TWI687301B - Imprinting method and imprinting device - Google Patents

Abstract

The invention provides an imprinting method and an imprinting device. [Subject] Its purpose is to improve the mold release property and stabilize the transfer quality of fine patterns. [Solution] It is characterized by the following steps: a resin coating step, in a state where the back surface of the substrate has been attached to the adhesive sheet, to cover the surface of the substrate, and to extend beyond the periphery of the substrate to come into contact with the adhesive sheet Light curing resin; pre-hardening step, by irradiating light from the back side of the substrate to harden the photo-hardening resin in contact with the adhesive sheet; pressing step, pressing the fine pattern formed on the mold against the surface of the substrate On the photo-curable resin; the hardening step, by irradiating light from the surface side of the substrate, hardens the photo-curable resin on the surface of the substrate; and the demolding step, by peeling from the hardened place on the adhesive sheet, the mold is removed from Light-hardening resin release.

Description

Imprinting method and imprinting device Field of invention

The invention relates to an imprinting method and an imprinting device.

Background of the invention

(Background of imprint technology, applicable fields)

In recent years, for optical components used in products such as displays and lighting, it is highly expected to realize devices that have discovered the following new functions that have not been previously available: by forming nanometer (nm) grades that exert special optical characteristics Fine patterns down to the micrometer (μm) level control the reflection and diffraction of light. As a method of forming such a fine pattern, in addition to photolithography technology and electron beam etching technology, imprint technology has also attracted attention in recent years.

The so-called imprint technique refers to a method of forming a fine pattern of a mold by pressing a mold with a fine pattern pre-processed on the surface against a resin that has been coated on the surface of the substrate.

As the imprinting method, there are a thermal imprinting method and a UV imprinting method. The thermal imprinting method is transferred by pressing a mold against the thermoplastic resin coated on the surface of the substrate to a temperature above the glass transition temperature. For the fine pattern, this UV imprinting method transfers the fine pattern by irradiating UV light in a state where the UV hardening resin is used and pressed against the mold.

Although the hot imprinting method has the characteristics of wide material selectivity, when transferring fine patterns, the mold needs to be heated and cooled, so there is a problem of low throughput. On the other hand, although the UV imprinting method is limited to materials hardened by ultraviolet rays, it has less selectivity than the thermal imprinting method, but it can be cured in a few seconds to several tens of seconds, so it has the advantage of very high yield. . Which of the hot imprinting method and the UV imprinting method will be used will vary according to the device to be applied, but when there is no problem of material factors, it is considered that the UV imprinting method is more suitable as a mass production method .

(Imprint technology)

The following describes the general procedure of forming a fine pattern by UV imprinting. FIG. 13 is a schematic diagram of a general flat plate imprinting step. First, on the surface of the substrate 11, the UV-curable resin 12 is entirely coated using a spin coating method or the like. Next, the substrate 11 is placed on the flat stage 13 and the mold 14 having the fine structure formed thereon is pressed and brought into contact from above. The method of pressing with the leveling tool 15 as a pressing means is common. Then, from above the mold 14 and the leveling tool 15, UV irradiation is performed with a UV irradiator 16 to harden the UV-curable resin 12. Finally, the leveling tool 15 and the mold 14 are moved upward, thereby releasing the mold 14 from the UV hardening resin 12.

However, in the case of this method, since the release direction is perpendicular to the transfer plane, a large release resistance is generated between the mold 14 and the cured UV-curable resin 12. Therefore, when the mold 14 is to be released from the UV-curable resin 12, the film may peel off between the UV-curable resin 12 and the substrate 11, which may cause unstable transfer quality of the fine pattern.

(Prior literature on previous topics)

As shown in FIG. 14, Patent Document 1 discloses that the mold 14 is made into a film shape, and after the transfer, the mold holder 17 disposed at the end is lifted to peel and release the mold 14.印方法。 Printing method. Since the mold release is not carried out in the vertical direction with respect to the transfer plane, but is carried out by peeling, the mold release resistance can be reduced and the transfer quality of the fine pattern can be stabilized. Also, as shown in FIG. 15, the imprint method disclosed in Patent Document 2 similarly makes the mold 14 into a film shape, and uses a pressure roller 151 as a pressure means, and presses the pressure roller 151 side after transfer As the mold 14 moves to the left in the figure, the mold holder 17 is raised, and the mold 14 is peeled off and released. At this time, the mold release resistance can also be reduced to stabilize the transfer quality of the fine pattern.

