TW201633373A - Imprint mold - Google Patents

Imprint mold Download PDF

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Publication number
TW201633373A
TW201633373A TW104142401A TW104142401A TW201633373A TW 201633373 A TW201633373 A TW 201633373A TW 104142401 A TW104142401 A TW 104142401A TW 104142401 A TW104142401 A TW 104142401A TW 201633373 A TW201633373 A TW 201633373A
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mold
main body
electroforming
metal mold
mold main
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TW104142401A
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TWI680498B (en
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Tomokazu Umezawa
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Fujifilm Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/10Moulds; Masks; Masterforms
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

To provide an imprint mold used upon being wrapped around a roll, wherein a concavo-convex pattern formation region of an electroformed mold can be effectively utilized. An imprint mold (10), comprising a disc-shaped electroformed mold body (1) having a concavo-convex pattern (2) formed on the surface, and an extension part (3) integrated with the electroformed mold body (1) so as to extend around the electroformed mold body (1).

Description

壓印用模具Imprinting mold

本發明有關在向塗敷於基板上的光阻劑轉印微小的凹凸圖案的壓印方法中使用的壓印用模具,特別是有關具有撓性的壓印用模具。The present invention relates to an imprint mold used for an imprint method for transferring a minute concavo-convex pattern to a photoresist applied to a substrate, and more particularly to a mold for imprint having flexibility.

壓印指的是如下這樣的技術:將形成有凹凸圖案的模(一般也被稱作模具、壓模、型板)按壓於塗敷在被轉印基板上的光阻劑,使光阻劑力學變形或流動,從而將微小的圖案精密地轉印在光阻劑膜上。作為微小的凹凸圖案,存在10nm左右至100μm左右的圖案。只要製作一次模具,即便是奈米等級的微小構造的圖案也能夠簡單地反覆成型,所以比較經濟,並且是有害的廢棄物以及排出物少的轉印技術,因而期待應用於半導體領域等各種領域。Embossing refers to a technique in which a mold having a concavo-convex pattern (generally also referred to as a mold, a stamper, or a mold) is pressed against a photoresist coated on a substrate to be transferred to form a photoresist. The mechanical deformation or flow causes the minute pattern to be precisely transferred onto the photoresist film. As a minute uneven pattern, there is a pattern of about 10 nm to 100 μm. It is expected to be applied to various fields such as the semiconductor field, as long as the mold of the nano-scale is easily reversible, and it is economical, and it is a wasteful waste and a transfer technique with a small amount of discharged matter. .

另外,作為壓印方法,提出了應用輥對輥等捲筒處理技術的方法。例如,提出了如下壓印方法:在將成為加工對象的具有撓性的長條片(例如樹脂製膜、無機基板等)放出的放出裝置與捲繞該片的捲繞裝置之間的搬運路上,具備在表面具有微小的凹凸圖案的輥狀金屬模(也被稱作模輥或壓輥),一邊使輥狀金屬模與片的加工面接觸一邊將片從放出裝置向捲繞裝置搬運。由此,能夠連續且高效地對樹脂製膜實施壓花加工,或在塗敷在片上的光阻劑上形成圖案。Further, as an imprint method, a method of applying a roll processing technique such as a roll-to-roller has been proposed. For example, there has been proposed an imprinting method in which a discharge device that releases a flexible long strip (for example, a resin film or an inorganic substrate) to be processed and a winding device that winds the sheet are transported. A roll-shaped metal mold (also referred to as a mold roll or a press roll) having a fine uneven pattern on the surface is provided, and the sheet is conveyed from the discharge device to the winding device while bringing the roll-shaped mold into contact with the processed surface of the sheet. Thereby, the resin film can be embossed continuously or efficiently, or a pattern can be formed on the photoresist applied on the sheet.

對於上述輥狀金屬模,例如公知如下製造方法:通過將具有凹凸圖案的片狀的薄金屬模(模片)捲繞於成為旋轉軸的輥,對繞輥一周的模片的相對的端邊彼此進行焊接而製造。For the above-described roll-shaped metal mold, for example, a manufacturing method is known in which a sheet-like thin metal mold (die) having a concavo-convex pattern is wound around a roll that serves as a rotating shaft, and opposite ends of the die that are wound around the roll Manufactured by welding each other.

上述這樣的模片能夠使用表面具有奈米級、亞微米級的微小的凹凸圖案的主模(原盤)製作,由於該主模的製作耗費時間與成本,因此難以實現模具本身的大型化。因此,作為從普通大小的主模製作大面積模具的方法,還公知從主模製作多個複製模具,將複製模具彼此相連而形成大面積模具的技術(例如,專利文獻1、2等),專利文獻2中公開了通過使用了將樹脂製的大面積模具捲繞於輥主體而成的輥模的輥對輥方式向膜狀的轉印材料進行轉印的內容。The above-described mold sheet can be produced by using a master mold (original disc) having a minute uneven pattern on the surface of a nanometer or submicron scale, and the production of the master mold is time consuming and costly, so that it is difficult to increase the size of the mold itself. Therefore, as a method of producing a large-area mold from a main mold of a normal size, a technique of producing a plurality of replica molds from a master mold and connecting the replica molds to each other to form a large-area mold is known (for example, Patent Documents 1, 2, etc.) Patent Document 2 discloses that a film-shaped transfer material is transferred by a roll-to-roll method using a roll mold in which a resin-made large-area mold is wound around a roll main body.

近年來,開發了通過在作為LED(Leaser eliminate diode)的基板的藍寶石基板的表面具備微小凹凸形狀而實現LED的亮度提高的技術,作為製作該圖案化藍寶石基板(PSS:Patterned Sapphire Substrate)的方法,也關注壓印法。In recent years, a technique for improving the brightness of an LED by providing a fine uneven shape on the surface of a sapphire substrate as a substrate of an LED (Leaser eliminate diode) has been developed as a method of producing the patterned sapphire substrate (PSS: Patterned Sapphire Substrate). Also concerned about imprinting.

先前技術文獻Prior technical literature

專利文獻 專利文獻1:日本特開2012-118520號公報 專利文獻2:日本特開2014-80017號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2012-118520 (Patent Document 2: JP-A-2014-80017)

對於在上述的PSS的製作中採用輥對輥方式的壓印法的情況,考慮將向規定直徑(例如直徑300mm)的輥的表面捲繞具有微小凹凸的鎳(Ni)電鑄金屬模並利用帶進行固定而成的構件用作輥狀金屬模,通過輥對輥方式的壓印從該輥狀金屬模製作PSS用的樹脂模具。此時,Ni電鑄金屬模的厚度為幾十μm左右~幾百μm左右,由於向輥黏貼金屬模,因此在輥的表面與Ni電鑄金屬模的表面之間產生階梯差。作為Ni電鑄金屬模的原盤,一般使用矽(Si)晶片,該原盤是Ni電鑄金屬模的大小與原盤的大小大致相同的普通圓形部件。In the case of using the roll-to-roll type imprint method in the production of the PSS described above, it is conceivable to use a nickel (Ni) electroformed metal mold having a small unevenness on a surface of a roll having a predetermined diameter (for example, a diameter of 300 mm). The member to be fixed by the belt was used as a roll-shaped metal mold, and a resin mold for PSS was produced from the roll-shaped metal mold by roll-to-roll type embossing. At this time, the thickness of the Ni electroforming mold is about several tens of μm to several hundreds of μm, and since the metal mold is adhered to the roll, a step is generated between the surface of the roll and the surface of the Ni electroforming mold. As the master of the Ni electroformed metal mold, a bismuth (Si) wafer which is a general circular member in which the size of the Ni electroformed metal mold is substantially the same as the size of the original disk is generally used.

在樹脂模具的製作中,在以樹脂模具的凹凸圖案的形成區域更接近Ni電鑄金屬模的凹凸圖案的形成區域、較佳為二者相同的方式製作樹脂模具的情況下,由於能夠更有效地利用Ni電鑄金屬模的凹凸圖案,因此比較經濟。In the production of the resin mold, in the case where the resin mold is produced in such a manner that the formation region of the concave-convex pattern of the resin mold is closer to the formation region of the concave-convex pattern of the Ni electroforming mold, it is more effective. The use of the concave and convex pattern of the Ni electroformed metal mold is economical.

然而,當要更加有效地利用電鑄金屬模製作樹脂模具時,擔心在進行光阻劑塗敷時,塗敷區域擴展至電鑄金屬模的周圍。若光阻劑向電鑄金屬模的周圍擴展,則光阻劑進入電鑄金屬模與輥之間,該階梯部的光阻劑在壓印後也會殘留,成為此後的轉印不合格的原因。例如,在使用UV(紫外線)固化型的光阻劑的情況下,進入到電鑄金屬模與輥之間的光阻劑因UV照射而變硬,像毛刺那樣殘留,在下一次壓印中,產生毛刺作為缺陷而殘留的不良情況。However, when a resin mold is to be produced more efficiently by using an electroformed metal mold, there is a fear that the coating area spreads around the electroforming metal mold when the photoresist is applied. If the photoresist expands around the electroforming mold, the photoresist enters between the electroforming mold and the roller, and the photoresist of the step remains after the imprinting, which becomes unacceptable after the transfer. the reason. For example, in the case of using a UV (ultraviolet) curing type photoresist, the photoresist entering between the electroforming mold and the roller is hardened by UV irradiation, and remains like a burr, in the next imprinting, A defect that remains as a defect in the burr.

本發明是鑒於上述情況而完成的,其目的在於提供一種壓印用模具,其能夠在進行樹脂模具製作時有效地使用電鑄金屬模的凹凸圖案區域製作樹脂模具。The present invention has been made in view of the above circumstances, and an object thereof is to provide a mold for imprinting which can efficiently form a resin mold using a concavo-convex pattern region of an electroforming mold when a resin mold is produced.

用於解決課題的手段Means for solving problems

本發明的壓印用模具捲繞於輥上使用,在表面具有凹凸圖案,其包括:在表面上形成有凹凸圖案的圓盤狀的電鑄金屬模主體;以及與該電鑄金屬模主體一體化且在電鑄金屬模主體的周圍延伸的擴張部。The imprint mold of the present invention is wound around a roll and has a concave-convex pattern on the surface, comprising: a disk-shaped electroformed metal mold main body having a concave-convex pattern formed on the surface; and integral with the electroforming metal mold main body An expansion portion that extends around the body of the electroformed metal mold.

