 μm. is there.

The electroformed mold main body 1 is a disk having a diameter of φ ₁ and has a surface shape including a flat portion 2a on the outer periphery of a region where the uneven pattern 2 is formed (hereinafter referred to as a pattern region). In addition, the thickness of the flat portion 2a on the outer periphery is defined as the thickness of the electroformed mold main body 1. Pattern area in this example is a generally circular area with a diameter of phi _2.
In this example, a line-and-space pattern is provided as the concavo-convex pattern 2, but the pattern shape is not particularly limited, and various patterns such as a hole pattern and a pillar pattern are possible. The height of convex portions of the concave-convex pattern, the convex portion spacing, and the like are appropriately set in accordance with the application in the order of several tens nm to several hundreds μm.

  The electroformed mold body 1 is obtained by electroforming to a master described later, and examples of the material include metals including at least one of nickel, cobalt, gold, silver, copper, and iron, preferably nickel. is there. The thickness is 10 to 200 μm, more preferably 50 to 100 μm.

The plate-like member 4 which is a part of the extended portion 3 includes a center hole having a shape that matches the outer peripheral shape of the electroformed mold body 1 (here, a circle having a diameter φ ₁ ), and is larger than the electroformed mold body 1. It has an outer shape (here, a circle with a diameter of ₃ ). Here, the shape of the center hole of the plate-like member 4 “matches the outer peripheral shape of the electroformed mold main body 1” means that the shape is capable of receiving the electroformed mold main body 1. In order to facilitate the process, it is preferable that the diameter is about 0.1 to 0.2 mm larger than the diameter of the electroformed mold main body 1. In addition, when gaps are generated, it is preferable to embed them with an embedding agent or the like.

The outer shape of the extended portion 3 (the outer shape of the mold 10) is not limited to a circle as long as it is a shape that surrounds the electroformed mold body 1, and may be a square, a rectangle, or any other shape. In order to use the concave / convex pattern 2 of the electroformed mold body 1 to the maximum extent, it has one side with a length of a square diagonal line (= √2 · φ ₂ ) or more with one side having a diameter φ _{2 of the} pattern region. It needs to be a shape that encloses a square. Therefore, when the expansion part 3 is circular, it is desirable to have a diameter of √2 · φ ₂ or more. The outer shape of the extended portion 3 is more preferably a shape including a square having one side with a length of (√2 · φ ₂ +20) mm or more.

  Since it is preferable that the plate-like member 4 is not significantly different from the rigidity of the electroformed mold main body 1 in winding around the roll, it is preferable to use a material having a Young's modulus of about ± 100 GPa of the electroformed mold main body 1. Are particularly preferred. Accordingly, it is most preferable that the electroforming mold body 1 is made of the same material. For example, when the electroformed mold main body 1 is made of nickel, the plate-like member 4 is also preferably made of nickel. As the plate-like member 4, a stainless steel plate or the like is also suitable because it is easy to handle and low in cost.

The thickness t ₄ of the plate-like member 4, electroforming die is equal to or smaller than the thickness t ₁ ± 20 [mu] m of the body 1, is preferably not more than ± 10 [mu] m, most preferred is the same as the thickness of the electroforming die body 1. If the step is ± 20 μm or less, it is possible to suppress the generation of residues in the step portion during imprinting.
If the thickness of the electroformed mold main body 1 is the same, the flat portion 2a of the electroformed mold main body 1 and the surface of the plate-like member 4 are flush with each other, so that no residue is produced at the time of imprinting at the connecting portion, and transfer failure. Can be suppressed most effectively.
In the case where there is a step, it is preferable that the surface of the extended portion is higher than the surface of the main body, in particular, in order to use a transfer product produced with a roll mold as a mold. This is because the transferred pattern portion becomes higher than the peripheral portion, and transfer to another member using this mold becomes easy.

The thin plate 5 only needs to have supporting properties for supporting the electroformed mold body 1 and the plate-like member 4, and has at least a larger outer shape than the electroformed mold body 1. It is preferable that it is larger than the diameter of the hole. It is more preferable to have an outer shape equal to or greater than the outer shape of the plate-like member 4.
The material of the thin plate 5 is preferably a sheet material such as a film or a metal thin plate. Specifically, the film sheet material is PET (polyethylene terephthalate) or TAC (triacetyl cellulose), and the metal thin plate is nickel or Examples include stainless steel materials. In addition, it is also preferable to form with the same material as the electroforming mold main body 1 and the plate-like member 4.
The thickness _{t 5,} if the film sheet material 50 to 250 [mu] m, preferably 20~150μm in the case of the sheet metal.