Prior technical literature Patent Literature

Patent Document 1: Japanese Patent No. 5499306

Patent Document 2: Japanese Patent Laid-Open No. 2014-54735

Summary of the invention

Although any method has a certain degree of effect as a method for improving the releasability, it will be difficult due to the adhesion of the UV-curable resin 12 to the substrate 11 or the releasability with the mold 14, and this is not the case in all cases. Can be demolded well. In the following, specific examples of the mechanism of mold release failure due to the aforementioned various materials, adhesiveness and mold release properties will be exemplified.

16 is an enlarged cross-sectional view of the state of the step of demolding the end of the substrate 11 in the conventional imprint method. Actually, used as the substrate 11 Most of the materials are inorganic materials such as silicon or glass, and most of them do not have sufficient adhesion with organic resins such as UV-curable resin 12. Therefore, although it is possible to perform a silane coupling process or the like on the substrate 11 in advance to ensure adhesion, there are also examples in which stable adhesion cannot be ensured due to the temperature conditions of the coupling process and the like. Therefore, there may be a situation where the adhesive force at the junction P1 between the UV-curable resin 12 and the substrate 11 becomes unstable and becomes small. In addition, the materials used for the mold 14 are mostly organic resins such as acrylic or epoxy resin. Since they have the same properties as the UV-curable resin 12, they often form a large adhesive force during curing. Although it is possible to make the mold 14 or the UV-curable resin 12 contain a fluorine-based material to reduce the adhesive force, there are examples where these are unstable due to curing conditions and the like. Therefore, there may be a situation where the adhesive force at the junction P2 between the UV hardening resin 12 and the mold 14 becomes large. Therefore, there will be the following problem: at the time of demolding, the adhesive force of the UV curing resin 12 at the junction P2 with the mold 14 exceeds the adhesion to the substrate 11 at the junction P1, and as shown in FIG. 16, the substrate 11 Film peeling occurs with the UV hardening resin 12, and the transfer quality of the fine pattern is unstable.

In view of the above-mentioned conventional problems, the present invention aims to stabilize the transfer quality of fine patterns by improving the mold releasability.

In order to solve the above problems, the imprint method of the present invention is characterized by the following steps: a resin coating step, in a state where the back surface of the substrate has been attached to the adhesive sheet, to cover the surface of the substrate and exceed the substrate Apply light-curing resin on the outer periphery in contact with the aforementioned adhesive sheet; The pre-hardening step, by irradiating light from the back side of the substrate, hardens the photo-curable resin in contact with the adhesive sheet; the pressing step, presses the fine pattern formed on the mold against the photo-curing on the surface of the substrate Hardening step, by irradiating light from the surface side of the substrate to harden the photocurable resin on the surface of the substrate; and a demolding step, by peeling from the hardened place on the adhesive sheet, the The mold is released from the aforementioned photo-curable resin.

According to the imprint method of the present invention, the releasability of imprint can be improved, and the transfer quality of fine patterns can be stabilized.

11, 21: substrate

21a: surface

21b: back

21c: the most upstream side of the substrate

21d: the most upstream end of the substrate

12, 22: UV hardening resin

22a: The part that was hardened in the prior hardening step (Coated in the resin coating step (UV hardening resin part)

22b: The uncured part in the pre-curing step (the part where the UV curable resin is not applied in the resin coating step)

22c: The part that can be hardened or not hardened in the prior hardening step (the part that can be coated or not coated in the resin coating step)

13, 23: stage

14, 24: mold

24a: Face 1

24b: Face 2

15, 25: leveling tool

151, 251: Pressure roller

252: Keep the wheel

16, 26: UV irradiator

17, 27: mold holding tool

28: Adhesive sheet

281: Adhesive sheet correction jig

29: Prior UV irradiator

30: fluid pressure

P1, P4: the junction between the UV hardening resin and the substrate

P2: Adjacent part of UV hardening resin and mold

P3: Adjacent part of UV hardening resin and adhesive sheet

X: Feed direction

FIG. 1A shows the resin coating step of the imprint method in Embodiment 1 of the present invention.