本發明的壓印用模具可以構成為,擴張部包括板狀構件和薄板,所述板狀構件具備中心孔,該中心孔具有與電鑄金屬模主體的外周形狀一致的形狀,所述薄板具有比電鑄金屬模主體的外形大的外形,向板狀構件的中心孔嵌入電鑄金屬模主體,板狀構件與電鑄金屬模主體黏接在薄板上而被一體化。The imprint mold of the present invention may be configured such that the expansion portion includes a plate member and a thin plate, and the plate member has a center hole having a shape conforming to an outer peripheral shape of the electroforming mold main body, the thin plate having The outer shape of the electroformed metal mold main body is larger than the outer shape of the electroformed metal mold main body, and the electroformed metal mold main body is fitted into the center hole of the plate-shaped member. The plate-shaped member and the electroforming metal mold main body are bonded to the thin plate and integrated.

本發明的壓印用模具可以構成為,擴張部由具備鑽柱坑(counter boring)部的帶鑽柱坑部薄板構成,該鑽柱坑部為與電鑄金屬模主體的外周形狀一致的形狀,通過向帶鑽柱坑部薄板的鑽柱坑部嵌入黏接電鑄金屬模主體,由此電鑄金屬模主體與擴張部一體化。The die for imprint of the present invention may be configured such that the expanded portion is formed of a drilled-hole portion having a drill boring portion having a shape conforming to the outer peripheral shape of the electroformed metal mold main body. The electroformed metal mold main body and the expansion portion are integrated by inserting and bonding the electroformed metal mold main body to the drill string pit portion with the drill string hole thin plate.

或者,本發明的壓印用模具可以構成為,擴張部由具備中心孔的板狀構件構成,該中心孔具有與電鑄金屬模主體的外周形狀一致的形狀,向板狀構件的中心孔嵌入電鑄金屬模主體,板狀構件與電鑄金屬模主體在該電鑄金屬模主體的周緣連接而被一體化。Alternatively, the imprint mold of the present invention may be configured such that the expanded portion is formed of a plate-like member having a center hole having a shape conforming to the outer peripheral shape of the electroformed metal mold main body, and is embedded in the center hole of the plate-shaped member. The electroformed metal mold main body is formed by connecting the plate-shaped member and the electroforming mold main body to the periphery of the electroforming mold main body.

需要說明的是,作為本發明的壓印用模具,較佳為擴張部的表面與電鑄金屬模主體的表面的階梯差是10μm以下。In addition, as the mold for imprint of the present invention, it is preferable that the step of the surface of the expanded portion and the surface of the electroforming mold main body is 10 μm or less.

發明效果Effect of the invention

本發明的壓印用模具是捲繞於輥上使用且表面具有凹凸圖案的壓印用模具,由於具備在表面上形成有凹凸圖案的圓盤狀的電鑄金屬模主體的周圍延伸的擴張部,因此,即便是在捲繞於輥上而用作輥狀金屬模時,在形成有凹凸圖案的區域中全部塗敷有光阻劑液的情況下,也能夠使光阻劑液留在模具表面內。由此,能夠抑制光阻劑液朝向模具與輥之間進入,能夠抑制輥對輥方式所導致的壓印時的轉印不良。The imprint mold of the present invention is an imprint mold which is wound around a roll and has a concavo-convex pattern on its surface, and has a flared portion extending around a disk-shaped electroformed metal mold body having a concavo-convex pattern formed on its surface. Therefore, even when it is wound on a roll and used as a roll-shaped metal mold, when all of the areas in which the uneven pattern is formed are coated with the photoresist liquid, the photoresist liquid can be left in the mold. Inside the surface. Thereby, it is possible to prevent the photoresist liquid from entering between the mold and the roller, and it is possible to suppress the transfer failure at the time of imprinting due to the roller-to-roll method.

以下,使用附圖對本發明的實施方式進行說明,但本發明不限於此。需要說明的是,為了容易視覺辨認,附圖中的各構成要素的比例尺等相對於實際情況進行了適當改變。Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In addition, in order to make it easy to visually recognize, the scale of each component in the drawing, etc. are changed suitably with respect to actual conditions.

<第一實施方式的壓印用模具><Mold for Imprint of First Embodiment>

圖1係示意性地示出本發明的第一實施方式的壓印用模具10的俯視圖以及剖視圖。Fig. 1 is a plan view and a cross-sectional view schematically showing an imprint mold 10 according to a first embodiment of the present invention.

壓印用模具10係捲繞於輥上使用的、在表面具有凹凸圖案2的壓印用模具,包括在表面形成有凹凸圖案2的圓盤狀的電鑄金屬模主體1、以及與電鑄金屬模主體1一體化且在電鑄金屬模主體1的周圍延伸的擴張部3。The imprint mold 10 is an imprint mold which is wound on a roll and has a concavo-convex pattern 2 on its surface, and includes a disk-shaped electroformed metal mold main body 1 having a concavo-convex pattern 2 formed on its surface, and an electroforming mold. The expanded portion 3 in which the metal mold main body 1 is integrated and extends around the electroforming metal mold main body 1.

在本實施方式中,擴張部3包括板狀構件4以及薄板5,板狀構件4具備與電鑄金屬模主體1的外周形狀一致的形狀的中心孔,薄板5具有比電鑄金屬模主體1的外形大的外形,向板狀構件4的中心孔嵌入電鑄金屬模主體1,板狀構件4與電鑄金屬模主體1黏接在薄板5而被一體化,由此形成壓印用模具10。In the present embodiment, the expansion portion 3 includes a plate-like member 4 and a thin plate 5, and the plate-like member 4 is provided with a center hole having a shape conforming to the outer peripheral shape of the electroforming mold main body 1, and the thin plate 5 has a specific electroforming mold main body 1. The shape of the outer shape is large, and the electroforming mold main body 1 is fitted into the center hole of the plate member 4, and the plate member 4 is bonded to the electroformed metal mold main body 1 to be integrated with the thin plate 5, thereby forming an imprint mold. 10.

壓印用模具10具有能夠捲繞於輥而使用的程度的撓性,根據其材質的不同,厚度的適當範圍不同,但厚度較佳為20~300μm,更佳為50~200μm。The imprint mold 10 has flexibility to the extent that it can be wound around a roll, and the thickness is appropriately varied depending on the material. However, the thickness is preferably 20 to 300 μm, more preferably 50 to 200 μm.

電鑄金屬模主體1是直徑φ1 的圓盤,具有在形成有凹凸圖案2的區域(以下稱作圖案區域。)的外周具備平坦部2a的表面形狀。需要說明的是,將該外周的平坦部2a的厚度定義為電鑄金屬模主體1的厚度。在本例中,圖案區域大概是直徑φ2 的圓形區域。The electroformed metal mold main body 1 is a disk having a diameter of φ 1 and has a surface shape including a flat portion 2a on the outer circumference of a region in which the uneven pattern 2 is formed (hereinafter referred to as a pattern region). It should be noted that the thickness of the flat portion 2a of the outer circumference is defined as the thickness of the electroformed metal mold body 1. In this example, the pattern area is approximately a circular area of diameter φ 2 .

在本例中,作為凹凸圖案2而具備線寬/間隔(Line and Space)的圖案,但圖案形狀不特別限定,也可以是孔圖案、柱狀圖案等各種圖案。凹凸圖案的凸部高度、凸部間隔等能夠在幾十nm~幾百μm的級別中根據用途而適當設定。In this example, the pattern of the line width and the space is provided as the uneven pattern 2, but the pattern shape is not particularly limited, and various patterns such as a hole pattern and a columnar pattern may be used. The height of the convex portion of the concave-convex pattern, the interval between the convex portions, and the like can be appropriately set depending on the application in the order of several tens of nm to several hundreds of μm.

電鑄金屬模主體1通過對後述的原盤進行電鑄而得到,作為材料,能夠舉出含有鎳、鈷、金、銀、銅以及鐵中的至少一種的金屬,較佳為鎳。其厚度為10~200μm,更佳為50~100μm。The electroforming mold main body 1 is obtained by electroforming a master disk to be described later, and examples of the material include a metal containing at least one of nickel, cobalt, gold, silver, copper, and iron, and nickel is preferable. The thickness thereof is from 10 to 200 μm, more preferably from 50 to 100 μm.

作為擴張部3的一部分的板狀構件4具備具有與電鑄金屬模主體1的外周形狀(在此是直徑φ1 的圓形)一致的形狀的中心孔,且具有比電鑄金屬模主體1大的外形(在此是直徑φ3 的圓形)。在此,板狀構件4的中心孔的形狀“與電鑄金屬模主體1的外周形狀一致”表示是能夠容納電鑄金屬模主體1的形狀,為了容易地進行嵌入,較佳形成為比電鑄金屬模主體1的直徑大0.1~0.2mm左右,另一方面較佳為間隙小,因此間隙不過大為好。需要說明的是,在產生間隙的情況下,較佳為通過填埋劑等進行填埋。The plate-like member 4 which is a part of the expansion portion 3 is provided with a center hole having a shape conforming to the outer circumferential shape of the electroforming mold main body 1 (here, a circular shape having a diameter φ 1 ), and has a specific electroforming mold main body 1 Large shape (here is a circle with a diameter of φ 3 ). Here, the shape of the center hole of the plate-like member 4 "consistent with the outer peripheral shape of the electroforming mold main body 1" means that the shape of the electroforming mold main body 1 can be accommodated, and it is preferably formed into a specific electric quantity for easy embedding. The diameter of the cast metal mold main body 1 is as large as about 0.1 to 0.2 mm, and on the other hand, the gap is preferably small, so the gap is not so good. In addition, in the case where a gap is generated, it is preferably filled with a landfill or the like.