In this example, the electroformed mold body 1 and the plate-like member 4 are fixed on the thin plate 5 using an adhesive 8. As the adhesive 8, it is only necessary to adhere the electroformed mold body 1 and the plate-like member 4 to the thin plate 5. For example, a double-sided sheet or an adhesive can be used. An example of a double-sided sheet is LA-50 manufactured by Nitto Denko. Examples of adhesives include acrylic rubber adhesives.
Alternatively, the electroformed mold body 1 may be fitted into the center hole of the plate member 4 and the center hole and the outer shape of the electroformed mold body 1 may be connected by soldering, and then fixed on the plate member 4 with an adhesive.

A method for producing the imprint mold of the first embodiment shown in FIG. 1 will be described.
FIG. 2 schematically shows the manufacturing process of the imprint mold 10 according to the first embodiment.

As shown in FIG. 2, the imprint mold 10 is produced by electroforming on a master (master mold) described later, and the release electroforming mold body 1 b released from the master and the two thin plates 4 a and 5. It is produced using.
Peeling electroforming die body 1b are those that remain peeled from the master, it is a substantially disk-shaped with a diameter of phi _0, the peripheral edge which may have become distorted by rattled. Therefore, an electroformed mold body 1 is formed by wire cutting into a circle having a diameter φ ₁ in order to arrange the periphery of the peeled electroformed mold body 1b into a circle.
As sheet 4a, prepared to have a larger diameter phi ₃ than the length of a diagonal line of the square to one side the diameter phi ₂ of the pattern regions uneven pattern 2 of electroforming die body 1 is formed, electroforming die body provided first diameter phi ₁ or more in diameter phi ₄ of the center hole 4b to prepare a plate-like member 4.
Further, a thin plate 5 having a diameter φ ₅ larger than the diameter φ ₁ of the electroformed mold body 1 is prepared. 1 and 2, the thin plate 5 and the plate-like member 4 have substantially the same diameter, but the diameters of the two may not be the same.

  Thereafter, the adhesive 8 is applied onto the thin plate 5 not provided with the central hole, and the central hole 4b of the plate-like member 4 is arranged at the center of the thin plate 5 so that the outer shape of the plate-like member 4 coincides with that of the thin plate 5. Further, the electroformed mold body 1 is fitted into the center hole 4b, and the three members are integrated to form an imprint composed of the electroformed mold body 1 and the extended portion 3 composed of the plate member 4 and the thin plate 5. A mold 10 is obtained.

What is necessary is just to determine suitably the magnitude | size of the external shape of a mold 10, and the magnitude | size of a pattern area | region according to the magnitude | size of the uneven | corrugated pattern processed goods used as the object of imprint. For example, as a mold for producing a PSS having a diameter of 6 inches (150 mm), the diameter φ _{2 of the} pattern region is 170 mm, the diameter φ ₁ of the electroformed mold body ₁ is 180 mm, and the diameter φ ₃ of the plate-like member 4 is The diameter φ _{5 of the} thin plate 5 is 300 mm. When the electroforming mold body 1 and the plate-like member 4 are made of nickel, the thickness is set to 70 μm, for example.

Next, an imprint method using the imprint mold 10 of the present embodiment will be described.
FIG. 3 is a perspective view showing a roll mold 12 in which an imprint mold 10 is wound around a roll 11. As shown in FIG. 3, the roll mold 12 is configured by winding one or two imprint molds 10 around the roll 11 and fixing them. For example, the mold 10 may be fixed on the roll 10 by adhering an adhesive tape to the end thereof.

FIG. 4 is a view showing a part of an apparatus for performing an imprint method by a roll-to-roll method.
A die coater 16 for applying a resist solution 15a to the mold 10 is disposed above the roll mold 12, and an ultraviolet ray for curing the resist solution 15a at a position facing the die coater 16 with respect to the roll mold 12. An irradiation light source 17 is arranged. Further, on both sides of the roll mold 12, a transport roll 13 a for transporting the film 14 fed from a feeding device (not shown) and press-contacting the roll mold 12, and the film 14 are peeled from the roll mold 12. A conveying roll 13b that conveys toward a winding device (not shown) is disposed.
Here, in order to use a photo-curing resist that is cured by irradiation with ultraviolet rays, the ultraviolet irradiation light source 17 is provided. However, when a thermosetting resist is used, a heater is provided instead of the ultraviolet irradiation light source. It should be.