Figure 1B shows the pre-hardening step of the same imprint method.

FIG. 1C shows the pressing step of the same imprint method.

Figure 1D shows the hardening step of the same imprint method.

Fig. 1E shows the demolding step of the same imprint method.

FIG. 2 is a schematic diagram illustrating the effect in Embodiment 1 of the present invention.

FIG. 3 is a schematic diagram illustrating the effect of Embodiment 1 of the present invention.

FIG. 4 shows another example related to the pressurizing step in Embodiment 1 of the present invention.

FIG. 5 shows another example related to the demolding step in Embodiment 1 of the present invention.

FIG. 6 shows another example related to the method of attaching the adhesive sheet in Embodiment 1 of the present invention.

FIG. 7 shows another example related to the method of attaching the adhesive sheet in Embodiment 1 of the present invention.

FIG. 8 shows another example related to the method of attaching the adhesive sheet in Embodiment 1 of the present invention.

FIG. 9A shows the resin coating step of the imprint method in Embodiment 2 of the present invention.

Fig. 9B shows the pre-hardening step of the same imprint method.

Fig. 9C shows the pressing and hardening steps of the same imprint method.

Fig. 9D shows the demolding step of the same imprint method.

Fig. 10 is a diagram for explaining the hardening part of the same imprinting method in the prior hardening step.

Fig. 11 is a diagram for explaining the hardening part of the same imprint method in the prior hardening step.

12 is a diagram showing another example related to the resin coating step in Embodiment 2 of the present invention.

Figure 13 shows an overview of general UV imprinting technology.

14 is a schematic diagram of the roller imprinting method described in Patent Document 1.

15 is a schematic diagram of the roller imprinting method described in Patent Document 2.

16 is a schematic diagram for explaining the problem of the conventional imprint method.

Forms for carrying out the invention

(Embodiment 1)

The imprinting method and imprinting apparatus in Embodiment 1 of the present invention will be described below with reference to the drawings. As shown in FIGS. 1A to 1E, the imprint apparatus of the present invention includes an adhesive sheet 28, a stage 23, a mold 24, a leveling tool 25, a UV irradiator 26, a prior UV irradiator 29, and a resin coating not shown布装置。 Cloth device. The specific operation of each configuration is performed together with the following description of the imprint method.

1A to 1D are schematic diagrams showing the flow of steps of the imprint method in Embodiment 1 of the present invention. First, in the resin coating step shown in FIG. 1A, the UV curable resin 22 is coated on the substrate 21. In the substrate 21, the back surface 21b is pasted and held on the adhesive sheet 28 in advance. The adhesive sheet 28 is fixed and adhered to the adhesive sheet correction jig 281 to apply a predetermined tension to the adhesive sheet 28 itself. The substrate 21 in this state is coated with UV-curable resin 22 with a resin coating device. At this time, the coating is performed so as to cover the surface 21 a of the substrate 21 and contact the adhesive sheet 28 beyond the outer periphery of the substrate 21. Depending on the viscosity of the material, various methods such as spin coating, screen printing, and electrostatic coating can also be used as the coating method. The appearance of the resin coating device will vary depending on the coating method. In addition, various materials can be considered for the substrate 21 depending on the target product and the like, and examples thereof include silicon, sapphire, and gallium nitride.

Next, in the pre-curing step shown in FIG. 1B, the UV-curable resin 22 of the outer peripheral portion of the substrate 21 coated with the UV-curable resin 22 is cured. The substrate 21 adhered to the adhesive sheet 28 is provided on the stage 23 via the adhesive sheet 28. The stage 23 is formed of a material that can penetrate light, It may be made of, for example, quartz glass. Below the stage 23, a prior UV irradiator 29 that can irradiate UV light upward is provided to irradiate UV light from below after the substrate 21 is installed. At this time, since the substrate 21 is not transparent to UV light, the substrate 21 can be shielded, and the UV-curable resin 22 on the substrate surface 21a is not cured, but only cured beyond the outer periphery of the substrate 21 and UV hardening resin 22 in contact with the adhesive sheet 28.

