JP4717697B2 - Manufacturing method of resin molded products - Google Patents

Description

  The present invention relates to a method for producing a resin molded product and a resin molded product obtained by the method.

  Conventionally, as a method for producing a resin molded product, a method is generally used in which a metal block is machined to obtain a mold so that a desired resin molded product is obtained, and a resin is poured into the mold for production. there were. However, since much time and cost have been required to manufacture the mold, various alternative methods have been studied. For example, there is a method described in Patent Document 1.

  As shown in FIG. 10, Patent Document 1 discloses a method for producing a foamed material such as a packing or a seal by a screen printing method, whereby a desired shape can be easily and quickly applied to an object to be coated. In addition, it is described that a product of a certain quality without variation can be obtained in large quantities.

JP-A-6-117543

  However, in actuality, the mask manufacturing process and the printing process are separate processes, that is, a mask is first manufactured by stretching a screen on which a resin pattern is formed on a frame, and then a coated material is applied to an object using the manufactured mask. Is printing. For this reason, it is necessary to align the mask and the object to be coated during the printing process. However, a positional shift occurs during the alignment, which leads to a defect.

  An object of the present invention is to provide a method for easily and inexpensively producing a resin molded product having a desired shape, and a resin molded product produced by this production method.

The method for producing a resin molded product of the present invention includes a step of forming a flexible support layer 15 on the substrate 10, and a step of forming a pattern layer 12 having a desired opening 12a on the support layer 15. The step of applying the resin 13 to the opening 12a, the step of attaching the sheet 14 on the pattern layer 12, and the substrate 10 is removed , and then the pattern layer 12 is put together with the sheet 14 from the support layer 15 And the step of removing.

Further, the method for producing a resin molded product of the present invention includes a step of forming a flexible support layer 25 on the substrate 20 and a first metal having an opening serving as a desired pattern layer on the support layer 25. A step of forming a layer 26, a step of applying a resin 23 in the opening, a step of forming a second metal layer 28 on the first metal layer 26, and a sheet 24 on the second metal layer 28. It is characterized by comprising a step of pasting and a step of removing the first metal layer 26 and the second metal layer 28 together with the sheet 24 from the support layer 25 after removing the substrate 20 .

The present invention, before the step of forming the pattern layer, and forming a metal body 16 having a projecting portion 16a at a position corresponding to the opening portion.

  Furthermore, the present invention is characterized in that the metal body 16 is formed by electroforming.

The method for producing a resin molded product of the present invention includes a step of forming a flexible support layer 15 on the substrate 10, and a step of forming a pattern layer 12 having a desired opening 12a on the support layer 15. The step of applying the resin 13 to the opening 12a, the step of attaching the sheet 14 on the pattern layer 12, and the removal of the substrate 10, the pattern layer 12 together with the sheet 14 from the support layer 15 The process includes a step of removing, and by forming the desired pattern layer 12, various shapes of resin molded products can be obtained easily and inexpensively. In addition, since the resin molded product is obtained in a state of being formed on the support layer 15 , when a large number of resin molded products are formed, it can be prevented from being scattered. Furthermore, since the resin molded product can be carried and stored in a state formed on the support layer 15, the resin molded product can be manufactured by reusing the substrate 10, so that the resin molded product can be manufactured, transported and stored on the substrate 10. Productivity is good.

Further, the method for producing a resin molded product of the present invention includes a step of forming a flexible support layer 25 on the substrate 20 and a first metal having an opening serving as a desired pattern layer on the support layer 25. A step of forming a layer 26, a step of applying a resin 23 in the opening, a step of forming a second metal layer 28 on the first metal layer 26, and a sheet 24 on the second metal layer 28. And a step of removing the first metal layer 26 and the second metal layer 28 together with the sheet 24 from the support layer 25 after the substrate 20 is removed, and a part of the resin 23 is removed. By forming the second metal layer 28 so as to cover it, it is possible to more reliably prevent the resin 23 and the sheet 24 from adhering to each other when the sheet 24 is attached onto the second metal layer 28. Remove the resin 23 when removing It can be present on the reliably supported layer 25.