The roll mold 12 is rotated in the direction of the arrow, and the resist solution 15 a is applied to the application region of the mold 10 by the die coater 16. The coating width by the die coater 16 is a length that is 5 mm or more, preferably 10 mm or more outside the maximum diameter (diameter φ ₂ ) of the pattern region of the mold 10. FIG. 5 is a diagram schematically showing a resist application region on the mold 10. In FIG. 5, a hatched area indicated by a dotted line is an application area of the resist solution 15 a having an application width L. In this example, the resist application area is an approximately square area having one side L longer than the diameter φ ₁ of the electroforming mold body 1. is there.

By making the coating area wider than the pattern area, it is possible to perform imprinting using the entire pattern area effectively. At this time, since the resist solution is applied with an application width equal to the diameter φ ₁ of the electroformed mold body 1, the resist solution 15 a spreads on the roll 11 when the extension portion 3 is not provided. Therefore, the spread of the resist solution 15a can be kept on the mold 10.
Therefore, the resist solution 15a enters a gap between the roll 11 and the mold 10 generated when the resist solution 15a spreads on the roll 11, or the resist remains in a stepped portion between the roll 11 and the mold 10 after imprinting. The occurrence of this problem can be suppressed, and as a result, transfer defects during imprinting in the roll-to-roll method can be suppressed.

Along with the rotation of the roll mold 12, the mold 10 coated with the resist solution 15a is brought into pressure contact with the film 14 conveyed by the conveying roll 13a via the resist solution 15a. The resist solution 15a is cured by being conveyed and irradiated with ultraviolet rays, and the resin layer 15 to which the concave / convex pattern 2 of the mold 10 is transferred is formed. At this time, the resin layer 15 is fixed to the film 14, and is peeled off from the roll mold 12 while the resin layer 15 is fixed to the film 14 in the transport roll 13 b and is transported to the winding device together with the film 14.
By repeating the above operation, a plurality of resin layers 15 having a concavo-convex pattern formed on the surface of the mold 10 are formed on the film 14. Thereafter, a film-shaped mold 19 (see FIG. 7) in which the resin layer 15 having the uneven pattern is laminated on the film 14 is obtained by cutting out the region where the resin layer 15 having the circular uneven pattern is provided. it can.

  Here, the process from the master to the production of the electroformed mold and the production of the concavo-convex pattern processed product will be briefly described with reference to FIGS. FIG. 6 is a diagram schematically showing a process from the Si master to the production of a roll mold, and FIG. 7 schematically shows a process until a concavo-convex pattern processed product is produced using a film-like mold. FIG.

As shown in FIG. 6, first, a Si master disc 21 having an uneven pattern on the surface is prepared. The size of the Si master disk 21 is generally about 150 mm (6 inches) or 200 mm (8 inches) in diameter.
Electroforming is performed on the surface of the uneven pattern of the Si master. In particular, after a conductive layer (metal film) having a thickness of about several μm is first formed by electroless plating, an electroformed layer 1a having a thickness of about several tens of μm to several hundreds of μm is formed by electrolytic plating (electroforming). A filming method is preferred. Nickel is preferable as a material for forming the electroformed layer 1a, but is not limited to nickel.
Thereafter, the electroformed layer 1 a is peeled off from the Si master 21 to obtain the electroformed mold body 1. The process of providing the expansion part 3 in the electroforming mold main body 1 to produce the imprint mold 10 is as described with reference to FIG. Thereafter, the imprint mold 10 is wound around a roll 11 to form a roll mold 12.

  In addition, when obtaining the electroformed mold body 1 from the master, the area surrounding the pattern area of the master is increased, and the electroformed mold body 1 having the same area as that provided with the extended portion is produced by electroforming. In this case, there is no need to provide an extension as in the present invention. However, in order to maintain the same pattern area, it is necessary to increase the size of the master itself, and the cost is increased by increasing the size of the master, and the cost is increased by increasing the size of the electroforming tank for electroforming. Will occur. According to the method for producing an imprint mold of the present invention, a mold suitable for a roll mold can be produced at a lower cost by using an existing electroforming tank without increasing the master cost.