擴張部3的外形(模具10的外形)只要是能夠包圍電鑄金屬模主體1的形狀則不限於圓形,可以為正方形、長方形及其他任意形狀。為了最大限度有效地使用電鑄金屬模主體1的凹凸圖案2,需要為如下這樣的形狀,即,將具有以圖案區域的直徑φ2 作為一邊的正方形的對角線的長度(=√2・φ2 )以上的長度的一邊的正方形内包的形狀。由此,在擴張部3是圓形的情况下,較佳為具有√2・φ2 以上的長度的直徑。更佳為擴張部3的外形是將具有(√2・φ2 +20)mm以上的長度的一邊的正方形内包的形狀。The outer shape of the expanded portion 3 (the outer shape of the mold 10) is not limited to a circular shape as long as it can surround the electroformed metal mold main body 1, and may be a square, a rectangle, or any other shape. In order to use the uneven pattern 2 of the electroforming mold main body 1 to the maximum extent, it is necessary to have a shape having a length of a square having a diameter φ 2 of the pattern region as one side (=√2· φ 2 ) The shape of the inner square of one side of the length. Therefore, when the expansion portion 3 is circular, it is preferable to have a diameter of √2·φ 2 or more. More preferably, the outer shape of the expanded portion 3 is a shape in which a square having one side of a length of (√2·φ 2 + 20) mm or more is enclosed.

對於板狀構件4,較佳為其向輥捲繞時的剛性並不明顯區別於電鑄金屬模主體1,因此,較佳為使用電鑄金屬模主體1的楊氏模數±100GPa左右的材料,尤其較佳為與楊氏模數相等。由此,最佳由與電鑄金屬模主體1相同的材料構成。例如,在電鑄金屬模主體1由鎳構成的情況下,較佳板狀構件4也由鎳構成。作為板狀構件4,由於不繡鋼板等的操作性高且低成本,因此不繡鋼板等也適合。For the plate member 4, it is preferable that the rigidity at the time of winding the roll is not significantly different from that of the electroformed metal mold main body 1. Therefore, it is preferable to use the Young's modulus of the electroformed metal mold main body 1 of about ±100 GPa. The material is particularly preferably equal to the Young's modulus. Therefore, it is preferably composed of the same material as that of the electroforming mold main body 1. For example, in the case where the electroformed metal mold main body 1 is made of nickel, it is preferable that the plate-like member 4 is also made of nickel. As the plate-like member 4, since the workability of a non-embroidered steel plate or the like is high and the cost is low, a stainless steel plate or the like is also suitable.

板狀構件4的厚度t4 為電鑄金屬模主體1的厚度t1 ±20μm以下,較佳為±10μm以下,最佳與電鑄金屬模主體1的厚度相同。只要階梯差在±20μm以下,就能夠在壓印時抑制階梯部處的殘渣的產生。The thickness t 4 of the plate-like member 4 is the thickness t 1 ± 20 μm or less, preferably ± 10 μm or less, of the electroformed metal mold main body 1, and is preferably the same as the thickness of the electroforming mold main body 1. As long as the step is ±20 μm or less, it is possible to suppress the generation of residue at the step portion at the time of imprinting.

若與電鑄金屬模主體1的厚度相同,則由於電鑄金屬模主體1的平坦部2a與板狀構件4的表面處於同一平面,因此壓印時不會在連接部分產生殘渣,能夠最有效地抑制轉印不良。If the thickness of the electroformed metal mold main body 1 is the same, since the flat portion 2a of the electroforming mold main body 1 and the surface of the plate-like member 4 are flush with each other, no residue is generated at the joint portion during the imprinting, which is most effective. Suppressing poor transfer.

在產生階梯差的情況下,特別是為了將利用輥狀金屬模製成的轉印品用作模具,較佳為擴張部的表面比主體的表面高。其原因在於,轉印形成的圖案部比周邊部高,容易使用該模具向其他構件進行轉印。In the case where a step is generated, in particular, in order to use a transfer product made of a roll-shaped metal mold as a mold, it is preferable that the surface of the expanded portion is higher than the surface of the main body. This is because the pattern portion formed by the transfer is higher than the peripheral portion, and it is easy to transfer the other member using the mold.

薄板5只要是具有支承電鑄金屬模主體1與板狀構件4的支承性的構件即可,至少具有比電鑄金屬模主體1大的外形,較佳為比板狀構件4的中心孔的直徑大。更佳為具有與板狀構件4的外形同等以上的外形。The thin plate 5 may have a shape that supports the electroformed metal mold main body 1 and the plate-like member 4, and has at least a larger outer shape than the electroforming mold main body 1, and is preferably larger than the center hole of the plate-shaped member 4. Large diameter. More preferably, it has an outer shape equal to or higher than the outer shape of the plate member 4.

作為薄板5的材質,較佳為膜等片原材料、金屬薄板等,具體地說,作為膜片原材料,能夠列舉出PET(聚對苯二甲酸乙二醇酯)、TAC(三醋酸纖維素)等,作為金屬薄板,能夠列舉出鎳、不繡鋼材等。需要說明的是,也較佳由與電鑄金屬模主體1、板狀構件4相同的材料形成。The material of the sheet 5 is preferably a sheet material such as a film or a metal sheet. Specifically, examples of the sheet material include PET (polyethylene terephthalate) and TAC (triacetate). Examples of the metal thin plate include nickel and non-embroidered steel. It is to be noted that it is also preferably formed of the same material as the electroformed metal mold main body 1 and the plate-shaped member 4.

在為膜片原材料的情況下,厚度t5 較佳為50~250μm,在為金屬薄板的情況下,厚度t5 較佳為20~150μm。In the case of a film material, the thickness t 5 is preferably 50 to 250 μm, and in the case of a metal thin plate, the thickness t 5 is preferably 20 to 150 μm.

在本例中,使用黏接劑8在薄板5上固定電鑄金屬模主體1以及板狀構件4。作為黏接劑8,只要能夠向薄板5黏接電鑄金屬模主體1與板狀構件4即可,例如,能夠使用雙面黏合片、黏接劑等。作為雙面黏合片的例子,能夠列舉出日東電工製LA-50。另外,作為黏接劑的例子,能夠列舉出丙烯酸橡膠系的黏接劑。In this example, the electroformed metal mold main body 1 and the plate-like member 4 are fixed to the thin plate 5 using the adhesive 8. As the adhesive 8, the electroformed metal mold main body 1 and the plate-like member 4 can be bonded to the thin plate 5, and for example, a double-sided adhesive sheet, an adhesive, or the like can be used. An example of the double-sided adhesive sheet is LA-50 manufactured by Nitto Denko Corporation. Moreover, as an example of an adhesive agent, the acryl rubber type adhesive agent is mentioned.

需要說明的是,也可以將電鑄金屬模主體1嵌入到板狀構件4的中心孔,利用焊料連接中心孔與電鑄金屬模主體1外形,在此基礎上利用黏接劑固定在板狀構件4上。It should be noted that the electroformed metal mold main body 1 may be embedded in the center hole of the plate-like member 4, and the center hole and the shape of the electroformed metal mold main body 1 may be connected by solder, and the adhesive is fixed on the plate shape. On the member 4.

對圖1所示的第一實施方式的壓印用模具的製作方法進行說明。A method of manufacturing the imprint mold of the first embodiment shown in Fig. 1 will be described.

圖2示意性地示出第一實施方式的壓印用模具10的製造步驟。Fig. 2 schematically shows the manufacturing steps of the imprint mold 10 of the first embodiment.

如圖2所示那樣,壓印用模具10使用通過向後述的原盤(主模)進行電鑄而製成且從原盤脫模後的剝離電鑄金屬模主體1b、和兩張薄板4a及5製成。As shown in FIG. 2, the imprint mold 10 is a peeling electroforming metal mold main body 1b which is produced by electroforming from a master (main mold) which will be described later, and is released from the master disc, and two sheets 4a and 5 production.

剝離電鑄金屬模主體1b保持從原盤剝離後的狀態,是直徑φ0 的大致圓盤狀,但存在周緣歪斜而變形的情況。因此,將為了將該剝離電鑄金屬模主體1b的周緣規整為圓形而線切割為直徑φ1 的圓形的構件作為電鑄金屬模主體1。The state in which the peeling electroforming metal mold main body 1b is kept from the original disc is a substantially disk shape having a diameter of φ 0 , but the peripheral edge is deformed and deformed. Therefore, a circular member which is cut into a circular shape and has a diameter of φ 1 in order to straighten the periphery of the peeling electroforming mold main body 1b is used as the electroformed metal mold main body 1.

作為薄板4a,準備具有比以電鑄金屬模主體1的形成有凹凸圖案2的圖案區域的直徑φ2 作為一邊的正方形的對角線的長度更大的直徑φ3 的薄板,設置電鑄金屬模主體1的直徑φ1 以上的直徑φ4 的中心孔4b,製成板狀構件4。As the sheet 4a, having a concave-convex pattern prepared diameter φ 2 of the pattern area 2 as the length of the diagonal side of the square of the diameter φ greater than the electroforming mold are formed in the body 1 of the sheet 3, is provided a metal electroforming The center hole 4b of the diameter φ 4 having a diameter φ 1 or more of the mold main body 1 is formed into a plate-like member 4.

此外,作為薄板5,準備具有比電鑄金屬模主體1的直徑φ1 更大的直徑φ5 的薄板。在圖1以及圖2中,薄板5與板狀構件4使用直徑大致相同的構件,但兩者的直徑也可以不相同。Further, as the sheet 5, preparing a thin electroformed mold body than the diameter of the larger diameter φ 1 φ 1 to 5. In FIGS. 1 and 2, the thin plate 5 and the plate-like member 4 are members having substantially the same diameter, but the diameters of the two may be different.

然後,在未設置有中心孔的薄板5上塗敷黏接劑8,將板狀構件4以外形與薄板5的外形一致且將板狀構件4的中心孔4b配置在薄板5的中心的方式與薄板5重疊,進一步向板狀構件4的中心孔4b嵌入電鑄金屬模主體1,使三個構件一體化,得到由電鑄金屬模主體1以及包括板狀構件4和薄板5的擴張部3構成的壓印用模具10。Then, the adhesive 8 is applied to the thin plate 5 not provided with the center hole, and the outer shape of the plate-like member 4 is aligned with the outer shape of the thin plate 5, and the center hole 4b of the plate-like member 4 is disposed at the center of the thin plate 5. The thin plates 5 are overlapped, and the electroformed metal mold main body 1 is further fitted into the center hole 4b of the plate-like member 4, and the three members are integrated to obtain the electroformed metal mold main body 1 and the expanded portion 3 including the plate-like member 4 and the thin plate 5. The stamping die 10 is constructed.