Further, before the step of forming the pattern layer, so to form a metal body 16 having a projecting portion 16a at a position corresponding to the opening, when the elaborate coating resin 13 and 23 to the opening, the resin Since 13 and 23 bite into the overhanging portion 16a, the resin 13 and 23 having a desired shape can be formed on the substrates 10 and 20 or the support layers 15 and 25 with good adhesion. Further, when removing the subsequent pattern layer , the resins 13 and 23 are not displaced or peeled off. Further, if the metal body 16 is formed by electroforming, it can be easily formed.

(First embodiment)
A first embodiment of a method for producing a resin molded product according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a resin molded product 1, and FIG. 2 is a plan view thereof. The shape and dimensions of the resin molded product 1 of this embodiment when viewed from above as shown in FIG. 2 are rectangular frame shapes having an inner diameter of 10.1 mm × 55.6 mm and an outer diameter of 11.1 mm × 56.6 mm. Two ring shapes having an inner diameter of 2.7 mm and an outer diameter of 3.7 mm are integrally formed on each of the pair of sides. The resin molded product 1 is used as, for example, a battery insulator. Hereinafter, the manufacturing method of the resin molded product 1 of this embodiment is demonstrated based on FIG. 3 shown typically.

  First, as shown in FIG. 3A, in order to form a pattern layer 12 on a 400 mm square to 700 mm square substrate 10, in this embodiment, a negative type photosensitive dry film resist is adjusted to a predetermined height. The resist layer 11 is formed by laminating one or several sheets and performing thermocompression bonding or the like. The substrate 10 may be anything such as a metal body, a synthetic resin body, or glass, but in the present embodiment, it is made of 400 mm square stainless steel. Moreover, the thickness of the resist layer 11 is good to form to the same extent as the thickness dimension of the desired resin molded product 1, and the thickness of the resist layer 11 was 200 micrometers in this embodiment.

  And after making the pattern film (glass mask) which has a translucent hole closely_contact | adhere on this resist layer 11, it exposes by irradiating an ultraviolet light with an ultraviolet lamp, and each process of image development and drying is performed. Then, the pattern layer 12 having a desired opening 12a is formed on the substrate 10 as shown in FIG. 3B by dissolving and removing the unexposed portion. This is a mold for producing a resin molded product having a desired shape.

  Next, as shown in FIG. 3C, the resin 13 is applied to the opening 12a of the pattern layer 12 with a squeegee or the like, dried and cured. The cured resin is characterized by stretching and contracting like rubber. Here, it is preferable to add a release agent to the resin 13. This is not only to make the resin 13 easy to peel off, but also to make the resin 13 easy to cure. After this step, it is preferable to bake in order to harden the resin 13 more firmly. At this time, gas is generated from the resist, and this gas inhibits the curing of the resin. However, the resin 13 to which a release agent is added can prevent this inhibition.

  Next, as shown in FIG. 3D, a sheet 14 having a thickness of 100 to 200 μm and having an adhesive layer, for example, is formed on the pattern layer 12. At this time, the resin 13 and the sheet 14 are not bonded. This is because, as shown in the drawing, a dent is caused by the surface tension in the central portion of the resin 13 applied to each opening 12a.

  Finally, as shown in FIG. 3 (e), by peeling off the substrate 10, the resin on the pattern layer 12 and the pattern layer 12 that could not be scraped off by the squeegee attached to the sheet 14 can be collectively removed, and resin molding A state in which the product 1 is formed on the substrate 10 can be obtained. If the substrate 10 is removed (peeled) when transported or stored in this state and the resin molded product 1 is used, the substrate 10 can be firmly reinforced with the substrate 10 until just before the resin molded product 1 is used.

  As described above, the resin molded product 1 (resin 13) is bonded to the sheet 10 and the pattern layer 12 is bonded to the sheet 14 as described above. This is because the resin molded product 1 (resin 13) has a taper shape that expands toward the substrate 10, and the pattern layer 12 excluding the opening 12a has a taper shape that expands toward the sheet 14. is there.

  Moreover, when removing the pattern layer 12, it is preferable to peel off so that the board | substrate 10 may be bent. This is because the resin molded product 1 (resin 13) to be obtained has rubber characteristics and is attracted in the direction of pulling due to the rubber characteristics. Thus, if the substrate 10 is peeled off, the pattern 12 is removed together with the sheet 14, but the resin molded product 1 (resin 13) can be maintained on the substrate 10. Therefore, the substrate 10 is preferably flexible.