  The process of producing the film-shaped mold 19 in which the resin layer 15 having the uneven pattern is laminated on the film 14 from the roll mold 12 is as described above with reference to FIG.

Furthermore, with reference to FIG. 7, the process of producing PSS24 used as a board | substrate of LED as an example of an uneven | corrugated pattern processed goods using the film-form mold 19 is demonstrated.
First, a sapphire substrate (sapphire wafer) 24A is prepared. As a sapphire substrate, a substrate of about 2 to 6 inches is generally used, and a substrate as large as possible having a size equal to or smaller than the pattern region size of the mold is preferable because the pattern region of the mold can be effectively used.

  For example, an ultraviolet curable resist solution 25A is applied onto the sapphire substrate 24A, the film mold 19 is pressed onto the resist solution 25A so as to transfer the concavo-convex pattern, and the resist solution 25A is cured by irradiation with ultraviolet rays. As a result, the resin layer 25 having an uneven pattern formed by transferring the uneven pattern of the film-shaped mold 19 is formed. The film-shaped mold 19 is peeled from the resin layer 25, and reactive ion etching (RIE) is performed using the resin layer 25 as a mask, so that the surface of the sapphire substrate 24A conforms to the uneven pattern of the resin layer 25. PSS24 can be obtained by forming an uneven | corrugated pattern.

  As described above, by using the imprint mold 10, the resist solution 15 a can be prevented from entering between the mold 10 and the roll 11 during imprinting by the roll-to-roll method, and imprinting is repeated. Transfer defects at the time of performing can be suppressed.

<Imprint Mold of Second Embodiment>
FIG. 8 is a diagram schematically showing a manufacturing process of the imprint mold 30 according to the second embodiment of the present invention.
The imprint mold 30 according to the present embodiment extends around a disc-shaped electroformed mold body 1 having an uneven pattern 2 formed on the surface thereof, and the electroformed mold body 1 integrated with the electroformed mold body 1. And an extending portion 33.
In this embodiment, the extended portion 33 is formed of a counterbored thin plate having a counterbore portion 35 having a shape that matches the outer peripheral shape of the electroformed mold body 1, and the imprint mold 30 is a counterbored portion 35 of the counterbored thin plate. The electroformed mold main body 1 and the extended portion 33 are integrated by fitting the electroformed mold main body 1 into and bonding them.

The imprint mold 30 is flexible enough to be wound around a roll and has an appropriate range depending on the material, but the thickness is preferably 20 to 300 μm, more preferably 50 to 200 μm. is there.
As the electroforming mold main body 1, the same one as the imprint mold 10 of the first embodiment can be used.

Extension 33 is conductive (in this case, a circle having a diameter phi ₁₎ metal casting mold body 1 of the outer peripheral shape provided with a counterbore portion 35 of the depth t ₃₅ having a shape that matches, electroforming die body 1 is larger than the outer shape (here in a thin plate having a thickness t ₃₃ having a circular) diameter phi _6. Here, the counterbore part 35 is a flat bottom concave part having a shape for receiving the electroformed mold body 1, and the shape of the counterbore part 35 "matches the outer peripheral shape of the electroformed mold body 1" The shape means that the mold body 1 can be received, but in order to facilitate fitting, the mold body 1 is formed to have a diameter of about 0.1 to 0.2 mm larger than the diameter φ ₁ of the mold body 1. On the other hand, since it is preferable that the gap is small, it is preferable not to be too large. In addition, when gaps are generated, it is preferable to embed them with an embedding agent or the like.

The outer shape of the extended portion 33 (the outer shape of the mold 30) is not limited to a circle as long as it is a shape that surrounds the electroformed mold body 1, and may be a square, a rectangle, or any other shape. In order to use the concave / convex pattern 2 of the electroformed mold body 1 to the maximum extent, it has one side with a length of a square diagonal line (= √2 · φ ₂ ) or more with one side having a diameter φ _{2 of the} pattern region. It needs to be a shape that encloses a square. Therefore, when the extended portion 33 is circular, it is desirable that it has a diameter of √2 · φ ₂ or more. The outer shape of the extended portion 3 is more preferably a shape that encloses a square having one side with a diameter of (√2 · φ ₂ +20) mm or more.