In the pressing step shown in FIG. 1C, the second surface 24 b of the mold 24 that forms a fine pattern on the first surface 24 a is pressed against the substrate 21 disposed on the stage 23 by the leveling tool 25. The forming method can be applied to various methods, but here the flat plate method is used as a representative example for description. Specifically, the mold 24 is in the form of a film, and is attached to the mold gripper 27 with a predetermined tension applied. In addition, the second surface 24b of the mold 24 is pressed with a leveling tool 25 from above, and the fine pattern formed on the first surface 24a of the mold 24 is pressed against the UV-curable resin 22 on the substrate 21 to make the UV-curable resin 22 Fill in fine patterns.

After that, in the curing step shown in FIG. 1D, the UV-curable resin 22 coated on the substrate 21 is cured. The leveling tool 25 has light permeability, and may be made of, for example, quartz glass. In addition, since the mold 24 is light transmissive and allows the UV light irradiated by the UV irradiator 26 disposed above to penetrate almost completely downward, the UV hardening resin 22 can be hardened.

Finally, in the demolding step shown in FIG. 1E, the cured UV-curable resin 22 and the mold 24 are demolded. At this time, the leveling tool 25 is released from the pressurization and retracted first. When the film-like mold 24 is demolded, it is peeled off from the end of the substrate 21 by raising the mold gripper 27 Way to demold it. In this way, the mold releasability can be improved, and the transfer quality of fine patterns can be improved. Hereinafter, the details will be described with reference to FIGS. 2 and 3.

2 is an enlarged cross-sectional view showing the state of the substrate end portion in the pressurization step of the present embodiment, and FIG. 3 is an enlarged cross-sectional view showing the state of the substrate end portion in the demolding step of the present embodiment. The same symbols as those in Fig. 1 or equivalent parts will be attached. In the pressurizing step shown in FIG. 2, the mold 24 is brought into contact with the UV hardening resin 22. On the surface 21a of the substrate 21, since the UV-curable resin 22 is a viscous body before curing, it is filled in the pattern of the mold 24. On the other hand, in the area beyond the outer periphery of the substrate 21 and in contact with the adhesive sheet 28, since the UV-curable resin 22 has been cured in the pre-curing step of FIG. 1B, there is no adhesiveness and stickiness, and it has Elastomer with specific hardness. Therefore, the adhesive force of the junction P2 between the UV-curable resin 22 and the mold 24 becomes significantly smaller. On the other hand, the adhesion force between the UV curing resin 22 and the adhesive sheet 28 at the junction P3 in this region will be significantly increased due to the following reasons: the UV curing resin 22 is cured in a pre-curing step, and the adhesion of the adhesive sheet 28 Performance, and a fixed interface is formed between the UV hardening resin 22 and the adhesive sheet 28.

When moving to the demolding step shown in FIG. 3 in this state, the adhesive force of the bonding point P3 of the UV hardening resin 22 and the adhesive sheet 28 becomes significantly greater than the bonding point P2 of the UV hardening resin 22 and the mold 24 Adhesion. Therefore, it must be peeled off from the mold 24 side. In addition, in order to peel off the part of the mold on the substrate 21 from the UV hardening resin 22, a specific mold release impedance is required at the junction P4 between the substrate 21 and the UV hardening resin 22. Here, since the mold 24 has been peeled off from the end, the demolding resistance at the next P4 will be The adhesion force at the point P3 becomes sufficiently small. In addition, since the force point at the time of peeling is present at the junction P4 and is far away from the portion at the junction P3, it is difficult to cause film peeling between the substrate 21 and the UV-curable resin 22. Therefore, the mold releasability can be improved, and the transfer quality of fine patterns can be stabilized.

Furthermore, in the first embodiment, the method of using a flattening tool is cited as a representative example of the pressure method, but the pressure method is not limited to this. For example, as shown in FIG. 4, a fluid pressure of 30 such as air is used. The same effect can be expected by pressing the entire surface of the substrate 21. In addition, in FIG. 4, the same symbols as those in FIG. 1 or equivalent parts are attached. In addition, a pressure roller as described below may be used as the pressure method.