(Second Embodiment)
Next, 2nd Embodiment of the manufacturing method of the resin molded product which concerns on this invention is described based on FIG. In addition, the same code | symbol is attached | subjected to the same member as 1st Embodiment, and the description is abbreviate | omitted.

  First, a 400 to 700 mm square substrate 10 is prepared. The substrate 10 may be any metal body, synthetic resin body, glass, or the like, but in the present embodiment, it is made of 400 mm square stainless steel. Then, as shown in FIG. 4A, a support layer 15 is formed on the substrate 10 by nickel-cobalt electroforming. The support layer 15 is formed by a method such as plating, sputtering, vapor deposition, or silver mirror reaction, a heat-peeling adhesive in which a foaming agent that is foamed by heating is mixed, or a UV curable type that is cured by UV irradiation. A film made of polyphenylene sulfide (PPS), polyester, polyetherimide, polyimide, or the like may be integrally laminated through an adhesive. In the case of using a UV curable adhesive, it is better to use a translucent substrate 10 such as glass in order to surely peel it by UV irradiation from the back surface of the substrate 10 and curing. And the thickness of the support layer 15 should just be a thickness which has a firmness, and if it forms by nickel-cobalt electroforming, 10-100 micrometers is enough, and in this embodiment, it is nickel-cobalt electroforming. The thickness was set to 50 μm.

  The reason why the support layer 15 is formed is that, as described in the first embodiment, the resin molded product 1 has a property unique to rubber such that the resin molded product 1 is drawn toward the direction of pulling. In the step of removing 12, in the first embodiment, the substrate 10 on which the resin molded product 1 is formed is peeled off so as to be bent. Accordingly, the substrate 10 is preferably flexible, but if a flexible substrate cannot be prepared, a flexible support layer 15 may be formed on the substrate 10 as in this embodiment. .

  Next, as shown in FIG. 4B, in order to form the pattern layer 12 on the support layer 15, in this embodiment, one or several negative type photosensitive dry film resists are matched to a predetermined height. The resist layer 11 is formed on the surface of the support layer 15 by laminating the sheets and performing thermocompression bonding or the like. The thickness of the resist layer 11 may be approximately the same as the thickness dimension of the desired resin molded product 1. In this embodiment, the thickness of the resist layer 11 is 200 μm.

  And after making the pattern film (glass mask) which has a translucent hole closely_contact | adhere on the resist layer 11, it exposes by irradiating an ultraviolet light with an ultraviolet lamp, and performs each process of image development and drying, By dissolving and removing the unexposed portion, a pattern layer 12 having a desired opening 12a is formed on the support layer 15 as shown in FIG. In this way, a mold used for manufacturing the resin molded product 1 can be obtained.

  Next, as shown in FIG. 4D, the resin 13 is applied to the opening 12a of the pattern layer 12 with a squeegee or the like, dried and cured. The cured resin has a feature that it expands and contracts like rubber. Moreover, it is preferable to add a release agent to the resin 13 as in the first embodiment.

  Next, as illustrated in FIG. 4E, a sheet 14 having a thickness of 100 to 200 μm in which an adhesive layer is formed on the pattern layer 12 is attached. At this time, the resin 13 and the sheet 14 are not bonded. This is because, as shown in the drawing, a dent is caused by the surface tension in the central portion of the resin 13 applied to each opening 12a.

  Finally, as shown in FIG. 4F, the substrate 10 is peeled and removed, and then the support layer 15 is bent so that the squeegee present on the sheet 14 and the squeegee existing on the pattern layer 12 are removed. Thus, the resin that could not be scraped off can be removed all at once from the support layer 15, and the resin molded product 1 can be formed on the support layer 15. If conveyance and storage are performed in this state, the support layer 15 may be able to reinforce firmly until just before using the resin molded product 1.

  As described above, the resin molded product 1 (resin 13) is separated on the support layer 15 side and the pattern layer 12 is separated on the sheet 14 side, as shown in FIG. 4 (f). ) Is not bonded to the sheet 14, and the resin molded product 1 (resin 13) has a taper shape that expands toward the support layer 15, and the pattern layer 12 excluding the opening 12 a is expanded toward the sheet 14. This is because it is tapered.