模具10的外形的大小、圖案區域的大小只要根據成為壓印物件的凹凸圖案加工品的大小適當地確定即可。例如,作為用於製作6英寸(150mm)直徑的PSS的模具,將圖案區域的直徑φ2 設為170mm,將電鑄金屬模主體1的直徑φ1 設為180mm,將板狀構件4的直徑φ3 設為300mm,將薄板5的直徑φ5 設為300mm。在電鑄金屬模主體1、板狀構件4由鎳形成的情況下,其厚度設為例如70μm。The size of the outer shape of the mold 10 and the size of the pattern region may be appropriately determined depending on the size of the processed product of the concave-convex pattern to be an imprinted article. For example, as a mold for producing a 6 inch (150 mm) diameter PSS, the diameter φ 2 of the pattern region is set to 170 mm, and the diameter φ 1 of the electroformed metal mold main body 1 is set to 180 mm, and the diameter of the plate member 4 is set. φ 3 is set to 300 mm, and the diameter φ 5 of the thin plate 5 is set to 300 mm. In the case where the electroforming metal mold main body 1 and the plate-like member 4 are formed of nickel, the thickness thereof is, for example, 70 μm.

接下來,對使用了本實施方式的壓印用模具10的壓印法進行說明。Next, an imprint method using the imprint mold 10 of the present embodiment will be described.

圖3是示出在輥11上捲繞壓印用模具10而成的輥狀金屬模12的立體圖。如圖3所示那樣,輥狀金屬模12通過在輥11上捲繞並固定一個或兩個壓印用模具10而構成。模具10只要例如在其端部黏貼黏接帶並固定在輥11上即可。FIG. 3 is a perspective view showing the roll-shaped mold 12 in which the imprint mold 10 is wound around the roll 11. As shown in FIG. 3, the roll-shaped metal mold 12 is constituted by winding and fixing one or two imprint molds 10 on the roll 11. The mold 10 is only required to adhere to the adhesive tape at its end portion and to be fixed to the roller 11.

圖4是示出用於實施基於輥對輥方式的壓印法的裝置的局部的圖。Fig. 4 is a view showing a part of an apparatus for carrying out an imprint method based on a roll-to-roll method.

在輥狀金屬模12的上方配置有用於將光阻劑液15a向模具10塗敷的模具式塗布機16,在相對於輥狀金屬模12與模具式塗布機16對置的位置配置有用於使光阻劑液15a固化的紫外線照射光源17。並且,輥狀金屬模12的兩旁配置有搬運輥13a以及搬運輥13b,該搬運輥13a用於搬運從未圖示的放出裝置放出的膜14並使其壓接於輥狀金屬模12,該搬運輥13b將膜14從輥狀金屬模12剝離並朝向未圖示的捲繞裝置搬運。A die coater 16 for applying the photoresist liquid 15a to the mold 10 is disposed above the roll die 12, and is disposed at a position opposed to the die coater 16 with respect to the roll die 12 The ultraviolet light that cures the photoresist liquid 15a illuminates the light source 17. Further, a conveyance roller 13a and a conveyance roller 13b for conveying the film 14 discharged from a discharge device (not shown) and being pressed against the roll-shaped mold 12 are disposed on both sides of the roll-shaped mold 12 The conveyance roller 13b peels the film 14 from the roll-shaped metal mold 12, and conveys it to the winding apparatus not shown.

需要說明的是,在此,為了使用因紫外線的照射而固化的光固化型的光阻劑而配備紫外線照射光源17,但在使用熱固化型的光阻劑的情況下,也可以代替紫外線照射光源而配備加熱器。Here, the ultraviolet light source 17 is provided in order to use a photocurable photoresist which is cured by irradiation of ultraviolet rays, but in the case of using a thermosetting photoresist, it may be replaced by ultraviolet radiation. The light source is equipped with a heater.

輥狀金屬模12沿箭頭方向旋轉,通過模具式塗布機16向模具10的塗敷區域塗敷光阻劑液15a。基於模具式塗布機16的塗敷寬度是比模具10的圖案區域的最大直徑(直徑φ2 )向外側延伸5mm以上的長度,較佳為向外側延伸10mm以上的長度。圖5係示意性地示出模具10上的光阻劑塗敷區域的圖。在圖5中,虛線所示的斜線區域是塗敷寬度L的光阻劑液15a的塗敷區域,在本例中,光阻劑塗敷區域是具有比電鑄金屬模主體1的直徑φ1 更長的一邊L的大致正方形的區域。The roll mold 12 is rotated in the direction of the arrow, and the photoresist liquid 15a is applied to the application region of the mold 10 by the die coater 16. The coating width of the die coater 16 is a length that extends outward by 5 mm or more from the maximum diameter (diameter φ 2 ) of the pattern region of the mold 10, and preferably extends to the outside by a length of 10 mm or more. FIG. 5 is a view schematically showing a photoresist application region on the mold 10. In Fig. 5, a hatched area indicated by a broken line is a coating area of a photoresist liquid 15a coated with a width L. In this example, the photoresist coating area has a diameter φ larger than that of the electroformed metal mold body 1. 1 The area of the square of the longer side of L.

通過使塗敷區域比圖案區域大,能夠進行有效地使用圖案區域的整個區域進行的壓印。此時,由於以與電鑄金屬模主體1的直徑φ1 相同的塗敷寬度塗敷光阻劑液,因此在不存在擴張部3的情況下,光阻劑液15a在輥11上擴展,但由於擴張部3的存在,能夠將光阻劑液15a的擴展限制在模具10上。By making the coating area larger than the pattern area, it is possible to perform imprinting using the entire area of the pattern area efficiently. At this time, since the photoresist liquid is applied at the same coating width as the diameter φ 1 of the electroforming mold main body 1, the photoresist liquid 15a spreads on the roller 11 in the absence of the expansion portion 3. However, due to the presence of the expansion portion 3, the expansion of the photoresist liquid 15a can be restricted to the mold 10.

由此,能夠抑制因光阻劑液15a在輥11上擴展而產生的光阻劑液15a進入輥11與模具10的間隙、或壓印後光阻劑殘留在輥11與模具10的階梯部等問題的產生,結果是,能夠抑制輥對輥方式中的壓印時的轉印不良。Thereby, it is possible to suppress the photoresist liquid 15a generated by the expansion of the photoresist liquid 15a on the roller 11 from entering the gap between the roller 11 and the mold 10, or the photoresist remaining in the step portion of the roller 11 and the mold 10 after the imprinting. As a result of the problem, it is possible to suppress the transfer failure at the time of imprinting in the roll-to-roll method.

伴隨著輥狀金屬模12的旋轉,塗敷有光阻劑液15a的模具10隔著光阻劑液15a壓接於通過搬運輥13a搬運的膜14,進而,被搬運到基於紫外線照射光源17的紫外線照射區域並受到紫外線照射之後,光阻劑液15a固化,形成轉印有模具10的凹凸圖案2的樹脂層15。此時,樹脂層15固定於膜14,在搬運輥13b中樹脂層15維持固定於膜14的狀態,從輥狀金屬模12被剝離並與膜14一起向捲繞裝置搬運。The mold 10 coated with the photoresist liquid 15a is pressed against the film 14 conveyed by the conveyance roller 13a via the photoresist liquid 15a, and is further conveyed to the ultraviolet light-emitting source 17 by the rotation of the roll-shaped metal mold 12. After the ultraviolet ray irradiation region is irradiated with ultraviolet rays, the photoresist liquid 15a is solidified, and the resin layer 15 on which the uneven pattern 2 of the mold 10 is transferred is formed. At this time, the resin layer 15 is fixed to the film 14, and the resin layer 15 is held and fixed to the film 14 in the conveyance roller 13b, and is peeled off from the roll-shaped metal mold 12, and is conveyed to the winding device together with the film 14.

通過反覆進行以上操作,在膜14上形成多個具有在模具10的表面形成的凹凸圖案的樹脂層15。然後,通過切出設置有具有圓形的凹凸圖案的樹脂層15的區域,能夠得到在膜14上層疊具有凹凸圖案的樹脂層15而成的膜狀模具19(參照圖7)。By repeating the above operations, a plurality of resin layers 15 having concavo-convex patterns formed on the surface of the mold 10 are formed on the film 14. Then, by cutting out a region in which the resin layer 15 having a circular uneven pattern is cut out, a film-shaped mold 19 in which a resin layer 15 having a concave-convex pattern is laminated on the film 14 can be obtained (see FIG. 7).

在此,參照圖6以及圖7簡單說明從原盤到電鑄金屬模的製成、凹凸圖案加工品的製成的步驟。圖6是示意性地示出從Si原盤製成輥狀金屬模為止的步驟的圖,圖7是示意性地示出使用膜狀的模具製成凹凸圖案加工品為止的步驟的圖。Here, the steps from the master to the electroforming metal mold and the production of the concave-convex pattern processed product will be briefly described with reference to FIGS. 6 and 7. FIG. 6 is a view schematically showing a procedure from the formation of a roll-shaped metal mold from a Si master, and FIG. 7 is a view schematically showing a procedure of forming a textured product by using a film-shaped mold.

如圖6所示那樣,首先,準備表面具有凹凸圖案的Si原盤21。Si原盤21的尺寸一般為直徑150mm(6英寸)、200mm(8英寸)左右。As shown in Fig. 6, first, an Si master 21 having a concave-convex pattern on its surface is prepared. The size of the Si master 21 is generally about 150 mm (6 inches) in diameter and about 200 mm (8 inches) in diameter.

對該Si原盤的凹凸圖案表面實施電鑄。特別是較佳如下方法:首先通過無電鍍沈積(electroless deposition)形成幾μm左右的膜厚較薄的導電層(金屬膜),之後通過電鍍(electroplating)(電鑄)使幾十μm~幾百μm左右的厚度的電鑄層1a成膜。形成電鑄層1a的材料較佳為鎳,但不限於鎳。The surface of the concave-convex pattern of the Si original disk was subjected to electroforming. In particular, it is preferable to form a conductive layer (metal film) having a thin film thickness of about several μm by electroless deposition, and then to tens several μm to several hundreds by electroplating (electroforming). The electroformed layer 1a having a thickness of about μm is formed into a film. The material forming the electroformed layer 1a is preferably nickel, but is not limited to nickel.

然後,將電鑄層1a從Si原盤21剝離而得到電鑄金屬模主體1。在電鑄金屬模主體1上設置擴張部3並製作壓印用模具10的步驟如參照圖2說明那樣。然後,將壓印用模具10捲繞於輥11而形成輥狀金屬模12。Then, the electroformed layer 1a is peeled off from the Si master 21 to obtain an electroformed metal mold body 1. The step of providing the expansion portion 3 on the electroforming mold main body 1 and producing the imprint mold 10 is as described with reference to Fig. 2 . Then, the imprint mold 10 is wound around the roll 11 to form a roll-shaped mold 12.