In addition, although the method used in the demolding step is to peel off the end of the mold 24 by raising the mold gripper 27, as shown in FIG. 5, by using ultrasonic vibration, etc., the microscopic image It is a method of swinging the mold holding tool 27 in the up and down direction, so that the mold release resistance between the mold 24 on the substrate 21 and the UV hardening resin 22 is reduced, and a more stable mold release can be achieved. In addition, by simultaneously moving the adhesive sheet correction jig 281 downward, the opening angle of the mold 24 and the UV hardening resin 22 can be further increased, and the mold releasability can be improved.

In addition, the shape of the adhesive sheet correction jig 281 to which the adhesive sheet 28 is fixed can take various forms depending on the shape of the target substrate 21 and the like. 6 to 8 are examples of manufacturing various shapes of the adhesive sheet 28 and the adhesive sheet correction jig 281 in this embodiment. When the substrate 21 has a quadrangular shape, the adhesive sheet correction jig 281 is, for example, arranged on the left and right sides of the substrate 21 as shown in FIG. 6 or is arranged to surround the periphery of the substrate 21 as shown in FIG. 7. By this, the adhesive sheet 28 can be made Tension is stable. When the substrate 21 is circular, as shown in FIG. 8, the adhesive sheet correction jig 281 is formed into a circular ring shape. Thereby, the tension of the adhesive sheet 28 can be made isotropic.

(Embodiment 2)

Next, the imprint method of Embodiment 2 of the present invention will be described with reference to the drawings. In addition, what was described in Embodiment 1 is the state shown in FIG. 1B in which the UV curing resin 22 beyond the outer periphery of the substrate 21 is cured in the preliminary curing step. On the other hand, the second embodiment is different from the first embodiment in that a part of the UV curable resin 22 beyond the outer periphery of the substrate 21 is not cured.

9A to D are schematic diagrams showing the flow of steps of the imprint method in Embodiment 2 of the present invention. For simplicity, the same symbols as those in Figure 1A~E or equivalent parts will be attached. The resin coating step shown in FIG. 9A is the same as the case described in FIG. 1A in Embodiment 1, and therefore description will be omitted.

In the pre-curing step shown in FIG. 9B, among the UV-curable resin 22 that has been in contact with the adhesive sheet 28 beyond the periphery of the substrate 21, although the UV-curable resin 22 located on the left side in the figure than the substrate 21 is cured, it does not The UV hardening resin 22 located on the right side of the substrate 21 is not hardened. Details will be described later.

In the pressing and curing step shown in FIG. 9C, as a pressing method, a pressing roller 251 is used to press the film-like mold 24 against the UV-curable resin 22 while applying pressure The axial direction Z of the pressing roller 251 and the feeding direction X (the direction from left to right in the figure) perpendicular to the pressing direction Y are fed to pressurize sequentially. At the same time, the UV irradiator 26 is also pressurized from above The roller 251 moves synchronously, so that the UV hardening resin 22 is hardened in sequence. In addition, in order to prevent the portion of the mold 24 after the pressure roller 251 passes through before the UV hardening resin 22 is hardened, a holding roller 252 is provided. The holding roller 252 is provided upstream of the UV irradiator 26 in the feed direction X.

In the demolding step shown in FIG. 9D, the holding roller 252 is fed in the feed direction X while raising the mold gripper 27 on the upstream side only from the upstream in the feed direction X Side. Here, the UV curable resin 22 upstream of the substrate 21 in the feed direction X has been previously cured in the step shown in FIG. 9B, so the adhesion force with the mold 24 becomes smaller, and the adhesive sheet 28 The adhesion will become greater. Thereby, since the film peeling between the substrate 21 and the UV-curable resin 22 can be prevented, the mold releasability can be improved, and the transfer quality of the fine pattern can be stabilized.

In addition, since the UV-curable resin 22 located downstream of the substrate 21 in the feed direction X is not cured in advance, the outflow of the UV-curable resin 22 can be promoted, and the transfer quality of the fine pattern can be stabilized. The details are explained below.

In the second embodiment, since the pressure roller 251 feeds the UV curable resin 22 while pressing the UV curing resin 22, the UV curable resin 22 on the substrate 21 is also pressed toward the feed direction X. It is assumed that, in FIG. 9B, when the entire range of the UV-curable resin 22 beyond the outer periphery of the substrate 21 is cured, the UV-curable resin 22 that is squeezed in the feed direction X will be because the UV that has been cured downstream of the substrate 21 The resin 22 is hardened and blocked. Therefore, it becomes difficult for the UV curable resin 22 to flow downstream, and the film thickness of the UV curable resin 22 becomes thicker on the downstream side than on the upstream side, and there is a possibility that the transfer quality of the fine pattern may be reduced.