  Further, when the resin layer 1 is obtained by removing the pattern layer 12, it is preferable to peel the substrate 10 so as to be bent as described in the first embodiment, but when a flexible substrate cannot be prepared. Therefore, the steps described in the present embodiment can be taken to obtain a state in which the resin molded product 1 is formed on the support layer 15, which is light and compact. Furthermore, since the resin molded product 1 can be manufactured by using the substrate 10 again, and transport and storage can be performed on the support layer 15, the productivity is good.

(Third embodiment)
Next, 3rd Embodiment of the manufacturing method of the resin molded product which concerns on this invention is described based on FIG. In the first and second embodiments, the case where the substrate 10 is removed and only the resin 13 becomes a resin molded product has been described, but in this embodiment, the resin molded product composed of the substrate 10 and the resin 13 will be described. . In addition, the same code | symbol is attached | subjected to the same member as the said embodiment, and the description is abbreviate | omitted.

  As a resin molded product 2 composed of the substrate 10 and the resin 13, for example, as shown in FIG. 5, is a lead (metal body) 16 formed on the substrate 10 brought into contact with an electrode of a semiconductor device to be electrically connected? There is a probe to test. In addition, a protrusion made of metal is provided on the lead 16 in order to ensure contact with the electrode of the semiconductor device. In recent years, a conductive resin 13 is provided on the lead 16. There is. However, since the tackiness between the lead 16 and the conductive resin 13 is poor, the conductive resin 13 was peeled off from the lead 16 as the test was repeated. In the present embodiment, means for solving the above problems will be described.

  First, as shown in FIG. 6D, leads 16 are formed on the insulating substrate 10 by a known method such as pressing, electroforming, sputtering, etching, or the like. The lead 16 may be formed of a single metal such as copper or nickel, or may be formed by stacking another metal on one metal, for example, nickel-cobalt on copper. The substrate 10 may be a film made of polyimide or the like.

  Here, the lead 16 is preferably formed with an overhang portion 16a. This is because the resin 13 can be formed on the substrate 10 with good adhesion. Any method may be used for forming the overhanging portion 16a. For example, the resist layer 17 is formed by laminating one or several negative photosensitive dry film resists to a predetermined height and performing thermocompression bonding or the like. (FIG. 6 (a)), and a pattern film (glass mask) having a light transmitting hole is adhered onto the resist layer 17, and then exposed to ultraviolet light with an ultraviolet lamp for exposure, development, and drying. The desired resist pattern layer 18 is formed on the substrate 10 (FIG. 6B) by dissolving and removing the unexposed portions by performing each of the above processes, and with respect to the exposed surface not covered with the resist pattern layer 18 Then, if necessary, after surface activation treatment such as removal of the surface oxide film by chemical etching or well-known chemical treatment with chemicals, the electroformed metal is electroplated beyond the thickness of the resist pattern layer 18. Let (FIG. 6 (c)), that is a so-called overhang, a lead 16 having a projecting portion 16a can be easily formed. Note that the shape and the like of the lead 16 are appropriately changed according to the application. Further, the length of the overhanging portion 16a is preferably in the range of 10 to 100 μm, and in this embodiment, it is set to 25 μm.

  Next, as shown in FIG. 7A, by laminating one or several negative photosensitive dry film resists on the substrate 10 and the leads 16 to a predetermined height, and performing thermocompression bonding or the like. A resist layer 11 is formed. The thickness of the resist layer 11 is preferably in the range of 50 to 400 μm. In the present embodiment, the thickness of the resist layer 11 is 200 μm.

  Next, after a pattern film (glass mask) having a light transmitting hole is adhered onto the resist layer 11, exposure is performed by irradiating ultraviolet light with an ultraviolet lamp, and development and drying are performed. Then, the pattern layer 12 is formed so that the opening 12a is formed at a position corresponding to the lead 16, as shown in FIG.

  Next, as shown in FIG. 7C, the conductive resin 13 is applied to the opening 12a of the pattern layer 12 with a squeegee or the like, dried and cured. The cured resin has a feature that it expands and contracts like rubber. Further, it is preferable to add a release agent to the resin 13. This is because the pattern layer 12 is easily peeled off from the resin 13 and the resin 13 is easily cured. After this step, it is preferable to bake in order to harden the resin 13 more firmly. At this time, gas is generated from the resist, and this gas inhibits the curing of the resin. However, the resin 13 to which a release agent is added can prevent this inhibition.