需要說明的是,在從原盤獲得電鑄金屬模主體1時,只要擴大包圍原盤的圖案區域的區域的面積,利用電鑄製作具有與具備擴張部的情況相同面積的電鑄金屬模主體1,就不需要設置本發明這樣的擴張部。然而,在想要維持相同的圖案區域的情況下,需要增大原盤本身的大小,出現增大該原盤所引發的成本增高、擴大進行電鑄時的電鑄槽所引發的成本增高。根據本發明的壓印用模具的製作方法,能夠在不使原盤成本上升的情況下使用現有的電鑄槽以更低的價格製作與輥狀金屬模相適的模具。In the case where the electroformed metal mold main body 1 is obtained from the original disk, the electroformed metal mold main body 1 having the same area as that of the case where the expanded portion is provided is formed by electroforming as long as the area of the region surrounding the pattern region of the original disk is enlarged. It is not necessary to provide an expansion portion such as the present invention. However, in the case where it is desired to maintain the same pattern area, it is necessary to increase the size of the original disk itself, increase the cost caused by the increase of the original disk, and increase the cost caused by the electroforming tank at the time of electroforming. According to the method for producing an imprint mold of the present invention, it is possible to produce a mold suitable for a roll-shaped metal mold at a lower price without using an existing electroforming groove without increasing the cost of the original disk.

製作從輥狀金屬模12向膜14上層疊具有凹凸圖案的樹脂層15而成的膜狀模具19的步驟如上述參照圖4說明那樣。The step of producing the film-shaped mold 19 in which the resin layer 15 having the uneven pattern is laminated from the roll-shaped metal mold 12 to the film 14 is as described above with reference to FIG. 4 .

進而,參照圖7,作為使用膜狀模具19加工的凹凸圖案加工品的一例子,說明製作用作LED基板的PSS24的步驟。Further, a step of fabricating the PSS 24 used as the LED substrate will be described as an example of the processed product of the uneven pattern processed by the film-shaped mold 19 with reference to FIG.

首先,準備藍寶石基板(藍寶石晶片)24A。作為藍寶石基板,一般為2~6英寸左右的基板,為與模具的圖案區域尺寸同等以下的大小且盡可能大的基板能夠有效運用模具的圖案區域,因此較佳。First, a sapphire substrate (sapphire wafer) 24A is prepared. The sapphire substrate is generally a substrate having a size of about 2 to 6 inches, and is preferably equal to or smaller than the size of the pattern region of the mold, and the substrate having the largest possible size can effectively use the pattern region of the mold.

在藍寶石基板24A上例如塗敷紫外線固化型的光阻劑液25A,以向該光阻劑液25A上轉印凹凸圖案的方式壓接膜狀模具19,照射紫外線使光阻劑液25A固化,由此形成具有轉印了膜狀模具19的凹凸圖案而成的凹凸圖案的樹脂層25。將膜狀模具19從樹脂層25剝離,以樹脂層25作為掩膜而進行反應性離子蝕刻(RIE:Reactive Ion Etching),由此在藍寶石基板24A的表面形成與樹脂層25的凹凸圖案匹配的凹凸圖案,從而得到PSS24。The sapphire substrate 24A is coated with, for example, an ultraviolet curable photoresist liquid 25A, and the film-shaped mold 19 is pressure-bonded to transfer the concave-convex pattern onto the photoresist liquid 25A, and the ultraviolet ray is applied to cure the photoresist liquid 25A. Thus, the resin layer 25 having the uneven pattern in which the uneven pattern of the film-shaped mold 19 is transferred is formed. The film-shaped mold 19 is peeled off from the resin layer 25, and reactive ion etching (RIE) is performed using the resin layer 25 as a mask, thereby forming a pattern matching the concave-convex pattern of the resin layer 25 on the surface of the sapphire substrate 24A. Concave-convex pattern to obtain PSS24.

如上,通過使用壓印用模具10,能夠預防在基於輥對輥方式的壓印時,光阻劑液15a向模具10與輥11之間進入的情況,能夠抑制反覆進行壓印時的轉印不良。As described above, by using the imprint mold 10, it is possible to prevent the photoresist liquid 15a from entering between the mold 10 and the roller 11 during the imprinting by the roll-to-roll method, and it is possible to suppress the transfer when the imprinting is repeated. bad.

<第二實施方式的壓印用模具><Mould for Imprinting of Second Embodiment>

圖8是示意性地示出本發明的第二實施方式的壓印用模具30的製造步驟的圖。FIG. 8 is a view schematically showing a manufacturing procedure of the imprint mold 30 according to the second embodiment of the present invention.

本實施方式的壓印用模具30包括:在表面上形成有凹凸圖案2的圓盤狀的電鑄金屬模主體1;以及與電鑄金屬模主體1一體化且在電鑄金屬模主體1的周圍延伸的擴張部33。The imprint mold 30 of the present embodiment includes a disk-shaped electroformed metal mold main body 1 having a concavo-convex pattern 2 formed on its surface, and an electroformed metal mold main body 1 integrated with the electroforming mold main body 1. An expansion portion 33 extending around.

在本實施方式中,擴張部33由具備與電鑄金屬模主體1的外周形狀一致的形狀的鑽柱坑部35的帶鑽柱坑部薄板構成,通過向帶鑽柱坑部薄板的鑽柱坑部35嵌入黏接電鑄金屬模主體1而使得電鑄金屬模主體1與擴張部33一體化,由此形成壓印用模具30。In the present embodiment, the expansion portion 33 is formed of a drill string hole thin plate having a drill string hole portion 35 having a shape conforming to the outer circumferential shape of the electroforming mold main body 1, and is passed through a drill string with a drill string hole plate. The pit portion 35 is fitted into the electroformed metal mold main body 1 so that the electroforming mold main body 1 and the expanded portion 33 are integrated, whereby the imprint mold 30 is formed.

壓印用模具30具有能夠捲繞於輥而使用的程度的撓性,根據其材質不同,厚度的適當範圍不同,但壓印用模具30的厚度較佳為20~300μm,更佳為50~200μm。The embossing mold 30 has flexibility to be wound around the roller, and the appropriate range of the thickness varies depending on the material. However, the thickness of the embossing die 30 is preferably 20 to 300 μm, more preferably 50 Å. 200 μm.

作為電鑄金屬模主體1,能夠使用與第一實施方式的壓印用模具10相同的構件。As the electroforming mold main body 1, the same member as the imprint mold 10 of the first embodiment can be used.

擴張部33是厚度t33 的薄板,具備具有與電鑄金屬模主體1的外周形狀(在此是直徑φ1 的圓形)一致的形狀的深度t35 的鑽柱坑部35,且具有比電鑄金屬模主體1大的外形(在此是直徑φ6 的圓形)。在此,鑽柱坑部35指的是容納電鑄金屬模主體1的形狀的底面平坦的凹部,鑽柱坑部35的形狀“與電鑄金屬模主體1的外周形狀一致”表示是能夠容納電鑄金屬模主體1的形狀,但為了容易地進行嵌入而較佳形成為比電鑄金屬模主體1的直徑φ1 大0.1~0.2mm左右,另一方面,由於較佳為間隙較小,因此間隙不過大為好。需要說明的是,在產生間隙的情况下,較佳為利用填埋劑等進行填埋。The expanded portion 33 is a thin plate having a thickness t 33 and is provided with a drill string hole portion 35 having a depth t 35 that matches the outer peripheral shape of the electroformed metal mold main body 1 (here, a circular shape having a diameter of φ 1 ), and has a ratio The large shape of the electroformed metal mold body 1 (here, a circle having a diameter of φ 6 ). Here, the drill string hole portion 35 refers to a flat bottom portion that accommodates the shape of the electroforming mold main body 1. The shape of the drill string hole portion 35 "is identical to the outer peripheral shape of the electroforming mold main body 1" means that it can accommodate The shape of the electroformed metal mold main body 1 is preferably formed to be about 0.1 to 0.2 mm larger than the diameter φ 1 of the electroformed metal mold main body 1 in order to facilitate the embedding. On the other hand, since the gap is preferably small, So the gap is not great. In addition, in the case where a gap is generated, it is preferable to carry out landfill by using a landfill or the like.

擴張部33的外形(模具30的外形)只要是包圍電鑄金屬模主體1的形狀則不限於圓形,能夠設為正方形、長方形及其他任意形狀。為了最大限度有效地使用电铸金属模主體1的凹凸圖案2,需要為如下這樣的形狀,即,將具有以圖案區域的直徑φ2 作為一邊的正方形的對角線的長度(=√2・φ2 )以上的長度的一邊的正方形内包的形狀。由此,在擴張部33是圓形的情况下,較佳為具有√2・φ2 以上的長度的直徑。更佳為擴張部33的外形是將具有(√2・φ2 +20)mm以上的長度的一邊的正方形内包的形狀。The outer shape of the expanded portion 33 (the outer shape of the mold 30) is not limited to a circular shape as long as it surrounds the shape of the electroforming mold main body 1, and can be square, rectangular, or any other shape. In order to maximize efficient use of electroforming mold a concavo-convex pattern of the body 2, as required for such a shape, i.e., having a length to diameter φ 2 as the pattern area side of the square of the diagonal (= √2 · φ 2 ) The shape of the inner square of one side of the length. Therefore, when the expansion portion 33 is circular, it is preferable to have a diameter of √2·φ 2 or more. More preferably, the outer shape of the expanded portion 33 is a shape in which a square having one side of a length of (√2·φ 2 + 20) mm or more is enclosed.

由帶鑽柱坑部薄板構成的擴張部33較佳為,向輥11捲繞時的剛性並不明顯區別於電鑄金屬模主體1,因此,較佳為使用電鑄金屬模主體1的楊氏模數±100GPa左右的材料,尤其較佳為與楊氏模數相同。因此,最佳為利用與電鑄金屬模主體1相同的材料構成的構件。例如,在電鑄金屬模主體1由鎳構成的情況下,較佳為擴張部33也由鎳構成。It is preferable that the expansion portion 33 composed of the thin plate having the drill string is not significantly different from the electroformed metal mold main body 1 when wound up to the roller 11, and therefore, it is preferable to use the electroformed metal mold body 1 A material having a modulus of about ±100 GPa is particularly preferably the same as the Young's modulus. Therefore, it is preferable to use a member made of the same material as the electroformed metal mold main body 1. For example, when the electroformed metal mold main body 1 is made of nickel, it is preferable that the expanded portion 33 is also made of nickel.