  The expansion portion 33 made of a counterbore thin plate preferably has a material having a Young's modulus of about ± 100 GPa of the electroformed mold body 1 because the rigidity when wound around the roll 11 is preferably not significantly different from that of the electroformed mold body 1. It is particularly preferable that the Young's modulus is equivalent. Accordingly, it is most preferable that the electroforming mold body 1 is made of the same material. For example, when the electroformed mold main body 1 is made of nickel, the extended portion 33 is also preferably made of nickel.

The depth t ₃₅ of the counterbore part 35 of the expansion part 33 is not more than the thickness t ₁ ± 20 μm of the electroformed mold body 1, preferably not more than ± 10 μm, and most preferably the thickness t ₃₅ of the electroformed mold body 1. ₁ is the same. With ± 20 [mu] m or less and the thickness t ₁ of the depth t ₃₅ the electroforming die body 1 of the counterbore portion 35, the step between the electroforming die body 1 and the extension part 33 surface can be suppressed to below ± 20 [mu] m In addition, it is possible to suppress the generation of residue in the step portion during imprinting. If electroforming die depth t ₃₅ of thickness t ₁ and the counterbore portion 35 of main body 1 is substantially the same, the flat portion 2a of the electroforming die body 1 and the surface of the extension portion 33 in the connection portion for a flush Transfer defects can be most effectively suppressed without generating a residue during imprinting.
In the case where a step can be formed, in order to use a transfer product produced with a roll mold as a mold, it is preferable that the surface of the extended portion is higher than the surface of the main body. This is because the transferred pattern portion becomes higher than the peripheral portion, and transfer to another member using this mold becomes easy.

The electroforming mold body 1 is fixed to the counterbore part 35 of the thin plate with the counterbore part using an adhesive 38. As the adhesive 38, it is sufficient if the electroformed mold body 1 can be bonded to the counterbore part 35, and for example, an acrylic rubber adhesive can be used. Or you may affix an adhesive tape on the bottom face of the counterbore part 35, and affix the electroformed pipe type main body 1. FIG.
When a gap is generated between the electroformed mold body 1 and the surface of the extended portion 33, it is preferable to use an adhesive 38 or the like as an embedding agent so that they are flush with each other.

A method for producing the imprint mold 30 of this embodiment will be described. As shown in FIG. 8, the imprint mold 30 is manufactured by electroforming the above-described master (master mold), and includes a peeled electroforming mold body 1b released from the master and one thin plate 33a. It is made using.
Peeling electroforming die body 1b are those that remain peeled from the master, and the electroforming die body 1 those wire cut into a circle with a diameter of phi ₁ in order to adjust the circumference of the peeling electroforming die body 1b in a circular To do.
As sheet 33a, providing a material having a larger diameter phi ₆ than the length of a diagonal line of the square to one side the diameter phi ₂ of the pattern regions uneven pattern 2 of electroforming die body 1 is formed, electroforming die body a circular counterbore portion 35 of a diameter phi ₁ or more in diameter phi ₇ is provided to produce an extension 33 consisting of thin plate with countersunk portion.

  By applying an adhesive 38 to the bottom surface of the counterbore part 35 of the extension part 33 and fitting and fixing the electroformed mold body 1 to the counterbore part 35, an imprint mold 30 comprising the electroforming mold body 1 and the extension part 33. Get.

The outer size and the pattern area of the mold 30 of the present embodiment may be appropriately determined depending on the size of the uneven pattern processed product to be imprinted. For example, as a mold 30 for producing a 6-inch (150 mm) diameter PSS, the pattern region has a diameter φ ₂ of 170 mm, the electroformed mold body 1 has a diameter φ ₁ of 180 mm, and the expanded portion 33 has a diameter φ ₆ . Set to 300 mm. When both the electroformed mold body 1 and the extended portion 33 are formed of nickel, for example, the thickness t ₁ of the electroformed mold body ₁ is 50 μm, the thickness t ₃₃ of the expanded portion ₃₃ is 150 μm, and the counterbore portion 35 is the depth t ₃₅ to 100 [mu] m.