  Next, as illustrated in FIG. 7D, a sheet 14 having a thickness of 100 to 200 μm in which an adhesive layer is formed on the pattern layer 12 is attached. At this time, the resin 13 and the sheet 14 are not bonded. This is because, as shown in the drawing, a dent is caused by the surface tension in the central portion of the resin 13 applied to each opening 12a.

  Finally, as shown in FIG. 7 (e), by removing the substrate 10, the resin on the pattern layer 12 and the pattern layer 12 that could not be scraped off by the squeegee attached to the sheet 14 can be collectively removed, and the resin molding Product 2 (probe) can be obtained.

  As described above, the resin 13 of the resin molded product 2 is separated from the substrate 10 and the pattern layer 12 is separated from the sheet 14 as described above. This is because the resin 13 of the resin molded product 2 has a taper shape that expands toward the substrate 10, and the pattern layer 12 except the opening 12 a has a taper shape that expands toward the sheet 14. If the overhanging portion 16a is formed on the lead 16, the resin 13 bites into the overhanging portion 16a, so that the bonding force between the lead 16 and the resin 13 is improved, and the resin 13 is fixed on the substrate 10. The obtained state is obtained.

  Moreover, when removing the pattern layer 12, it is preferable to peel off so that the board | substrate 10 may be bent. This is because the resin 13 of the resin molded product 2 has rubber characteristics and is attracted in the direction of pulling due to the rubber characteristics. As a result, if the substrate 10 is peeled off, the pattern 12 is removed together with the sheet 14, but the resin 13 of the resin molded product 2 remains maintained on the substrate 10. Therefore, the substrate 10 is preferably flexible. Of course, as in the second embodiment, the support layer 15 may be formed on the substrate 10 to form the resin molded product 2 including the support layer 15 and the resin 13.

( Fourth embodiment )
Next, a reference example of the method for producing a resin molded product according to the present invention will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same member as the said embodiment, and the description is abbreviate | omitted.

  First, the support layer 25 is formed on the substrate 20. The substrate 20 is made of a metal body of 400 mm to 700 mm square, a synthetic resin body, glass or the like. The support layer 25 is formed by a method such as plating, electroforming, silver mirror reaction, vapor deposition, or sputtering, or a heat-peeling type adhesive in which a foaming agent that foams by heating is mixed, or is cured by UV irradiation. There is one in which films made of polyphenylene sulfide (PPS), polyester, polyetherimide, polyimide, and the like are laminated integrally through a UV curable adhesive. If the support layer 25 formed on the substrate 20 is non-conductive, a conductive film is formed on the support layer 25 by a known method such as plating, electroforming, silver mirror reaction, vapor deposition, sputtering, or the like. In this embodiment, as shown in FIG. 8A, a support layer 25 having a thickness of 50 μm is formed on a 400 mm square stainless steel substrate 20 by nickel-cobalt electroforming. If the substrate 20 is flexible, the step of forming the next resist layer 21 on the substrate 20 without forming the support layer 25 may be performed.

  Next, as shown in FIG. 8B, a resist is deposited on the support layer 25, and in the present embodiment, one or several positive type photosensitive dry film resists are laminated in accordance with a predetermined height and thermocompression bonded. By doing so, the resist layer 21 is formed on the surface of the support layer 25. The thickness of the resist layer 21 may be approximately the same as the thickness dimension of a desired resin molded product. In the present embodiment, the thickness of the resist layer 21 is 200 μm.

  Next, after a pattern film (glass mask) having a light transmitting hole is adhered on the resist layer 21, exposure is performed by irradiating ultraviolet light with an ultraviolet light lamp, and development and drying are performed. Then, by dissolving and removing the unexposed portion, a desired pattern layer 22 is formed on the support layer 25 as shown in FIG. After this, it is preferable to perform a peeling treatment on the exposed support layer 25.

  Next, as shown in FIG. 8D, the first metal layer 26 selected from nickel, copper, nickel-cobalt and the like up to the same height as the thickness of the pattern layer 22 on the exposed support layer 25. In this embodiment, is formed by electroforming.

  Next, the pattern layer 22 on the support layer 25 is removed. As a method for removing this resist, a method for removing swelling with an alkaline solution, or the like can be considered. Then, as shown in FIG. 9A, a resin 23 is applied to the opening that can be removed by removing the pattern layer 22 with a squeegee or the like, and dried. The cured resin has a feature that it expands and contracts like rubber. Further, it is preferable to add a release agent to the resin 23 as in the above embodiment.