擴張部33的鑽柱坑部35的深度t35 在電鑄金屬模主體1的厚度t1 ±20μm以下,較佳為±10μm以下,最佳的是與電鑄金屬模主體1的厚度t1 相同。通過將鑽柱坑部35的深度t35 設為電鑄金屬模主體1的厚度t1 ±20μm以下,能夠將電鑄金屬模主體1與擴張部33表面的階梯差抑制在±20μm以下,能夠抑制壓印時在階梯部產生殘渣的情況。只要電鑄金屬模主體1的厚度t1 與鑽柱坑部35的深度t35大致相同,由於電鑄金屬模主體1的平坦部2a與擴張部33的表面處於同一平面,因此壓印時不會在連接部分產生殘渣,能夠最有效地抑制轉印不良。The depth t 35 of the drill string hole portion 35 of the expanded portion 33 is not less than the thickness t 1 ± 20 μm of the electroformed metal mold main body 1, preferably ± 10 μm or less, and most preferably the thickness t 1 of the electroformed metal mold main body 1. the same. By setting the depth t 35 of the drill string hole portion 35 to the thickness t 1 ± 20 μm or less of the electroforming mold main body 1, the step of the surface of the electroforming mold main body 1 and the expanded portion 33 can be suppressed to ±20 μm or less. It suppresses the occurrence of residue in the step portion at the time of imprinting. As long as the thickness t 1 of the electroformed metal mold body 1 is substantially the same as the depth t35 of the drill string hole portion 35, since the flat portion 2a of the electroformed metal mold main body 1 and the surface of the expanded portion 33 are in the same plane, the stamping does not occur. Residue is generated in the joint portion, and transfer failure can be most effectively suppressed.

在出現階梯差的情況下,尤其是,為了將利用輥狀金屬模製作的轉印品用作模具,較佳為擴張部的表面比主體的表面高。其原因在於,轉印形成的圖案部比周邊部高,容易使用該模具向其他構件進行轉印。In the case where a step is present, in particular, in order to use a transfer product produced by a roll-shaped metal mold as a mold, it is preferable that the surface of the expanded portion is higher than the surface of the main body. This is because the pattern portion formed by the transfer is higher than the peripheral portion, and it is easy to transfer the other member using the mold.

電鑄金屬模主體1使用黏接劑38固定於帶鑽柱坑部薄板的鑽柱坑部35。作為黏接劑38,只要能夠向鑽柱坑部35黏接電鑄金屬模主體1即可,例如,能夠使用丙烯酸樹脂系的黏接劑等。或者,也可以在鑽柱坑部35的底面黏貼黏性膠帶來黏貼電鑄金屬模主體1。The electroformed metal mold main body 1 is fixed to the drill string hole portion 35 with the drill string hole sheet using the adhesive 38. As the adhesive 38, the electroformed metal mold main body 1 can be bonded to the drill string hole portion 35, and for example, an acrylic resin-based adhesive or the like can be used. Alternatively, the electroformed metal mold main body 1 may be adhered by adhering an adhesive tape to the bottom surface of the drill string hole portion 35.

需要說明的是,在電鑄金屬模主體1與擴張部33的表面之間產生間隙的情況下,較佳將黏接劑38等用作填埋劑,使它們處於同一平面。In the case where a gap is formed between the surface of the electroformed metal mold main body 1 and the expanded portion 33, it is preferable to use the adhesive 38 or the like as a landfill so that they are on the same plane.

對本實施方式的壓印用模具30的製作方法進行說明。如圖8所示那樣,壓印用模具30使用通過向已敘述的原盤(主模)進行電鑄而製成且從原盤脫模後的剝離電鑄金屬模主體1b、和一張薄板33a製作。A method of manufacturing the imprint mold 30 of the present embodiment will be described. As shown in Fig. 8, the imprint mold 30 is produced by using a strip electroformed metal mold main body 1b which is produced by electroforming the original disc (main mold) and released from the original disc, and a thin plate 33a. .

剝離電鑄金屬模主體1b保持從原盤剝離的狀態,將為了將該剝離電鑄金屬模主體1b的周緣規整為圓形而線切割為直徑φ1 的圓形的構件用作電鑄金屬模主體1。The peeling electroforming metal mold main body 1b is kept in a state of being peeled off from the original disk, and a circular member cut into a circular diameter φ 1 for the circumference of the peeling electroforming metal mold main body 1b is used as an electroforming metal mold main body. 1.

作為薄板33a,準備具有直徑φ6 的薄板,該直徑φ6 比以電鑄金屬模主體1的形成有凹凸圖案2的圖案區域的直徑φ2 作為一邊的正方形的對角線的長度更大,設置電鑄金屬模主體1的直徑φ1 以上的直徑φ7 的圓形的鑽柱坑部35,製作由帶鑽柱坑部薄板構成的擴張部33。As the sheet 33a, preparing a sheet of a diameter φ 6, φ 6 diameter ratio of the electroforming die main body 1 is formed with a pattern of concave-convex pattern area diameter [Phi] 2 2, a greater length of the diagonal of the square side, A circular drill string hole portion 35 having a diameter φ 7 or more of a diameter φ 1 or more of the electroformed metal mold main body 1 is provided, and an expanded portion 33 composed of a thin plate having a drill string is formed.

向擴張部33的鑽柱坑部35的底面塗敷黏接劑38,向鑽柱坑部35嵌入固定電鑄金屬模主體1,由此獲得由電鑄金屬模主體1與擴張部33構成的壓印用模具30。The adhesive agent 38 is applied to the bottom surface of the drill string hole portion 35 of the expansion portion 33, and the electroforming mold main body 1 is fitted and fixed to the drill string hole portion 35, thereby obtaining the electroforming mold main body 1 and the expansion portion 33. Imprint mold 30.

對於本實施方式的模具30,其外形大小、圖案區域的大小只要根據成為壓印物件的凹凸圖案加工品的大小而適當地確定即可。例如,作為用於製作6英寸(150mm)直徑的PSS的模具30,將圖案區域的直徑φ2 設為170mm,將電鑄金屬模主體1的直徑φ1 設為180mm,將擴張部33的直徑φ6 設為300mm。在電鑄金屬模主體1以及擴張部33均由鎳形成的情況下,例如,將電鑄金屬模主體1的厚度t1 設為50μm,將擴張部33的厚度t33 設為150μm,將鑽柱坑部35的深度t35 設為100μm。In the mold 30 of the present embodiment, the outer shape and the size of the pattern region may be appropriately determined depending on the size of the textured product to be the embossed article. For example, as the mold 30 for producing a 6 inch (150 mm) diameter PSS, the diameter φ 2 of the pattern region is set to 170 mm, the diameter φ 1 of the electroformed metal mold body 1 is set to 180 mm, and the diameter of the expanded portion 33 is set. φ 6 is set to 300mm. When the electroforming mold main body 1 and the expansion portion 33 are both formed of nickel, for example, the thickness t 1 of the electroforming mold main body 1 is set to 50 μm, and the thickness t 33 of the expanded portion 33 is set to 150 μm. The depth t 35 of the pillar portion 35 is set to 100 μm.

這樣的第二實施方式的壓印用模具30與第一實施方式的壓印用模具10相同地用於基於輥對輥方式的壓印法,能夠防止在進行基於輥對輥方式的壓印時,光阻劑液15a進入模具30與輥11之間,能夠抑制反覆進行壓印時的轉印不良。The imprint mold 30 of the second embodiment is used for the imprint method based on the roll-to-roll method in the same manner as the imprint mold 10 of the first embodiment, and it is possible to prevent the imprinting by the roll-to-roll method. The photoresist liquid 15a enters between the mold 30 and the roller 11, and it is possible to suppress transfer failure when the imprint is repeatedly performed.

<第三實施方式的壓印用模具><Mold for Imprint of Third Embodiment>

圖9是示意性地示出本發明的第三實施方式的壓印用模具40的製造步驟的圖。FIG. 9 is a view schematically showing a manufacturing procedure of the imprint mold 40 according to the third embodiment of the present invention.

本實施方式的壓印用模具40包括:在表面上形成有凹凸圖案2的圓盤狀的電鑄金屬模主體1;以及與電鑄金屬模主體1一體化且在電鑄金屬模主體1的周圍延伸的擴張部43。The imprint mold 40 of the present embodiment includes a disk-shaped electroformed metal mold main body 1 having a concavo-convex pattern 2 formed on its surface, and an electroformed metal mold main body 1 integrated with the electroforming mold main body 1. An expansion portion 43 extending around.

在本實施方式中,擴張部43由具備與電鑄金屬模主體1的外周形狀一致的形狀的中心孔45的板狀構件構成,向板狀構件(擴張部43)的中心孔45嵌入電鑄金屬模主體1,在電鑄金屬模主體1的周緣連接板狀構件而一體化,由此形成壓印用模具40。In the present embodiment, the expansion portion 43 is formed of a plate-like member having a center hole 45 having a shape conforming to the outer circumferential shape of the electroforming mold main body 1, and is embedded in the center hole 45 of the plate-shaped member (expansion portion 43). The metal mold main body 1 is connected to the peripheral edge of the electroforming mold main body 1 by connecting the plate-like members, thereby forming the imprint mold 40.

壓印用模具40基於能夠捲繞於輥而使用的程度的撓性,根據其材質的不同,厚度的適當範圍不同,但壓印用模具40的厚度較佳為20~300μm,更佳為50~200μm。The embossing mold 40 has a different degree of thickness depending on the material, and the thickness of the embossing mold 40 is preferably 20 to 300 μm, more preferably 50, depending on the material. ~200μm.

作為電鑄金屬模主體1,能夠使用與第一實施方式的壓印用模具10相同的構件。As the electroforming mold main body 1, the same member as the imprint mold 10 of the first embodiment can be used.