On the other hand, in this embodiment, since the UV-curable resin 22 located downstream of the substrate 21 is not cured in advance, the UV-curable resin 22 that is squeezed in the feed direction X flows out to the adhesive downstream of the substrate 21 On sheet 28. Therefore, the film thickness of the UV hardening resin 22 can be uniformized, and the transfer quality of the fine pattern can be improved.

10 and 11 are plan views illustrating where the substrate 21 is hardened in the prior hardening step when the substrate 21 is rectangular or circular. In the figure, the symbol 22a is a portion that is cured in the pre-curing step, and represents a portion of the UV-curable resin that is upstream of the substrate 21 in the feeding direction X. Symbol 22b is a portion that has not been cured in the prior curing step, and indicates a portion of the UV-curable resin located downstream of the substrate 21 in the feeding direction X. Symbol 22c indicates a portion of the UV-curable resin other than that, and is a portion that may or may not be cured in the prior curing step.

When the substrate 21 is rectangular, as shown in FIG. 10, the UV curing resin portion 22 a on the upstream side of the most upstream side 21 c of the substrate 21 in the feed direction X is cured. In order to promote the outflow of the UV-curable resin 22, the portion 22b of the UV-curable resin located downstream of the substrate 21 in the feed direction X is not cured. When the substrate 21 is circular, as shown in FIG. 11, it is necessary to harden the portion 22 a of the UV-curable resin on the upstream side of the feeding direction X than the one of the most upstream end 21 d of the substrate 21. This area becomes a shape formed by arcs and strings. In order to promote the outflow of the UV curable resin 22, the portion 22b of the UV curable resin located downstream of the substrate 21 in the feed direction X is not cured.

In the second embodiment, in the pre-curing step shown in FIG. 9B, the UV on the upstream side of the substrate 21 in the feed direction X is made hard The hardening resin 22 hardens without hardening the UV hardening resin located downstream of the substrate 21. Alternatively, in the resin coating step, the UV-curable resin 22 may be applied to the adhesive sheet 28 on the upstream side of the substrate 21 in the feed direction X, and the adhesive sheet 28 on the downstream side of the substrate 21 Not coated. With this, the same effect as described above can be obtained.

That is, when the UV curing resin 22 on the upstream side of the comparison substrate 21 is irradiated with UV light for curing, the adhesion between the UV curing resin 22 and the mold 24 becomes smaller, and the adhesion with the adhesive sheet 28 becomes larger. This can prevent the film from peeling between the substrate 21 and the UV curable resin 22, so that the mold releasability can be improved, and the transfer quality of the fine pattern can be stabilized. In addition, since the UV curable resin 22 is not applied downstream of the substrate 21 in the feed direction X, the outflow of the UV curable resin 22 can be promoted, and the transfer quality of the fine pattern can be stabilized.

Here, with reference to FIGS. 10 and 11, a description will be given of where UV curable resin is applied in the resin application step. In the figure, the symbol 22a indicates a portion where the UV-curable resin 22 is applied in the resin application step. Symbol 22b indicates a portion where the UV-curable resin 22 is not applied in the resin application step. Symbol 22c indicates a portion that may or may not be coated in the resin coating step. In addition, it can also be made as follows: It is predicted that the UV hardening resin 22 on the substrate 21 can be squeezed to a certain extent in the feed direction X, and as shown in FIG. 12, in the surface of the substrate 22, Without covering the entire surface, a part of the downstream side in the feed direction X is exposed.

In addition, the second embodiment is described as follows: the pressure roller 251 is used as a pressure member so as not to exceed the outer periphery of the substrate 21 The entire surface of the UV hardening resin 22 is hardened, and the UV hardening resin 22 on the peeling side is hardened. Alternatively, even if a flattening tool or fluid pressure as described in Embodiment 1 is used as the pressurizing member, the entire surface of the UV-curable resin 22 beyond the outer periphery of the substrate 21 is not hardened, and the side of the peeling is not The same effect can be obtained even if the UV hardening resin 22 is hardened.