  Next, the second metal layer 28 selected from nickel, copper, nickel-cobalt, or the like is formed on the first metal layer 26 by electroforming in this embodiment. At this time, as shown in FIG. 9B, it is desirable to form the second metal layer 28 so as to cover a part of the resin 23. Before forming the second metal layer 28, a peeling process may be performed on the resin 23 and an adhesion process may be performed on the first metal layer 26.

  Next, as illustrated in FIG. 9C, a sheet 24 having a thickness of 100 to 200 μm in which an adhesive layer is formed on the second metal layer 28 is attached.

  Finally, as shown in FIG. 9 (d), the substrate 20 is peeled off and the support layer 25 is peeled off. Preferably, the substrate 20 is peeled off, and then the support layer 25 is peeled off so as to be adhered to the sheet 24. Further, the resin that could not be scraped off by the squeegee existing on the first metal layer 26, the second metal layer 28, and the first metal layer 26 could be removed from the support layer 25, and a resin molded product was formed on the support layer 25. The state can be obtained. If conveyance and storage are performed in this state, the support layer 25 may be able to reinforce firmly until just before using the resin molded product. In addition, when peeling off the support layer 25, it is desirable to peel off the support layer 25. This is because the dried resin 23 has a property of being drawn toward the direction of pulling, and takes advantage of this property.

  Thus, the resin molded product (resin 23) has a taper shape that expands toward the support layer 25, the first metal layer 26 has a taper shape that expands toward the sheet 24, and each opening. In addition to the central portion of the resin 13 coated on the portion 22a being recessed by surface tension, the second metal layer 28 is formed so as to cover a part of the resin 23, whereby the sheet 24 is It is possible to more reliably prevent the resin 23 and the sheet 24 from adhering to each other when being stuck on the layer 28. Therefore, when the sheet 24 is peeled off, the resin 23 is more surely present on the support layer 25. Can do.

  In this reference example, the second metal layer 28 is formed on the first metal layer 26 by electroforming to prevent the resin 23 and the sheet 24 from adhering to each other. However, the second metal layer 28 is formed on the first metal layer 26. The material and method of the object are not limited to this, and more specifically, it is sufficient to form an object at a location excluding the surface of the resin 23. In short, if a step is produced between the surface of the resin 23 and the surface of the object, the resin It is thought that adhesion between the sheet 23 and the sheet 24 can be prevented.

It is a perspective view of the resin molded product which concerns on 1st Embodiment of this invention. It is a top view of the resin molded product which concerns on 1st Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 1st Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 2nd Embodiment of this invention. It is a schematic diagram of the resin molded product which concerns on 3rd Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 3rd Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 3rd Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 4th Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the resin molded product which concerns on 4th Embodiment of this invention. It is process explanatory drawing of the manufacturing method of the conventional resin molded product.

Explanation of symbols

1 resin molded product 2 resin molded product (probe)
DESCRIPTION OF SYMBOLS 10 , 20 Board | substrate 12 Pattern layer 12a Opening part 13 , 23 Resin 14 , 24 sheet 15 , 25 Support layer 16 Metal body (lead)
16a Overhang
26 1st metal layer (pattern layer)
28 Second metal layer

Claims (4)

Forming a flexible support layer 15 on the substrate 10;
Forming a pattern layer 12 having a desired opening 12a on the support layer 15;
Applying a resin 13 to the opening 12a;
Attaching the sheet 14 on the pattern layer 12;
And a step of removing the pattern layer 12 together with the sheet 14 from the support layer 15 after removing the substrate 10. Forming a flexible support layer 25 on the substrate 20;
Forming a first metal layer 26 having an opening to be a desired pattern layer on the support layer 25;
Applying a resin 23 to the opening;
Forming a second metal layer 28 on the first metal layer 26;
Attaching the sheet 24 on the second metal layer 28;
A method of manufacturing a resin molded product, comprising: removing the first metal layer 26 and the second metal layer 28 together with the sheet 24 from the support layer 25 after removing the substrate 20.   3. The method for producing a resin molded product according to claim 1, wherein the metal body 16 having an overhanging portion 16 a is formed at a position corresponding to the opening before the step of forming the pattern layer.   The method for producing a resin molded product according to claim 3, wherein the metal body 16 is formed by an electroforming method.

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