擴張部43由具備具有與電鑄金屬模主體1的外周形狀(在此是直徑φ1 的圓形)一致的形狀的中心孔45的板狀構件構成,且具有比電鑄金屬模主體1大的外形(在此是具有長度a的邊的正方形)。在此,擴張部43的中心孔45的形狀“與電鑄金屬模主體1的外周形狀一致”表示是能夠容納電鑄金屬模主體1的形狀,為了容易地進行嵌入而較佳形成為比電鑄金屬模主體1的直徑φ1 大0.1~0.2mm左右,另一方面,由於較佳為間隙小,因此間隙不過大為好。The expansion portion 43 is formed of a plate-like member having a center hole 45 having a shape that matches the outer circumferential shape of the electroforming mold main body 1 (here, a circle having a diameter of φ 1 ), and has a larger size than the electroforming mold main body 1 . The shape (here is a square with the side of length a). Here, the shape of the center hole 45 of the expanded portion 43 "corresponding to the outer peripheral shape of the electroforming mold main body 1" means that the shape of the electroforming mold main body 1 can be accommodated, and it is preferably formed into a specific electric quantity for easy embedding. The diameter φ 1 of the cast metal mold main body 1 is as large as about 0.1 to 0.2 mm. On the other hand, since the gap is preferably small, the gap is not particularly good.

擴張部43的外形(模具40的外形)只要是包圍電鑄金屬模主體1的形狀則不限於正方形,能夠設為圓形、長方形及其他任意形狀。為了最大限度有效地使用电铸金属模主體1的凹凸圖案2,在如本實施方式那樣是正方形的情况下,其一邊的長度a需要是以圖案區域的直徑φ2 作為一邊的正方形的對角線的長度(=√2・φ2 )以上的長度。因此,在將擴張部43的外形設為圓形的情况下,較佳具有√2・φ2 以上的長度的直徑。擴張部43的外形更較佳為將具有直徑(√2・φ2 +20)mm以上的長度的一邊的正方形内包的形狀。The outer shape of the expanded portion 43 (the outer shape of the mold 40) is not limited to a square as long as it surrounds the shape of the electroformed metal mold main body 1, and can be circular, rectangular, or any other shape. In order to use the uneven pattern 2 of the electroforming mold main body 1 to the maximum extent, in the case of a square as in the present embodiment, the length a of one side needs to be a diagonal of a square having the diameter φ 2 of the pattern area as one side. The length of the line (=√2·φ 2 ) or longer. Thus, in the case where the outer shape of the expansion portion 43 is set circular, preferably having a diameter of a length √2 · φ 2 or more. The outer shape of the expanded portion 43 is more preferably a shape in which a square having one side having a diameter (√2·φ 2 + 20) mm or more is enclosed.

由板狀構件構成的擴張部43較佳為,向輥捲繞時的剛性不明顯區別於電鑄金屬模主體1,因此,較佳使用電鑄金屬模主體1的楊氏模數±100GPa左右的材料,尤其較佳為與楊氏模數相等。因此,最佳為利用與電鑄金屬模主體1相同的材料構成的構件。例如,在電鑄金屬模主體1由鎳構成的情況下,較佳為擴張部43也由鎳構成。The expansion portion 43 composed of the plate member preferably has a rigidity that is not significantly different from that of the electroformed metal mold main body 1 when wound up to the roll. Therefore, it is preferable to use the Young's modulus of the electroformed metal mold main body 1 to be about ±100 GPa. The material is particularly preferably equal to the Young's modulus. Therefore, it is preferable to use a member made of the same material as the electroformed metal mold main body 1. For example, when the electroformed metal mold main body 1 is made of nickel, it is preferable that the expanded portion 43 is also made of nickel.

擴張部43的厚度t43 在電鑄金屬模主體1的厚度t1 ±20μm以下,較佳為±10μm以下,最佳的是與電鑄金屬模主體1的厚度t1 相同。只要階梯差在±20μm以下,就能夠抑制壓印時在階梯部產生殘渣的情況。若與電鑄金屬模主體1的厚度t1 相同,則電鑄金屬模主體1的平坦部2a與擴張部43的表面處於同一平面,因此,壓印時不會在連接部分產生殘渣,能夠最有效地抑制轉印不良。The thickness t 43 of the expanded portion 43 is not less than the thickness t 1 ± 20 μm of the electroformed metal mold main body 1, preferably ± 10 μm or less, and is preferably the same as the thickness t 1 of the electroformed metal mold main body 1. When the step is ±20 μm or less, it is possible to suppress the occurrence of residue in the step portion at the time of imprinting. When the thickness t 1 of the electroformed metal mold main body 1 is the same, the flat portion 2a of the electroforming mold main body 1 and the surface of the expanded portion 43 are flush with each other. Therefore, no residue is generated at the joint portion during the imprinting, and the most The transfer failure is effectively suppressed.

在出現階梯差的情況下,尤其是,為了將利用輥狀金屬模製作的轉印品用作模具,較佳為擴張部的表面比主體的表面高。其原因在於,轉印形成的圖案部比周邊部高,容易使用該模具向其他構件進行轉印。In the case where a step is present, in particular, in order to use a transfer product produced by a roll-shaped metal mold as a mold, it is preferable that the surface of the expanded portion is higher than the surface of the main body. This is because the pattern portion formed by the transfer is higher than the peripheral portion, and it is easy to transfer the other member using the mold.

擴張部43與電鑄金屬模主體1的連接能夠使用焊料49進行。向擴張部43的中心孔45嵌入電鑄金屬模主體1,向其間隙填充焊料49使兩者連接。此時,在焊料49形成為在表面隆起的情況下,較佳為實施切削、按壓等處理,以使得表面處於同一平面。The connection of the expanded portion 43 to the electroformed metal mold body 1 can be performed using the solder 49. The electroformed metal mold main body 1 is fitted into the center hole 45 of the expanded portion 43, and the gap is filled with the solder 49 to connect the two. At this time, in the case where the solder 49 is formed to be raised on the surface, it is preferable to perform processing such as cutting, pressing, or the like so that the surfaces are in the same plane.

對本實施方式的壓印用模具40的製作方法進行說明。如圖9所示那樣,壓印用模具40使用通過向已敘述的原盤(主模)進行電鑄而製成且使用從原盤脫模後的剝離電鑄金屬模主體1b、和一張薄板43a製作。A method of manufacturing the imprint mold 40 of the present embodiment will be described. As shown in Fig. 9, the imprint mold 40 is formed by electroforming the original disc (main mold) and using the strip electroformed metal mold main body 1b after being released from the original disc, and a thin plate 43a. Production.

剝離電鑄金屬模主體1b保持從原盤剝離的狀態,將為了將該剝離電鑄金屬模主體1b的周緣規整為圓形而線切割為直徑φ1 的圓形的構件用作電鑄金屬模主體1。The peeling electroforming metal mold main body 1b is kept in a state of being peeled off from the original disk, and a circular member cut into a circular diameter φ 1 for the circumference of the peeling electroforming metal mold main body 1b is used as an electroforming metal mold main body. 1.

作為薄板43a,準備具有長度a的一邊的正方形的薄板,該長度a比以電鑄金屬模主體1的形成有凹凸圖案2的圖案區域的直徑φ2 作為一邊的正方形的對角線的長度更大,在該薄板上設置電鑄金屬模主體1的直徑φ1 以上的直徑φ8 的圓形的中心孔45而製作擴張部43。As the thin plate 43a, a square thin plate having one side of the length a is prepared, and the length a is longer than the length of the diagonal of the square which is the diameter φ 2 of the pattern region in which the concave-convex pattern 2 is formed in the electroforming mold main body 1 as one side. The circular center hole 45 having a diameter φ 8 or more of the diameter φ 1 or more of the electroformed metal mold main body 1 is provided on the thin plate to form the expanded portion 43.

向擴張部43的中心孔45嵌入電鑄金屬模主體1,向其周緣與中心孔的間隙填埋焊料49,將電鑄金屬模主體1與擴張部43接合而一體化,得到壓印用模具40。The electroformed metal mold main body 1 is fitted into the center hole 45 of the expanded portion 43, the solder 49 is filled in the gap between the peripheral edge and the center hole, and the electroforming mold main body 1 and the expanded portion 43 are joined and integrated to obtain an imprint mold. 40.

對於本實施方式的模具40,其外形大小、圖案區域的大小只要根據成為壓印物件的凹凸圖案加工品的大小而適當地確定即可。例如,作為用於製作6英寸(150mm)直徑的PSS的模具40,將圖案區域的直徑φ2 設為170mm,將電鑄金屬模主體1的直徑φ1 設為180mm,將擴張部43的一邊的長度a設為345mm。在電鑄金屬模主體1以及擴張部43均由鎳形成的情況下,例如,將電鑄金屬模主體1的厚度t1 以及擴張部43的厚度t43 均設為150μm。In the mold 40 of the present embodiment, the outer shape and the size of the pattern region may be appropriately determined depending on the size of the processed product of the uneven pattern to be an imprinted article. For example, as the mold 40 for producing a 6-inch (150 mm) diameter PSS, the diameter φ 2 of the pattern region is set to 170 mm, and the diameter φ 1 of the electroforming mold main body 1 is set to 180 mm, and one side of the expanded portion 43 is used. The length a is set to 345 mm. In the case where the electroforming mold main body 1 and the expansion portion 43 are both formed of nickel, for example, the thickness t 1 of the electroforming mold main body 1 and the thickness t 43 of the expanded portion 43 are both set to 150 μm.

這樣的第三實施方式的壓印用模具40與第一實施方式的壓印用模具10相同地用於基於輥對輥方式的壓印法,能夠防止在進行基於輥對輥方式的壓印時,光阻劑液15a向模具40與輥11之間進入的情況,能夠抑制反覆進行壓印時的轉印不良。The imprint mold 40 of the third embodiment is used for the imprint method based on the roll-to-roll method in the same manner as the imprint mold 10 of the first embodiment, and it is possible to prevent the imprinting by the roll-to-roll method. When the photoresist liquid 15a enters between the mold 40 and the roller 11, it is possible to suppress transfer failure when the imprint is repeatedly performed.