  The imprint mold 30 according to the second embodiment is used for the imprint method using the roll-to-roll method in the same manner as the imprint mold 10 according to the first embodiment, and roll-to-roll. It is possible to prevent the resist solution 15a from entering between the mold 30 and the roll 11 at the time of imprinting by the method, and it is possible to suppress a transfer defect when imprinting is repeatedly performed.

<Imprint Mold of Third Embodiment>
FIG. 9 is a diagram schematically showing a manufacturing process of the imprint mold 40 according to the third embodiment of the present invention.
The imprint mold 40 according to the present embodiment extends around a disc-shaped electroformed mold body 1 having an uneven pattern 2 formed on the surface thereof and the electroformed mold body 1 integrated with the electroformed mold body 1. The extension part 43 which exists is comprised.
In this embodiment, the extended portion 43 is made of a plate-like member having a center hole 45 having a shape that matches the outer peripheral shape of the electroformed mold body 1, and the imprint mold 40 is formed in the center hole 45 of the plate-like member 4. The electroformed mold main body 1 is fitted and connected to the plate member 4 at the periphery of the electroformed mold main body 1 so as to be integrated.

The imprint mold 40 is flexible enough to be wound around a roll and has an appropriate range depending on the material, but the thickness is preferably 20 to 300 μm, more preferably 50 to 200 μm. is there.
As the electroforming mold main body 1, the same one as the imprint mold 10 of the first embodiment can be used.

Extension 43 is conductive (in this case, a circle having a diameter phi ₁₎ metal casting mold body 1 of the outer peripheral shape consists plate-shaped member having a central bore 45 having a shape that matches, electroforming die body 1 is larger than the outer shape ( Here, a square having a side with a length a). Here, “the shape of the center hole 45 of the extended portion 43“ matches with the outer peripheral shape of the electroformed mold body 1 ”means that the shape is capable of receiving the electroformed mold body 1, but is fitted. In order to facilitate the process, it is preferable that the diameter is about 0.1 to 0.2 mm larger than the diameter φ ₁ of the electroformed mold main body 1. .

The outer shape of the extended portion 43 (the outer shape of the mold 40) is not limited to a square as long as the shape surrounds the electroformed mold main body 1, and may be a circular shape, a rectangular shape, or any other shape. In order to use the concavo-convex pattern 2 of the electroformed mold body 1 to the maximum extent, in the case of a square as in the present embodiment, the length a of one side is a square diagonal line with the diameter φ _{2 of the} pattern region as one side. It is necessary that the length is equal to or greater than the length (= √2 · φ ₂ ). Therefore, when the outer shape of the extended portion 43 is circular, it is desirable that the diameter has a length of √2 · φ ₂ or more. The outer shape of the extended portion 3 is more preferably a shape that encloses a square having one side with a diameter of (√2 · φ ₂ +20) mm or more.

  The expansion portion 43 made of a plate-like member preferably has a rigidity that is not significantly different from that of the electroformed mold main body 1 when wound around a roll. Therefore, a material having a Young's modulus of about ± 100 GPa of the electroformed mold main body 1 is used. It is particularly preferable that the Young's modulus is equivalent. Accordingly, it is most preferable that the electroforming mold body 1 is made of the same material. For example, when the electroformed mold main body 1 is made of nickel, it is preferable that the extended portion 43 is also made of nickel.

The thickness t ₄₃ of the extended portion 43 is not more than the thickness t ₁ ± 20 μm of the electroformed mold body 1, preferably not more than ± 10 μm, and most preferably the same as the thickness t ₁ of the electroformed mold body 1. . If the step is ± 20 μm or less, it is possible to suppress the generation of residues in the step portion during imprinting. If the thickness is the same as the thickness t _{1 of} the electroformed mold main body 1, the flat portion 2a of the electroformed mold main body 1 and the surface of the extended portion 43 are flush with each other. Defects can be most effectively suppressed.
In the case where a step can be formed, in order to use a transfer product produced with a roll mold as a mold, it is preferable that the surface of the extended portion is higher than the surface of the main body. This is because the transferred pattern portion becomes higher than the peripheral portion, and transfer to another member using this mold becomes easy.

  Connection between the extended portion 43 and the electroformed mold main body 1 can be made by solder 49. The electroformed mold main body 1 is fitted into the center hole 45 of the extended portion 43, and a solder 49 is filled in the gap to connect the two. At this time, when the solder 49 is formed so as to be raised on the surface, it is preferable to perform a process such as shaving or applying pressure so that the surface is flush.