Furthermore, in the first and second embodiments, although the case where the UV irradiator irradiates the UV hardening resin 22 with UV light through the mold 24 having UV transparency to harden it, it is not limited to In this case, the mold 24 can be made transparent to light other than UV, a resin that can be cured under light other than UV, and a light irradiator that emits light other than UV can be used.

Industrial availability

The present invention is useful for an imprinting method and an imprinting device that can improve the transfer quality of fine patterns by improving mold releasability.

21: substrate

21a: surface

22: UV hardening resin

24: mold

25: Leveling tool

P2: Adjacent part of UV hardening resin and mold

P3: Adjacent part of UV hardening resin and adhesive sheet

28: Adhesive sheet

Claims (10)

An imprinting method characterized by the following steps: a resin coating step, in a state where the back surface of the substrate has been attached to the adhesive sheet, to cover the surface of the substrate and extend beyond the outer periphery of the substrate to come into contact with the adhesive sheet Way, applying photo-curing resin; pre-hardening step, by irradiating light from the back side of the substrate, hardening the photo-curing resin in contact with the adhesive sheet; pressing step, pressing the fine pattern formed on the mold On the photo-curable resin on the surface of the substrate; the hardening step, by irradiating light from the surface side of the substrate, hardening the photo-curable resin on the surface of the substrate; and the demolding step, from the adhesive sheet The hardened portion is peeled off, and the mold is released from the photocurable resin. The embossing method according to claim 1, wherein the pressing step is performed by pressing the mold with a transparent plate tool, and the hardening step is by irradiating light through the plate tool Come on. The imprint method of claim 1, wherein the pressurizing step is performed by pressurizing the mold with a fluid. The imprint method according to claim 1, wherein the pressurizing step is to feed the mold toward the feeding direction perpendicular to the axial direction of the pressurizing roller and the pressurizing direction while pressing the mold with the pressurizing roller The hardening step is performed in synchronization with the movement of the pressure roller The moving light irradiator sequentially hardens the photo-curable resin on the surface of the substrate. The imprint method according to claim 4, wherein, in the pre-curing step, the photo-curable resin located downstream of the substrate is not irradiated with light in the feed direction, but is positioned at the most upstream of the substrate. Part of the light hardening resin on the upstream side is irradiated with light, and the aforementioned demolding step is performed by peeling from the upstream side in the aforementioned feed direction. The imprint method according to claim 4, wherein, in the resin coating step, the adhesive sheet located downstream of the substrate in the feed direction is not coated with a photocurable resin, but is positioned at a position higher than that of the substrate The most upstream part of the adhesive sheet on the more upstream side is coated with a photo-curable resin, and the mold release step is performed by peeling from the upstream side in the feed direction. An imprinting device is characterized by comprising: an adhesive sheet that can be attached to and held on the back surface of a substrate, and has translucency and flexibility; and a resin coating device that can coat a surface of the substrate with a photo-curable resin And extends beyond the outer periphery of the substrate to contact the adhesive sheet; the stage can be provided with the substrate through the adhesive sheet, and has translucency; the first light irradiator can be placed between the stage and the aforementioned At least a part of the photo-curable resin exceeding the outer periphery of the substrate is adhered to the sheet Irradiation of light; mold, forming a fine pattern on the first surface facing the surface of the substrate, and having translucency and flexibility; pressing member, which can press the second surface of the mold opposite to the first surface And the second light irradiator, which can irradiate light onto the surface of the substrate through the mold. The imprint apparatus according to claim 7, wherein the pressing member has a flat plate shape having translucency, and the second light irradiator irradiates light onto the surface of the substrate via the pressing member. The imprint apparatus according to claim 7, wherein the aforementioned pressurizing member is a fluid. The embossing device according to claim 7, wherein the pressing member has a roller shape having a central axis, and by pressing the second surface of the mold on one side, the second side faces the direction perpendicular to the central axis direction and the pressing direction Feed in the feeding direction to sequentially press the mold against the photo-curable resin, and the second light irradiator moves in synchronization with the movement of the pressing member, and sequentially causes the photo-curable resin on the surface of the substrate Harden in sequence.

Images