1‧‧‧電鑄金屬模主體
1a‧‧‧電鑄層
1b‧‧‧剝離電鑄金屬模主體
2‧‧‧凹凸圖案
2a‧‧‧平坦部
3、33、43‧‧‧擴張部
4‧‧‧板狀構件
4a、33a、43a‧‧‧薄板
4b‧‧‧中心孔
5‧‧‧薄板
8‧‧‧黏接劑
10、30、40‧‧‧壓印用模具
11‧‧‧輥
12‧‧‧輥狀金屬模
13a、13b‧‧‧搬運輥
14‧‧‧膜
15‧‧‧樹脂層
15a‧‧‧光阻劑液
16‧‧‧模具式塗布機 
17‧‧‧紫外線照射光源
19‧‧‧膜狀模具
21‧‧‧原盤
24‧‧‧圖案化藍寶石基板
24A‧‧‧藍寶石基板
25‧‧‧樹脂層
25A‧‧‧光阻劑液
35‧‧‧鑽柱坑部
38‧‧‧黏接劑
45‧‧‧中心孔
49‧‧‧焊料
L‧‧‧塗敷寬度
t1、t33、t4、t43、t5‧‧‧厚度
φ0、φ1、φ2、φ3、φ4、φ5、φ6、φ7、φ8‧‧‧直徑
1‧‧‧Electroforming metal mold body
1a‧‧‧Electroforming layer
1b‧‧‧ peeling electroformed metal mold body
2‧‧‧ concave pattern
2a‧‧‧flat
3, 33, 43‧‧‧ expansion department
4‧‧‧ Plate-like members
4a, 33a, 43a‧‧‧thin
4b‧‧‧Center hole
5‧‧‧Sheet
8‧‧‧Adhesive
10, 30, 40‧ ‧ embossing mold
11‧‧‧ Roll
12‧‧‧ Roll metal mold
13a, 13b‧‧‧Transport roller
14‧‧‧ film
15‧‧‧ resin layer
15a‧‧‧ photoresist liquid
16‧‧‧Mold coating machine
17‧‧‧UV light source
19‧‧‧ Film mold
21‧‧‧Original
24‧‧‧ patterned sapphire substrate
24A‧‧‧Sapphire substrate
25‧‧‧ resin layer
25A‧‧‧ photoresist liquid
35‧‧‧Drilling pit
38‧‧‧Adhesive
45‧‧‧ center hole
49‧‧‧ solder
L‧‧‧ coating width
t 1 , t 33 , t 4 , t 43 , t 5 ‧‧‧ thickness φ 0 , φ 1 , φ 2 , φ 3 , φ 4 , φ 5 , φ 6 , φ 7 , φ 8 ‧‧‧ diameter

圖1係第一實施方式的壓印用模具的俯視圖以及剖視圖。 圖2係示意性地示出第一實施方式的壓印用模具的製作步驟的圖。 圖3係示出捲繞於輥上的壓印用模具的立體圖。 圖4係示出用於實施基於輥對輥方式的壓印法的裝置的局部的圖。 圖5係示意性地示出壓印用模具上的光阻劑塗敷區域的圖。 圖6係示意性地示出從原盤製成輥狀金屬模為止的步驟的圖。 圖7係示意性地示出使用膜狀模具製成凹凸圖案加工品為止的步驟的圖。 圖8係示意性地示出第二實施方式的壓印用模具的製作步驟的圖。 圖9係示意性地示出第三實施方式的壓印用模具的製作步驟的圖。Fig. 1 is a plan view and a cross-sectional view of a stamping die of a first embodiment. Fig. 2 is a view schematically showing a manufacturing step of the imprint mold of the first embodiment. Fig. 3 is a perspective view showing an imprint mold wound on a roll. Fig. 4 is a view showing a part of an apparatus for carrying out an imprint method based on a roll-to-roll method. Fig. 5 is a view schematically showing a photoresist application region on a stamping die. Fig. 6 is a view schematically showing a step from the preparation of a roll-shaped metal mold from a master. Fig. 7 is a view schematically showing a procedure until a textured product is formed using a film mold. Fig. 8 is a view schematically showing a manufacturing step of the imprint mold of the second embodiment. Fig. 9 is a view schematically showing a manufacturing procedure of a stamping die of a third embodiment.

1‧‧‧電鑄金屬模主體 1‧‧‧Electroforming metal mold body

2‧‧‧凹凸圖案 2‧‧‧ concave pattern

2a‧‧‧平坦部 2a‧‧‧flat

3‧‧‧擴張部 3‧‧‧Expansion Department

4‧‧‧板狀構件 4‧‧‧ Plate-like members

5‧‧‧薄板 5‧‧‧Sheet

8‧‧‧黏接劑 8‧‧‧Adhesive

10‧‧‧壓印用模具 10‧‧‧impression mold

φ1、φ2、φ3‧‧‧直徑 φ 1 , φ 2 , φ 3 ‧‧‧ diameter

t1、t4、t5‧‧‧厚度 t 1 , t 4 , t 5 ‧‧‧ thickness

Claims (5)

一種壓印用模具,其捲繞於輥上使用,且在表面具有凹凸圖案,其中,包括: 在表面上形成有所述凹凸圖案的圓盤狀的電鑄金屬模主體;以及 與該電鑄金屬模主體一體化且在所述電鑄金屬模主體的周圍延伸的擴張部。An imprint mold for winding on a roll and having a concave-convex pattern on a surface, comprising: a disk-shaped electroformed metal mold body having the concave-convex pattern formed on the surface; and the electroforming An expanded portion in which the metal mold body is integrated and extends around the electroformed metal mold body. 如申請專利範圍第1項所述之壓印用模具,其中, 所述擴張部包括板狀構件和薄板,所述板狀構件具備中心孔,該中心孔具有與所述電鑄金屬模主體的外周形狀一致的形狀,所述薄板具有比所述電鑄金屬模主體的外形大的外形, 向所述板狀構件的所述中心孔嵌入所述電鑄金屬模主體,所述板狀構件和所述電鑄金屬模主體黏接在所述薄板上而被一體化。The mold for imprint according to claim 1, wherein the expansion portion includes a plate member and a thin plate, and the plate member has a center hole having a body with the electroformed metal mold a shape in which the outer peripheral shape is uniform, the thin plate has a larger outer shape than the outer shape of the electroforming metal mold main body, and the electroforming metal mold main body is embedded in the center hole of the plate-shaped member, the plate-shaped member and The electroformed metal mold body is bonded to the thin plate to be integrated. 如申請專利範圍第1項所述之壓印用模具,其中, 所述擴張部由具備鑽柱坑(counter boring)部的帶鑽柱坑部薄板構成,所述鑽柱坑部為與所述電鑄金屬模主體的外周形狀一致的形狀, 通過向所述帶鑽柱坑部薄板的所述鑽柱坑部嵌入黏接所述電鑄金屬模主體,由此所述電鑄金屬模主體與所述擴張部一體化。The mold for imprint according to claim 1, wherein the expansion portion is constituted by a drilled hole portion having a drill boring portion, wherein the drill pit portion is a shape in which the outer peripheral shape of the electroformed metal mold main body is uniform, and the electroforming mold main body is embedded and bonded to the drill string hole portion of the drill string hole thin plate, whereby the electroforming metal mold main body and The expansion portion is integrated. 如申請專利範圍第1項所述之壓印用模具,其中, 所述擴張部由具備中心孔的板狀構件構成,該中心孔具有與所述電鑄金屬模主體的外周形狀一致的形狀, 向所述板狀構件的所述中心孔嵌入所述電鑄金屬模主體,所述板狀構件與所述電鑄金屬模主體在該電鑄金屬模主體的周緣連接而被一體化。The mold for imprint according to claim 1, wherein the expansion portion is formed of a plate-like member having a center hole having a shape conforming to an outer peripheral shape of the electroforming mold main body. The electroformed metal mold main body is fitted into the center hole of the plate-shaped member, and the plate-shaped member and the electroforming mold main body are connected to each other at a peripheral edge of the electroforming mold main body. 如申請專利範圍第1至4項中任一項所述之壓印用模具,其中, 所述擴張部的表面與所述電鑄金屬模主體的表面的階梯差是10μm以下。The imprint mold according to any one of claims 1 to 4, wherein a step of the surface of the expanded portion and a surface of the electroforming mold main body is 10 μm or less.
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KR101816838B1 (en) * 2016-07-08 2018-01-09 주식회사 기가레인 Replica mold for nano imprint, manufacturing method and equipment thereof
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Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08190739A (en) * 1995-01-10 1996-07-23 Canon Inc Stamper roll
JP2001035021A (en) * 1999-07-14 2001-02-09 Sony Corp Stamper roll
US6517995B1 (en) * 1999-09-14 2003-02-11 Massachusetts Institute Of Technology Fabrication of finely featured devices by liquid embossing
US7418902B2 (en) * 2005-05-31 2008-09-02 Asml Netherlands B.V. Imprint lithography including alignment
JP4830171B2 (en) * 2006-05-15 2011-12-07 学校法人早稲田大学 Mold support structure
CN101795961B (en) * 2007-09-06 2013-05-01 3M创新有限公司 Tool for making microstructured articles
JP5408649B2 (en) * 2008-02-20 2014-02-05 学校法人東京理科大学 Method for producing endless pattern
US20100090341A1 (en) * 2008-10-14 2010-04-15 Molecular Imprints, Inc. Nano-patterned active layers formed by nano-imprint lithography
JP2012056085A (en) * 2010-09-03 2012-03-22 Bridgestone Corp Method of manufacturing cylindrical mold and apparatus for the same
JP6045782B2 (en) 2010-11-09 2016-12-14 旭化成株式会社 Fine concavo-convex pattern base material and manufacturing method thereof, wire grid polarizer and manufacturing method thereof
JP2012109487A (en) * 2010-11-19 2012-06-07 Hitachi High-Technologies Corp Double-sided imprint apparatus
JP2012181895A (en) * 2011-03-02 2012-09-20 Bridgestone Corp Resin stamper for imprint and manufacturing method thereof
CN103764361A (en) * 2011-08-30 2014-04-30 综研化学株式会社 Resin mold bonding method and roll-to-roll continuous mold composition using same
US20140093692A1 (en) 2012-09-28 2014-04-03 Soken Chemical & Engineering Co., Ltd. Resin Mold, Production Process Therefor and Uses Thereof
CN105026449B (en) * 2013-03-04 2021-05-04 东洋合成工业株式会社 Composition, resin mold, optical imprint method, method for manufacturing optical element, and method for manufacturing electronic element
SG10201707221PA (en) * 2013-03-15 2017-10-30 Canon Nanotechnologies Inc Nano imprinting with reusable polymer template with metallic or oxide coating

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