A method for producing the imprint mold 40 of this embodiment will be described. As shown in FIG. 9, the imprint mold 40 is manufactured by electroforming the above-described master (master mold), and includes a release electroforming mold body 1 b released from the master and one thin plate 43 a. It is made using.
Peeling electroforming die body 1b are those that remain peeled from the master, and the electroforming die body 1 those wire cut into a circle with a diameter of phi ₁ in order to adjust the circumference of the peeling electroforming die body 1b in a circular To do.
As sheet 43a, Prepare a square having a diagonal of greater length a than the length side of the square to one side the diameter phi ₂ of the pattern regions uneven pattern 2 of electroforming die body 1 is formed , it provided electroforming die circular center hole 45 of the main body 1 of diameter phi ₁ or more in diameter phi ₈ to produce an extension 43.

  The electroformed mold main body 1 is fitted into the center hole 45 of the extended portion 43, solder 49 is embedded in the gap between the peripheral edge and the central hole, and the electroformed mold main body 1 and the extended portion 43 are joined and integrated to form the imprint mold 40. obtain.

The outer size and the pattern area of the mold 40 of the present embodiment may be appropriately determined depending on the size of the uneven pattern processed product to be imprinted. For example, as a mold 40 for producing a PSS having a diameter of 6 inches (150 mm), the diameter φ _{2 of the} pattern region is 170 mm, the diameter φ ₁ of the electroformed mold body ₁ is 180 mm, and the length of one side of the extended portion 43 is set. a is set to 345 mm. When both the electroformed mold body 1 and the extended portion 43 are formed of nickel, for example, the thickness t ₁ of the electroformed mold body 1 and the thickness t 43 of the extended portion ₄₃ are both 150 μm.

  The imprint mold 40 according to the third embodiment is used for the imprint method using the roll-to-roll method in the same manner as the imprint mold 10 according to the first embodiment, and roll-to-roll. It is possible to prevent the resist solution 15a from entering between the mold 40 and the roll 11 at the time of imprinting by the method, and it is possible to suppress a transfer defect when imprinting is repeatedly performed.

DESCRIPTION OF SYMBOLS 1 Electroforming die main body 2 Uneven | corrugated pattern 3, 33, 43 Expansion part 4 Plate-like member 4b Center hole 5 Thin plate 8 Adhesive 10, 30, 40 Imprint mold 11 Roll 12 Roll mold 13a, 13b Conveyance roll 14 Film 15 Resin layer 15a Resist liquid 16 Die coater 17 UV irradiation light source 19 Film mold 21 Master disk 24 Patterned sapphire substrate 24A Sapphire substrate 25 Resin layer 25A Resist liquid 35 Counterbore part 38 Adhesive 45 Central hole 49 Solder

Claims (5)

An imprint mold having a concavo-convex pattern on the surface, wound around a roll,
A disc-shaped electroformed mold body having the uneven pattern formed on the surface;
An imprint mold comprising: an expansion portion extending around the electroforming mold main body integrated with the electroforming mold main body. The extension portion is composed of a plate-like member having a center hole having a shape that matches the outer peripheral shape of the electroformed mold body, and a thin plate having an outer shape larger than the outer shape of the electroformed mold body,
The imprint mold according to claim 1, wherein the electroformed mold main body is fitted into the central hole of the plate-like member, and the plate-like member and the electroformed mold main body are bonded and integrated on the thin plate. . The extension portion is made of a counterbored thin plate with a counterbore portion having a shape that matches the outer peripheral shape of the electroformed mold body,
2. The imprint mold according to claim 1, wherein the electroformed mold main body and the extension portion are integrated by fitting and bonding the electroformed mold main body to the counterbore portion of the counterbore thin plate. The extension portion is composed of a plate-like member having a center hole having a shape that matches the outer peripheral shape of the electroformed mold body,
2. The in-hole according to claim 1, wherein the electroformed mold main body is fitted into the center hole of the plate-shaped member, and the plate-shaped member and the electroformed mold main body are connected at the periphery of the electroformed mold main body to be integrated. Mold for printing.   The imprint mold according to any one of claims 1 to 4, wherein a step between the surface of the extended portion and the surface of the electroformed mold main body is 10 µm or less.